CN109461807A - A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip - Google Patents
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip Download PDFInfo
- Publication number
- CN109461807A CN109461807A CN201811445012.XA CN201811445012A CN109461807A CN 109461807 A CN109461807 A CN 109461807A CN 201811445012 A CN201811445012 A CN 201811445012A CN 109461807 A CN109461807 A CN 109461807A
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- China
- Prior art keywords
- upside
- led chip
- high voltage
- down mounting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 21
- 230000005855 radiation Effects 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 230000000694 effects Effects 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 238000009434 installation Methods 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, including substrate, the centre of substrate top side opens up inverted T shaped groove, the front side of inverted T shaped groove, rear side, top side is communicated with outside respectively, the surface of substrate is equipped with the ontology of upside-down mounting high voltage LED chip, bar blocks are fixedly mounted in lower end on the left of ontology with right side respectively, the lower part of bar blocks and ontology forms T-type structure and is located in inverted T shaped groove, the T-type structure that bar blocks are formed with body lower part can slide back and forth along inverted T shaped groove, the P electrode of ontology, N electrode is located at the left bottom surface of ontology, right bottom surface, the corresponding P electrode in the top surface of substrate, N electrode opens up cable hole respectively, the corresponding cable hole bearing in the top surface of substrate installs turntable.The configuration of the present invention is simple is skillfully constructed, and so that the positive electrode activity of hard contact and upside-down mounting high voltage LED chip on substrate is cooperatively connected, the disassembly after substrate is installed to convenient for upside-down mounting high voltage LED chip is convenient to overhaul to upside-down mounting high voltage LED chip.
Description
Technical field
The invention belongs to flip LED high-voltage chip field, specifically a kind of easily encapsulation easy heat radiation upside-down mounting high-voltage LED core
Piece.
Background technique
Upside-down mounting high voltage LED chip possesses the incomparable advantage of positive cartridge chip, and this chip is by light from substrate sapphire
It emits, encapsulation process utilizes eutectic welding method, by the metal salient point on the electrode and electrode of substrate of chip front side
Alignment welds；In this inverted structure encapsulation process, does not need to carry out electrode connection with gold thread, increase the stabilization of encapsulation
Property, the metal film layer on N-shaped or the surface p-type GaN can not only play conductive and current expansion, but also can play reflection photon
Effect, the light emission for avoiding LED from issuing is absorbed to substrate, in addition, the heat that the LED luminescent layer of inverted structure generates directly passes
To substrate, there is better heat dissipation effect；But after the electrode of chip front side is directed at welding with the metal salient point on electrode of substrate
It is difficult to dismantle, when the sub- wafer damage of upside-down mounting high voltage LED chip, upside-down mounting high voltage LED chip can not be overhauled, or maintenance
It is cumbersome, and alignment function difficulty is installed, the packaging efficiency of upside-down mounting high voltage LED chip is seriously affected, practical need are unable to satisfy
Ask, still devise a kind of novel easy encapsulation easy heat radiation upside-down mounting high voltage LED chip.
Summary of the invention
The present invention provides a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, to solve defect in the prior art.
The present invention is achieved by the following technical programs:
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, including substrate, the centre of substrate top side opens up inverted T shaped groove, inverted T shaped
Front side, rear side, the top side of slot are communicated with outside respectively, and the surface of substrate is equipped with the ontology of upside-down mounting high voltage LED chip, and ontology is left
The lower end on side and right side is fixedly mounted bar blocks respectively, and the lower part composition T-type structure of bar blocks and ontology is simultaneously located at inverted T shaped groove
Interior, the T-type structure that bar blocks are formed with body lower part can slide back and forth along inverted T shaped groove, and P electrode, the N electrode of ontology distinguish position
Left bottom surface, right bottom surface in ontology, the corresponding P electrode in the top surface of substrate, N electrode open up cable hole, the top surface pair of substrate respectively
The cable hole bearing installation turntable answered, circular metal plate, circular metal plate, turntable, cable hole center is fixedly mounted in the upper end of cable hole
Line is conllinear, and the centre of turntable top side opens up lateral bar shaped through groove respectively, and it is symmetrical that the inner wall of bar shaped through groove opens up front and back respectively
Sliding slot, activity installation sliding block respectively in sliding slot are fixedly mounted the same vertical tube between two opposite sliding blocks of front and back, vertical tube it is upper
Vertical linear bearing is fixedly mounted with lower end in end respectively, activity installation metallic rod respectively in linear bearing, on the outside of vertical tube in
Portion opens up through-hole respectively, and difference activity installation inserted link, inserted link are fixed with the inner wall of corresponding vertical tube by spring respectively in through-hole
Connection, the inner end of metallic rod are respectively hinged one end of connecting rod, and the other end of connecting rod is cut with scissors with the inner end of corresponding inserted link respectively
Chain link, the metallic rod in the same vertical tube are electrically connected, the outer end of metal link rod can respectively with corresponding P electrode, N electrode
Bottom side, circular metal plate topside contacts cooperation.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip as described above, the bottom side of the substrate uniformly opens up number
A blind hole.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip as described above, the periphery of the turntable opens up decoration and splits
Line.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip as described above, peace is fixed in the outer end of the inserted link respectively
Fill plectane.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip as described above, the vertical tube, turntable are insulating materials
Manufacture.
