CN210745547U - Electronic device - Google Patents
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- CN210745547U CN210745547U CN201921864307.0U CN201921864307U CN210745547U CN 210745547 U CN210745547 U CN 210745547U CN 201921864307 U CN201921864307 U CN 201921864307U CN 210745547 U CN210745547 U CN 210745547U
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- mems microphone
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- 239000002184 metal Substances 0.000 claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 19
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 19
- 238000003466 welding Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
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Abstract
The utility model provides an electronic device, including the MEMS microphone and with the terminal equipment that the MEMS microphone was assembled mutually, wherein, terminal equipment includes the FPC board, the MEMS microphone includes the packaging structure who is formed by metal casing and PCB board, wherein, sets up the MEMS chip on the inside PCB board of packaging structure, is provided with the sound hole with the corresponding position of MEMS chip on the PCB board, wherein, the FPC board sets up the side at the PCB board to PCB board and FPC board structure as an organic whole, the FPC board is located packaging structure's external environment. Utilize the utility model discloses, can solve the problem that MEMS microphone assembly yield is low, assembly efficiency is low and assembly cost is high.
Description
Technical Field
The utility model relates to an acoustoelectric technology field, more specifically relates to an electronic device, especially relates to an electronic device of MEMS microphone and FPC board assembly.
Background
With the progress of society and the development of technology, in recent years, the volume of electronic products such as mobile phones and notebook computers is continuously reduced, and people have higher and higher performance requirements on the portable electronic products, so that the volume of electronic parts matched with the portable electronic products is continuously reduced, and the performance and consistency are continuously improved. MEMS microphones integrated by MEMS (Micro-Electro-Mechanical-System, MEMS for short) technology are beginning to be applied to electronic products such as mobile phones and notebook computers in batches, and the packaging volume thereof is smaller than that of the conventional electret microphone, so that they are popular among most microphone manufacturers.
Fig. 1 illustrates a conventional MEMS microphone assembly structure, as shown in fig. 1, the conventional MEMS microphone structure includes a package structure composed of a metal case 1 ' and a PCB 2 ', an ASIC chip 4 ' and a MEMS chip 3 ' are disposed on the PCB 2 ' inside the package structure, the MEMS chip 3 ' is fixed to the PCB 2 ' by glue, the MEMS chip 3 ' is electrically connected to the ASIC chip 4 ' by a metal wire, and the ASIC chip 4 ' is electrically connected to the PCB 2 ' by a metal wire; on the PCB 2 ', at a position corresponding to the MEMS chip 3', there is provided a sound hole 7 'communicating with the outside, at the bottom of the PCB 2', that is: an FCB board 8 'is provided under the PCB board 2' outside the encapsulation structure, and the PCB board and the FPC board of the terminal device are electrically connected together through pads 9 'of the PCB board 2', that is: the MEMS microphone is electrically connected to the terminal device through the bonding pad 9'.
In the embodiment shown in fig. 1, when the MEMS microphone is assembled with the terminal device, SMT (surface mount Technology, chinese name: surface mount Technology) is used, that is: the PCB board 2 'of the MEMS microphone is electrically connected to the FCB board 8' through the pads 9 ', the FCB board 8' being a part of the component of the terminal equipment. In addition, a through hole 10 'is provided in the FCB plate 8' at a position corresponding to the sound hole 7 ', and the MEMS chip 3' communicates with the outside through the sound hole 7 'and the through hole 10'.
Therefore, the traditional MEMS microphone adopts the SMT technology to assemble the MEMS microphone to the terminal device, and the bonding pad is required to be welded, and the assembly method has a generally low welding yield, thereby reducing the assembly efficiency of the MEMS microphone and causing cost loss.
In order to solve the above problems, an electronic device with an assembled MEMS microphone and a terminal device is needed.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to an electronic device to solve the problems of low assembly yield, low assembly efficiency and high assembly cost of MEMS microphones.
The utility model provides an electronic device, comprising an MEMS microphone and a terminal device assembled with the MEMS microphone, wherein, the terminal device comprises an FPC board, the MEMS microphone comprises a packaging structure formed by a metal shell and a PCB board, wherein,
arranging an MEMS chip on a PCB inside the packaging structure, arranging a sound hole on the PCB corresponding to the MEMS chip, wherein,
the FPC board sets up the side of PCB board, and the PCB board with FPC board structure as an organic whole, the FPC board is located packaging structure's external environment.
