CN210694490U

CN210694490U - PCB packaging pad structure based on crimping device

Info

Publication number: CN210694490U
Application number: CN201921782890.0U
Authority: CN
Inventors: 吴灿文
Original assignee: Shenzhen Kaibao Technology Co ltd
Current assignee: Shenzhen Kaibao Technology Co ltd
Priority date: 2019-10-23
Filing date: 2019-10-23
Publication date: 2020-06-05
Anticipated expiration: 2029-10-23

Abstract

The utility model discloses a PCB packaging bonding pad structure based on crimping device, including PCB base plate and pad subassembly, the through-hole that cooperatees and use with the pad subassembly is seted up on the surface of PCB base plate, the pad subassembly includes outer copper ring and interior copper ring, the surface of outer copper ring and the inner wall contact of through-hole, the bottom of outer copper ring both sides is all seted up flutedly, the utility model relates to a pad technical field. This PCB encapsulates pad structure based on crimping device, when the mounting pad, operating personnel does not need appurtenance, can install the pad fast through manual operation, when the pad damages, can be very convenient and quick take off the pad to its maintenance, thereby to a great extent has improved the efficiency of installation and maintenance, after the component is installed, fix a position the component through a plurality of extrusion points, thereby carried out stable fixed to the component, guarantee electrical components's normal work, simultaneously can be very convenient take off it.

Description

PCB packaging pad structure based on crimping device

Technical Field

The utility model relates to a pad technical field specifically is PCB encapsulation pad structure based on crimping device.

Background

The pad, the basic constitutional unit of surface mounting assembly, the pad pattern that is used for constituting the circuit board, the pad combination that various designs for special component type promptly can be divided into surface mounting pad and crimping pad, in present life, can not use the electrical apparatus at all times, the application face that crimping pad also is wider and wider just, crimping pad's advantage lies in small, control effect is big, but it is when crimping the component, the crimping is hard and difficult for pulling out, the pressure that produces when crimping easily damages the pad.

In the PCB packaging pad structure (No. CN208480052U) of the crimping device in Chinese patent, a claw structure is newly added, when a crimping circuit element is damaged, people easily pull out a pad when pulling out the element, so that the pad is damaged, the claw structure is added at one end of the pad, the claw is fixed on the back of a circuit board, the damage of the pad can be effectively reduced, the pad is fixed on the circuit board through the claw structure, the structure can not ensure that the pad can be stably fixed on the circuit board, when an operator applies too much force, the pad can be pulled out, if the pad is damaged, when the pad needs to be detached, the claw structure is quite troublesome to detach.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a PCB encapsulates pad structure based on crimping device has solved PCB encapsulates pad structure when crimping component, and the crimping is hard and be difficult for extracting, fixes insecure and dismantles troublesome problem to the pad.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: PCB encapsulates pad structure based on crimping device, including PCB base plate and pad subassembly, the through-hole that cooperatees and use with the pad subassembly is seted up on the surface of PCB base plate, the pad subassembly includes outer copper ring and interior copper ring, the surface of outer copper ring and the inner wall contact of through-hole, the bottom of outer copper ring both sides all is seted up flutedly to the top fixed mounting of recess inner wall has the chute board, the inside sliding connection of chute board has the slider, the bottom fixedly connected with movable fixture block of slider, movable fixture block is located the inside one side fixedly connected with spring pipe of recess to the one end of spring pipe and the inner wall fixed connection of recess, the top of movable fixture block and the bottom contact of PCB base plate.

Preferably, the inner copper ring is arranged inside the outer copper ring, a cavity is formed between the outer copper ring and the inner copper ring, and elastic rubber is arranged in the cavity.

Preferably, the top of the outer copper ring is fixedly connected with a limiting ferrule, the bottom of the limiting ferrule is in contact with the top of the PCB substrate, and a limiting groove is formed in the limiting ferrule.

Preferably, the inside fixed mounting of spacing groove has the spring beam to the one end fixedly connected with circular touch multitouch of spring beam, the surface bonding of circular touch multitouch has anti-skidding rubber pad.

Preferably, the bottom of the movable clamping block is a smooth inclined surface.

Preferably, the number of the limiting grooves is at least eight

Advantageous effects

The utility model provides a PCB encapsulation pad structure based on crimping device. The method has the following beneficial effects:

(1) this PCB encapsulates pad structure based on crimping device, bottom through outer copper ring both sides all is seted up flutedly, and the top fixed mounting of recess inner wall has the chute board, the inside sliding connection of chute board has the slider, the bottom fixedly connected with activity fixture block of slider, the activity fixture block is located the inside one side fixedly connected with spring pipe of recess, and the one end of spring pipe and the inner wall fixed connection of recess, the top of activity fixture block contacts with the bottom of PCB base plate, when installing the pad, operating personnel does not need appurtenance, can install the pad fast through manual operation, and install the back pad and can stably fix on the circuit board, when the pad damages, can be very convenient and quick take off the pad and maintain it, thereby to a great extent has improved the efficiency of installation and maintenance.

(2) This PCB encapsulation pad structure based on crimping device, install in the inside of outer copper ring through interior copper ring, and vacuole formation between outer copper ring and the interior copper ring, and be provided with elastic rubber in the cavity, the spacing lasso of top fixedly connected with of outer copper ring, and the bottom of spacing lasso and the top contact of PCB base plate, the spacing groove has been seted up to spacing lasso's inside, the inside fixed mounting of spacing groove has the spring beam, and the circular touch multitouch that supports of one end fixedly connected with of spring beam, circular touch multitouch's surface bonding has anti-skidding rubber pad, after the component is installed, fix a position the component through a plurality of extrusion points, thereby carried out stable fixed to the component, guarantee electrical components's normal work, simultaneously can be very convenient take off it.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic diagram of a pad assembly structure according to the present invention;

FIG. 3 is an enlarged view of a portion of the substrate of FIG. 2;

fig. 4 is a partial enlarged view of the utility model at B in fig. 2;

fig. 5 is a top view of the limiting ring structure of the present invention.

