CN218570556U

CN218570556U - PCB structure of pin bonding pad of plug-in high-power device

Info

Publication number: CN218570556U
Application number: CN202222392005.6U
Authority: CN
Inventors: 杨明静; 王雪霞; 申会芳; 赵庆超; 宗绍国; 肖成斌; 宗恒; 杨雷; 崔波波
Original assignee: Shandong Houde Control Technology Co ltd
Current assignee: Shandong Houde Control Technology Co ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2023-03-03
Anticipated expiration: 2032-09-08

Abstract

The utility model provides a PCB structure of plug-in high-power device pin pad, high-power device's pin is on the basis of oval pad, increase three semioval little pad in the pin outside, three semioval pad, use the pad mid point to distribute as interaxis 45 degrees, no. 1 little pad is perpendicular with pin length in length direction, no. 2 little pad is anticlockwise rotation 45 degrees on No. 1 little pad basis, no. 3 little pad is clockwise rotation 45 degrees on No. 1 little pad basis. The utility model discloses an increase the electrical connection that three semiellipse shape pad increases pin and PCB pad in high-power device's pin both sides, increased pin and pad effectively and born the ability of electric current, increase the stress and the heat radiating area that the device bore when the plug simultaneously, strengthen the mechanical reliability and the thermal reliability of device effectively, and can not increase high-speed circuit board's manufacturing cost.

Description

PCB structure of pin bonding pad of plug-in type high-power device

Technical Field

The utility model relates to a circuit board design technical field especially relates to a PCB structure of plug-in high-power device pin pad.

Background

A Printed Circuit Board (PCB), also called a Printed Circuit Board, is one of the important components of electronic products. The electronic product manufactured by the printed circuit board has the advantages of high reliability, good consistency, high mechanical strength, light weight, small volume, easy standardization and the like. Almost every electronic device, as small as electronic watches, calculators, as large as computers, communication devices, electronic radar systems, uses a printed board for electrical interconnection between the electronic components, as long as they are present.

In the early stages of electronic technology development, circuits were made up of power supplies, wires, switches, and components. The components are connected by leads, and the fixation of the components is carried out three-dimensionally in space. With the development of electronic technology, the functions and structures of electronic products become complex, the layout of components and interconnection wiring are greatly restricted, and if the space wiring method is used, the electronic products become dazzling. It is therefore required to plan the electronic components and wiring through the PCB board.

With the development of light weight and portability of electronic products, the PCB not only has the function of electrically interconnecting and supporting the components, but also integrates the power part and the control part.

In the prior art, more and more circuit boards are used which conduct high power. If the amount of current in the designed circuit board is not appropriate, a malfunction is liable to occur. These faults are generally characterized by overheating or by functional and reliability:

overheating: if the width of the metal traces and planes of the circuit board are not wide enough to accommodate the current passing through them, the final area of the circuit board will be at a higher temperature than it should be. This can affect the stability of the distribution of current throughout the circuit board, thereby forcing other components to operate outside their specified temperature ranges. As more and more components operate at temperatures higher than expected, the greater the likelihood of a circuit board failure.

Functionality and reliability: not only does the elevated operating temperature affect the proper operation of the circuit board, but other mechanical problems may also be apparent. In some cases, high currents may result in reduced circuit board performance if the circuit board is not properly designed for its operating current levels. For example, the plate material may eventually melt, or the thin metal traces may burn through like a blown fuse.

Therefore, how to avoid the above fault characteristics and realize the functions of the power part and the control part to ensure the reliable bearing of the circuit board on the high-power device, especially on the plug-in high-power device, becomes a problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

In order to solve the deficiency of the prior art, the utility model provides a PCB structure of plug-in high-power device pin pad can overcome high-power device and to printed circuit board's harsh requirement, has increased pin and pad effectively and has born the ability of electric current, increases stress and heat radiating area that the device bore when the plug simultaneously, strengthens the mechanical reliability and the thermal reliability of device effectively, and can not increase high-speed circuit board's manufacturing cost.

The utility model adopts the following technical scheme:

a PCB structure of pin bonding pads of a plug-in high-power device comprises an oval bonding pad and three semi-oval small bonding pads; the three semi-elliptical small bonding pads are distributed on the outer sides of the elliptical bonding pads.

Further, the three small semi-elliptical pads are consistent in size and shape.

Furthermore, the three small semi-elliptical pads are distributed in a fan shape by taking the middle point of the elliptical pad as the center.

Furthermore, adjacent semi-elliptical small bonding pads of the three semi-elliptical small bonding pads are uniformly distributed on the outer side of the elliptical pin bonding pad at an angle of 45 degrees.

Furthermore, the semi-elliptical small bonding pad positioned in the middle is perpendicular to the length direction of the elliptical bonding pad in the length direction.

Further, the size of the semi-elliptical small bonding pad is larger than one half of the length of the elliptical bonding pad in length and smaller than two thirds of the length of the elliptical bonding pad.

Further, the size of the semi-elliptical small pad is less than one third of the length of the elliptical pad in width and greater than one fourth of the length of the elliptical pad.