In addition, the preferred structure is that the PCB and the FPC are integrated into an integral structure through a press-fitting process.
In addition, the terminal device preferably further includes another component, and the FPC board is electrically connected to the other component of the terminal device.
In addition, it is preferable that an ASIC chip is further provided on the PCB inside the package structure, wherein,
the ASIC chip and the MEMS chip are fixed on the PCB through glue respectively.
In addition, the MEMS chip and the ASIC chip, and the ASIC chip and the PCB board are electrically connected by metal wires.
In addition, the preferable structure is that the cavity formed by the MEMS chip and the PCB is a front cavity of the MEMS microphone;
and a sealed space formed by the metal shell and the PCB is a rear cavity of the MEMS microphone.
In addition, it is preferable that the metal case is fixed to the PCB by solder paste.
According to the above technical scheme, the utility model provides an electronic device makes into integrated into one piece's structure through the FPC board with the PCB board in the MEMS microphone and terminal equipment, compares in traditional MEMS microphone's SMT welding assembly mode, the utility model discloses an electronic device is owing to become a body structure with PCB board and FPC board design, need not be connected PCB board and FPC board electricity through the pad to improve the yield of assembly efficiency and assembly, can also reduce assembly cost simultaneously.
Drawings
Other objects and results of the invention will be more apparent and readily appreciated by reference to the following specification taken in conjunction with the accompanying drawings, and as the invention is more fully understood. In the drawings:
FIG. 1 is a cross-sectional view of a conventional MEMS microphone assembly;
fig. 2 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.
Wherein the reference numerals include: 1. metal casing, 2, PCB board, 3, MEMS chip, 4, SAIC chip, 5, metal wire, 6, metal wire, 7, sound hole, 8, FPC board, 1 ', metal casing, 2 ', PCB board, 3 ', MEMS chip, 4 ', SAIC chip, 5 ', metal wire, 6 ', metal wire, 7 ', sound hole, 9 ', bonding pad, 10 ', through-hole.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
To the aforesaid traditional MEMS microphone mounting means that provides, the problem that the assembly yield is low, assembly efficiency is low and assembly cost is high the utility model provides an electron device makes into integrated into one piece's structure through the FPC board with PCB board in the MEMS microphone and terminal equipment to solve above-mentioned problem.
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
To illustrate the structure of the electronic device provided by the present invention, fig. 2 shows a cross-sectional structure of the electronic device according to an embodiment of the present invention.
As shown in fig. 2, the present invention provides an electronic device, which includes a MEMS microphone and a terminal device assembled with the MEMS microphone, wherein the terminal device includes an FPC Board 8, and the MEMS microphone includes a package structure formed by a metal housing 1 and a PCB Board 2(printed circuit Board).
Among them, the FPC (Flexible Printed Circuit), which is a name of chinese, has the characteristics of high wiring density, light weight, and thin thickness, and is mainly applied to many electronic products such as mobile phones, notebook computers, PDAs, digital cameras, microphones, and the like. The FPC board is made of polyimide or polyester film as a base material.
The MEMS microphone comprises a packaging structure, a PCB (printed circuit board) 2, an MEMS chip 3, a sound hole 7, a microphone body and a microphone body, wherein the MEMS chip 3 is arranged on the PCB 2 in the packaging structure, the sound hole 7 is arranged at a position, corresponding to the MEMS chip 3, on the PCB 2, and a cavity formed by the MEMS chip 3 and the PCB 2 is a front cavity of the MEMS microphone; the sealed space formed by the metal shell 1 and the PCB 2 is the back cavity of the MEMS microphone.
Wherein, FPC board 8 sets up the side at PCB board 2 to PCB board 2 and FPC board 8 structure as an organic whole, FPC board 8 is arranged in packaging structure's external environment. The PCB 2 and the FPC 8 are integrated into a whole through a pressing process. The PCB 2 is formed by superposing a top layer, a bottom layer and at least two layers of middle layers between the bottom layer and the bottom layer, the FPC board 12 is also formed by laminating different layers, and the PCB 2 and the FPC board 12 are pressed together to form an integral structure.
