CN209000949U - A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip - Google Patents
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip Download PDFInfo
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- CN209000949U CN209000949U CN201821988975.XU CN201821988975U CN209000949U CN 209000949 U CN209000949 U CN 209000949U CN 201821988975 U CN201821988975 U CN 201821988975U CN 209000949 U CN209000949 U CN 209000949U
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- upside
- led chip
- high voltage
- down mounting
- substrate
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Abstract
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, including substrate, the centre of substrate top side opens up inverted T shaped groove, the front side of inverted T shaped groove, rear side, top side is communicated with outside respectively, the surface of substrate is equipped with the ontology of upside-down mounting high voltage LED chip, bar blocks are fixedly mounted in lower end on the left of ontology with right side respectively, the lower part of bar blocks and ontology forms T-type structure and is located in inverted T shaped groove, the T-type structure that bar blocks are formed with body lower part can slide back and forth along inverted T shaped groove, the P electrode of ontology, N electrode is located at the left bottom surface of ontology, right bottom surface, the corresponding P electrode in the top surface of substrate, N electrode opens up cable hole respectively, the corresponding cable hole bearing in the top surface of substrate installs turntable.The utility model structure is simple, is skillfully constructed, and so that the positive electrode activity of hard contact and upside-down mounting high voltage LED chip on substrate is cooperatively connected, the disassembly after substrate is installed to convenient for upside-down mounting high voltage LED chip is convenient to overhaul to upside-down mounting high voltage LED chip.
Description
Technical field
The utility model belongs to flip LED high-voltage chip field, specifically a kind of easily encapsulation easy heat radiation upside-down mounting high pressure
LED chip.
Background technique
Upside-down mounting high voltage LED chip possesses the incomparable advantage of positive cartridge chip, and this chip is by light from substrate sapphire
It emits, encapsulation process utilizes eutectic welding method, by the metal on the electrode and electrode of substrate of chip front side
Salient point alignment welds；In this inverted structure encapsulation process, does not need to carry out electrode connection with gold thread, increase encapsulation
The metal film layer on stability, N-shaped or the surface p-type GaN can not only play conductive and current expansion, but also can play reflected light
The effect of son, the light emission for avoiding LED from issuing is absorbed to substrate, in addition, the heat that the LED luminescent layer of inverted structure generates is straight
It connects and is transmitted to substrate, there is better heat dissipation effect；But the electrode of chip front side is directed at weldering with the metal salient point on electrode of substrate
It is difficult to dismantle after connecing, when the sub- wafer damage of upside-down mounting high voltage LED chip, upside-down mounting high voltage LED chip can not be overhauled, or
Inspection operation is cumbersome, and installs alignment function difficulty, seriously affects the packaging efficiency of upside-down mounting high voltage LED chip, is unable to satisfy reality
Border demand, still devise a kind of novel easy encapsulation easy heat radiation upside-down mounting high voltage LED chip.
Summary of the invention
The utility model provides a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, to solve in the prior art lack
It falls into.
The utility model is achieved by the following technical programs:
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, including substrate, the centre of substrate top side open up inverted T shaped groove,
Front side, rear side, the top side of T-slot are communicated with outside respectively, and the surface of substrate is equipped with the ontology of upside-down mounting high voltage LED chip, this
It is fixedly mounted bar blocks on the left of body respectively with the lower end on right side, the lower part composition T-type structure of bar blocks and ontology is simultaneously located at inverted T shaped
In slot, the T-type structure that bar blocks are formed with body lower part can slide back and forth along inverted T shaped groove, P electrode, the N electrode difference of ontology
Left bottom surface, right bottom surface positioned at ontology, the corresponding P electrode in the top surface of substrate, N electrode open up cable hole, the top surface of substrate respectively
Corresponding cable hole bearing installs turntable, and the upper end of cable hole is fixedly mounted circular metal plate, circular metal plate, turntable, in cable hole
Heart line is conllinear, and the centre of turntable top side opens up lateral bar shaped through groove respectively, and it is symmetrical that the inner wall of bar shaped through groove opens up front and back respectively
Sliding slot, the same vertical tube is fixedly mounted between two opposite sliding blocks of front and back in activity installation sliding block respectively in sliding slot, vertical tube
Vertical linear bearing is fixedly mounted in top and bottom respectively, difference activity installation metallic rod in linear bearing, on the outside of vertical tube
Middle part opens up through-hole respectively, difference activity installation inserted link in through-hole, and inserted link is solid by spring with the inner wall of corresponding vertical tube respectively
Fixed connection, the inner end of metallic rod are respectively hinged one end of connecting rod, the other end of connecting rod respectively with the inner end of corresponding inserted link
Hinge connection, the metallic rod in the same vertical tube are electrically connected, the outer end of metallic rod can respectively with corresponding P electrode, N electrode
Bottom side, circular metal plate topside contacts cooperation.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip as described above, the bottom side of the substrate uniformly opens up number
A blind hole.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip as described above, the periphery of the turntable opens up decoration and splits
Line.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip as described above, peace is fixed in the outer end of the inserted link respectively
Fill plectane.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip as described above, the vertical tube, turntable are insulating materials
Manufacture.
