CN210702061U

CN210702061U - Antidetonation support accessory mould with heat dissipation function

Info

Publication number: CN210702061U
Application number: CN201921325228.2U
Authority: CN
Inventors: 刘亮
Original assignee: Guangzhou Palang Building Decoration Engineering Co Ltd
Current assignee: Guangzhou Palang Building Decoration Engineering Co Ltd
Priority date: 2019-08-15
Filing date: 2019-08-15
Publication date: 2020-06-09
Anticipated expiration: 2029-08-15

Abstract

The utility model discloses an antidetonation support accessory mould with heat dissipation function, including first mould and second mould, the back of first mould and second mould all is equipped with the casing, is located the upper and lower both ends of one side casing of first mould communicate respectively has feed liquor pipe and drain pipe, liquid outlet and leakage fluid dram have been seted up respectively to one side of feed liquor pipe and drain pipe, the inside of second mould run through have with feed liquor pipe and drain pipe assorted through-hole, the fin is all installed to the inside of casing, the heat-conducting plate is installed to the tip of fin, one side of fin is equipped with the semiconductor refrigeration piece. The utility model discloses a back at first mould and second mould sets up the casing, and first mould and second mould are linked together through feed liquor pipe, drain pipe and through-hole, lets in cooling medium such as refrigerant, water in to the casing through the feed liquor pipe, cools down for first mould and second mould, improves the production efficiency of antidetonation support accessory.

Description

Antidetonation support accessory mould with heat dissipation function

Technical Field

The utility model relates to an antidetonation support technical field specifically is an antidetonation support accessory mould with heat dissipation function.

Background

The anti-seismic support limits the displacement of the attached electromechanical engineering facilities, controls the vibration of the facilities and transmits the load to various components or devices on the bearing structure. When meeting the earthquake of earthquake fortification intensity in local area, the building water supply and drainage, fire control, heating, ventilation, air conditioning, gas, heating power, electric power, communication and other electromechanical engineering facilities after earthquake fortification can achieve the aims of lightening earthquake damage, reducing and preventing secondary disasters as much as possible, thereby achieving the purpose of reducing casualties and property loss.

When utilizing the mould production antidetonation support accessory, in order to increase production efficiency, can cool off the accessory mostly, adopt water-cooled mode to cool off the accessory after the shaping at present mostly, in the time of cooling rapidly, can cause the accessory internal connection not inseparable enough, cause cracked risk easily.

Disclosure of Invention

An object of the utility model is to provide an antidetonation support accessory mould with heat dissipation function sets up the casing through the back at first mould and second mould, and first mould and second mould are linked together through feed liquor pipe, drain pipe and through-hole, lets in cooling medium such as refrigerant or water through the feed liquor pipe in to the casing, cools down for first mould and second mould to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an antidetonation support accessory mould with heat dissipation function, includes first mould and second mould, the back of first mould and second mould all is equipped with the casing, is located the upper and lower both ends of one side casing of first mould communicate respectively has feed liquor pipe and drain pipe, liquid outlet and leakage fluid dram have been seted up respectively to one side of feed liquor pipe and drain pipe, the inside of second mould run through have with feed liquor pipe and drain pipe assorted through-hole, the fin is all installed to the inside of casing, the heat-conducting plate is installed to the tip of fin, one side of fin is equipped with the semiconductor refrigeration piece.

Preferably, a step surface is arranged inside the through hole.

Preferably, a gasket is bonded to the surface of the step surface.

Preferably, a heat-conducting silicone grease layer is coated between the heat-conducting plate and the semiconductor refrigerating plate.

Preferably, a protective net is welded to the outer portion of the shell.

Preferably, a fan is installed at one end of the protection net.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a set up the casing at the back of first mould and second mould, first mould and second mould are linked together through feed liquor pipe, drain pipe and through-hole, let in cooling medium such as refrigerant or water through the feed liquor pipe to the casing, cool down for first mould and second mould, improve the production efficiency of antidetonation support accessory;

2. the utility model discloses set up the fin in the casing, the fin is carried in the temperature biography in the casing, dispels the heat to the fin through the semiconductor refrigeration piece, has improved the radiating efficiency of mould.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of the area A in FIG. 1;

fig. 3 is a schematic sectional structure diagram of the second mold of the present invention.