One kind as described above easily encapsulates easy heat radiation upside-down mounting high voltage LED chip, is fixedly mounted respectively in the cable hole
Metal bar, metal bar are fixedly connected with corresponding circular metal plate respectively, and the lower end of metal bar is flushed with the bottom surface of substrate.
The invention has the advantages that the configuration of the present invention is simple, is skillfully constructed, make hard contact and upside-down mounting high pressure on substrate
The positive electrode activity of LED chip is cooperatively connected, the disassembly after substrate is installed to convenient for upside-down mounting high voltage LED chip, convenient to
High voltage LED chip maintenance is filled, and the position of the hard contact on substrate can be adjusted, it is positive convenient for upside-down mounting high voltage LED chip
The alignment of metal salient point on electrode and electrode of substrate realizes the quick assembling of upside-down mounting high voltage LED chip, can satisfy practical need
It asks, is suitble to promote.When the ontology of upside-down mounting high voltage LED chip is installed on substrate, first by the group of bar blocks and body lower part
It is slid into inverted T shaped groove at T-type structure, the positive P electrode of upside-down mounting high voltage LED chip, N electrode is made to be located at corresponding turntable
Top presses the outer end of inserted link, and inserted link enters in vertical tube along corresponding through-hole, and spring is stretched, and the inner end of inserted link passes through connecting rod
Corresponding metallic rod is driven to move inward, the lower end of the metallic rod of downside is separated with corresponding circular metal plate, releases the gold of downside
Belong to limit of the bar to turntable, vertical tube, turntable can be rotated at this time, and vertical tube can be pushed to move along bar shaped through groove, sliding block difference
It is slided along corresponding sliding slot, until the metallic rod of upside is located at the underface of the positive P electrode of upside-down mounting high voltage LED chip, N electrode,
The outer end of inserted link is unclamped, inserted link resets under the elastic thrust effect of spring, and metallic rod is outside along corresponding linear bearing respectively
It is mobile, until the lower end of the metallic rod of downside is engaged with corresponding circular metal plate, at this time on the upside of metallic rod upper end with it is right
The bottom side close contacting fit of the P electrode or N electrode answered, and ontology has the trend that is jacked up, bar blocks and body lower part
Composition T-type structure can form pretightning force in inverted T shaped groove, pacify the composition T-type structure of bar blocks and body lower part firmly
In inverted T shaped groove；In the lower part insertion substrate of ontology, is transmitted convenient for body interior heat to substrate, be conducive to upside-down mounting high pressure
The heat dissipation of the ontology of LED chip.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is structural schematic diagram of the invention；Fig. 2 is I partial enlarged view of Fig. 1.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, as shown, including substrate 1, the centre of 1 top side of substrate is opened
If inverted T shaped groove 2, front side, rear side, the top side of inverted T shaped groove 2 are communicated with outside respectively, and the surface of substrate 1 is equipped with upside-down mounting high pressure
Bar blocks 4, the lower part of bar blocks 4 and ontology 3 is fixedly mounted in the ontology 3 of LED chip, 3 left side of ontology and the lower end on right side respectively
It forms T-type structure and is located in inverted T shaped groove 2, the T-type structure of bar blocks 4 and 3 lower part of ontology composition can be along 2 front and back of inverted T shaped groove
Sliding, P electrode 5, the N electrode 6 of ontology 3 are located at the left bottom surface of ontology 3, right bottom surface, the corresponding P electrode in the top surface of substrate 1
5, N electrode 6 opens up cable hole 7 respectively, and corresponding 7 bearing of cable hole in the top surface of substrate 1 installs turntable 8, and the upper end of cable hole 7 is solid
Dingan County fills circular metal plate 9, and circular metal plate 9, turntable 8,7 centerline collineation of cable hole, the centre of 8 top side of turntable opens up transverse direction respectively
Bar shaped through groove 10, the inner wall of bar shaped through groove 10 opens up the symmetrical sliding slot 11 in front and back respectively, and activity installation is slided respectively in sliding slot 11
Block 12, is fixedly mounted the same vertical tube 13 between two opposite sliding blocks 12 of front and back, the top and bottom of vertical tube 3 fixed peace respectively
Vertical linear bearing 14 is filled, the middle part of difference activity installation metallic rod 15 in linear bearing 14,13 outside of vertical tube opens up respectively
Through-hole 16, the interior installation inserted link 17 of activity respectively of through-hole 16, inserted link 17 are solid by spring 18 with the inner wall of corresponding vertical tube 13 respectively
Fixed connection, the inner end of metallic rod 15 are respectively hinged one end of connecting rod 19, the other end of connecting rod 19 respectively with corresponding inserted link
17 inner end hinge connection, the metallic rod 15 in the same vertical tube 13 are electrically connected, the outer end of metal link rod 15 can respectively with
The topside contacts cooperation of corresponding P electrode 5, the bottom side of N electrode 6, circular metal plate 9.The configuration of the present invention is simple is skillfully constructed, and makes
The positive electrode activity of hard contact and upside-down mounting high voltage LED chip on substrate is cooperatively connected, and pacifies convenient for upside-down mounting high voltage LED chip
Disassembly after being attached to substrate, it is convenient that upside-down mounting high voltage LED chip is overhauled, and the position of the hard contact on substrate can be adjusted,
Convenient for the alignment of the metal salient point on the positive electrode of upside-down mounting high voltage LED chip and electrode of substrate, upside-down mounting high voltage LED chip is realized
Quick assembling, can satisfy actual demand, be suitble to promote.When the ontology 3 of upside-down mounting high voltage LED chip is installed on substrate 1,
The composition T-type structure of bar blocks 4 and 3 lower part of ontology is slid into inverted T shaped groove 2 first, makes the positive P of upside-down mounting high voltage LED chip
Electrode 5, N electrode 6 are located at the top of corresponding turntable 8, press the outer end of inserted link 17, inserted link 17 along corresponding through-hole 16 into
Enter in vertical tube 13, spring 18 is stretched, and the inner end of inserted link 17 drives corresponding metallic rod 15 to move inward by connecting rod 19, downside
The lower end of metallic rod 15 separated with corresponding circular metal plate 9, release limit of the metallic rod 15 of downside to turntable 8, vertical tube 13,
Turntable 8 can be rotated at this time, and vertical tube 13 can be pushed to move along bar shaped through groove 10, and sliding block 12 is sliding along corresponding sliding slot 11 respectively
It is dynamic, until the metallic rod 15 of upside is located at the underface of the positive P electrode 5 of upside-down mounting high voltage LED chip, N electrode 6, unclamp inserted link 17
Outer end, inserted link 17 resets under the elastic thrust effect of spring 18, metallic rod 15 respectively along corresponding linear bearing 14 outward
It is mobile, until the lower end of the metallic rod 15 of downside is engaged with corresponding circular metal plate 9, at this time on the upside of metallic rod 15 upper end
With the bottom side close contacting fit of corresponding P electrode 5 or N electrode 6, and ontology 3 has the trend that is jacked up, bar blocks 4 and this
The composition T-type structure of 3 lower part of body can form pretightning force in inverted T shaped groove 2, make the composition T-type of bar blocks 4 Yu 3 lower part of ontology
It is well-set to be mounted in inverted T shaped groove 2；In the lower part insertion substrate 1 of ontology 3, passed convenient for 3 internal heat of ontology to substrate 1
It passs, is conducive to the heat dissipation of the ontology 3 of upside-down mounting high voltage LED chip.
Specifically, as shown, the bottom side of substrate 1 described in the present embodiment uniformly opens up several blind holes 20.Convenient for base
Plate 1 absorbs the discharge of heat, further promotes the heat dissipation effect of upside-down mounting high voltage LED chip ontology 3.
Specifically, as shown, the periphery of turntable 8 described in the present embodiment opens up decorative crack.Convenient for turning for turntable 8
It is dynamic, increase user's usage experience.