One kind as described above easily encapsulates easy heat radiation upside-down mounting high voltage LED chip, is fixedly mounted respectively in the cable hole
Metal bar, metal bar are fixedly connected with corresponding circular metal plate respectively, and the lower end of metal bar is flushed with the bottom surface of substrate.
The utility model has the advantages that: the utility model structure is simple, is skillfully constructed, and makes the hard contact on substrate and falls
It fills the positive electrode activity of high voltage LED chip to be cooperatively connected, the disassembly after substrate is installed to convenient for upside-down mounting high voltage LED chip, side
Just upside-down mounting high voltage LED chip is overhauled, and the position of the hard contact on substrate can be adjusted, be convenient for upside-down mounting high voltage LED chip
The alignment of metal salient point on positive electrode and electrode of substrate is realized the quick assembling of upside-down mounting high voltage LED chip, be can satisfy
Actual demand is suitble to promote.It, first will be under bar blocks and ontology when the ontology of upside-down mounting high voltage LED chip is installed on substrate
The composition T-type structure in portion slides into inverted T shaped groove, is located at the positive P electrode of upside-down mounting high voltage LED chip, N electrode corresponding
The top of turntable presses the outer end of inserted link, and inserted link enters in vertical tube along corresponding through-hole, and spring is stretched, and the inner end of inserted link is logical
Crossing connecting rod drives corresponding metallic rod to move inward, and the lower end of the metallic rod of downside is separated with corresponding circular metal plate, under releasing
Limit of the metallic rod of side to turntable, vertical tube can rotate turntable at this time, and vertical tube can be pushed to move along bar shaped through groove, sliding
Block is slided along corresponding sliding slot respectively, until the metallic rod of upside is being located at the positive P electrode of upside-down mounting high voltage LED chip, N electrode just
The outer end of inserted link is unclamped in lower section, and inserted link resets under the elastic thrust effect of spring, and metallic rod is respectively along corresponding linear bearing
It is displaced outwardly, until the lower end of the metallic rod of downside is engaged with corresponding circular metal plate, the upper end of the metallic rod of upside at this time
With the bottom side close contacting fit of corresponding P electrode or N electrode, and ontology has the trend that is jacked up, under bar blocks and ontology
The composition T-type structure in portion can form pretightning force in inverted T shaped groove, keep the composition T-type structure of bar blocks and body lower part secured
Be mounted in inverted T shaped groove；In the lower part insertion substrate of ontology, is transmitted convenient for body interior heat to substrate, be conducive to upside-down mounting
The heat dissipation of the ontology of high voltage LED chip.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model；Fig. 2 is I partial enlarged view of Fig. 1.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, as shown, including substrate 1, the centre of 1 top side of substrate is opened
If inverted T shaped groove 2, front side, rear side, the top side of inverted T shaped groove 2 are communicated with outside respectively, and the surface of substrate 1 is equipped with upside-down mounting high pressure
Bar blocks 4, the lower part of bar blocks 4 and ontology 3 is fixedly mounted in the ontology 3 of LED chip, 3 left side of ontology and the lower end on right side respectively
It forms T-type structure and is located in inverted T shaped groove 2, the T-type structure of bar blocks 4 and 3 lower part of ontology composition can be along 2 front and back of inverted T shaped groove
Sliding, P electrode 5, the N electrode 6 of ontology 3 are located at the left bottom surface of ontology 3, right bottom surface, the corresponding P electrode in the top surface of substrate 1
5, N electrode 6 opens up cable hole 7 respectively, and corresponding 7 bearing of cable hole in the top surface of substrate 1 installs turntable 8, and the upper end of cable hole 7 is solid
Dingan County fills circular metal plate 9, and circular metal plate 9, turntable 8,7 centerline collineation of cable hole, the centre of 8 top side of turntable opens up transverse direction respectively
Bar shaped through groove 10, the inner wall of bar shaped through groove 10 opens up the symmetrical sliding slot 11 in front and back respectively, and activity installation is slided respectively in sliding slot 11