In the figure: 1. a first mold; 2. a second mold; 3. a housing; 4. a liquid inlet pipe; 5. a liquid outlet pipe; 6. a liquid outlet; 7. a through hole; 8. a liquid discharge port; 9. a step surface; 10. a gasket; 11. a heat sink; 12. a heat conducting plate; 13. a semiconductor refrigeration sheet; 14. a thermally conductive silicone layer; 15. a protective net; 16. a fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 3, the present invention provides a technical solution: an anti-seismic support accessory die with a heat dissipation function comprises a first die 1 and a second die 2, wherein the back parts of the first die 1 and the second die 2 are respectively provided with a shell 3, the shell 3 is welded on the back parts of the first die 1 and the second die 2 in a sealing way and is regarded as a whole to prevent a cooling medium from leaking, the upper end and the lower end of the shell 3 positioned on one side of the first die 1 are respectively communicated with a liquid inlet pipe 4 and a liquid outlet pipe 5, the liquid outlet pipe 5 is divided into two sections, one section is communicated with the shell 3, the other section is positioned inside the first die 1 and is used for discharging the cooling medium, one side of the liquid inlet pipe 4 and one side of the liquid outlet pipe 5 are respectively provided with a liquid outlet 6 and a liquid discharge port 8, the liquid outlet 6 enables the cooling medium to flow into the shell 3, a through hole 7 matched with the liquid inlet pipe 4 and the liquid outlet pipe 5 penetrates through the inside of the second die 2, the end of the radiating fin 11 is provided with a heat conducting plate 12, the heat conducting plate 12 is made of copper plate and has good radiating effect, one side of the radiating fin 11 is provided with a semiconductor refrigerating sheet 13, the semiconductor refrigerating sheet 13 utilizes Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized.

Specifically, a step surface 9 is formed inside the through hole 7. The step surface 9 is advantageous for limiting the position of the liquid inlet pipe 4 and the liquid outlet pipe 5 in the through hole 7.

Specifically, a gasket 10 is bonded to the surface of the step surface 9. The sealing gasket 10 is beneficial to improving the connection tightness between the liquid inlet pipe 4 and the liquid outlet pipe 5 and the through hole 7.

Specifically, a heat conducting silicone layer 14 is coated between the heat conducting plate 12 and the semiconductor refrigerating plate 13. The heat-conducting silicone grease uses organic silicone as a main raw material, and is added with a material with excellent heat resistance and heat-conducting property, so that the heat dissipation of the heat dissipation fins 11 is facilitated.

Specifically, a protective net 15 is welded to the outside of the housing 3. The protective net 15 is beneficial to protecting the semiconductor chilling plates 13 from being damaged.

Specifically, a fan 16 is attached to one end of the protection net 15. The fan 16 can remove the heat emitted from the semiconductor cooling fins 13.

The working principle is as follows: during the use, back at first mould 1 and second mould 2 sets up casing 3, first mould 1 and second mould 2 are through feed liquor pipe 4, drain pipe 5 and through-hole 7 are linked together, let in cooling medium such as refrigerant or water in to casing 3 through feed liquor pipe 4, cool down for first mould 1 and second mould 2, dispel the heat to fin 11 through semiconductor refrigeration piece 13, the radiating efficiency of mould has been improved, and simultaneously, can discharge the heat that semiconductor refrigeration piece 13 gave out by fan 16, improve the production efficiency of antidetonation support accessory.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an antidetonation support accessory mould with heat dissipation function, includes first mould (1) and second mould (2), its characterized in that: the back of first mould (1) and second mould (2) all is equipped with casing (3), is located the upper and lower both ends of one side casing (3) of first mould (1) communicate respectively has feed liquor pipe (4) and drain pipe (5), liquid outlet (6) and leakage fluid dram (8) have been seted up respectively to the upper and lower both ends of feed liquor pipe (4) and drain pipe (5), the inside of second mould (2) run through have with feed liquor pipe (4) and drain pipe (5) assorted through-hole (7), fin (11) are all installed to the inside of casing (3), heat-conducting plate (12) are installed to the tip of fin (11), one side of fin (11) is equipped with semiconductor refrigeration piece (13).

2. An anti-seismic support accessory mould with heat dissipation function of claim 1, characterized in that: a step surface (9) is arranged in the through hole (7).

3. An antidetonation support accessory mould with heat dissipation function of claim 2, characterized in that: and a sealing gasket (10) is adhered to the surface of the step surface (9).

4. An anti-seismic support accessory mould with heat dissipation function of claim 1, characterized in that: and a heat-conducting silicone grease layer (14) is coated between the heat-conducting plate (12) and the semiconductor refrigerating sheet (13).

5. An anti-seismic support accessory mould with heat dissipation function of claim 1, characterized in that: protective nets (15) are welded outside the shell (3).

6. An anti-seismic support accessory mould with heat dissipation function of claim 5, characterized in that: and a fan (16) is arranged at one end of the protective net (15).