CN210690434U - Circuit board through hole defect final inspection equipment - Google Patents
Circuit board through hole defect final inspection equipment Download PDFInfo
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- CN210690434U CN210690434U CN201921196541.0U CN201921196541U CN210690434U CN 210690434 U CN210690434 U CN 210690434U CN 201921196541 U CN201921196541 U CN 201921196541U CN 210690434 U CN210690434 U CN 210690434U
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Abstract
The utility model discloses a circuit board through hole defect final inspection equipment, which comprises an assembled mirror surface light reflection platform and an optical camera lens assembly arranged above the assembled mirror surface light reflection platform, wherein the assembled mirror surface light reflection platform comprises a mirror surface stainless steel layer, and the upper surface of the assembled mirror surface light reflection platform is used for placing a circuit board to be detected after drilling; the optical camera lens assembly comprises a camera and an auto-collimation parallel light tube connected with the camera, the outlet end of the auto-collimation parallel light tube is arranged opposite to a circuit board to be detected placed on the assembled mirror surface light reflection platform, the camera is used for imaging and providing a main light source, light emitted by the main light source irradiates the circuit board to be detected after being amplified through the auto-collimation parallel light tube, and irradiates the mirror surface stainless steel layer through a through hole in the circuit board to be detected, and then at least part of light reflected by the mirror surface stainless steel layer enters the through hole in the circuit board to be detected. The utility model discloses utilize mirror surface light reflection platform to absorb through-hole formation of image information on the printed circuit board.
Description
Technical Field
The utility model relates to a circuit board detection area especially relates to a circuit board through-hole defect examines equipment eventually.
Background
In the current highly developed electronic industry era, Printed Circuit boards (PCBs for short) have become one of the essential parts of products such as computers and electronic communication.
With the development of science and technology, the functional structure of electronic products is more and more complex, and the layout and interconnection wiring of components on the circuit board are no longer as random as before, so that a large number of various types of holes (through holes, blind holes, buried holes) have been used on some high-order printed circuit boards to achieve functional interconnection.
Aiming at detecting the type of the through hole, most of the prior appearance maintenance equipment in the market at present can not have the capability of collecting the fine image inside the drilled through hole, and is attributed to that most of the prior equipment adopts the same optical detection structure, namely the printed circuit board to be detected is placed on a working platform with an adsorption device, and an upper pick-up lens and a three-dimensional light source are adopted for lighting to pick up the image, and the structure has advantages for detecting the types of the printed circuit boards with common defects and the like, but not for those through-hole circuit boards that have undergone a laser drilling process, they are analyzed from a process point of view, even laser drilling can not ensure that the front end aperture and the rear end aperture of the through hole are completely consistent, the image obtained by the illumination of the upper light source is only the information of all the front holes on the circuit board, the image information inside the through hole and the image information of the rear end hole cannot be captured due to the lack of effective light source illumination.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that the through-hole type printed circuit board can't be overhauld to the accurate on the maintenance equipment among the prior art, the utility model provides a circuit board through-hole defect examines equipment eventually, technical scheme is as follows:
the utility model provides a circuit board through hole defect final inspection equipment, which comprises a base, an assembly mirror surface light reflection platform arranged on the base, and an optical camera lens component arranged above the assembly mirror surface light reflection platform, wherein the assembly mirror surface light reflection platform comprises a mirror surface stainless steel layer, and the upper surface of the assembly mirror surface light reflection platform is used for placing a circuit board to be detected after drilling;
the optical camera lens assembly comprises a camera and an auto-collimation parallel light tube connected with the camera, the outlet end of the auto-collimation parallel light tube is arranged opposite to a circuit board to be detected which is arranged on the assembled mirror surface light reflection platform, the camera is used for imaging and providing a main light source, light emitted by the main light source irradiates the circuit board to be detected after being amplified by the auto-collimation parallel light tube, and irradiates the mirror surface stainless steel layer through a through hole in the circuit board to be detected, and then at least part of light reflected by the mirror surface stainless steel layer enters the through hole in the circuit board to be detected.
Further, the assembled mirror light reflection platform further comprises an optical glass layer arranged above the mirror stainless steel layer and attached to the mirror stainless steel layer, and the optical glass layer is used for supporting the circuit board to be detected.
Furthermore, a reflection lamp set is arranged in the middle of the auto-collimation parallel light pipe and is used for being matched with the spectroscope in the auto-collimation parallel light pipe so as to disperse and reflect light rays to the circuit board to be detected.