Further, as shown, plectane 21 is fixedly mounted in the outer end of inserted link 17 described in the present embodiment respectively.Increase and inserts
The area of 17 outer end of bar, convenient for pressing the outer end of inserted link 17.
Further, as shown, vertical tube 13, turntable 8 described in the present embodiment are insulating materials manufacture.It avoids erecting
Pipe 13, the contact electric leakage of turntable 8.
Further, as shown, metal bar 22, metal is fixedly mounted in cable hole 7 described in the present embodiment respectively
Stick 22 is fixedly connected with corresponding circular metal plate 9 respectively, and the lower end of metal bar 22 is flushed with the bottom surface of substrate 1.Conducting wire is welded
To the lower end of metal bar 22, it is electrically connected convenient for conducting wire and circular metal plate 9.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (6)
1. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, it is characterised in that: including substrate (1), in substrate (1) top side
Between open up inverted T shaped groove (2), front side, rear side, the top side of inverted T shaped groove (2) are communicated with outside respectively, and the surface of substrate (1) is equipped with
Bar blocks (4), bar blocks are fixedly mounted in the ontology (3) of upside-down mounting high voltage LED chip, ontology (3) left side and the lower end on right side respectively
(4) with the lower part of ontology (3) composition T-type structure and in inverted T shaped groove (2), the T of bar blocks (4) and ontology (3) lower part composition
Type structure can slide back and forth along inverted T shaped groove (2), and P electrode (5), the N electrode (6) of ontology (3) are located at a left side for ontology (3)
Bottom surface, right bottom surface, the corresponding P electrode in top surface (5), the N electrode (6) of substrate (1) open up cable hole (7) respectively, the top of substrate (1)
Face corresponding cable hole (7) bearing installs turntable (8), and circular metal plate (9) are fixedly mounted in the upper end of cable hole (7), circular metal plate
(9), turntable (8), cable hole (7) centerline collineation, the centre of turntable (8) top side open up lateral bar shaped through groove (10) respectively,
The inner wall of bar shaped through groove (10) opens up the symmetrical sliding slot (11) in front and back respectively, movable installation sliding block (12) of difference in sliding slot (11),
It is fixedly mounted the same vertical tube (13) between two opposite sliding blocks (12) of front and back, the top and bottom of vertical tube (3) are fixed respectively
Install vertical linear bearing (14), activity installation metallic rod (15) respectively in linear bearing (14), on the outside of vertical tube (13) in
Portion opens up through-hole (16) respectively, activity installation inserted link (17) respectively in through-hole (16), inserted link (17) respectively with corresponding vertical tube
(13) inner wall is fixedly connected by spring (18), and the inner end of metallic rod (15) is respectively hinged one end of connecting rod (19), even
The other end of bar (19) is connected with the inner end hinge of corresponding inserted link (17) respectively, the metallic rod (15) in the same vertical tube (13)
Be electrically connected, the outer end of metal link rod (15) can respectively with corresponding P electrode (5), the bottom side of N electrode (6), circular metal plate
(9) topside contacts cooperation.
2. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: the base
The bottom side of plate (1) uniformly opens up several blind holes (20).
3. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: described turns
The periphery of disk (8) opens up decorative crack.
4. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: described inserts
Plectane (21) are fixedly mounted in the outer end of bar (17) respectively.
5. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: described is perpendicular
Pipe (13), turntable (8) are insulating materials manufacture.
6. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: described walks
Metal bar (22) are fixedly mounted respectively in string holes (7), metal bar (22) is fixedly connected with corresponding circular metal plate (9) respectively, gold
The lower end for belonging to stick (22) is flushed with the bottom surface of substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811445012.XA CN109461807A (en) | 2018-11-29 | 2018-11-29 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811445012.XA CN109461807A (en) | 2018-11-29 | 2018-11-29 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109461807A true CN109461807A (en) | 2019-03-12 |
Family
ID=65611905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811445012.XA Pending CN109461807A (en) | 2018-11-29 | 2018-11-29 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
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| Country | Link |
|---|---|
| CN (1) | CN109461807A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116721980A (en) * | 2023-01-31 | 2023-09-08 | 无锡耐唯科技有限公司 | Diode packaging structure and packaging method |
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| CN209000949U (en) * | 2018-11-29 | 2019-06-18 | 山东聚芯光电科技有限公司 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
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