In the embodiment of the present invention, the terminal device further includes other components, and the FPC board is electrically connected to the other components of the terminal device; when the MEMS microphone was in the assembly, the MEMS microphone passed through PCB board, FPC board and terminal equipment electricity and is connected, the utility model discloses an electron device (MEMS microphone and terminal equipment) assembly mode compares in the SMT welding assembly mode of traditional MEMS microphone in the embodiment that figure 1 shows, the utility model discloses an MEMS microphone is connected with terminal equipment and does not need the pad to carry out the pad to improve and change and join in marriage efficiency and assembly cost.
Furthermore, the embodiment of the present invention provides an ASIC chip 4 on the PCB 2 inside the package structure, wherein the ASIC chip 4 and the MEMS chip 3 are fixed on the PCB 2 by glue respectively. The MEMS chip 3 and the ASIC chip 4, and the ASIC chip 4 and the PCB board 2 are electrically connected through metal wires, namely: the MEMS chip 3 is electrically connected with the ASIC chip 4 through a metal wire 5, and the ASIC chip 4 is electrically connected with the PCB 2 through a metal wire 6; and the metal case 1 is fixed to the PCB 2 by solder paste.
In the embodiment of the present invention, sound acts on the MEMS chip 3 through the sound hole 7; the MEMS chip 3 converts the received sound signals into analog signals and transmits the analog signals to the ASIC chip 4 through a metal wire 5; the ASIC chip 4 converts the received analog signal into a digital signal, performs signal amplification, calibration and other processing, transmits the processed digital signal to the PCB 2 through the metal wire 6, and simultaneously, the digital signal in the PCB 2 is directly transmitted to the FPC board of the terminal device, thereby realizing that the signal is directly transmitted to the terminal device through the PCB board.
Can find out through above-mentioned embodiment, the utility model provides an electronic device makes into integrated into one piece's structure through the FPC board with the PCB board in the MEMS microphone and terminal equipment, compares in traditional MEMS microphone's SMT welding assembly mode, the utility model discloses an electronic device is owing to become a body structure with PCB board and FPC board design, need not be connected PCB board and FPC board electricity through the pad to improve the yield of assembly efficiency and assembly, can also reduce assembly cost simultaneously.
The electronic device according to the present invention has been described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various modifications can be made to the electronic device proposed by the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.
Claims (7)
1. An electronic device comprising a MEMS microphone and a terminal device assembled with the MEMS microphone, wherein the terminal device comprises an FPC board, the MEMS microphone comprises an encapsulation structure formed by a metal housing and a PCB board, wherein,
arranging an MEMS chip on a PCB board in the packaging structure, arranging a sound hole on the PCB board corresponding to the MEMS chip, and arranging a sound hole on the PCB board,
the FPC board sets up the side of PCB board, and the PCB board with FPC board structure as an organic whole, the FPC board is located packaging structure's external environment.
2. The electronic device of claim 1,
the PCB and the FPC board are integrated into an integrated structure through a pressing process.
3. The electronic device of claim 1,
the terminal equipment also comprises other parts, and the FPC board is electrically connected with the other parts of the terminal equipment.
4. The electronic device of claim 1,
an ASIC chip is also arranged on the PCB inside the packaging structure, wherein,
the ASIC chip and the MEMS chip are fixed on the PCB through glue respectively.
5. The electronic device of claim 4,
the MEMS chip and the ASIC chip and the PCB are electrically connected through metal wires.
6. The electronic device of claim 1,
a cavity formed by the MEMS chip and the PCB is a front cavity of the MEMS microphone;
and a sealed space formed by the metal shell and the PCB is a rear cavity of the MEMS microphone.
7. The electronic device of claim 1,
the metal shell is fixed with the PCB through solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921864307.0U CN210745547U (en) | 2019-10-30 | 2019-10-30 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921864307.0U CN210745547U (en) | 2019-10-30 | 2019-10-30 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210745547U true CN210745547U (en) | 2020-06-12 |
Family
ID=71009337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921864307.0U Active CN210745547U (en) | 2019-10-30 | 2019-10-30 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210745547U (en) |
-
2019
- 2019-10-30 CN CN201921864307.0U patent/CN210745547U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200617 Address after: Room 103, No. 396, Songling Road, Laoshan District, Qingdao City, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |