CN210671193U - Electronic component with welding short circuit prevention structure applied to SMT mounting - Google Patents
Electronic component with welding short circuit prevention structure applied to SMT mounting Download PDFInfo
- Publication number
- CN210671193U CN210671193U CN201920277731.9U CN201920277731U CN210671193U CN 210671193 U CN210671193 U CN 210671193U CN 201920277731 U CN201920277731 U CN 201920277731U CN 210671193 U CN210671193 U CN 210671193U
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- CN
- China
- Prior art keywords
- electronic component
- insulating
- prevention structure
- circuit prevention
- smt
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000002265 prevention Effects 0.000 title claims description 20
- 238000003466 welding Methods 0.000 title abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 230000017525 heat dissipation Effects 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 238000009413 insulation Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an be applied to SMT and paste electronic component who has anti-welding short circuit structure that pastes dress, it includes the electronic component body, the electronic component body includes radiating part and a plurality of pin, and the pin is arranged around radiating part, and first insulating part fixed connection has a plurality of bed hedgehopping parts on the surface of radiating part, first insulating part's fixed surface, and second insulating part fixed mounting is on bed hedgehopping part. The condition of pin and radiating part contact appears easily when welding electronic component on the PCB board, and short circuit fault can appear between them when ground connection, and this utility model discloses at insulating structure of radiating part surface design, thoroughly solved the short circuit problem that can appear.
Description
Technical Field
The utility model relates to a SMT pastes dress field particularly, relates to an electronic component who is applied to SMT and pastes dress and has anti-welding short circuit structure.
Background
The soldering technology is widely applied in the field of SMT (surface mount technology) mounting, has been successfully operated in various industries of electronic products for decades, and simultaneously innovates more accurate high-density technology. The design quality of pad is closely relevant with electronic product's quality, and if the size shape of pad design is not the electronic component that the adaptation is welded, the soldering tin position that appears easily is not accurate, leads to the short circuit problem.
In order to solve the problems of the pad design, various insulating methods are usually used to avoid short circuit.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides an be applied to SMT and paste electronic component who has anti-welding short circuit structure that pastes dress can solve the short circuit problem that produces because of pin and radiating part ground connection.
The utility model provides an be applied to SMT and paste electronic component who has anti-welding short circuit structure that pastes dress, it includes the electronic component body, and it includes radiating part and a plurality of pin, and the pin is arranged around radiating part, and first insulating part fixed connection has a plurality of bed hedgehopping parts in radiating part's surface, and the fixed surface of first insulating part installs, and second insulating part fixed mounting is on bed hedgehopping part.
The utility model provides an be applied to SMT and paste electronic component who has anti-welding short circuit structure that pastes dress installs insulating part on radiating part and makes its unable ground connection to the short circuit problem because of pin and radiating part ground connection production has been solved.
Therefore, the electronic component with the solder short-circuit prevention structure applied to SMT mounting according to the present embodiment has the following advantages compared to the prior art:
1) the problem of the short circuit that produces because of pin and heat dissipation part ground connection is solved, make the problem product can normal use, reduced the defective percentage.
2) The welding surface of the electronic element is protected by the insulating part, and the welding surface is prevented from rubbing with the outside.
3) Simple structure, low cost and easy production and maintenance.
Furthermore, a raising component is fixedly arranged at each of four corners of the first insulating component.
In foretell be applied to electronic component that has solder joint short circuit structure that SMT pasted dress, as further scheme, installation bed hedgehopping part has improved insulation system's stability on four angles of first insulating part, and bed hedgehopping part makes and leaves certain space in the middle of second insulating part and the radiating part simultaneously, guarantees that the radiating part can normally dispel the heat.
Further, the second insulating member is an insulating plate, and a plurality of bee holes are formed in the surface of the insulating plate.
In the electronic component with the solder short-circuit prevention structure applied to SMT mounting, as a further scheme, the insulating plate needs to have a certain heat dissipation function because the discrete heat components of the insulating plate are close, and the problem is solved by the bee-hole design.
Further, the insulating plate is parallel to the heat dissipation part, and the insulating plate covers the pins.
In the electronic component with the solder short circuit prevention structure applied to SMT mounting, as a further scheme, the insulating plate covers the pins to protect the pins from rubbing with the outside, and product stability is improved.
Furthermore, the heightening part is made of PPS high-temperature resistant plastic.
In the electronic component with the solder short-circuit prevention structure applied to SMT mounting, as a further solution, since the raised part is close to the heat dissipation part, a high temperature resistant material is required.
Further, the first insulating part is a PET high-temperature resistant adhesive tape.
In the electronic component with the solder short-circuit prevention structure applied to SMT mounting, as a further solution, since the first insulating member is in close contact with the heat dissipation member, a high temperature resistant material is required.
Furthermore, the heat dissipation component is a copper plate, and the contact surface of the electronic element body and the copper plate is coated with heat-conducting silicone grease.
