CN210721317U - Computer motherboard hardware heat dissipation processing apparatus - Google Patents
Computer motherboard hardware heat dissipation processing apparatus Download PDFInfo
- Publication number
- CN210721317U CN210721317U CN202020036277.0U CN202020036277U CN210721317U CN 210721317 U CN210721317 U CN 210721317U CN 202020036277 U CN202020036277 U CN 202020036277U CN 210721317 U CN210721317 U CN 210721317U
- Authority
- CN
- China
- Prior art keywords
- plate
- fixed
- heat dissipation
- roof
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer motherboard hardware heat dissipation processing apparatus, including the mounting panel, mounting panel top and bottom symmetry are provided with the bolt, and mounting panel one side top is fixed with the roof, and mounting panel one side bottom is fixed with the bottom plate, and roof and bottom plate intermediate position are fixed with same host computer body, and host computer body one side is provided with fixed otter board, and fixed otter board inside is provided with the U-shaped pipe, fixed otter board top and bottom respectively with roof and bottom plate nested connection, and roof one side is provided with fixed establishment. The utility model discloses in be provided with fixed otter board in host computer body one side, fixed otter board inside is provided with the U-shaped pipe, fixed otter board top and bottom respectively with roof and bottom plate nested connection, the inside water that is equipped with of U-shaped pipe, the outside aluminum alloy that the heat conductivity is strong that uses can increase the area of contact with the host computer body, absorbs the heat fast to reach good radiating effect.
Description
Technical Field
The utility model relates to a heat abstractor technical field especially relates to a computer motherboard hardware heat dissipation processing apparatus.
Background
At present, a computer is an electronic computing machine for high-speed computing, can perform numerical computation and logic computation, and also has a memory function, and is a modern intelligent electronic device capable of automatically and high-speed processing mass data according to program operation. Computers have had an extremely important impact on human productivity and social activities and have been rapidly developed with great vitality.
A computer motherboard is one of the most basic and important components of a computer, and main circuit systems constituting the computer are mounted on the motherboard. In order to avoid damage of computer motherboard hardware due to over-high temperature, the computer motherboard hardware needs to be subjected to heat dissipation treatment, so that heat generated by the computer motherboard hardware is quickly dissipated into the air, and the heat dissipation effect of the conventional heat dissipation device still needs to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a computer mainboard hardware heat dissipation processing device.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a computer motherboard hardware heat dissipation processing apparatus, includes the mounting panel, mounting panel top and bottom symmetry are provided with the bolt, and mounting panel one side top is fixed with the roof, and mounting panel one side bottom is fixed with the bottom plate, and roof and bottom plate intermediate position are fixed with same host computer body, and host computer body one side is provided with fixed otter board, and fixed otter board inside is provided with the U-shaped pipe, fixed otter board top and bottom respectively with roof and bottom plate nested connection, and roof one side is provided with fixed establishment.
Preferably, one side of the top plate and one side of the bottom plate are connected with the same cover plate, and the nesting connection part of the cover plate and the top plate and the bottom plate is provided with a convex block.
Preferably, the fixing mechanism is provided with a first buckle plate at the symmetrical positions of the top plate and the bottom plate, the cover plate is provided with a second buckle plate at the top and the bottom of one side close to the first buckle plate, and the second buckle plate is buckled with the first buckle plate.
Preferably, first ventilation hole has been seted up to roof and bottom plate symmetry, and first ventilation hole exit position is provided with the second screen panel.
Preferably, the cover plate is internally provided with a groove, a fan is fixed in the groove, and one side of the fan is provided with a first mesh enclosure.
Preferably, a second ventilation hole is formed in one side, close to the mounting plate, of the main machine body, and a third mesh enclosure is arranged in the second ventilation hole.
Preferably, a cold air blower is fixed on one side of the mounting plate and connected with an air guide pipe, a plurality of exhaust pipes are arranged on one side of the air guide pipe, fine through holes are formed in the exhaust pipes, and an air homogenizing plate is arranged inside the air guide pipe.
The utility model has the advantages that:
1. the device is provided with fixed otter board in host computer body one side, and fixed otter board is inside to be provided with the U-shaped pipe, and water is equipped with to U-shaped intraduct, and the outside uses the aluminum alloy that the heat conductivity is strong, can increase the area of contact with the host computer body, absorbs the heat, fixed otter board top and bottom respectively with roof and bottom plate nested connection, can be through starting the fan, and the wind blows to the U-shaped pipe and discharges from first ventilation hole to reach good radiating effect.
2. Be provided with the air-cooler in the device, the air-cooler starts the back, and exhaust cold wind blows to the host computer body from the exhaust pipe through the guide duct, takes away the heat from the second venthole to further reach radiating effect.