Furthermore, the optical camera lens assembly further comprises an auxiliary light source arranged below the outlet end of the auto-collimation parallel light pipe, and the brightness of the auxiliary light source and the brightness of a main light source provided by the camera are both adjustable.
Furthermore, a convex mirror is arranged at the outlet end of the auto-collimation collimator, and the auxiliary light source is an annular LED lamp group arranged around the convex mirror.
Furthermore, the detection equipment also comprises an air blowing device arranged at the bottom of the auto-collimation parallel light tube, the air blowing device is used for providing air flow for the assembled mirror light reflection platform, and light emitted by the optical camera lens assembly can penetrate through the air blowing device and irradiate on the circuit board to be detected.
Further, the mirror surface stainless steel layer is the same with the size of optical glass layer, the base still including setting up equipment mirror surface light reflection platform is protective bounding wall all around.
Further, the specular grade of the specular stainless steel layer is greater than or equal to 8K.
Further, the flatness of the optical glass layer is required to reach 0.05 mm.
Furthermore, an adjustable bolt hole position used for adjusting the planeness of the assembled mirror light reflection platform is reserved on the upper surface of the base.
The utility model discloses following beneficial effect has:
a. the mirror surface stainless steel with the mirror surface grade of more than 8K is used as a detection table top formed by combining a mirror surface with high-wear-resistant optical transparent glass, so that a light source erected on the camera assembly can penetrate through the through hole in the printed circuit board and reflect enough effective light source from the bottom of the through hole to shoot fine image information in the through hole;
b. the brightness, the contrast and the like of a light source required by an optical image are realized by converting the control of two light source groups on the camera lens assembly, and the light source guarantee is provided for the light reflection platform;
c. the backlight source required for shooting the internal image of the through hole on the circuit board is met by installing the table board consisting of glass with a light source reflecting effect and mirror surface stainless steel, so that the technology of shooting all the internal images of the through hole at one time without turning over the board surface is realized;
d. the circuit board is tightly attached to the platform while the light reflection platform is clean by additionally arranging the large-flow air blowing device, so that the accuracy of the image is ensured.
Drawings
The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of operation, together with objects, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a circuit board through hole defect final inspection apparatus provided by an embodiment of the present invention;
fig. 2 is a top view of a base of a circuit board through hole defect final inspection apparatus provided by an embodiment of the present invention;
fig. 3 is a partial cross-sectional view of a circuit board on an assembled mirrored light reflecting platform provided by an embodiment of the present invention;
fig. 4 is a light path diagram in the optical camera lens assembly of the circuit board through hole defect final inspection device provided by the embodiment of the present invention.
Wherein the reference numerals include: the method comprises the following steps of 1-a base, 11-a protective coaming, 12-an adjustable bolt hole site, 2-an assembled mirror light reflection platform, 21-a mirror stainless steel layer, 22-an optical glass layer, 3-an optical camera lens component, 31-a camera, 32-an auto-collimation collimator, 321-a spectroscope, 33-a reflection lamp group, 34-an auxiliary light source, 4-a circuit board to be detected, 41-a through hole and 5-an air blowing device.
Detailed Description
In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.
The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of operation, together with subject matter, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying drawings.
It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements.
Because the illustrative embodiments of the present invention may be implemented, to a great extent, using electronic components and circuits known to those skilled in the art, as described above, the details are not to be interpreted as more fully outside the scope of the invention as deemed necessary for the fundamental concept of the invention to be understood and appreciated in order not to obscure or distract from the teachings of the invention.
The utility model provides a circuit board through-hole defect examines equipment eventually, refers to fig. 1, circuit board through-hole defect examines equipment eventually includes base 1, sets up equipment mirror surface light reflection platform 2, the setting on base 1 and is in the optical camera lens subassembly 3 of equipment mirror surface light reflection platform 2 top, equipment mirror surface light reflection platform 2 includes mirror surface stainless steel layer 21, 2 upper surfaces of equipment mirror surface light reflection platform are used for placing the completion drilling wait to detect circuit board 4, the embodiment of the utility model provides a circuit board through-hole defect examines equipment eventually can lay on the maintenance equipment to the printed circuit board defect, promptly base 1 does the main part base of maintenance equipment. The main body base of the maintenance equipment is made of aluminum castings and is formed by finish machining through a numerical control machine tool, the structure of the main body base has strong stability, and meanwhile, the main body base also provides a good foundation for assembling the mirror surface light reflection platform 2, and particularly the base 1 can reach the required plane precision of 0.05 mm.
