CN110784568A - Mounting structure for mobile phone motherboard - Google Patents

Mounting structure for mobile phone motherboard Download PDF

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Publication number
CN110784568A
CN110784568A CN201911012861.0A CN201911012861A CN110784568A CN 110784568 A CN110784568 A CN 110784568A CN 201911012861 A CN201911012861 A CN 201911012861A CN 110784568 A CN110784568 A CN 110784568A
Authority
CN
China
Prior art keywords
mounting
mobile phone
spring
main part
mounting bracket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911012861.0A
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Chinese (zh)
Inventor
连泽伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Tianlong Rich Information Technology Co Ltd
Original Assignee
Jiangsu Tianlong Rich Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Tianlong Rich Information Technology Co Ltd filed Critical Jiangsu Tianlong Rich Information Technology Co Ltd
Priority to CN201911012861.0A priority Critical patent/CN110784568A/en
Publication of CN110784568A publication Critical patent/CN110784568A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0277Details of the structure or mounting of specific components for a printed circuit board assembly

Abstract

The invention discloses a mounting structure for a mobile phone mainboard, which comprises a mounting frame main body, a micro fan and a partition plate, wherein a groove is formed in one side in the mounting frame main body, a first spring is mounted on the inner side of the groove through a screw, one end of the first spring is connected with a clamping block, a support rod is arranged at the lower end of the inner side of the mounting frame main body, one end of the support rod is connected with the micro fan, a second spring is arranged at the bottom of the support rod, the bottom end of the second spring is connected with a heat conduction silicone sheet, a through anti-interference magnetic ring is arranged on one side of the mounting frame main body. The invention is convenient for mounting and dismounting the mainboard, has good heat dissipation performance and convenient use, and is suitable for wide popularization and use.