In the figure: 1. a PCB substrate; 2. a pad assembly; 3. a through hole; 201. an outer copper ring; 202. an inner copper ring; 203. a groove; 204. a chute plate; 205. a slider; 206. a movable clamping block; 207. a spring tube; 208. a cavity; 209. an elastic rubber; 210. a limiting ferrule; 211. a limiting groove; 212. a spring lever; 213. a circular contact block; 214. anti-skid rubber pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a PCB packaging pad structure based on a crimping device comprises a PCB substrate 1 and a pad assembly 2, wherein the surface of the PCB substrate 1 is provided with a through hole 3 matched with the pad assembly 2 for use, the pad assembly 2 comprises an outer copper ring 201 and an inner copper ring 202, the outer surface of the outer copper ring 201 is contacted with the inner wall of the through hole 3, the bottoms of two sides of the outer copper ring 201 are respectively provided with a groove 203, a chute plate 204 is fixedly arranged above the inner wall of the groove 203, the inside of the chute plate 204 is connected with a slide block 205 in a sliding manner, the bottom of the slide block 205 is fixedly connected with a movable fixture block 206, one side of the movable fixture block 206 positioned inside the groove 203 is fixedly connected with a spring tube 207, the outside of the spring tube 207 is a rubber leather sheath, a reset spring is arranged inside the rubber leather sheath, one end of the spring tube 207 is fixedly connected with the inner wall of the groove 203, the top of the movable fixture block 206 is contacted with the, a cavity 208 is formed between the outer copper ring 201 and the inner copper ring 202, an elastic rubber 209 is arranged in the cavity 208, the elastic rubber 209 can enable the inner copper ring 202 to slightly protrude under a normal state, after the element pins are inserted, the element pins can be slightly extruded to play a certain fixing role, and meanwhile, the cavity 208 has a good buffering role, the top of the outer copper ring 201 is fixedly connected with a limiting ferrule 210, the bottom of the limiting ferrule 210 is contacted with the top of the PCB substrate 1, a limiting groove 211 is formed in the limiting ferrule 210, a spring rod 212 is fixedly arranged in the limiting groove 211, the spring rod 212 is composed of two sections, a thin section is sleeved in a thick section, a spring is arranged in a thick section, so that the thin section can stretch, a round contact block 213 is fixedly connected at one end of the spring rod 212, and an anti-slip rubber pad 214 is bonded on the surface of the round contact block 213, the bottom of the movable clamping block 206 is a smooth inclined surface, and the number of the limiting grooves 211 is at least eight.

During the use, can insert pad subassembly 2 in the through-hole 3, treat that pad subassembly 2 inserts the back completely, mutually support through activity fixture block 206 and spacing lasso 210 and carried out fine fixed to pad subassembly 2, can insert the inside of pad subassembly 2 with the pin crimping of component this moment, treat that the component inserts the back of accomplishing, elastic deformation through spring rod 212, make circular touch pad 213 carry out fine fixed to the component, further fixed to the component has been carried out through the cooperation of the elastic rubber 209 in pad subassembly 2 simultaneously, when needing to change the component, operating personnel can take out the component, when pad subassembly 2 damages, can extrude two activity fixture block 206, treat that activity fixture block 206 gets into inside recess 203 completely after, operating personnel can take off pad subassembly 2, maintain it.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. PCB encapsulation pad structure based on crimping device, including PCB base plate (1) and pad subassembly (2), through-hole (3) that cooperate the use with pad subassembly (2) are seted up on the surface of PCB base plate (1), its characterized in that: the welding disc assembly (2) comprises an outer copper ring (201) and an inner copper ring (202), wherein the outer surface of the outer copper ring (201) is in contact with the inner wall of the through hole (3);

the bottom of outer copper ring (201) both sides all is seted up recess (203) to the top fixed mounting of recess (203) inner wall has chute board (204), the inside sliding connection of chute board (204) has slider (205), the bottom fixedly connected with activity fixture block (206) of slider (205), activity fixture block (206) are located one side fixedly connected with spring pipe (207) of recess (203) inside, and the one end of spring pipe (207) and the inner wall fixed connection of recess (203), the top of activity fixture block (206) and the bottom contact of PCB base plate (1).

2. The crimped device-based PCB package pad structure of claim 1, wherein: the inner copper ring (202) is arranged inside the outer copper ring (201), a cavity (208) is formed between the outer copper ring (201) and the inner copper ring (202), and elastic rubber (209) is arranged in the cavity (208).

3. The crimped device-based PCB package pad structure of claim 1, wherein: the top of the outer copper ring (201) is fixedly connected with a limiting ferrule (210), the bottom of the limiting ferrule (210) is in contact with the top of the PCB substrate (1), and a limiting groove (211) is formed in the limiting ferrule (210).

4. The crimped device-based PCB package pad structure of claim 3, wherein: the inside fixed mounting of spacing groove (211) has spring beam (212) to the one end fixedly connected with circular contact block (213) of spring beam (212), the surface bonding of circular contact block (213) has anti-skidding rubber pad (214).

5. The crimped device-based PCB package pad structure of claim 1, wherein: the bottom of the movable clamping block (206) is a smooth inclined surface.

6. The crimped device-based PCB package pad structure of claim 3, wherein: the number of the limiting grooves (211) is at least eight.