The optical camera lens assembly 3 includes a camera 31 and an auto-collimation collimator 32 connected to the camera 31, an outlet end of the auto-collimation collimator 32 is disposed opposite to the circuit board 4 to be detected placed on the assembled specular light reflection platform 2, the camera 31 is configured to image and provide a main light source, light emitted from the main light source irradiates the circuit board 4 to be detected after being amplified by the auto-collimation collimator 32, and irradiates the specular stainless steel layer 21 through a through hole 41 on the circuit board 4 to be detected, and then light reflected by the specular stainless steel layer 21 at least partially enters the through hole 41 on the circuit board 4 to be detected, see fig. 3. In a preferred embodiment of the present invention, the middle portion of the self-collimating collimator 32 is provided with a reflection lamp set 33, the reflection lamp set 33 is used for cooperating with the beam splitter 321 in the self-collimating collimator 32 to disperse and reflect light to the circuit board 4 to be detected, and the principle of the internal light path is as shown in fig. 4. In a preferred embodiment of the present invention, the optical camera lens assembly 3 further includes an auxiliary light source 34 disposed below the outlet end of the auto-collimation parallel light pipe 32, the auxiliary light source 34 and the main light source provided by the camera 31 have adjustable brightness, more preferably, the outlet end of the auto-collimation parallel light pipe 32 is provided with a convex lens, and the auxiliary light source 34 is disposed around the convex lens in an annular LED lamp set.
The optical camera lens component 3 is composed of a Basler high-definition camera (i.e. a Video camera 31) and a Video light pipe (i.e. an auto-collimation parallel light pipe 32) with high magnification, and a group of reflection lamp groups 33 are additionally arranged at the middle end part of the Video light pipe, and the optical camera lens component has the functions of dispersing and reflecting light to the circuit board 4 to be detected by matching with a spectroscope 321 in the Video light pipe, providing the most direct effective light source for the Basler high-definition camera, and simultaneously enabling a bottom mirror surface light reflection table surface to light the effective source light on the inner wall of the through hole 41 in the circuit board 4 to be detected. The annular LED lamp group (namely the auxiliary light source 34) arranged around the high-magnification convex mirror at the bottom of the light pipe provides an optimal auxiliary light source for shooting common defects on the surface of the circuit board, the parameters of brightness, contrast and the like of the two groups of light can be well controlled through auxiliary software on equipment, and the appropriate light can be automatically adjusted according to the difference between the material of the printed circuit board and the type of the defects.
In a preferred embodiment of the present invention, the assembled specular light reflection platform 2 further includes an optical glass layer 22 disposed above and bonded to the specular stainless steel layer 21, the optical glass layer 22 is used for supporting the circuit board 4 to be detected, the specular stainless steel layer 21 is the same as the optical glass layer 22 in size, the specular grade of the specular stainless steel layer 21 is greater than or equal to 8K, and the specular stainless steel layer has good light reflection performance, and the thickness of the specular stainless steel layer is required to be within 1mm, so that the specular stainless steel layer can be better bonded to the finish-machined surface of the main body base 9, thereby ensuring the final mesa precision; the optical glass layer 22 is covered on the mirror stainless steel layer 21, and the two are completely attached to form the assembled mirror light reflection platform 2, the optical glass layer 22 is preferably used for optical purposes because the optical glass layer can have the advantages of good transmittance, light sensitivity, flatness, good wear resistance and the like, the optical glass layer is made of glass with better hardness and very wear resistance through good process treatment, which is very important for the optical glass layer to be used as a light reflection platform of the equipment, the thickness of the optical glass layer 22 is required to be 6mm, and the flatness after processing is required to be 0.05mm or higher.
As shown in fig. 2, as a preferred embodiment, the base 1 further includes a protective enclosure 11 disposed around the assembled mirror light reflection platform 2, and the protective enclosure 11 is mounted around to well position the two (the mirror stainless steel layer 21 and the optical glass layer 22) on the main body base 9, and the protective enclosure 11 is designed to protect the glass itself from being damaged, protect the operator from being damaged by the edge of the glass, and have a sealing property to prevent impurities from entering the mirror. Because the lines of the printed circuit board are thinner and thinner along with the higher and higher process precision of the printed circuit board, the requirement on the image precision of the equipment is also higher, and good mesa flatness is one of the conditions for ensuring the image precision. Therefore, the utility model discloses adjustable bolt hole site 12 that the distribution is even has still been reserved with one side of mirror surface stainless steel layer 21 binding face on the base 1 of circuit board through-hole defect final inspection equipment, guarantees with this equipment mirror surface light reflection platform 2 reaches required final mesa precision, and final plane precision is required within 0.1 mm.
