CN219998250U

CN219998250U - High heat conduction packaging substrate

Info

Publication number: CN219998250U
Application number: CN202321583350.6U
Authority: CN
Inventors: 孙军伟; 王海荣; 葛爱俊; 陈凯
Original assignee: Nantong Yourui Semiconductor Co ltd
Current assignee: Nantong Yourui Semiconductor Co ltd
Priority date: 2023-06-21
Filing date: 2023-06-21
Publication date: 2023-11-10
Anticipated expiration: 2033-06-21

Abstract

The utility model discloses a high-heat-conductivity packaging substrate, which comprises a first substrate, a second substrate, a heat-conducting plate and a plugging installation mechanism, wherein the heat-conducting plate is installed inside the first substrate and the second substrate; the plugging installation mechanism comprises a plurality of square plugboards installed at the bottom of the first substrate, and a first triangular block is fixedly installed on one side of each square plugboard. According to the utility model, the first substrate and the second substrate are simply and conveniently detached and installed through the action of the plugging installation mechanism, compared with a screw installation mode, workers do not need to carry out fixed installation by means of tools for screw installation, and the operation steps of the workers are correspondingly reduced, so that the working efficiency of the workers for the fixed installation of the first substrate and the second substrate is improved, and meanwhile, the working efficiency of the workers for the detachment and installation of the first substrate and the second substrate is further reduced according to the automatic plugging action of the first triangular block and the second triangular block.

Description

High heat conduction packaging substrate

Technical Field

The utility model relates to the technical field of packaging substrates, in particular to a high-heat-conductivity packaging substrate.

Background

Along with the continuous innovative development of the LED packaging substrate, the LED packaging substrate is gradually improved along with the requirements of various functionalities on the level of a manufacturing process, so that the functionalities of the LED packaging substrate are greatly improved, various LED packaging substrate products are continuously developed and updated, the structure of the LED packaging substrate is still further improved, the LED packaging substrate needs to be innovated in the use development stage, and the original LED packaging substrate needs to be improved so as to improve the use convenience of the LED packaging substrate.

When the packaging is basically used, two substrates are required to be attached and mounted, the substrates are attached and mounted in the prior art, the substrates are generally fixedly mounted in a screw mode, when the screws are used for mounting, workers need to be fixedly mounted by means of tools for mounting the screws, and accordingly operating steps of the workers are increased, so that the working efficiency of the workers on the substrate fixed mounting is reduced, and the high-heat-conductivity packaging substrate is provided.

Disclosure of Invention

The utility model aims to solve the problem that a worker needs to fix and install by means of a screw installation tool, and correspondingly increases the operation steps of the worker, so that the defect of the work efficiency of the worker on the fixed installation of a substrate is reduced, and provides the high-heat-conductivity packaging substrate.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

a high heat conduction packaging substrate comprises a first substrate, a second substrate, a heat conduction plate arranged in the first substrate and the second substrate, and an inserting installation mechanism;

the utility model provides a socket, including the square picture peg of second triangular block, the square picture peg of second triangular block is located to the one side fixed mounting of square picture peg, the both sides sliding connection of second base plate has a plurality of slip picture peg, the one end of slip picture peg is connected with the second triangular block, the outer wall both sides fixedly connected with extension spring of slip picture peg, the one end fixed mounting that second triangular block was kept away from to slip picture peg has the protective housing, two fixed mounting has the U type pole between the protective housing, one side of second base plate is located the other fixed mounting of protective housing has the fixed plate, one side of fixed plate is connected with the connecting rope, the one end that the fixed plate was kept away from to the connecting rope is connected with the dead lever.

Preferably, a plurality of square sockets are formed in the second substrate, the square plugboards and the interiors of the square sockets are arranged in a sliding mode, the sliding plugboards are inserted into the interiors of the square sockets in a sliding mode, and the second triangular blocks are located in the interiors of the square sockets.

Preferably, one sides of the first triangular block and the second triangular block are obliquely arranged, and one sides of the first triangular block and the second triangular block are in sliding fit.

Preferably, the sliding plugboard and the extension spring are both positioned in the protective shell, and one end of the extension spring, which is far away from the sliding plugboard, is connected to the outer wall of the second base plate.

Preferably, one side of the protective housing is attached to the outer wall of the second substrate.

Preferably, the fixing plate and the protective shell are provided with fixing holes, the two fixing holes are correspondingly arranged, the fixing rod and the fixing holes are arranged in a sliding manner, and the fixing rod fixes the fixing plate and the protective shell through the fixing holes.

