CN210778539U

CN210778539U - Spherical thimble cap

Info

Publication number: CN210778539U
Application number: CN201921877690.3U
Authority: CN
Inventors: 刘朝斌; 曾德祥
Original assignee: Lesan Phoenix Semiconductor Co
Current assignee: Lesan Phoenix Semiconductor Co
Priority date: 2019-11-01
Filing date: 2019-11-01
Publication date: 2020-06-16
Anticipated expiration: 2029-11-01

Abstract

The utility model relates to a sheet-loading device, and discloses a spherical thimble cap, which comprises a cap body for accommodating a thimble, wherein one end of the cap body is provided with a cap, the cap is a segment and the vertex of a spherical crown of the cap body protrudes out of the cap body, and the cap is provided with a through hole for a needle body of the thimble to pass through; the utility model discloses the structure that changes traditional cap makes thimble cap can effectual separation chip and bottom pad pasting.

Description

Spherical thimble cap

Technical Field

The utility model relates to a mounting device particularly, relates to a spherical thimble cap.

Background

In the chip mounting process, a chip film with a chip is placed on the thimble cap in an adsorbing mode, and a thimble is arranged inside the cap body of the thimble cap and used for ejecting the chip to be sucked out by a certain distance so that the chip can be sucked.

The cap of the conventional thimble cap is divided into two types: one is a cap with an annular groove, the other is a planar cap with holes, but when the two caps are relatively high in stickiness to a film, the ejector pins are required to provide enough energy to separate the chip and the film, but when the ejector pins are relatively high in stickiness, collision is easy to occur between adjacent chips to cause edge cracking of the chip; further, when the chip size is large or the adhesion of the adhesive film is unstable, the chip is not easily picked up, and when the chip is picked up, the chip is rotated or displaced to suspend the chip.

Chinese utility model patent publication No. CN202159655U specifically discloses a chip mounter thimble, its cap is smooth planar structure, when the pad pasting viscosity is great or chip size is great, can not effectual messenger's chip and bottom pad pasting separation.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a spherical thimble cap makes thimble cap can effectual separation chip and bottom pad pasting through the structure that changes traditional cap.

The embodiment of the utility model is realized like this: a spherical thimble cap comprises a cap body for accommodating a thimble, wherein one end of the cap body is provided with a cap, the cap is a segment of a sphere, the top point of a spherical crown of the cap body protrudes out of the cap body, and the cap is provided with a through hole for a needle body of the thimble to pass through.

Further, the top of the cap is a plane parallel to the bottom surface of the ball segment.

Further, the through hole is perpendicular to the bottom surface of the cap.

Furthermore, the through holes are circumferentially distributed by taking the top point of the spherical crown of the cap as the center, the number of distributed circles of the through holes is more than or equal to 2, and the top point of the spherical crown of the cap is provided with the through holes.

Furthermore, the top of the through hole of the outer ring is higher than the upper top surface of the cap body or is flush with the upper top surface of the cap body.

Furthermore, the number of the thimbles is more than or equal to 1.

Further, the top surface of the cap body is provided with a mounting groove, and the bottom surface edge of the cap is provided with a mounting block matched with the mounting groove.

Furthermore, the mounting groove is provided with a chamfer angle close to the outer wall of the cap body, and one side of the chamfer angle is contacted with the mounting block.

Further, the chamfer angle is a 45-degree chamfer angle.

The utility model has the advantages that: the utility model provides a spherical thimble cap changes the structure of cap into the segment from the flat board, and when the chip pad pasting was pushed up on the thimble, the cap of segment shape can give a slight deformation of pad pasting, makes the chip pad pasting can have a decurrent pretension, pushes up in the cooperation thimble, can effectual messenger's chip and pad pasting separation.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a cross-sectional view of a spherical spike cap provided in accordance with one embodiment;

FIG. 2 is a top view of a spherical cap provided in accordance with one embodiment;

FIG. 3 is a partial perspective view of a spherical spike cap according to one embodiment;

FIG. 4 is a schematic diagram illustrating a comparative use of a spherical thimble cap and a conventional cap according to an embodiment;