In the utility model discloses a preferred embodiment, the check out test set is still including setting up gas blowing device 5 in auto-collimation collimator 32 bottom, gas blowing device 5 be used for to assembly mirror surface light reflection platform 2 provides the air current, the light that optical camera lens subassembly 3 sent can pass gas blowing device 5 and shine on waiting to detect on the circuit board 4. Because its characteristic of light reflection platform needs to have holistic mirrorlike nature, and it itself needs to be clean, can not have any damage or impurity to prevent to influence or disturb the high definition camera and take every slight image on the printed circuit board, especially image in the through-hole, consequently, the utility model discloses a circuit board through-hole defect final inspection equipment is equipped with large-traffic gas blowing device 5, and this device is installed the bottom of optical camera lens subassembly 3, and the light of camera lens can directly be hit through this device wait to detect on the circuit board 4, the gas of this device also blows to wait to detect on the circuit board 4 along with light together, mutually noninterfere. The device has the greatest effect of ensuring that all images under the lens can be well focused, and the fitting degree of the circuit board under the lens and the table top can be ensured to a certain extent through controllable airflow pressure. The device is matched with a high-definition camera and software to realize automatic focusing of video images, and precision and controllability of maintenance equipment are greatly improved.
The utility model discloses used a mirror surface level to reach the mirror surface stainless steel more than 8K as the mirror surface, the detection mesa that wear-resisting optics usage printing opacity clear glass combination forms such as cooperation removes to replace original tradition by the mesa that metal aluminium processing formed, uses this detection mesa purpose that has the reflex action in order to let the light source of erectting on camera subassembly can see through the through-hole on the printed circuit board and reflect sufficient effective light source from its bottom and take the inside slight image information of through-hole.
The utility model discloses integrated on current maintenance equipment basic platform, realize luminance, the contrast etc. of the required light source of optical image through two light source group control on the conversion camera lens subassembly, provide the light source assurance for the light reflection platform. The backlight source required for shooting the internal image of the through hole on the circuit board is met by installing the table board consisting of glass with the function of reflecting light source and mirror surface stainless steel, so that the technology of shooting all the internal images of the through hole without turning the board surface once is realized. The circuit board is tightly attached to the platform by additionally arranging the large-flow air blowing device, so that the accuracy of the image is ensured.
The application of the light reflection platform greatly improves the detection precision of the maintenance equipment, and meanwhile, the detection efficiency is also effectively improved.
Further, those skilled in the art will appreciate that the boundaries between the above described operations are merely illustrative. Multiple operations may be combined into a single operation, a single operation may be distributed in additional operations, and operations may be performed at least partially overlapping times. Further, alternative embodiments may include multiple illustrations of specific operations, and the order of operations may be varied in various other embodiments.
However, other modifications, variations, and alternatives are also possible. The specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense.
In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of other elements or steps than those listed in a claim. Furthermore, the terms "a" or "an," as used herein, are defined as one or more than one. Moreover, the use of the introductory phrases such as "at least one" and "one or more" in the claim recitations should not be interpreted to imply that the introduction of an indefinite articles "a" or "an" into another claim element limits any particular claim containing such introduced claim element to inventions containing only one such element, even when the same claim includes the introductory phrases "one or more" or "at least one" and indefinite articles such as "a" or "an". The same holds true for the use of definite articles. Unless otherwise specified, terms such as "first" and "second" are used to arbitrarily distinguish between the elements such terms describe. Thus, these terms are not necessarily intended to indicate temporal or other prioritization of such elements. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
While certain features of the invention have been illustrated and described herein, many modifications, substitutions, changes, and equivalents will now occur to those of ordinary skill in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (10)
1. The circuit board through hole defect final inspection equipment is characterized by comprising a base (1), an assembly mirror surface light reflection platform (2) arranged on the base (1), and an optical camera lens assembly (3) arranged above the assembly mirror surface light reflection platform (2), wherein the assembly mirror surface light reflection platform (2) comprises a mirror surface stainless steel layer (21), and the upper surface of the assembly mirror surface light reflection platform (2) is used for placing a circuit board (4) to be inspected after drilling is completed;
the optical camera lens assembly (3) comprises a camera (31) and an auto-collimation parallel light pipe (32) connected with the camera, the outlet end of the auto-collimation parallel light pipe (32) is opposite to a circuit board (4) to be detected, which is arranged on the assembled mirror light reflection platform (2), the camera (31) is used for imaging and providing a main light source, light emitted by the main light source irradiates the circuit board (4) to be detected after being amplified by the auto-collimation parallel light pipe (32) and irradiates the mirror stainless steel layer (21) through a through hole (41) in the circuit board (4) to be detected, and then the light reflected by the mirror stainless steel layer (21) at least partially enters the through hole (41) in the circuit board (4) to be detected.