Compared with the prior art, the utility model has the beneficial effects that:

according to the high-heat-conductivity packaging substrate, the first substrate and the second substrate are detached and installed simply through the action of the plugging installation mechanism, compared with a screw installation mode, workers do not need to conduct fixed installation through tools for screw installation, and accordingly operation steps of the workers are reduced, working efficiency of the workers for the fixed installation of the first substrate and the second substrate is improved, and meanwhile working efficiency of the workers for the detachment and installation of the first substrate and the second substrate is further reduced according to the automatic plugging action of the first triangular block and the second triangular block.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a package substrate with high thermal conductivity according to the present utility model;

fig. 2 is an enlarged schematic view of the structure of the high thermal conductivity package substrate at a position a in fig. 1 according to the present utility model;

fig. 3 is a schematic diagram of a structure of a high thermal conductivity package substrate according to the present utility model, wherein a first substrate and a second substrate are separated from each other;

fig. 4 is a schematic cross-sectional structure of a package substrate with high thermal conductivity according to the present utility model.

In the figure 1, a first substrate; 2. a heat conductive plate; 3. square plugboard; 301. a first triangular block; 302. sliding plugboards; 303. a second triangular block; 304. a tension spring; 305. a protective shell; 306. a U-shaped rod; 307. a fixing plate; 308. a connecting rope; 309. a fixed rod; 4. and a second substrate.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model.

As shown in fig. 1-4, a high heat conduction package substrate comprises a first substrate 1, a second substrate 4, a heat conduction plate 2 arranged inside the first substrate 1 and the second substrate 4, and a plugging installation mechanism; the inserting installation mechanism comprises a plurality of square inserting plates 3 which are installed at the bottom of a first substrate 1, a first triangular block 301 is fixedly installed on one side of each square inserting plate 3, a plurality of sliding inserting plates 302 are connected to two sides of a second substrate 4 in a sliding mode, a second triangular block 303 is connected to one end of each sliding inserting plate 302, extension springs 304 are fixedly connected to two sides of the outer wall of each sliding inserting plate 302, a protective shell 305 is fixedly installed at one end, far away from the second triangular block 303, of each sliding inserting plate 302, a U-shaped rod 306 is fixedly installed between the two protective shells 305, a fixed plate 307 is fixedly installed beside the protective shell 305 on one side of the second substrate 4, a connecting rope 308 is connected to one side of the fixed plate 307, and a fixed rod 309 is connected to one end, far away from the fixed plate 307, of the connecting rope 308;

the utility model is further specifically detailed, a plurality of square sockets are formed on the second substrate 4, the square plugboards 3 and the interiors of the square sockets are in sliding arrangement, the sliding plugboards 302 are slidably inserted into the interiors of the square sockets, the second triangular blocks 303 are positioned in the interiors of the square sockets, one sides of the first triangular blocks 301 and the second triangular blocks 303 are in inclined arrangement, the inclined sides of the first triangular blocks 301 and the second triangular blocks 303 are in sliding fit arrangement, the sliding plugboards 302 and the extension springs 304 are positioned in the protective shell 305, one ends of the extension springs 304, which are far away from the sliding plugboards 302, are connected to the outer wall of the second substrate 4, one sides of the protective shell 305 are in fit arrangement with the outer wall of the second substrate 4, the fixing plates 307 and the protective shell 305 are provided with fixing holes, the two fixing holes are correspondingly arranged, the fixing rods 309 and the fixing holes are in sliding arrangement, and the fixing rods 309 fix the fixing plates 307 and the protective shell 305 through the fixing holes;

it should be noted that: according to the effect that the sliding plugboard 302 and the extension spring 304 are positioned in the protective shell 305, the sliding plugboard 302 and the extension spring 304 can be stably protected, the use effect of a worker on the sliding plugboard 302 and the extension spring 304 is improved, and according to the effect of the connecting rope 308, the fixing rod 309 is stably positioned on one side of the fixing plate 307, so that the fixing rod 309 is convenient for the worker to use, and the efficiency of the worker to detach and install the first substrate 1 and the second substrate 4 is improved;

through the setting of above-mentioned technical scheme, simple and convenient dismantlement installation of first base plate 1 and second base plate 4, compare in the mode of screw installation, just need not the staff and carry out fixed mounting with the help of the instrument of screw installation, corresponding reduction staff's operating procedure to promoted the staff to first base plate 1 and the work efficiency of second base plate 4 fixed mounting, simultaneously according to the effect of the automatic grafting of first triangular block 301 and second triangular block 303, further reduced staff to first base plate 1 and the work efficiency of second base plate 4 dismantlement installation.