FIG. 5 is a cross-sectional view of the spherical spike cap provided in accordance with the second embodiment;

FIG. 6 is a cross-sectional view of the spherical thimble cap provided in the third embodiment;

FIG. 7 is a cross-sectional view of the spherical spike cap provided in the fourth embodiment;

in the figure: 100-cap, 110-through hole, 120-mounting block, 200-cap body, 210-chamfer, 300-thimble, 400-pad pasting, 500-chip, 600-mounting groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "inside" and "outside" are used for indicating the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the utility model is usually placed when using, and are only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or element to be referred must have a specific position, be constructed and operated in a specific position, and thus should not be construed as limiting the present invention.

The first embodiment is as follows:

referring to fig. 1, a spherical thimble cap includes a cap 100, a cap 200, and a thimble 300 disposed inside the cap 200, wherein the cap 100 is a segment and a top of a spherical surface thereof protrudes from the cap 200; the cap 100 is provided with a through hole 110 for the needle body of the thimble to pass through, the thimble 300 is ejected out of the through hole 110, and the through hole 110 is also used as a flow channel of air in the cap body 200; the spherical segment comprises a spherical crown and a bottom surface; referring to fig. 4, on the premise of the same-size thimble cap, that is, the diameter of the cross section of the cap body 200 is L, the upper-jacked segment-shaped cap 100 has a proper jacking force on the adhesive film 400 under the vacuum adsorption effect in the cap body 200, so that the adhesive film 400 is slightly deformed, and the length of the upper-jacked segment-shaped cap extends to L', so that the adhesive film 400 has a downward pre-tightening force, and at the same time, the number of chips 500 in a unit area is unchanged, and the chips 500 are jacked out from the through holes 110 by matching with the thimble 300, so that the chips 500 are separated from the adhesive film 400 by a larger acting force; in the conventional planar cap with the same size, the length of the film 400 is always L, so that the pre-tightening force is not present.

Specifically, referring to fig. 2 and 3, the through holes 110 are perpendicular to the bottom surface of the cap 100 and circumferentially distributed with the highest point of the cap 100 as a center, the number of distributed circles is greater than or equal to 2, and the top point of the spherical crown of the cap 100 is provided with the through holes 110 for matching with the ejector pins 300, in this embodiment, the number of the ejector pins 300 is 1, but may be multiple in other embodiments; referring to FIG. 3, the top of the through hole 110 of the outer ring is higher than the upper top surface H of the cap body 200 by a distance H which is not less than 0; when the adhesive film 400 contacts the segment-shaped cap 100, the chip 500 is prevented from being damaged due to direct contact with the corner of the cap 200 under the vacuum absorption effect in the cap 200.

Specifically, referring to fig. 3, in the present embodiment, the top surface of the cap body 200 is provided with an installation groove 600, the installation groove 600 is located on the inner wall of the cap body 200, the cap body 200 is pressed mainly by the deformation of the cap 100 itself to fix the cap 100 on the cap body 200, the edge of the cap 100 is provided with an installation block 120 used in cooperation with the installation groove 600 for better detachable installation on the cap body 200, the shape of the installation block 120 is not particularly limited, but may not be provided as such in other embodiments; the installation groove 600 is provided with a 45-degree chamfer 210 near the outer wall of the cap body 200, one side of the chamfer 210 is in contact with the installation block 120, and damage caused by direct contact between the chip 500 and the 90-degree corner of the cap body 200 under the action of vacuum adsorption in the cap body 200 when the film 400 is in contact with the cap 100 is avoided.

Example two:

the present embodiment is substantially the same as the embodiment, as shown in fig. 5, and the main difference is that the cap 100 and the cap body 200 are installed differently; specifically, the top surface of the cap body 200 is provided with an installation groove 600, the installation groove 600 is located in the middle of the top surface of the cap body 200, the cap 100 is fixed on the cap body 200 mainly by clamping the installation block 120 at the groove position of the installation groove 600, the edge of the cap 100 is provided with the installation block 120 used in cooperation with the installation groove 600 for better detachable installation on the cap body 200, the shape of the installation block 120 is not particularly limited, and certainly, the installation block may not be provided as such in other embodiments; the installation groove 600 is provided with a 45-degree chamfer 210 near the outer wall of the cap body 200, one side of the chamfer 210 is in contact with the upper surface of the installation block 120, and damage caused by direct contact between the chip 500 and the 90-degree corner of the cap body 200 under the action of vacuum adsorption in the cap body 200 when the film 400 is in contact with the cap 100 is avoided.