The same vertical tube 13 is fixedly mounted between two opposite sliding blocks 12 of front and back in block 12, and the top and bottom of vertical tube 13 are fixed respectively
Vertical linear bearing 14 is installed, the middle part of difference activity installation metallic rod 15 in linear bearing 14,13 outside of vertical tube is opened respectively
If through-hole 16, activity installation inserted link 17, inserted link 17 pass through spring 18 with the inner wall of corresponding vertical tube 13 respectively respectively in through-hole 16
It is fixedly connected, the inner end of metallic rod 15 is respectively hinged one end of connecting rod 19, and the other end of connecting rod 19 is inserted with corresponding respectively
The inner end hinge of bar 17 connects, and the metallic rod 15 in the same vertical tube 13 is electrically connected, the outer end of metallic rod 15 can respectively with
The topside contacts cooperation of corresponding P electrode 5, the bottom side of N electrode 6, circular metal plate 9.The utility model structure is simple, and design is skilful
It is wonderful, so that the positive electrode activity of hard contact and upside-down mounting high voltage LED chip on substrate is cooperatively connected, is convenient for upside-down mounting high-voltage LED
Chip is installed to the disassembly after substrate, convenient to overhaul to upside-down mounting high voltage LED chip, and can adjust hard contact on substrate
Upside-down mounting high pressure is realized convenient for the alignment of the metal salient point on the positive electrode of upside-down mounting high voltage LED chip and electrode of substrate in position
The quick assembling of LED chip, can satisfy actual demand, be suitble to promote.The ontology 3 of upside-down mounting high voltage LED chip is installed to base
When on plate 1, the composition T-type structure of bar blocks 4 and 3 lower part of ontology is slid into inverted T shaped groove 2 first, makes upside-down mounting high voltage LED chip
Positive P electrode 5, N electrode 6 are located at the top of corresponding turntable 8, press the outer end of inserted link 17, inserted link 17 is along corresponding
Through-hole 16 enters in vertical tube 13, and spring 18 is stretched, and the inner end of inserted link 17 drives corresponding metallic rod 15 inwardly by connecting rod 19
Mobile, the lower end of the metallic rod 15 of downside is separated with corresponding circular metal plate 9, releases the metallic rod 15 of downside to turntable 8, vertical tube
13 limit can rotate turntable 8 at this time, and vertical tube 13 can be pushed to move along bar shaped through groove 10, and sliding block 12 is respectively along correspondence
Sliding slot 11 slide, until the metallic rod 15 of upside is located at the underface of the positive P electrode 5 of upside-down mounting high voltage LED chip, N electrode 6,
The outer end of inserted link 17 is unclamped, inserted link 17 resets under the elastic thrust effect of spring 18, and metallic rod 15 is respectively along corresponding straight line
Bearing 14 is displaced outwardly, until the lower end of the metallic rod 15 of downside is engaged with corresponding circular metal plate 9, the metal of upside at this time
The bottom side close contacting fit of the upper end of bar 15 and corresponding P electrode 5 or N electrode 6, and ontology 3 has the trend jacked up, item
Shape block 4 and the composition T-type structure of 3 lower part of ontology can form pretightning force in inverted T shaped groove 2, make bar blocks 4 and 3 lower part of ontology
Composition T-type structure be firmly installed in inverted T shaped groove 2；In the lower part insertion substrate 1 of ontology 3, it is convenient for 3 internal heat of ontology
It is transmitted to substrate 1, is conducive to the heat dissipation of the ontology 3 of upside-down mounting high voltage LED chip.
Specifically, as shown, the bottom side of substrate 1 described in the present embodiment uniformly opens up several blind holes 20.Convenient for base
Plate 1 absorbs the discharge of heat, further promotes the heat dissipation effect of upside-down mounting high voltage LED chip ontology 3.
Specifically, as shown, the periphery of turntable 8 described in the present embodiment opens up decorative crack.Convenient for turning for turntable 8
It is dynamic, increase user's usage experience.
Further, as shown, plectane 21 is fixedly mounted in the outer end of inserted link 17 described in the present embodiment respectively.Increase and inserts
The area of 17 outer end of bar, convenient for pressing the outer end of inserted link 17.
Further, as shown, vertical tube 13, turntable 8 described in the present embodiment are insulating materials manufacture.It avoids erecting
Pipe 13, the contact electric leakage of turntable 8.