As shown in fig. 1-4, the functional principle of the present utility model can be illustrated by the following operation: when a worker performs packaging and installation on the first substrate 1 and the second substrate 4, the square plugboard 3 at the bottom of the first substrate 1 is directly inserted into the square jack on the second substrate 4, along with the continuous insertion of the square plugboard 3 into the square jack, the outer wall of the square plugboard 3 slides in the square jack, when the first triangular block 301 and the second triangular block 303 are contacted, according to the inclined sides of the first triangular block 301 and the second triangular block 303, the first triangular block 301 performs extrusion sliding on the second triangular block 303 correspondingly, the second triangular block 303 drives the sliding plugboard 302 to slide towards the outer wall of the square jack, when the first triangular block 301 and the second triangular block 303 are separated, the bottom of the square plugboard 3 contacts with the bottom of the inner wall of the square jack, and when the first triangular block 301 is positioned at the bottom of the second triangular block 303, at this time, the sliding plugboard 302 drives the first triangular block 301 to block above the second triangular block 303, and accordingly, the first substrate 1 and the second substrate 4 are fixedly inserted, if the first substrate 1 and the second substrate 4 need to be disassembled, the U-shaped rod 306 is pulled to drive the protective shell 305 and the sliding plugboard 302 to slide towards the outer side of the square socket, so that the first triangular block 301 and the second triangular block 303 are separated, then the fixing rod 309 is inserted into the fixing hole, the protective shell 305 is fixed, at this time, the first substrate 1 can be taken out, through the arrangement of the structure, the disassembly and the assembly of the first substrate 1 and the second substrate 4 are simplified, compared with the screw assembly mode, the fixed assembly is carried out without the help of tools of workers, the operation steps of the workers are correspondingly reduced, thereby improving the working efficiency of the staff for the fixed installation of the first substrate 1 and the second substrate 4, and simultaneously further reducing the working efficiency of the staff for the disassembly installation of the first substrate 1 and the second substrate 4 according to the automatic plugging function of the first triangular block 301 and the second triangular block 303.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The high-heat-conductivity packaging substrate comprises a first substrate (1), a second substrate (4) and a heat conducting plate (2) arranged inside the first substrate (1) and the second substrate (4), and is characterized by further comprising an inserting installation mechanism;

the utility model provides a socket mounting mechanism, including square picture peg (3) of a plurality of installations in first base plate (1) bottom, one side fixed mounting of square picture peg (3) has first triangular block (301), the both sides sliding connection of second base plate (4) has a plurality of slip picture peg (302), the one end of slip picture peg (302) is connected with second triangular block (303), the outer wall both sides fixedly connected with extension spring (304) of slip picture peg (302), the one end fixed mounting that second triangular block (303) was kept away from to slip picture peg (302) has protective housing (305), two fixed mounting has U type pole (306) between protective housing (305), one side of second base plate (4) is located other fixed mounting of protective housing (305) fixed plate (307), one side of fixed plate (307) is connected with connecting rope (308), the one end that fixed plate (307) was kept away from to connecting rope (308) is connected with dead lever (309).

2. The high thermal conductivity package substrate according to claim 1, wherein the second substrate (4) is provided with a plurality of square sockets, the square plugboard (3) and the inside of the square sockets are arranged in a sliding manner, the sliding plugboard (302) is inserted into the inside of the square sockets in a sliding manner, and the second triangular block (303) is located in the inside of the square sockets.

3. The package substrate according to claim 1, wherein one side of the first triangular block (301) and one side of the second triangular block (303) are disposed in an inclined manner, and the inclined sides of the first triangular block (301) and the second triangular block (303) are disposed in a sliding fit manner.

4. The package substrate according to claim 1, wherein the sliding board (302) and the extension spring (304) are both located inside the protective case (305), and an end of the extension spring (304) away from the sliding board (302) is connected to an outer wall of the second substrate (4).

5. The packaging substrate with high thermal conductivity according to claim 1, wherein one side of the protective shell (305) is attached to the outer wall of the second substrate (4).

6. The package substrate with high thermal conductivity according to claim 1, wherein the fixing plate (307) and the protective case (305) are provided with fixing holes, the two fixing holes are arranged correspondingly, the fixing rod (309) and the fixing holes are arranged in a sliding manner, and the fixing rod (309) fixes the fixing plate (307) and the protective case (305) through the fixing holes.