3. The device is provided with fine and close through-hole on the exhaust pipe, and the inside even air board that is provided with of guide duct can make cold wind evenly arrange to each exhaust pipe, through fine and close through-hole, can make the wind direction spread on every side to increase the area of contact with the host computer body, thereby further reach radiating effect.
Drawings
Fig. 1 is a schematic view of an overall structure of a computer motherboard hardware heat dissipation processing apparatus according to embodiment 1 of the present invention;
fig. 2 is a schematic view of an overall structure of a computer motherboard hardware heat dissipation processing apparatus according to embodiment 2 of the present invention;
fig. 3 is a schematic view of an exhaust pipe structure of a computer motherboard hardware heat dissipation processing apparatus according to embodiment 2 of the present invention.
In the figure: the air purifier comprises a mounting plate 1, a top plate 2, a bottom plate 3, a host machine body 4, a first buckle plate 5, a cover plate 6, a second buckle plate 7, a bump 8, a fan 9, a first mesh enclosure 10, a first vent hole 11, a second mesh enclosure 12, a fixed mesh plate 13, a U-shaped pipe 14, a second vent hole 15, a third mesh enclosure 16, bolts 17, an air cooler 18, an air guide pipe 19, an exhaust pipe 20 and an air homogenizing plate 21.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1, a computer motherboard hardware heat dissipation processing apparatus, including mounting panel 1, mounting panel 1 top and bottom symmetry are provided with bolt 17, mounting panel 1 one side top is fixed with roof 2, mounting panel 1 one side bottom is fixed with bottom plate 3, roof 2 and bottom plate 3 intermediate position are fixed with same host computer body 4, host computer body 4 one side is provided with fixed otter board 13, fixed otter board 13 is inside to be provided with the U-shaped pipe 14, fixed otter board 13 top and bottom respectively with roof 2 and bottom plate 3 nested connection, roof 2 one side is provided with fixed establishment.
In the utility model, one side of the top plate 2 and one side of the bottom plate 3 are connected with the same cover plate 6, the nested connection part of the cover plate 6, the top plate 2 and the bottom plate 3 is provided with a lug 8, the symmetrical positions of the top plate 2 and the bottom plate 3 of the fixing mechanism are provided with a first buckle plate 5, the top and the bottom of the cover plate 6 close to one side of the first buckle plate 5 are symmetrically provided with a second buckle plate 7, and the second buckle plate 7 is buckled with the first buckle plate 5, thereby the cover plate 6 is convenient to;
The working principle is as follows: in the idle position of the device, all driving parts, which refer to power elements, electric devices and adaptive power supplies, are connected through leads, the specific connecting means refers to the following working principle that the electric connection is completed among the electric devices in sequence, the detailed connection means is the known technology in the field, the following mainly describes the working principle and the process, the electric control is not explained, in the device, a fixed screen 13 is arranged on one side of a main body 4, a U-shaped pipe 14 is arranged inside the fixed screen 13, water is filled inside the U-shaped pipe 14, aluminum alloy with strong heat conductivity is used outside the U-shaped pipe, the contact area between the fixed net plate 13 and the main body 4 can be increased, the fixed net plate can absorb heat, the top and the bottom of the fixed net plate 13 are respectively connected with the top plate 2 and the bottom plate 3 in a nested way, namely, by starting the fan 9, the wind blows toward the U-shaped pipe 14 and is discharged from the first vent hole 11, thereby achieving a good heat dissipation effect.
Example 2
Referring to fig. 2-3, a heat dissipation processing device for computer motherboard hardware, a cooling fan 18 is fixed on one side of a mounting plate 1, the cooling fan 18 is connected with an air duct 19, a plurality of exhaust ducts 20 are arranged on one side of the air duct 19, fine through holes are arranged on the exhaust ducts 20, and an air homogenizing plate 21 is arranged inside the air duct 19.
The working principle is as follows: be provided with air-cooler 18 in the device, after air-cooler 18 started, exhaust cold wind blows to host computer body 4 from exhaust pipe 20 through guide duct 19, take the heat away from second vent 15, thereby further reach radiating effect, be provided with fine and close through-hole on the exhaust pipe 20, the inside even air board 21 that is provided with of guide duct 19, can make cold wind evenly arrange to each exhaust pipe 20, through fine and close through-hole, can make the wind direction spread around, thereby increase the area of contact with host computer body 4, thereby further reach radiating effect.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The utility model provides a computer motherboard hardware heat dissipation processing apparatus, includes mounting panel (1), a serial communication port, mounting panel (1) top and bottom symmetry are provided with bolt (17), mounting panel (1) one side top is fixed with roof (2), mounting panel (1) one side bottom is fixed with bottom plate (3), roof (2) and bottom plate (3) intermediate position are fixed with same host computer body (4), host computer body (4) one side is provided with fixed otter board (13), fixed otter board (13) inside is provided with U-shaped pipe (14), fixed otter board (13) top and bottom respectively with roof (2) and bottom plate (3) nested connection, roof (2) one side is provided with fixed establishment.