Description

Mounting structure for mobile phone motherboard
Technical Field
The invention relates to the technical field of mobile phone mainboards, in particular to a mounting structure for a mobile phone mainboard.
Background
When a mobile phone mainboard is installed, installation accessories need to be used, the existing installation structure is inconvenient for disassembling and assembling the mainboard and cannot be used for auxiliary heat dissipation, and therefore, the installation structure for the mobile phone mainboard is provided.
Disclosure of Invention
The main purpose of the invention is to provide a mounting structure for a mobile phone mainboard, one end of the mainboard can be inserted into one side of a clamping block to push inwards by arranging a first spring and the clamping block, the other end of the mainboard is inserted into the bottom of a limiting block, the mainboard can be fixed by pushing the clamping block by the first spring, the mainboard can be taken out by pushing the clamping block, the mainboard can be conveniently dismounted, mounted and maintained, the mainboard can be blown for heat dissipation by arranging a micro fan, the heat-conducting silicone sheet can be pushed to be close to the inner wall of a mobile phone shell by arranging a second spring, the heat can be accelerated to be conducted to the mobile phone shell to be dissipated by the heat-conducting silicone sheet, the heat dissipation efficiency is improved, and the problems in the background technology can.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a mounting structure for mobile phone motherboard, includes mounting bracket main part, miniature fan and baffle, one side is provided with the recess in the mounting bracket main part, the recess inboard is installed a spring through the screw, and a spring one end connection fixture block, the inboard lower extreme of mounting bracket main part is provided with branch, miniature fan is connected to branch one end, the branch bottom is provided with No. two springs, and No. two spring bottom connection heat conduction silicone grease pieces, mounting bracket main part one side is provided with the anti-interference magnetic ring that link up, humidity switch is installed through the mounting groove to mounting bracket main part opposite side.
Further, mounting panels are arranged on two sides of the mounting frame main body, and limiting blocks are arranged on the inner side of the mounting frame main body.
Further, a partition plate is arranged on the inner side of the mounting frame main body.
Further, humidity switch upper end is provided with miniature bee calling organ, and humidity switch and miniature bee calling organ electrical property link to each other.
Further, the outer surface of the mounting frame main body is coated with an antistatic coating.
Compared with the prior art, the invention has the following beneficial effects:
1. through setting up the mounting panel, can utilize the bolt to be fixed the mounting panel in the casing of one's hand, through setting up a spring and fixture block, can be with mainboard one end grafting fixture block one side inwards promote, then peg graft the stopper bottom with the mainboard other end, a spring promotes the fixture block alright fix the mainboard, and promotes the fixture block and can take out the mainboard to the convenience carries out the dismouting to the mainboard and overhauls.
2. Through setting up miniature fan, can blow the heat dissipation to the mainboard, through setting up No. two springs, can promote heat conduction silicone grease piece and press close to the cell-phone shell inner wall, heat conduction so that the effluvium to the cell-phone shell is so that promoted the radiating efficiency, prevent the static coating through the setting, avoid static to conduct in the mounting bracket main part, and produce harm to the mainboard.
3. Through setting up the humidity switch, fall into water at the cell-phone and take out the back or receive the rainwater splash back, the humidity switch can detect humidity around, if the humidity value exceeds the setting value, the humidity switch can open miniature buzzer and whistle and remind to the user in time shuts down the maintenance, through setting up anti-interference magnetic ring, passes anti-interference magnetic ring with interconnecting link, can reduce the electromagnetic interference of other electronic equipment to the mainboard, and noise and peak on the power cord are disturbed.
Drawings
Fig. 1 is a schematic view of an overall structure of a mounting structure for a mobile phone motherboard according to the present invention.
Fig. 2 is a schematic diagram of a partition board of an installation structure for a mobile phone motherboard according to the present invention.
Fig. 3 is a schematic view of an antistatic coating of a mounting structure for a mobile phone motherboard according to the present invention.
In the figure: 1. a mounting bracket main body; 2. a groove; 3. a first spring; 4. a clamping block; 5. a partition plate; 6. an anti-interference magnetic ring; 7. a limiting block; 8. a micro fan; 9. a second spring; 10. a thermally conductive silicone sheet; 11. a micro buzzer; 12. a humidity switch; 13. mounting a plate; 14. an antistatic coating; 15. a support rod.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-3, a mounting structure for mobile phone motherboard, includes mounting bracket main part 1, miniature fan 8 and baffle 5, one side is provided with recess 2 in the mounting bracket main part 1, 2 inboard springs 3 of installing through the screw of recess, and 3 one ends of a spring connect fixture block 4, 1 inboard lower extreme of mounting bracket main part is provided with branch 15, miniature fan 8 is connected to branch 15 one end, 15 bottoms of branch are provided with No. two springs 9, and No. two springs 9 bottom connect heat conduction silicone grease piece 10, mounting bracket main part 1 one side is provided with the anti-interference magnetic ring 6 that link up, humidity switch 12 is installed through the mounting groove to mounting bracket main part 1 opposite side.
Wherein, mounting panel 13 is provided with on 1 both sides of mounting bracket main part, 1 inboard of mounting bracket main part is provided with stopper 7.
In this embodiment, as shown in fig. 1, the mounting structure is conveniently fixed in the mobile phone case by using bolts and a mounting plate 13.
Wherein, the inner side of the mounting frame main body 1 is provided with a clapboard 5.
Wherein, humidity switch 12 upper end is provided with miniature buzzer 11, and humidity switch 12 links to each other with miniature buzzer 11 electrical property.
In this embodiment, as shown in fig. 1, the humidity switch 12 can control the micro buzzer 11.
Wherein the outer surface of the mounting frame body 1 is coated with an antistatic coating 14.
In this embodiment, as shown in fig. 3, the anti-static coating 14 can prevent static electricity from being conducted to the mounting frame body 1, which may cause damage to the motherboard.
It should be noted that the invention is a mounting structure for a mobile phone motherboard, when in operation, a mounting plate 13 is fixed in a mobile phone case by using a bolt, one end of the motherboard is inserted into one side of a clamping block 4 and pushed inwards, then the other end of the motherboard is inserted into the bottom of a limiting block 7, a first spring 3 pushes the clamping block 4 to fix the motherboard, and pushes the clamping block 4 to take out the motherboard, thereby facilitating the disassembly and maintenance of the motherboard, a micro fan 8 can blow the motherboard to dissipate heat after being started, thereby accelerating the heat dissipation, a second spring 9 can push a heat-conducting silicone sheet 10 to be close to the inner wall of the mobile phone case, the heat-conducting silicone sheet 10 can accelerate the heat conduction to the mobile phone case to dissipate, thereby improving the heat dissipation efficiency, an anti-static coating 14 (produced by Huizhou City Brightness technology Limited company) can avoid the static mounting frame body 1 from being damaged, after the mobile phone is taken out in water or, humidity switch 12 (the west mountain hundred million city electronic components shop product of wenzhou) can detect the humidity around, if the humidity value exceeds the setting value, humidity switch 12 can open miniature buzzer 11 and whistle and remind to the user in time shuts down the maintenance, passes anti-interference magnetic ring 6 with interconnecting link (the production of Dongguan city jia Lin magnetism industry Limited company), can reduce the electromagnetic interference of other electronic equipment to the mainboard, and noise and spike interference on the power cord.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (5)