Furthermore, the oval bonding pad is positioned on the surface layer of the circuit board and is connected with a pin of the high-power device.

Furthermore, the three small semi-elliptical bonding pads are connected with pins of the high-power device.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses an increase the electrical connection that three semiellipse shape pad increases pin and PCB pad in high-power device's pin both sides, increased pin and pad effectively and born the ability of electric current, increase stress and heat radiating area that the device bore when the plug simultaneously, strengthen the mechanical reliability and the thermal reliability of device effectively, and can not increase high-speed circuit board's manufacturing cost.

Drawings

The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to constitute a limitation on the invention.

Fig. 1 is a schematic diagram of a first installation direction of a PCB structure of a pin pad of a plug-in high-power device of the present invention;

fig. 2 is a schematic diagram of a second installation direction of the PCB structure of the pin pad of the plug-in high-power device of the present invention;

Detailed Description

The present invention will be further explained with reference to the accompanying drawings and examples.

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the invention. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the invention. As used herein, the singular forms "a", "an", and/or "the" are intended to include the plural forms as well, unless the invention expressly state otherwise, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof;

for convenience of description, the words "upper", "lower", "left" and "right" in the present application, if any, merely indicate correspondence with the upper, lower, left and right directions of the drawings themselves, and do not limit the structure, but merely facilitate the description of the present invention and simplify the description, rather than indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Examples

The utility model discloses for solving the technical problem in the background art on prior art's basis, provide a PCB structure of plug-in high-power device pin pad, high-power device's pin increases three semioval small pad in the pin outside on the basis of oval pad, as shown in figure 1 to figure 2, oval pad is No. 0 pad, and three semioval small pad is No. 1 pad, no. 2 pad and No. 3 pad respectively. The three semi-elliptical bonding pads are distributed at a distance of 45 degrees by taking the middle point of the elliptical bonding pad as the center, the No. 1 small bonding pad is vertical to the length of the pin in the length direction, the No. 2 small bonding pad rotates 45 degrees anticlockwise on the basis of the No. 1 small bonding pad, and the No. 3 small bonding pad rotates 45 degrees clockwise on the basis of the No. 1 small bonding pad. An oval through hole is formed in the center of the No. 0 bonding pad, the length of the through hole is about the length from the center of the No. 2 small bonding pad to the center of the No. 3 small bonding pad, and therefore the bonding pad is convenient to fix on a pin of a high-power device and convenient to dissipate heat.

In an alternative embodiment, three small semi-elliptical pads with the same size and shape are attached to the outer side of the No. 0 pad, so that the overcurrent area and the heat dissipation area are increased.

In an optional embodiment, three semi-elliptical small bonding pads with the same size and shape are attached to the outer side of the No. 0 bonding pad, the three small bonding pads are uniformly distributed at 45 degrees, and the No. 1 small bonding pad is perpendicular to the No. 0 elliptical bonding pad in the length direction, so that the contact between solder and a pin is effectively improved, and the electrical reliability of the device pin on a PCB is enhanced.

In an optional embodiment, three semi-elliptical small pads with the same size and shape are attached to the outer side of the No. 0 pad, the size of each small pad is larger than one half of the length of the No. 0 elliptical pad in length and smaller than two thirds of the length of the No. 0 elliptical pad, and the size of each small pad is smaller than one third of the length of the No. 0 elliptical pad in width and larger than one fourth of the length of the No. 0 elliptical pad in width, so that the mechanical reliability of the device on the PCB is effectively enhanced.

In an alternative embodiment, the oval pad size is designed according to the actual device pin size.

Finally, it should be noted that the above mentioned embodiments are only preferred embodiments of the present invention, and not intended to limit the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that the technical solutions described in the foregoing embodiments can be modified or some technical features can be replaced equally, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A PCB structure of pin bonding pads of a plug-in high-power device is characterized by comprising an oval bonding pad and three semi-oval small bonding pads; the three semi-elliptical small bonding pads are distributed on the outer sides of the elliptical bonding pads; the three semi-elliptical small bonding pads are distributed in a fan shape by taking the middle point of the elliptical bonding pad as the center; adjacent semi-elliptical small bonding pads are uniformly distributed on the outer side of the elliptical pin bonding pad at an angle of 45 degrees; the oval bonding pad is positioned on the surface layer of the circuit board and is connected with a pin of a high-power device; and the three semi-elliptic small welding pads are all connected with a high-power device pin.

2. The PCB structure of the pin bonding pad of the pluggable high power device according to claim 1, wherein the three semi-elliptical small bonding pads are identical in size and shape.

3. The PCB structure of the pin bonding pad of the pluggable high power device as claimed in claim 1, wherein the semi-elliptical small bonding pad located in the middle is perpendicular to the elliptical bonding pad in the length direction.

4. The PCB structure of the pin pad of the pluggable high power device of claim 1, wherein the size of the semi-elliptical small pad is greater than one half of the length of the elliptical pad and less than two thirds of the length of the elliptical pad.

5. The PCB structure of the pin pad of the pluggable high power device of claim 1, wherein the size of the semi-elliptical small pad is less than one third of the length of the elliptical pad in width and greater than one quarter of the length of the elliptical pad.