2. The circuit board through hole defect final inspection equipment according to claim 1, wherein the assembled mirror surface light reflection platform (2) further comprises an optical glass layer (22) arranged above and attached to the mirror surface stainless steel layer (21), and the optical glass layer (22) is used for carrying the circuit board (4) to be inspected.
3. The circuit board through hole defect final inspection equipment according to claim 1, wherein a reflection lamp set (33) is arranged in the middle of the auto-collimation parallel light pipe (32), and the reflection lamp set (33) is used for matching with a spectroscope (321) in the auto-collimation parallel light pipe (32) to disperse and reflect light rays onto the circuit board (4) to be detected.
4. The circuit board through hole defect final inspection equipment according to claim 1, wherein the optical camera lens assembly (3) further comprises an auxiliary light source (34) arranged below the outlet end of the auto-collimation parallel light pipe (32), and the brightness of the auxiliary light source (34) and the brightness of a main light source provided by the camera (31) are both adjustable.
5. The circuit board through hole defect final inspection equipment according to claim 4, wherein the exit end of the auto-collimation collimator (32) is provided with a convex mirror, and the auxiliary light source (34) is an annular LED lamp group arranged around the convex mirror.
6. The circuit board through hole defect final inspection equipment according to claim 1, further comprising an air blowing device (5) arranged at the bottom of the auto-collimation collimator (32), wherein the air blowing device (5) is used for providing air flow to the assembled mirror surface light reflection platform (2), and light emitted by the optical camera lens assembly (3) can pass through the air blowing device (5) to irradiate the circuit board (4) to be inspected.
7. The circuit board through hole defect final inspection equipment according to claim 2, wherein the mirror surface stainless steel layer (21) and the optical glass layer (22) have the same size, and the base (1) further comprises a protective enclosure (11) arranged around the assembled mirror surface light reflection platform (2).
8. The circuit board via defect final inspection apparatus of claim 1, wherein the specular grade of the specular stainless steel layer (21) is greater than or equal to 8K.
9. The circuit board through hole defect final inspection apparatus according to claim 2, wherein the flatness requirement of the optical glass layer (22) is up to 0.05 mm.
10. The circuit board through hole defect final inspection equipment according to claim 1, wherein an adjustable bolt hole position (12) for adjusting the flatness of the assembled specular light reflection platform (2) is reserved on the upper surface of the base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921196541.0U CN210690434U (en) | 2019-07-26 | 2019-07-26 | Circuit board through hole defect final inspection equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921196541.0U CN210690434U (en) | 2019-07-26 | 2019-07-26 | Circuit board through hole defect final inspection equipment |
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| CN210690434U true CN210690434U (en) | 2020-06-05 |
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| CN201921196541.0U Active CN210690434U (en) | 2019-07-26 | 2019-07-26 | Circuit board through hole defect final inspection equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112327524A (en) * | 2020-11-13 | 2021-02-05 | Tcl华星光电技术有限公司 | Method and device for inspecting substrate film defect |
| CN114544665A (en) * | 2022-04-27 | 2022-05-27 | 惠州威尔高电子有限公司 | PCB forming groove gong missing rapid detection method, electronic equipment and storage medium |
| CN114791605A (en) * | 2021-01-26 | 2022-07-26 | 南京大量数控科技有限公司 | Optical system for measuring depth of inner layer of printed circuit board |
-
2019
- 2019-07-26 CN CN201921196541.0U patent/CN210690434U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112327524A (en) * | 2020-11-13 | 2021-02-05 | Tcl华星光电技术有限公司 | Method and device for inspecting substrate film defect |
| CN114791605A (en) * | 2021-01-26 | 2022-07-26 | 南京大量数控科技有限公司 | Optical system for measuring depth of inner layer of printed circuit board |
| CN114791605B (en) * | 2021-01-26 | 2023-08-22 | 南京大量数控科技有限公司 | Optical system for measuring depth of inner layer of printed circuit board |
| CN114544665A (en) * | 2022-04-27 | 2022-05-27 | 惠州威尔高电子有限公司 | PCB forming groove gong missing rapid detection method, electronic equipment and storage medium |
| CN114544665B (en) * | 2022-04-27 | 2022-07-08 | 惠州威尔高电子有限公司 | PCB forming groove milling missing rapid detection method, electronic equipment and storage medium |
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