CN210681514U

CN210681514U - Anti-static chip tray

Info

Publication number: CN210681514U
Application number: CN201921463225.5U
Authority: CN
Inventors: 李洪明
Original assignee: Beijing Tebo Wande Technology Co Ltd
Current assignee: Beijing Tebo Wande Technology Co Ltd
Priority date: 2019-09-04
Filing date: 2019-09-04
Publication date: 2020-06-05
Anticipated expiration: 2029-09-04

Abstract

The utility model discloses an anti-static chip tray, which comprises a bottom support and a tray cover, wherein the middle part of the bottom surface of the bottom support is embedded with a push plate, and the inner wall of a gland chamber of the tray cover is pasted with a cushion layer which is used for covering the opening part of a containing chamber; the tray of the utility model is made of antistatic material, and is provided with fine and compact grid grooves, thereby effectively preventing the damage caused by shaking and shaking to the device, and having no pollution, corrosion resistance, falling prevention and static prevention; in a natural state, the bottom surface of the push plate is flush with the bottom surface of the bottom support, when a chip needs to be taken, the push plate is jacked upwards from the bottom, and each jacking block jacks out the chip in each grid groove, so that chip scratching caused by scratching is avoided; paste at the gland indoor wall of tray lid and have the cushion layer that will hold the room opening part and cover, behind the closing cap, the buffering bubble point on the cushion layer slightly imbeds each grid inslot, with chip surface soft contact, when having guaranteed that the chip is stably placed, cushions the protection to the chip, reduces the disability rate in the transportation.

Description

Anti-static chip tray

Technical Field

The utility model relates to a chip production packing field specifically is an anti-static chip tray.

Background

Chips are a general term for semiconductor device products, and chips are a way of miniaturizing circuits (mainly including semiconductor devices, including passive components, etc.) in electronics, and are often fabricated on the surface of a semiconductor wafer. An integrated circuit manufactured with a circuit on a surface of a semiconductor chip is also called a thin-film (thin-film) integrated circuit; another type of thick-film integrated circuit (thick-film) is a miniaturized circuit formed by a separate semiconductor device and a passive component integrated on a substrate or a circuit board.

The integrated circuit chip needs to be packaged and protected by a tray during transportation or packaging, the existing chip tray is not easy to take out after the chips are stacked and placed, and the chips are small in size and easy to scratch and damage, so that scratching and damage of the chips are easily caused by direct scratching or integral pouring, and the quality of the chips is influenced; meanwhile, the protection performance of the existing tray on the chip is poor, the sealing cover is in rigid contact with the chip, the damage is easily caused by external stress, and the rejection rate is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an antistatic chip tray to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: an anti-static chip tray comprises a bottom support and a tray cover; the middle part of the bottom support protrudes upwards to form a containing chamber with an outward opening, the containing chamber is divided into a plurality of grid grooves, the middle part of the tray cover is provided with a gland chamber matched and sleeved with the containing chamber, two sides of the bottom support extend outwards to form a first positioning lug plate, and two sides of the tray cover extend outwards to form a second positioning lug plate matched with the first positioning lug plate; the push pedal is embedded in the middle of the bottom surface of the bottom support, and a cushion layer for covering the opening of the containing chamber is pasted on the inner wall of the gland chamber of the tray cover.

Preferably, the collet bottom is provided with the tray and presss from both sides, and the tray presss from both sides to be "cross" word structure, includes the side buckle of laminating fixed with location otic placode one, location otic placode two to and support the spacing portion of butt in the collet bottom surface.

Preferably, the push pedal upper surface is provided with the kicking block that upwards the arch inserted each grid inslot, and the push pedal both ends outwards extend and form the limiting plate, correspond limiting plate position department in the collet and be provided with the push away groove, are connected through compression spring between limiting plate upper surface and the push away groove top inner wall.

Preferably, the outer side surface of the cushion layer is provided with a plurality of buffer bubble points protruding towards each grid groove.

Preferably, the bottom surface of the push plate is flush with the bottom surface of the bottom support.

Preferably, the bottom support, the tray cover and the tray clamp are respectively of an integrally formed structure, and the bottom support, the tray cover and the tray clamp are all made of PS or ABS materials.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a tray is whole to adopt and is prevented that static material makes for hold silicon chip, IC, glass, crystal, photoelectric device and other microelectronic parts, through set up meticulous inseparable grid groove in the collet, effectually prevent to rock and shake the harm that brings for the device, pollution-free, anticorrosion, anti-drop, prevent static, provide convenient safe package mode.

2. The utility model discloses set up the push pedal in the collet, each inserts the kicking block in the grid groove as the bottom surface in grid groove in the push pedal, and the limiting plate at push pedal both ends inserts and pushes away the inslot and connect through compression spring, and under the natural state, the push pedal bottom surface flushes with the collet bottom surface, when the chip need be taken, with the push pedal by the bottom jack-up that makes progress, each kicking block is ejecting with the chip in each grid groove, avoids scratching the chip that the movement caused and draws the damage.

3. The utility model discloses paste at the gland room inner wall of tray lid and have the cushion pad layer that will hold the room opening part and cover, behind the closing cap, each grid inslot of buffering bubble point slight embedding on the cushion pad layer, with chip surface soft contact, when having guaranteed that the chip is stable to be placed, cushion the protection to the chip, reduce the disability rate in the transportation.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural diagram of the bottom bracket of the present invention;

fig. 3 is a schematic structural diagram of the tray cover of the present invention;

fig. 4 is a schematic view of a specific structure of the tray clamp of the present invention.