1. The utility model provides a mounting structure for mobile phone motherboard, includes mounting bracket main part (1), miniature fan (8) and baffle (5), its characterized in that: one side is provided with recess (2) in mounting bracket main part (1), recess (2) inboard is installed spring (3) through the screw, and spring (3) one end connection fixture block (4), mounting bracket main part (1) inboard lower extreme is provided with branch (15), miniature fan (8) are connected to branch (15) one end, branch (15) bottom is provided with No. two spring (9), and No. two spring (9) bottom connection heat conduction silicone grease piece (10), mounting bracket main part (1) one side is provided with anti-interference magnetic ring (6) that link up, humidity switch (12) are installed through the mounting groove to mounting bracket main part (1) opposite side.
2. The mounting structure for a main board of a mobile phone according to claim 1, wherein: mounting bracket main part (1) both sides are provided with mounting panel (13), mounting bracket main part (1) inboard is provided with stopper (7).
3. The mounting structure for a main board of a mobile phone according to claim 1, wherein: the inner side of the mounting frame main body (1) is provided with a partition plate (5).
4. The mounting structure for a main board of a mobile phone according to claim 1, wherein: the humidity control device is characterized in that a micro buzzer (11) is arranged at the upper end of the humidity switch (12), and the humidity switch (12) is electrically connected with the micro buzzer (11).
5. The mounting structure for a main board of a mobile phone according to claim 1, wherein: the outer surface of the mounting frame main body (1) is coated with an antistatic coating (14).
CN201911012861.0A 2019-10-23 2019-10-23 Mounting structure for mobile phone motherboard Pending CN110784568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911012861.0A CN110784568A (en) 2019-10-23 2019-10-23 Mounting structure for mobile phone motherboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911012861.0A CN110784568A (en) 2019-10-23 2019-10-23 Mounting structure for mobile phone motherboard

Publications (1)

Publication Number Publication Date
CN110784568A true CN110784568A (en) 2020-02-11

Family

ID=69386561

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911012861.0A Pending CN110784568A (en) 2019-10-23 2019-10-23 Mounting structure for mobile phone motherboard

Country Status (1)

Country Link
CN (1) CN110784568A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112583963A (en) * 2020-12-11 2021-03-30 泸州禾苗通信科技有限公司 Direct-insertion type mobile phone Bluetooth communication module structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103901908A (en) * 2012-12-27 2014-07-02 鸿富锦精密工业(武汉)有限公司 Moistureproof protection device and electronic device having the same
CN207218825U (en) * 2017-09-19 2018-04-10 深圳市盛大林科技有限公司 A kind of high efficiency and heat radiation composite phone housing
CN207301920U (en) * 2017-09-30 2018-05-01 深圳市速威迪电子有限公司 A kind of mainboard is embedded in mounting structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103901908A (en) * 2012-12-27 2014-07-02 鸿富锦精密工业(武汉)有限公司 Moistureproof protection device and electronic device having the same
CN207218825U (en) * 2017-09-19 2018-04-10 深圳市盛大林科技有限公司 A kind of high efficiency and heat radiation composite phone housing
CN207301920U (en) * 2017-09-30 2018-05-01 深圳市速威迪电子有限公司 A kind of mainboard is embedded in mounting structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112583963A (en) * 2020-12-11 2021-03-30 泸州禾苗通信科技有限公司 Direct-insertion type mobile phone Bluetooth communication module structure
CN112583963B (en) * 2020-12-11 2022-06-07 泸州禾苗通信科技有限公司 Direct-insertion type mobile phone Bluetooth communication module structure

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