Example three:

the present embodiment is substantially the same as the embodiment, as shown in fig. 6, and the main difference is that the cap 100 and the cap body 200 are installed differently; specifically, the top surface of the cap body 200 is provided with an installation groove 600, the installation groove 600 is located in the middle of the top surface of the cap body 200, the cap 100 is clamped and fixed on the cap body 200 mainly through elastic deformation of the cap 100, an installation block 120 used in cooperation with the installation groove 600 is arranged at the edge of the cap 100 and used for being detachably installed on the cap body 200, and the shape of the installation block 120 is not particularly limited; the installation groove 600 is provided with a 45-degree chamfer 210 near the outer wall of the cap body 200, one side of the chamfer 210 is in contact with the lower surface of the installation block 120, and damage caused by direct contact between the chip 500 and the 90-degree corner of the cap body 200 under the action of vacuum adsorption in the cap body 200 when the film 400 is in contact with the cap 100 is avoided.

Example four:

this embodiment is generally consistent with the first embodiment; the main difference is that, as shown in fig. 7, the top of the segment-shaped cap 100 is a plane parallel to the bottom of the segment, specifically, the plane is a circle with a diameter R, and the plane with the diameter R covers two innermost circles of through holes 110, so as to ensure that when the thimble 300 appears in the middle through hole 110, the outer circle of through holes 110 have a permanent adsorption force on the film 400.

When the top via 110 adsorbs the chip 500, since the chip 500 cannot be bent, when the segment-shaped cap 100 of the first embodiment is made of a plastic material, the cap 100 has a relative gap with respect to the chip 500, and the best adsorption effect cannot be achieved; the diameter is the plane of R and has increased the contact surface of cap top to pad pasting 400, the change increases with the chip 500 between the contact surface, has reduced foretell relative clearance, has increased the adsorption affinity, more is favorable to cooperating the thimble to push up, makes chip and pad pasting separation.

It should be noted that, in the first to third embodiments, when the segment-shaped cap 100 is made of an elastic material, the cap 100 may deform slightly at the top to effectively ensure the contact area with the film 400, reduce the relative gap, increase the adsorption force, and facilitate the upward ejection of the ejector pin to separate the chip from the film.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a spherical thimble cap, includes the cap body that is used for the holding thimble, cap body one end is equipped with cap, its characterized in that: the cap is a segment of a sphere, the top point of a spherical crown of the cap protrudes out of the cap body, and the cap is provided with a through hole for the needle body of the thimble to pass through.

2. The spherical thimble cap of claim 1, wherein: the top of the cap is a plane which is parallel to the bottom surface of the ball segment.

3. A spherical thimble cap according to claim 1 or claim 2, wherein: the through hole is perpendicular to the bottom surface of the cap.

4. The spherical thimble cap of claim 3, wherein: the through holes are circumferentially distributed by taking the top point of the spherical crown of the cap as a center, the number of distributed circles of the through holes is more than or equal to 2, and the top point of the spherical crown of the cap is provided with the through holes.

5. The spherical thimble cap of claim 4, wherein: the top of the through hole of the outer ring is higher than the upper top surface of the cap body or is flush with the upper top surface of the cap body.

6. A spherical thimble cap according to claim 1 or claim 2, wherein: the number of the thimbles is more than or equal to 1.

7. A spherical thimble cap according to claim 1 or claim 2, wherein: the top surface of the cap body is provided with a mounting groove, and the edge of the bottom surface of the cap body is provided with a mounting block matched with the mounting groove.

8. The spherical thimble cap of claim 7, wherein: the mounting groove is provided with a chamfer angle close to the outer wall of the cap body, and one side of the chamfer angle is in contact with the mounting block.

9. The spherical thimble cap of claim 8, wherein: the chamfer angle is a 45 degree chamfer angle.