Further, as shown, metal bar 22, metal is fixedly mounted in cable hole 7 described in the present embodiment respectively
Stick 22 is fixedly connected with corresponding circular metal plate 9 respectively, and the lower end of metal bar 22 is flushed with the bottom surface of substrate 1.Conducting wire is welded
To the lower end of metal bar 22, it is electrically connected convenient for conducting wire and circular metal plate 9.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that:
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement；And these are modified or replaceed, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution
The spirit and scope of scheme.
Claims (6)
1. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip, it is characterised in that: including substrate (1), in substrate (1) top side
Between open up inverted T shaped groove (2), front side, rear side, the top side of inverted T shaped groove (2) are communicated with outside respectively, and the surface of substrate (1) is equipped with
Bar blocks (4), bar blocks are fixedly mounted in the ontology (3) of upside-down mounting high voltage LED chip, ontology (3) left side and the lower end on right side respectively
(4) with the lower part of ontology (3) composition T-type structure and in inverted T shaped groove (2), the T of bar blocks (4) and ontology (3) lower part composition
Type structure can slide back and forth along inverted T shaped groove (2), and P electrode (5), the N electrode (6) of ontology (3) are located at a left side for ontology (3)
Bottom surface, right bottom surface, the corresponding P electrode in top surface (5), the N electrode (6) of substrate (1) open up cable hole (7) respectively, the top of substrate (1)
Face corresponding cable hole (7) bearing installs turntable (8), and circular metal plate (9) are fixedly mounted in the upper end of cable hole (7), circular metal plate
(9), turntable (8), cable hole (7) centerline collineation, the centre of turntable (8) top side open up lateral bar shaped through groove (10) respectively,
The inner wall of bar shaped through groove (10) opens up the symmetrical sliding slot (11) in front and back respectively, movable installation sliding block (12) of difference in sliding slot (11),
It is fixedly mounted the same vertical tube (13) between two opposite sliding blocks (12) of front and back, the top and bottom of vertical tube (13) are fixed respectively
Install vertical linear bearing (14), activity installation metallic rod (15) respectively in linear bearing (14), on the outside of vertical tube (13) in
Portion opens up through-hole (16) respectively, activity installation inserted link (17) respectively in through-hole (16), inserted link (17) respectively with corresponding vertical tube
(13) inner wall is fixedly connected by spring (18), and the inner end of metallic rod (15) is respectively hinged one end of connecting rod (19), even
The other end of bar (19) is connected with the inner end hinge of corresponding inserted link (17) respectively, the metallic rod (15) in the same vertical tube (13)
Be electrically connected, the outer end of metallic rod (15) can respectively with corresponding P electrode (5), the bottom side of N electrode (6), circular metal plate (9)
Topside contacts cooperation.
2. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: the base
The bottom side of plate (1) uniformly opens up several blind holes (20).
3. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: described turns
The periphery of disk (8) opens up decorative crack.
4. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: described inserts
Plectane (21) are fixedly mounted in the outer end of bar (17) respectively.
5. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: described is perpendicular
Pipe (13), turntable (8) are insulating materials manufacture.
6. a kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip according to claim 1, it is characterised in that: described walks
Metal bar (22) are fixedly mounted respectively in string holes (7), metal bar (22) is fixedly connected with corresponding circular metal plate (9) respectively, gold
The lower end for belonging to stick (22) is flushed with the bottom surface of substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821988975.XU CN209000949U (en) | 2018-11-29 | 2018-11-29 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821988975.XU CN209000949U (en) | 2018-11-29 | 2018-11-29 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
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| Publication Number | Publication Date |
|---|---|
| CN209000949U true CN209000949U (en) | 2019-06-18 |
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| CN201821988975.XU Active CN209000949U (en) | 2018-11-29 | 2018-11-29 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461807A (en) * | 2018-11-29 | 2019-03-12 | 山东聚芯光电科技有限公司 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
| CN116721980A (en) * | 2023-01-31 | 2023-09-08 | 无锡耐唯科技有限公司 | Diode packaging structure and packaging method |
-
2018
- 2018-11-29 CN CN201821988975.XU patent/CN209000949U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461807A (en) * | 2018-11-29 | 2019-03-12 | 山东聚芯光电科技有限公司 | A kind of easily encapsulation easy heat radiation upside-down mounting high voltage LED chip |
| CN116721980A (en) * | 2023-01-31 | 2023-09-08 | 无锡耐唯科技有限公司 | Diode packaging structure and packaging method |
| CN116721980B (en) * | 2023-01-31 | 2024-01-26 | 无锡耐唯科技有限公司 | Diode packaging structure and packaging method |
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