In the figure: 1. a bottom support; 2. a tray cover; 3. a holding chamber; 4. a grid groove; 5. a capping chamber; 6. positioning a first lug plate; 7. positioning a second lug plate; 8. a tray clamp; 9. side buckle; 10. a limiting part; 11. pushing the plate; 12. a top block; 13. a limiting plate; 14. pushing the groove; 15. a compression spring; 16. a cushion layer; 17. and buffering the bubble point.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1-4, the present invention provides a technical solution: an anti-static chip tray comprises a bottom support 1 and a tray cover 2; the middle part of the bottom support 1 protrudes upwards to form a containing chamber 3 with an outward opening, the containing chamber 3 is internally divided into a plurality of grid grooves 4, the middle part of the tray cover 2 is provided with a gland chamber 5 which is in matched and sleeved connection with the containing chamber 3, two sides of the bottom support 1 extend outwards to form a first positioning lug plate 6, and two sides of the tray cover 2 extend outwards to form a second positioning lug plate 7 which is matched with the first positioning lug plate 6; the middle part of the bottom surface of the bottom support 1 is embedded with a push plate 11, and the inner wall of a gland chamber 5 of the tray cover 2 is adhered with a cushion layer 16 which covers the opening of the containing chamber 3.

Further, 1 bottom of collet is provided with the tray and presss from both sides 8, and the tray presss from both sides 8 and is "cross" word structure, includes the side buckle 9 of laminating fixed with location otic placode 6, two 7 of location otic placode to and support the spacing portion 10 of butt in 1 bottom surface of collet.

Further, 11 upper surfaces of push pedal are provided with the kicking block 12 that upwards the arch inserted each

net inslot

4, and 11 both ends of push pedal outwards extend and form limiting plate 13, correspond limiting plate 13 position department in the collet 1 and be provided with and push away groove 14, are connected through compression spring 15 between limiting plate 13 upper surface and the 14 top inner walls that push away the groove.

Furthermore, a plurality of buffer bubble points 17 protruding into each grid groove 4 are arranged on the outer side surface of the buffer cushion layer 16.

Further, the bottom surface of the push plate 11 is flush with the bottom surface of the bottom support 1.

Further, the bottom support 1, the tray cover 2 and the tray clamp 8 are respectively of an integrally formed structure, and the bottom support, the tray cover 2 and the tray clamp are all made of PS or ABS materials.

During the use, superpose the chip in proper order or place one by one in the net groove 4 of collet 1, cover tray lid 2, recycle tray clamp 8 with collet 1 and tray lid 2 chucking. The tray is wholly made of anti-static materials and used for containing silicon wafers, ICs, glass, crystals, photoelectric devices and other microelectronic parts, fine and compact grid grooves 4 are formed in the bottom support 1, damage caused by shaking and vibration of the tray is effectively prevented, pollution and corrosion are avoided, anti-dropping and anti-static effects are achieved, and a convenient and safe packaging mode is provided. A push plate 11 is arranged in the bottom support 1, each top block 12 inserted into the grid groove 4 on the push plate 11 is used as the bottom surface of the grid groove 4, and the limiting plates 13 at two ends of the push plate 11 are inserted into the push grooves 14 and connected through compression springs 15; under the natural state, 11 bottom surfaces of push pedal flush with collet 1 bottom surface, when the chip need be taken, with push pedal 11 by the ejecting that makes progress of bottom, each kicking block 12 is ejecting with the chip in each grid groove 4, avoids digging the chip that causes and scratches the loss. Paste at 5 inner walls of gland room of tray lid 2 and have the cushion 16 that will hold 3 openings of room and cover, behind the closing cap, the buffering bubble point 17 on the cushion 16 slightly imbeds each net inslot 4, with chip surface soft contact, when having guaranteed that the chip is stably placed, carries out the buffer protection to the chip, reduces the disability rate in the transfer process.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An anti-static chip tray is characterized by comprising a bottom support (1) and a tray cover (2); the middle part of the bottom support (1) protrudes upwards to form a containing chamber (3) with an outward opening, the containing chamber (3) is internally divided into a plurality of grid grooves (4), the middle part of the tray cover (2) is provided with a gland chamber (5) which is in matched and sleeved connection with the containing chamber (3), two sides of the bottom support (1) extend outwards to form a first positioning lug plate (6), and two sides of the tray cover (2) extend outwards to form a second positioning lug plate (7) which is matched with the first positioning lug plate (6); bottom support (1) bottom surface middle part embedding push pedal (11), the gland room (5) inner wall of tray lid (2) is pasted and is had cushion (16) that will hold room (3) opening part cover.

2. An antistatic chip tray as claimed in claim 1, wherein: collet (1) bottom is provided with tray clamp (8), and tray clamp (8) are "ten" word structure, include side buckle (9) fixed with location otic placode (6), two (7) laminating to and support spacing portion (10) of butt in collet (1) bottom surface.

3. An antistatic chip tray as claimed in claim 1, wherein: push pedal (11) upper surface is provided with kicking block (12) that upwards arch inserted in each grid groove (4), and push pedal (11) both ends outwards extend and form limiting plate (13), correspond limiting plate (13) position department in collet (1) and be provided with and push away groove (14), and limiting plate (13) upper surface is connected through compression spring (15) between pushing away groove (14) top inner wall.

4. An antistatic chip tray as claimed in claim 1, wherein: and a plurality of buffer bubble points (17) protruding towards the inside of each grid groove (4) are arranged on the outer side surface of the buffer cushion layer (16).

5. An antistatic chip tray as claimed in claim 1, wherein: the bottom surface of the push plate (11) is flush with the bottom surface of the bottom support (1).

6. An antistatic chip tray as claimed in claim 1, wherein: the tray support (1), the tray cover (2) and the tray clamp (8) are respectively of an integrally formed structure and are made of PS or ABS materials.