In the electronic component with the solder short circuit prevention structure applied to SMT mounting, as a further scheme, the heat conduction silicone grease can improve the efficiency of heat conduction from the electronic component body to the copper plate.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic structural diagram of an electronic component with a solder short-circuit prevention structure for SMT mounting according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The first embodiment is as follows:
referring to fig. 1, the electronic component with solder short-circuit prevention structure for SMT mounting according to an embodiment of the present invention includes an electronic component body 1, the electronic component body 1 includes a heat dissipation component 11 and a plurality of pins 12, the pins 12 are arranged around the heat dissipation component 11, a first insulating component 2 is fixedly connected to the surface of the heat dissipation component 11, a plurality of heightening components 21 are fixedly mounted on the surface of the first insulating component 2, and a second insulating component 3 is fixedly mounted on the heightening components 21.
One raising member 21 is fixedly mounted at each of four corners of the first insulating member 2. The second insulating part 3 is the insulation board, and 3 surfaces of insulation board are provided with a plurality of bee holes, and insulation board 3 is on a parallel with heat dissipation part 11, and 3 covers pin 12 of insulation board, and bed hedgehopping part 21 adopts the high temperature resistant plastics of PPS, and first insulating part 2 is the high temperature resistant sticky tape of PET, and heat dissipation part 11 is the copper, scribbles heat conduction silicone grease on the contact surface of electronic component body 1 and copper 11.
The utility model provides an be applied to SMT and paste electronic component who has anti-welding short circuit structure that pastes dress installs insulating part on radiating part and makes its unable ground connection to the short circuit problem because of pin and radiating part ground connection production has been solved.
Therefore, the electronic component with the solder short-circuit prevention structure applied to SMT mounting according to the present embodiment has the following advantages compared to the prior art:
1) the problem of the short circuit that produces because of pin and heat dissipation part ground connection is solved, make the problem product can normal use, reduced the defective percentage.
2) The welding surface of the electronic element is protected by the insulating part, and the welding surface is prevented from rubbing with the outside.
3) Simple structure, low cost and easy production and maintenance.
Example two:
referring to fig. 1, an electronic component with a solder short-circuit prevention structure for SMT mounting according to a second embodiment of the present invention is shown in the drawings, and on the basis of the above embodiments, the present embodiment further provides the following technical solutions as improvements: the ceramic insulating coating is applied to the surface of the heat dissipation member 11, the heat dissipation effect and the protection of the pins 12 are reduced compared to the first embodiment, and the cost is reduced.
Example three:
referring to fig. 1, a third embodiment of the present invention is shown in the drawings, where the electronic component with a solder short-circuit prevention structure is applied to SMT mounting, and the present embodiment further provides the following technical solutions as improvements on the basis of the above embodiments: the insulation cover provided with the bee holes is fixedly arranged on the surface of the heat dissipation component 11, and the heat dissipation component 11 is covered by the bee hole insulation cover, so that the whole structure is simpler, and the production is easy.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (7)
1. An electronic component with solder short-circuit prevention structure for SMT mounting, comprising:
an electronic component body (1) including a heat-dissipating member (11) and a plurality of pins (12), the pins (12) being arranged around the heat-dissipating member (11);
a first insulating member (2) fixedly connected to the surface of the heat radiating member (11), wherein a plurality of raising members (21) are fixedly mounted on the surface of the first insulating member (2);
and a second insulating member (3) fixedly mounted on the step-up member (21).
2. An electronic component with solder short-circuit prevention structure for SMT according to claim 1, wherein one of the raised parts (21) is fixedly mounted at each of four corners of the first insulating part (2).
3. An electronic component with solder short-circuit prevention structure for SMT according to claim 1, wherein the second insulating member (3) is an insulating plate having a plurality of bee holes disposed on a surface thereof.
4. An electronic component with solder short-circuit prevention structure for SMT according to claim 3, wherein said insulating plate is parallel to said heat dissipation member (11), and covers said leads (12).
5. The electronic component with solder short-circuit prevention structure applied to SMT mounting according to claim 1 or 2, wherein the raised part (21) is made of PPS high-temperature resistant plastic.
6. The electronic component with solder short-circuit prevention structure applied to SMT according to claim 1, wherein the first insulating member (2) is PET high temperature resistant tape.
7. The electronic component with solder short-circuit prevention structure applied to SMT according to claim 1, wherein the heat dissipation component (11) is a copper plate, and a contact surface of the electronic component body (1) and the copper plate is coated with a heat conductive silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920277731.9U CN210671193U (en) | 2019-03-05 | 2019-03-05 | Electronic component with welding short circuit prevention structure applied to SMT mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920277731.9U CN210671193U (en) | 2019-03-05 | 2019-03-05 | Electronic component with welding short circuit prevention structure applied to SMT mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210671193U true CN210671193U (en) | 2020-06-02 |
Family
ID=70821116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920277731.9U Expired - Fee Related CN210671193U (en) | 2019-03-05 | 2019-03-05 | Electronic component with welding short circuit prevention structure applied to SMT mounting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210671193U (en) |
-
2019
- 2019-03-05 CN CN201920277731.9U patent/CN210671193U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200602 |