CN210676165U - Silicon chip or wafer cleaning machine - Google Patents
Silicon chip or wafer cleaning machine Download PDFInfo
- Publication number
- CN210676165U CN210676165U CN201921383955.4U CN201921383955U CN210676165U CN 210676165 U CN210676165 U CN 210676165U CN 201921383955 U CN201921383955 U CN 201921383955U CN 210676165 U CN210676165 U CN 210676165U
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- Prior art keywords
- cleaning
- wafer
- joint
- rack
- grabbing manipulator
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- 238000004140 cleaning Methods 0.000 title claims abstract description 124
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 27
- 239000010703 silicon Substances 0.000 title claims abstract description 27
- 238000007599 discharging Methods 0.000 claims abstract description 21
- 235000012431 wafers Nutrition 0.000 claims description 38
- 238000001179 sorption measurement Methods 0.000 claims description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009975 flexible effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a silicon wafer or wafer cleaning machine, which comprises a frame, a feeding platform, a cleaning tank component, a discharging platform and a multi-joint grabbing manipulator; the feeding table and the discharging table are respectively positioned on two sides of the cleaning tank assembly; a plurality of cleaning tanks are arranged on the cleaning tank assembly; the upper part of the cleaning tank component on the front side surface of the frame is open, and the rest surfaces are closed; an air draft device is arranged on the frame; the end of the multi-joint grabbing manipulator close to the rack is positioned above the cleaning tank assembly; the end, far away from the rack, of the multi-joint grabbing manipulator is positioned right in front of the rack; the end, close to the rack, of the multi-joint grabbing manipulator is provided with a turntable, and a grabbing device is arranged on the turntable. The utility model discloses electronic components cleaning machine has the characteristics that snatch the precision height, the cost is low, long service life.
Description
Technical Field
The utility model relates to a silicon wafer cleaning equipment of trades such as semiconductor, photovoltaic, LED especially relates to the cleaning machine of silicon wafer.
Background
Wafers in the semiconductor industry, silicon wafers in the photovoltaic industry, sapphire wafers in the LED industry, and the like must be cleaned in the manufacturing process to remove metal ion contamination, organic contamination, or particulate contamination from the surface of the silicon/wafer, and the cleaning process is performed in a special multi-tank cleaning process.
The multi-tank cleaning machine is generally mainly composed of a cleaning tank arranged on a rack, a cleaning liquid pipeline system, an ultrasonic system, a heating system, a cleaning throwing device, a cleaning basket conveying system and an electric control part, wherein the cleaning basket conveying system and the electric control part are positioned above the cleaning tank. The cleaning basket conveying system is arranged on the transverse guide rail and the vertical guide rail above the cleaning tank and the grabbing clamp arranged on the vertical guide rail. The outstanding disadvantages are that: the cleaning basket conveying system and the electric control part are positioned right above the cleaning tank, and the transmission assembly is complex in structure and low in grabbing precision; all are special equipment, so the manufacturing cost is high; the whole body is easily corroded by liquid volatile matters in the cleaning tank, and the service life is short.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a silicon chip or wafer cleaning machine to prior art's not enough, it has simple structure, and the cost is low, the long-lived advantage of life.
The utility model adopts the technical proposal as follows.
A silicon chip or wafer cleaning machine comprises a frame, a feeding table, a cleaning tank assembly, a discharging table and a multi-joint grabbing manipulator; the feeding table and the discharging table are respectively positioned on two sides of the cleaning tank assembly; a plurality of cleaning tanks are arranged on the cleaning tank assembly; the upper part of the cleaning tank component on the front side surface of the rack is open, and the other surfaces of the rack are closed; an air draft device is arranged on the frame; the end of the multi-joint grabbing manipulator close to the rack is positioned above the cleaning tank assembly; the end, far away from the rack, of the multi-joint grabbing manipulator is positioned right in front of the rack; a turntable is arranged at the end of the multi-joint grabbing manipulator, which is close to the rack, and a grabbing device is arranged on the turntable; the manipulator is taken through the grabbing device to grab the cleaning basket which is provided with the silicon wafer or the wafer and is arranged on the feeding platform, the cleaning basket is placed into each cleaning tank on the cleaning tank assembly to be cleaned, and the cleaning basket is grabbed on the discharging platform after the cleaning is finished.
As a preferred technical scheme, the cleaning tank assembly comprises a horizontal row or a plurality of horizontal rows of cleaning tanks.
As a preferred technical scheme, the number of the cleaning tanks in each horizontal row is 2-4.
As a preferred technical scheme, the top surfaces of the cleaning tanks are on the same plane.
As the preferred technical scheme, the top surfaces of the feeding platform, the discharging platform and the cleaning tanks are on the same plane.
As a preferred technical scheme, a feeding door is arranged on the side, close to the feeding table, of the rack, and a discharging door is arranged on the side, close to the discharging table, of the rack.
As preferred technical scheme, swing joint has a plurality of silicon chip receivers on the washing basket, and the degree of depth that highly is greater than each washing tank of washing basket.
As the preferred technical scheme, the grabbing device of the multi-joint grabbing manipulator is connected with the hook of the cleaning basket or in adsorption connection or in vacuum adsorption connection or in clamping connection.
As the preferred technical scheme, the cleaning basket is provided with an upright post, the end of the multi-joint grabbing manipulator, which is close to the rack, is provided with a clamp capable of clamping the upright post, and the clamp of the multi-joint grabbing manipulator, which is close to the end of the rack, is connected with the upright post of the cleaning basket in a clamping manner, or
The cleaning basket is provided with a column, the top end of the column is provided with an adsorption plate with a horizontal surface, the end of the multi-joint grabbing manipulator close to the frame is provided with a vacuum adsorption disc, the vacuum adsorption disc on the multi-joint grabbing manipulator is connected with the adsorption plate at the top end of the column in a vacuum adsorption way, or,
the cleaning basket is provided with an iron part, the end, close to the rack, of the multi-joint grabbing manipulator is provided with an electromagnet, and the electromagnet of the multi-joint grabbing manipulator is connected with the iron part of the cleaning basket in an electromagnetic adsorption mode.
As a preferred technical scheme, the multi-joint grabbing manipulator is a grabbing manipulator with six or more than six degrees of freedom.
The utility model has the advantages that: compared with the special grabbing device and the transmission assembly which are positioned above the cleaning tank in the prior art, the whole cleaning tank is not easily corroded by liquid volatile matters in the cleaning tank, electronic components in the cleaning solution are not easily polluted, and the service life is long; the multi-joint grabbing manipulator is common equipment in the market, and has the characteristics of flexible action, small motion inertia, strong universality, strong winding obstacle and high grabbing precision; the multi-joint grabbing manipulator is a mature product on the market, and compared with a special grabbing device and a transmission assembly in the prior art, the multi-joint grabbing manipulator is lower in manufacturing cost. The whole device occupies small area and has high automation degree.
Drawings
Fig. 1 is a schematic structural diagram of a preferred embodiment of the electronic component cleaning machine of the present invention.
Fig. 2 is a partially enlarged view of a portion a of fig. 1.
Fig. 3 is a partially enlarged view of a portion B of fig. 1.
Fig. 4 is a partially enlarged view of a portion C of fig. 1.
Fig. 5 is a state diagram of the electronic component cleaning machine shown in fig. 1.
Fig. 6 is a partially enlarged view of a portion D of fig. 5.
Fig. 7 is a partially enlarged view of a portion E of fig. 5.
Fig. 8 is a partially enlarged view of a portion F of fig. 5.
Fig. 9 is a schematic structural diagram of a preferred embodiment of the electronic component cleaning machine of the present invention.
Fig. 10 is a schematic structural diagram of a preferred embodiment of the electronic component cleaning machine of the present invention.
Wherein: a frame-1; a feeding table-2; a cleaning tank assembly-3; a discharging table-4; a multi-joint grabbing manipulator-5; near the frame end-51; -a gripping device-52; a turntable-53; a clip-54; cleaning tank-6; a cleaning basket-7; a feeding gate-8; a discharge door-9; an air draft device-10; a silicon wafer storage box-11; a column-12; an adsorption plate-13; a vacuum adsorption pan-14; iron part-15; an electromagnet-16.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
Example 1. As shown in fig. 1-7, a silicon wafer or wafer cleaning machine comprises a frame 1, a feeding table 2, a cleaning tank assembly 3, a discharging table 4, and a multi-joint grabbing manipulator 5; the feeding platform 2 and the discharging platform 4 are respectively positioned at two sides of the cleaning tank component 3; a plurality of cleaning tanks 6 are arranged on the cleaning tank component 3; the upper part of the front side cleaning tank component 3 of the frame 1 is open, and the rest surfaces of the frame 1 are closed; an air draft device 10 is arranged on the frame 1; the end 51 of the multi-joint grabbing manipulator 5 close to the frame is positioned above the cleaning tank assembly 3; the end of the multi-joint grabbing manipulator 5, which is far away from the rack, is positioned right in front of the rack; a turntable 53 is arranged on the end 51, close to the frame, of the multi-joint grabbing manipulator 5, and a grabbing device 52 is arranged on the turntable 53; the mechanical arm 5 is taken by the grabbing device 52 to grab the cleaning basket 7 filled with silicon wafers or crystal plates on the feeding platform 2, the cleaning basket is put into each cleaning tank 6 on the cleaning tank assembly 3 for cleaning, and the cleaning basket is grabbed on the discharging platform 4 after cleaning.
The wash tank assembly 3 includes two horizontal wash tanks 6.
The number of washing tanks 6 per horizontal row is 4. The air draft device 10 is arranged above the top surface of the cleaning groove 6 on the frame body.
The top surfaces of the cleaning tanks 6 are on the same plane.
The top surfaces of the feeding platform 2, the discharging platform 4 and the cleaning tanks 6 are on the same plane.
A feeding door 8 is arranged on the side, close to the feeding platform 2, of the rack 1, and a discharging door 9 is arranged on the side, close to the discharging platform 4, of the rack.
A plurality of silicon wafer storage boxes 11 are movably connected to the cleaning basket 7, and the height of the cleaning basket 7 is larger than the depth of each cleaning groove 6.
The cleaning basket 7 is provided with an upright post 12, the gripping device 52 is a clamp 54 capable of clamping the upright post 12, and the clamp 54 on the end 51, close to the frame, of the multi-joint gripping manipulator 5 is connected with the upright post 12 of the cleaning basket 7 in a clamping manner.
The multi-joint grabbing manipulator 5 is a grabbing manipulator with six degrees of freedom. The multi-joint grabbing manipulator 5 comprises a base 55, a rotating disc 56, a rotating disc servo motor 57, two arms 58, two joints 59 and two arm driving devices 510. The multi-joint mechanical arm is the earliest appearing industrial robot and the earliest appearing modern robot, can replace the heavy labor of people to realize the mechanization and automation of production, and can operate under the harmful environment to protect the personal safety.
In the embodiment, only the grabbing device of the multi-joint grabbing manipulator 5 close to the rack end 51 is positioned above the cleaning tank assembly 3, and the rest part is positioned right in front of the rack, so that the whole cleaning tank is not easily corroded by liquid volatile matters in the cleaning tank, and the service life is long; the multi-joint grabbing manipulator 5 is common equipment in the market, and has the characteristics of flexible action, small motion inertia, strong universality, strong winding obstacle and high grabbing precision; the multi-joint grabbing manipulator 5 is a mature product on the market, and compared with a special transmission assembly in the prior art, the multi-joint grabbing manipulator is lower in manufacturing cost.
Example 2. As shown in fig. 9, the present embodiment is different from embodiment 1 in that: the washing basket 7 is provided with an upright post 12, the top end of the upright post 12 is provided with an adsorption plate 13 with a horizontal top surface, a vacuum adsorption disc 14 is arranged at the end 51, close to the frame, of the multi-joint grabbing manipulator 5, and the vacuum adsorption disc 14 on the multi-joint grabbing manipulator 5 is connected with the adsorption plate 13 at the top end of the upright post 12 in a vacuum adsorption mode.
Example 3. As shown in fig. 10, the present embodiment is different from embodiment 1 in that: the cleaning basket 7 is provided with an iron part 15, the end 51, close to the frame, of the multi-joint grabbing manipulator 5 is provided with an electromagnet 16, and the electromagnet of the multi-joint grabbing manipulator 5 is connected with the iron part of the cleaning basket 7 in an electromagnetic adsorption mode.
The above-mentioned embodiments are only for understanding the present invention, and are not intended to limit the technical solutions of the present invention, and those skilled in the relevant art can make various changes or modifications based on the technical solutions described in the claims, and all equivalent changes or modifications should be covered by the scope of the claims of the present invention. The parts of the present invention not described in detail are the known techniques of those skilled in the art.
Claims (10)
1. A silicon chip or wafer cleaning machine is characterized in that: comprises a frame (1), a feeding platform (2), a cleaning tank component (3), a discharging platform (4) and a multi-joint grabbing manipulator (5); the feeding table (2) and the discharging table (4) are respectively positioned at two sides of the cleaning tank assembly (3); a plurality of cleaning tanks (6) are arranged on the cleaning tank assembly (3); the upper part of the cleaning tank component (3) on the front side surface of the rack (1) is open, and the rest surfaces of the rack (1) are closed; an air draft device (10) is arranged on the frame (1); the end (51) close to the frame of the multi-joint grabbing manipulator (5) is positioned above the cleaning tank assembly (3); the end of the multi-joint grabbing manipulator (5) far away from the rack (1) is positioned right in front of the rack (1); a turntable (53) is arranged at the end (51) of the multi-joint grabbing manipulator (5) close to the frame, and a grabbing device (52) is arranged on the turntable (53); the mechanical arm (5) is taken by the grabbing device (52) to grab the loading platform (2) and place the cleaning basket (7) containing silicon wafers or crystal wafers into each cleaning tank (6) on the cleaning tank assembly (3) for cleaning, and the mechanical arm is grabbed on the discharging platform (4) after cleaning.
2. A silicon wafer or wafer cleaning machine as claimed in claim 1 wherein: the cleaning tank assembly (3) comprises a horizontal row or a plurality of horizontal rows of cleaning tanks (6).
3. A silicon wafer or wafer cleaning machine as claimed in claim 2 wherein: the number of the cleaning tanks (6) in each horizontal row is 2-4.
4. A silicon wafer or wafer cleaning machine as claimed in claim 2 wherein: the top surfaces of the cleaning tanks (6) are on the same plane.
5. The silicon wafer or wafer cleaning machine of claim 4 wherein: the top surfaces of the feeding platform (2), the discharging platform (4) and the cleaning tanks (6) are on the same plane.
6. A silicon wafer or wafer cleaning machine as claimed in claim 1 wherein: a feeding door (8) is arranged on the side, close to the feeding platform (2), of the rack (1), and a discharging door (9) is arranged on the side, close to the discharging platform (4).
7. A silicon wafer or wafer cleaning machine as claimed in claim 1 wherein: a plurality of silicon wafer storage boxes (11) are movably connected to the cleaning basket (7), and the height of the cleaning basket (7) is larger than the depth of each cleaning groove (6).
8. The silicon wafer or wafer cleaning machine of claim 7 wherein: the grabbing device (52) of the multi-joint grabbing manipulator (5) is connected with the hook of the cleaning basket (7) in an adsorption or vacuum adsorption or clamping manner.
9. A silicon wafer or wafer cleaning machine as claimed in claim 8 wherein: an upright post (12) is arranged on the cleaning basket (7), the gripping device (52) is a clamp (54) which can clamp the upright post (12), the clamp (54) on the end (51) close to the frame of the multi-joint gripping manipulator (5) is connected with the upright post (12) of the cleaning basket (7) in a clamping way, or
An upright post (12) is arranged on the cleaning basket (7), an adsorption plate (13) with a horizontal top surface is arranged at the top end of the upright post (12), a vacuum adsorption disc (14) is arranged on the grabbing device (52), the vacuum adsorption disc (14) on the multi-joint grabbing manipulator (5) is connected with the adsorption plate (13) at the top end of the upright post (12) in a vacuum adsorption way, or,
the cleaning basket (7) is provided with an iron piece (15), the grabbing device (52) is an electromagnet (16), and the electromagnet of the multi-joint grabbing manipulator (5) is connected with the iron piece (15) of the cleaning basket (7) in an electromagnetic adsorption mode.
10. A silicon wafer or wafer cleaning machine as claimed in claim 1 wherein: the multi-joint grabbing manipulator (5) has six or more degrees of freedom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921383955.4U CN210676165U (en) | 2019-08-25 | 2019-08-25 | Silicon chip or wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921383955.4U CN210676165U (en) | 2019-08-25 | 2019-08-25 | Silicon chip or wafer cleaning machine |
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| Publication Number | Publication Date |
|---|---|
| CN210676165U true CN210676165U (en) | 2020-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921383955.4U Active CN210676165U (en) | 2019-08-25 | 2019-08-25 | Silicon chip or wafer cleaning machine |
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| CN (1) | CN210676165U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110369385A (en) * | 2019-08-25 | 2019-10-25 | 马玉水 | A kind of silicon wafer or wafer cleaning machine |
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2019
- 2019-08-25 CN CN201921383955.4U patent/CN210676165U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110369385A (en) * | 2019-08-25 | 2019-10-25 | 马玉水 | A kind of silicon wafer or wafer cleaning machine |
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| TR01 | Transfer of patent right |
Effective date of registration: 20201216 Address after: 252800 north of Renhe West Road, Gaotang County, Liaocheng City, Shandong Province Patentee after: SHANDONG LIANSHENG ELECTRONIC EQUIPMENT Co.,Ltd. Address before: 252800 Shandong Jiesheng Semiconductor Institute, middle section road, Renhe West Road, Gaotang County, Liaocheng City, Shandong Province Patentee before: Ma Yushui |