2. The computer motherboard hardware heat dissipation processing device as claimed in claim 1, wherein the same cover plate (6) is connected to one side of the top plate (2) and one side of the bottom plate (3), and a convex block (8) is arranged at the nesting connection position of the cover plate (6) and the top plate (2) and the bottom plate (3).
3. The computer motherboard hardware heat dissipation processing device as claimed in claim 2, wherein the fixing mechanism is provided with a first buckle plate (5) at a symmetrical position of the top plate (2) and the bottom plate (3), a second buckle plate (7) is symmetrically provided at the top and the bottom of the cover plate (6) close to one side of the first buckle plate (5), and the second buckle plate (7) is fastened with the first buckle plate (5).
4. The heat dissipation processing device for computer motherboard hardware as claimed in claim 3, wherein the top plate (2) and the bottom plate (3) are symmetrically provided with first ventilation holes (11), and a second mesh enclosure (12) is disposed at an outlet of the first ventilation holes (11).
5. The heat dissipation device for hardware on a computer motherboard according to claim 4, wherein the cover plate (6) has a recess therein, the fan (9) is fixed in the recess, and the first mesh enclosure (10) is disposed on one side of the fan (9).
6. The heat dissipation processing device for computer motherboard hardware as recited in claim 4 or 5, wherein a second ventilation hole (15) is disposed on one side of the host body (4) close to the mounting plate (1), and a third mesh enclosure (16) is disposed in the second ventilation hole (15).
7. The computer motherboard hardware heat dissipation processing device as claimed in claim 6, wherein a cold air blower (18) is fixed on one side of the mounting plate (1), the cold air blower (18) is connected with an air duct (19), a plurality of exhaust ducts (20) are arranged on one side of the air duct (19), fine through holes are arranged on the exhaust ducts (20), and an air uniform plate (21) is arranged inside the air duct (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020036277.0U CN210721317U (en) | 2020-01-09 | 2020-01-09 | Computer motherboard hardware heat dissipation processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020036277.0U CN210721317U (en) | 2020-01-09 | 2020-01-09 | Computer motherboard hardware heat dissipation processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210721317U true CN210721317U (en) | 2020-06-09 |
Family
ID=70934829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020036277.0U Expired - Fee Related CN210721317U (en) | 2020-01-09 | 2020-01-09 | Computer motherboard hardware heat dissipation processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210721317U (en) |
-
2020
- 2020-01-09 CN CN202020036277.0U patent/CN210721317U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209821768U (en) | Computer radiator device | |
| CN110446404A (en) | A kind of radar radiator structure | |
| CN210721317U (en) | Computer motherboard hardware heat dissipation processing apparatus | |
| CN208596352U (en) | A kind of computer chip water cooling plant | |
| CN212302406U (en) | PC host case capable of realizing efficient heat dissipation | |
| CN211506403U (en) | Heat radiator for big data processor | |
| CN211352903U (en) | Power amplifier capable of effectively dissipating heat | |
| CN210294963U (en) | Virtual digital currency processing apparatus | |
| JP2810153B2 (en) | Electronic device cooling structure | |
| CN214751760U (en) | Computer electronic component cooling device | |
| CN217133664U (en) | Water-cooled heat abstractor for computer | |
| CN209928357U (en) | Device for computer heat dissipation and heat dissipation mechanism | |
| CN105468115A (en) | Quick heat dissipation device for CPU (central processing unit) of computer | |
| CN212364942U (en) | Computer host air ducting | |
| CN111077958A (en) | Computer case air exhaust system and air exhaust method | |
| CN218735746U (en) | Board-level liquid cooling machine case | |
| CN219831812U (en) | PCIE acceleration card for computer | |
| CN215932491U (en) | Novel notebook refrigeration plant | |
| CN212850292U (en) | Precision inverter welding power supply with double cooling systems | |
| CN211210107U (en) | Power pack and power | |
| CN212084098U (en) | Computer hardware heat abstractor | |
| CN220962285U (en) | Intelligent network access terminal industrial personal computer | |
| CN216596172U (en) | Industrial computer with built-in temperature control and cooling device | |
| CN213694619U (en) | Integrated circuit tester convenient for heat dissipation | |
| CN217543787U (en) | Heat radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200609 Termination date: 20210109 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |