CN210663443U

CN210663443U - Semiconductor refrigeration module and semiconductor refrigeration device

Info

Publication number: CN210663443U
Application number: CN201921061744.9U
Authority: CN
Inventors: 佟贵年
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-05-05
Filing date: 2019-07-05
Publication date: 2020-06-02
Anticipated expiration: 2029-07-05

Abstract

The utility model provides a semiconductor refrigeration module, including first semiconductor refrigeration piece and sealed cowling, the inside chamber that holds that is provided with of sealed cowling, be the vacuum in holding the chamber, first semiconductor refrigeration piece holding in hold in the chamber. The utility model discloses still provide the semiconductor refrigeration device including above-mentioned semiconductor refrigeration module. The semiconductor refrigeration module and the semiconductor refrigeration device improve the refrigeration efficiency by sealing the semiconductor refrigeration sheet in vacuum.

Description

Semiconductor refrigeration module and semiconductor refrigeration device

Technical Field

The utility model relates to a semiconductor refrigeration technology field especially relates to a semiconductor refrigeration module and semiconductor refrigerating plant.

Background

The semiconductor refrigeration is a current transduction type refrigeration mode, can refrigerate and heat, and can realize high-precision control on temperature through control on input current. The semiconductor refrigeration chip generally comprises two ceramic sheets and a semiconductor material clamped between the two ceramic sheets, and the two ceramic sheets are connected through a sealant to seal the semiconductor material. The sealant connects the cold and hot ends of the semiconductor chilling plates together, which reduces the chilling efficiency. And because the temperature difference between the cold end and the hot end is large, the sealant can crack and lose efficacy after being used for a long time; because the sealant is a material with a macromolecular structure, water vapor can continuously permeate into the semiconductor refrigerating piece through the molecular gap of the sealant, so that the semiconductor material is corroded and short-circuited, and the semiconductor refrigerating piece fails. The water vapor enters the semiconductor refrigerating sheet and is condensed at the cold end; and when steam is less than 0 degree, can freeze at the cold junction, and it can seriously damage semiconductor refrigeration piece to freeze, therefore current semiconductor refrigeration piece can not use in the environment that is less than 0 degree. In addition, when the semiconductor refrigerating sheet is used for refrigerating, heat insulation cotton needs to be arranged at the cold end of the semiconductor refrigerating sheet to insulate the semiconductor refrigerating sheet so as to obtain high refrigerating efficiency, and the volume of a semiconductor refrigerating device using the semiconductor refrigerating sheet is overlarge.

SUMMERY OF THE UTILITY MODEL

Based on the not enough of above prior art, the utility model provides a semiconductor refrigeration module and semiconductor refrigerating plant of high refrigerating rate.

The utility model provides a semiconductor refrigeration module, including first semiconductor refrigeration piece and sealed cowling, the inside chamber that holds that is provided with of sealed cowling, it is formed with the vacuum to hold the intracavity, first semiconductor refrigeration piece holding in hold in the chamber.

In one embodiment, the sealing cover includes a first cover body and a second cover body connected to the first cover body, and the second cover body and the first cover body enclose to form the accommodating cavity.

In one embodiment, the first cover and the second cover are made of metal, glass or ceramic, and the first cover and the second cover are hermetically connected by welding or sintering.

In an embodiment, the semiconductor refrigeration module further includes a first exhaust pipe, the first exhaust pipe is hermetically inserted into the sealing cover and is communicated with the accommodating cavity, and one end of the first exhaust pipe, which is far away from the accommodating cavity, is of a closed structure.

In one embodiment, the semiconductor refrigeration module further includes a first thermal diffusion heat conduction element disposed on the sealing cover and connected to the first semiconductor refrigeration sheet.

In one embodiment, the semiconductor refrigeration module further comprises a connection terminal, and the connection terminal is inserted on the sealing cover in an insulating and sealing manner and is electrically connected with the first semiconductor refrigeration piece.

The utility model provides a still include the semiconductor refrigeration device of above-mentioned semiconductor refrigeration module.

In an embodiment, the semiconductor refrigeration device further includes a housing, the housing defines an accommodating cavity, and the semiconductor refrigeration module is disposed on the housing and covers the accommodating cavity.

In an implementation mode, the casing includes first casing portion, second casing portion and connecting wall, the second casing portion cover locate outside the first casing portion and with the interval preset distance between the first casing portion, the connecting wall connect the first casing portion with the second casing portion, first casing portion, second casing portion and the connecting wall encloses and forms a clearance space.

In one embodiment, a vacuum is formed in the gap space, and the semiconductor refrigeration device further comprises a second semiconductor refrigeration piece disposed in the gap space.

In one embodiment, the semiconductor refrigeration device further includes a second thermal diffusion heat conduction element disposed on the housing and connected to the second semiconductor refrigeration sheet.

In one embodiment, the semiconductor refrigeration device further comprises a second exhaust pipe, the second exhaust pipe is hermetically inserted into the shell and is communicated with the gap space, and one end, far away from the gap space, of the second exhaust pipe is of a closed structure.

In one embodiment, the first housing portion, the second housing portion, and the connecting wall are made of metal, glass, or ceramic, and the first housing portion, the second housing portion, and the connecting wall are connected by welding or sintering.

In one embodiment, the semiconductor refrigeration device further comprises a heating element housed in the interstitial space.

In an embodiment, the semiconductor refrigeration device further includes a sealing ring, and the sealing ring is disposed on the housing and abuts against the semiconductor refrigeration module, so as to seal the accommodating cavity.

In one embodiment, the semiconductor refrigeration device further comprises a heat sink disposed on the hermetic enclosure.

In one embodiment, the semiconductor cooling device further comprises a heat dissipation fan disposed on the heat sink.

In an embodiment, the semiconductor refrigeration device further comprises a housing, an inner cavity is arranged inside the housing, the inner cavity is a closed cavity, and the semiconductor refrigeration module is arranged on the housing and used for refrigerating the articles contained in the inner cavity.

The utility model provides a semiconductor refrigeration module and semiconductor refrigerating plant seals the semiconductor refrigeration piece in the vacuum, can avoid the convection heat transfer between the cold and hot end of semiconductor refrigeration piece, has improved refrigeration efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a perspective view of a semiconductor refrigeration module according to an embodiment of the present invention.

Fig. 2 is an exploded view of the semiconductor refrigeration module shown in fig. 1.

Fig. 3 is a cross-sectional view of the semiconductor refrigeration module of fig. 1 taken along III-III.

Fig. 4 is a perspective view of a semiconductor refrigeration apparatus according to a first embodiment of the present invention.

Fig. 5 is an exploded view of the semiconductor cooling device shown in fig. 4.

Fig. 6 is a cross-sectional view of the semiconductor refrigeration unit of fig. 4 taken along VI-VI.

Fig. 7 is a sectional view of a semiconductor refrigerator according to a second embodiment of the present invention.

Fig. 8 is a perspective view of a semiconductor refrigeration apparatus according to a third embodiment of the present invention.

Fig. 9 is a perspective view of a semiconductor refrigeration apparatus according to a fourth embodiment of the present invention.

Fig. 10 is a schematic configuration diagram of a semiconductor refrigeration apparatus according to a fifth embodiment of the present invention.

Description of the main elements

The following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It is to be noted that, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.

Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Features in the following embodiments may be combined with each other without conflict.

Referring to fig. 1 to 3, the present embodiment provides a semiconductor refrigeration module 10, which includes a sealing cover 11, a first semiconductor refrigeration sheet 12, a connection cable 17 and a first connection terminal 15. The inside accommodation chamber 13 that is provided with of sealed cowling 11, be the vacuum in the accommodation chamber 13. The first semiconductor refrigeration piece 12 is accommodated in the accommodating cavity 13, and the connecting cable 17 is accommodated in the accommodating cavity 13 and electrically connected with the first semiconductor refrigeration piece 12. The first connection terminal 15 is electrically connected to the connection cable 17 and extends out of the sealing cover 11.

The sealing cover 11 includes a first cover 112 and a second cover 113, and the inner surface of the first cover 112 and the inner surface of the second cover 113 surround to form the accommodating cavity 13. In the present embodiment, the material of the first cover 112 and the second cover 113 is metal, preferably stainless steel. The first cover 112 and the second cover 113 are hermetically connected by welding. It is understood that the first cap 112 and the second cap 113 may also be made of glass or ceramic, and the first cap 112 and the second cap 113 are hermetically connected by sintering.

The first connection terminal 15 is used for connecting a positive electrode or a negative electrode of a power supply to supply power to the first semiconductor refrigeration sheet 12. It can be understood that the number of the first connection terminals 15 is two, and the two first connection terminals are respectively used for connecting the positive pole and the negative pole of a power supply; the number of the connecting cables 17 is also two, and the two first connecting terminals 15 are electrically connected with the first semiconductor refrigeration sheet 12 respectively. The sealing cover 11 is provided with a mounting hole (not shown) for the first connection terminal 15 to pass through. The first connection terminal 15 is connected with the sealing cover 11 in an insulating and sealing manner through a glass sintering or ceramic sintering process.

The first semiconductor chilling plate 12 comprises a first substrate 121, a second substrate 123 and a plurality of groups of P-N junction semiconductors 124. The plurality of P-N junction semiconductors 124 are disposed between the first substrate 121 and the second substrate 123. The first semiconductor refrigeration piece 12 is packaged in the vacuum containing cavity 13, so that the heat at the hot end is prevented from flowing back to the cold end due to the fact that the first substrate 121 and the second substrate 123 of the first semiconductor refrigeration piece 12 mutually transfer heat through air, the heat conduction of the first semiconductor refrigeration piece 12 is more stable, the temperature difference between the cold end and the hot end of the first semiconductor refrigeration piece 12 is larger, and the refrigeration effect and the refrigeration speed of the first semiconductor refrigeration piece 12 are improved.

Further, the semiconductor refrigeration module 10 further includes a first exhaust pipe 14. The first exhaust pipe 14 is inserted on the sealing cover 11 and is communicated with the accommodating cavity 13. The end of the first exhaust pipe 14 away from the accommodating cavity 13 is of a closed structure. The first exhaust pipe 14 is used for vacuumizing the accommodating cavity 13. When the accommodating cavity 13 is vacuumized, the first exhaust pipe 14 is connected with a vacuum generator, and after the vacuumization is finished, the connecting end of the first exhaust pipe 14 and the vacuum generator is directly sealed to form the closed structure, so that the accommodating cavity 13 can be maintained in a vacuum state; or the pipe of the first exhaust pipe 14 is directly clamped by clamping or the like to form the closed structure, so that the vacuum state can be maintained in the accommodating cavity 13. Preferably, the first exhaust pipe 14 is welded to the sealing cap 11, so that the first exhaust pipe 14 is sealingly connected to the sealing cap 11.

It is to be understood that the manner of forming the vacuum in the accommodating chamber 13 is not limited to the above-mentioned vacuum-pumping manner, and for example, the accommodating chamber 13 inside the assembled sealing cover 11 may be in a vacuum state by directly welding and assembling the first cover 112 and the second cover 113 in a vacuum environment, and in this case, the first exhaust pipe 14 may be omitted.

Further, the semiconductor refrigeration module 10 further includes a first heat diffusion and conduction element 18. The first heat-diffusion heat-conduction element 18 is disposed on the sealing cover 11 and is used for rapidly diffusing heat generated by the first semiconductor chilling plate 12. In this embodiment, the number of the first thermal diffusion heat conduction elements 18 is two, and the two first thermal diffusion heat conduction elements 18 are disposed at two opposite ends of the first semiconductor refrigeration sheet 12 and are respectively connected to the sealing cover 11. The first thermal diffusion heat conducting element 18 may be a copper foil, an aluminum foil, a graphite sheet, a heat pipe, a thermal vapor chamber, or the like. It is understood that the first heat-spreading and heat-conducting element 18 can be connected to the first semiconductor cooling plate 12 through a thermal interface material such as a thermal paste or a thermal grease. It is understood that the number and the position of the first heat spreading and heat conducting elements 18 can be set according to the actual requirement, for example, the number of the first heat spreading and heat conducting elements 18 can also be one or more than two; the first thermal diffusion heat conduction element 18 may also be disposed on the outer surface of the sealing cover 11, and the first semiconductor cooling plate 12 is accommodated in the accommodating cavity 13 and connected to the sealing cover 11.

The semiconductor refrigeration module 10 provided by the embodiment is through inciting somebody to action first semiconductor refrigeration piece 12 encapsulates in the vacuous chamber 13 that holds, avoids carry out heat convection between the cold and hot end of first semiconductor refrigeration piece 12, makes the heat conduction of first semiconductor refrigeration piece 12 is more stable, and improves the refrigeration effect and the refrigeration speed of first semiconductor refrigeration piece 12.

In addition, the first cover body 112 and the second cover body 113 made of metal are assembled by welding to form the sealing cover 11 for encapsulating the first semiconductor refrigeration piece 12, or the first cover body 112 and the second cover body 113 made of glass or ceramic are assembled by sintering to form the sealing cover 11 for encapsulating the first semiconductor refrigeration piece 12, so that the sealing performance is good, and the sealing performance is not reduced after long-term use. Furthermore, the first connection terminal 15 is hermetically and insulatively connected to the sealing cap 11 through a glass sintering or ceramic sintering process, and the first exhaust pipe 14 is hermetically connected to the sealing cap 11 through a welding process, so that the sealing performance of the sealing cap 11 can be further improved, and the vacuum state can be maintained in the accommodating chamber 13. Steam can not get into inside semiconductor refrigeration module 10, and then avoid steam at the condensation of semiconductor refrigeration piece cold junction, avoid steam below the 0 degree to freeze at the semiconductor refrigeration piece cold junction simultaneously, thereby make semiconductor refrigeration module 10 can use in the environment that is less than 0 degree. In addition, the semiconductor refrigeration module 10 which is packaged with the first semiconductor refrigeration piece 12 in a vacuum mode has a good heat preservation effect, and when the semiconductor refrigeration module is applied to a semiconductor refrigeration device, heat preservation cotton does not need to be arranged, so that the semiconductor refrigeration device is lighter and thinner.

The utility model discloses still provide and include semiconductor refrigeration device of semiconductor refrigeration module 10.

Referring to fig. 4 to fig. 6, a semiconductor refrigeration device 100 according to a first embodiment of the present invention includes a housing 30 and the semiconductor refrigeration module 10. The housing 30 is provided with a containing cavity 31, and the semiconductor refrigeration module 10 is arranged on the housing 30 and covers the containing cavity 31. In the present embodiment, the semiconductor refrigeration module 10 serves as a cover of the case 30 and is provided separately from the case 30.

The housing 30 is generally U-channel shaped and includes a first housing portion 32, a second housing portion 33, and a connecting wall 34. The second housing portion 33 is sleeved outside the first housing portion 32, and is spaced from the first housing portion 32 by a predetermined distance. The connecting wall 34 connects the first housing part 32 and the second housing part 33. The first housing portion 32, the second housing portion 33 and the connecting wall 34 surround to form a gap space 36. A vacuum is present in the interstitial space 36.

The first housing part 32 includes a first bottom wall 321, and a first peripheral wall 323 formed to protrude circumferentially around the first bottom wall 321. The upper surface of the first bottom wall 321 and the inner side surface of the first peripheral wall 323 surround to form the accommodating cavity 31. The second housing portion 33 includes a second bottom wall 331, and a second peripheral wall 333 formed to protrude circumferentially around the second bottom wall 331. The side of the first peripheral wall 323 remote from the first bottom wall 321 and the side of the second peripheral wall 333 remote from the second bottom wall 331 are connected by the connecting wall 34. The lower surface of the first bottom wall 321, the outer side surface of the first peripheral wall 323, the lower surface of the connecting wall 34, the upper surface of the second bottom wall 331, and the inner side surface of the second peripheral wall 333 surround the gap space 36. In the present embodiment, the first housing portion 32, the second housing portion 33, and the connecting wall 34 are made of metal, preferably stainless steel. The first housing portion 32, the second housing portion 33, and the connecting wall 34 are hermetically connected by welding. It is understood that the first housing part 32, the second housing part 33 and the connecting wall 34 may also be made of glass or ceramic.

Further, the semiconductor refrigeration device 100 further includes a second exhaust duct 70. The second exhaust pipe 70 is inserted into the housing 30 and communicates with the gap space 36. The end of the second exhaust duct 70 remote from the interstitial space 36 is of closed construction. The second exhaust tube 70 is used to evacuate the interstitial space 36. When the gap space 36 is vacuumized, the second exhaust pipe 70 is connected with a vacuum generator, and after the vacuumization is completed, the connection end of the second exhaust pipe 70 and the vacuum generator is directly sealed to form the closed structure, so that the vacuum state in the gap space 36 can be maintained; or the duct of the second exhaust pipe 70 may be directly clamped by means of clamping or the like to form the closed structure, so that the vacuum state can be maintained in the gap space 36. Preferably, the second exhaust pipe 70 is welded to the housing 30 so that the second exhaust pipe 70 is sealingly connected to the housing 30.

It is to be understood that the method of forming the vacuum in the gap space 36 is not limited to the above-mentioned vacuum-pumping method, and for example, the gap space 36 formed inside the housing 30 may be formed by welding and assembling the first housing part 32, the second housing part 33, and the connecting wall 34 directly in a vacuum environment, and in this case, the second exhaust pipe 70 may be omitted.

Further, the semiconductor refrigeration device 100 further comprises a second semiconductor refrigeration piece 40. The second semiconductor chilling plate 40 is accommodated in the gap space 36 and is used for chilling the articles accommodated in the accommodating cavity 31. The structure of the second semiconductor chilling plate 40 is the same as that of the first semiconductor chilling plate 12, and the detailed description is omitted here.

In this embodiment, the number of the second semiconductor chilling plates 40 is two, one of the second semiconductor chilling plates 40 is accommodated in the gap space 36 and located at the bottom of the housing 30, and the other second semiconductor chilling plate 40 is accommodated in the gap space 36 and located at the side of the housing 30. It is understood that the number and the position of the second semiconductor chilling plates 40 may be set according to actual needs, for example, the number of the second semiconductor chilling plates 40 is one or more than two, and the second semiconductor chilling plates 40 may also be set on multiple sides of the housing 30.

Further, the semiconductor cooling device 100 further includes a second heat-diffusion heat-conduction element 60. The second heat-diffusion heat-conduction element 60 is disposed on the housing 30, and is used for rapidly diffusing the heat generated by the second semiconductor chilling plate 40. In this embodiment, the number of the second thermal diffusion and conduction elements 60 is two, and the two second thermal diffusion and conduction elements 60 are disposed at two opposite ends of the second semiconductor chilling plate 40 and are respectively connected to the housing 30. The second thermal diffusion heat conducting element 60 may be a copper foil, an aluminum foil, a graphite sheet, a heat pipe, a thermal vapor chamber, or the like. It is understood that the number and the position of the second thermal diffusion and conduction elements 60 can be set according to the actual requirement, for example, the number of the second thermal diffusion and conduction elements 60 can also be one or more than two; the second thermal diffusion heat conduction element 60 can also be disposed on the inner surface and the outer surface of the housing 30, and the second semiconductor chilling plate 40 is accommodated in the accommodating cavity 13 and connected to the housing 30.

Further, the semiconductor refrigeration device 100 further comprises a control board 50, wherein the control board 50 is disposed on the housing 30 and electrically connected to the second semiconductor refrigeration piece 40, and is used for controlling the second semiconductor refrigeration piece 40.

Further, the semiconductor cooling device 100 further includes a second connection terminal 90. The second connection terminal 90 is inserted into the housing 30 in an insulating and sealing manner, and is electrically connected to the second semiconductor chilling plate 40. The second connection terminal 90 is used for connecting an external power source to provide electric power to the second semiconductor chilling plate 40. The second connection terminal 90 is connected to the housing 30 in an insulating and sealing manner by a glass sintering or ceramic sintering process.

Further, the semiconductor refrigeration device 100 further includes a sealing ring 80. The seal ring 80 is disposed on the connecting wall 34 of the housing 30, and abuts against an edge of the sealing cover 11 of the semiconductor refrigeration module 10, so as to seal the accommodation chamber 31.

The semiconductor refrigeration device 100 according to the present embodiment is used for refrigerating the articles accommodated in the accommodation chamber 31. The second semiconductor refrigerating sheet 40 is packaged in vacuum, so that the heat convection between the cold end and the hot end of the semiconductor refrigerating sheet can be avoided, and the refrigerating efficiency is improved. And the housing 30 made of metal, glass or ceramic is assembled by welding or sintering, and has good sealing performance, and the sealing performance is not reduced after long-term use. In addition, the second connection terminal 90 is hermetically connected to the housing 30 by a glass sintering or ceramic sintering process, so that the sealing property of the housing 30 can be further improved, and the gap space 36 can be maintained in a vacuum state. In addition, the semiconductor refrigeration piece is packaged in vacuum, the heat preservation effect is excellent, heat preservation cotton does not need to be arranged for heat preservation, and the semiconductor refrigeration device 100 is lighter and thinner.

Referring to fig. 7, a semiconductor refrigeration device 200 according to a second embodiment of the present invention is substantially the same as the semiconductor refrigeration device according to the first embodiment, and the differences are: the semiconductor refrigeration device 200 also includes a heating element 210. In particular, the second semiconductor chilling plate located at the bottom of the housing 30 is replaced by the heating element 210. Specifically, the heating element 210 is received in the gap space 36 and is located at the bottom of the housing 30. The heating element 210 is used for heating the object accommodated in the accommodating cavity 31. It is understood that the position of the heating element 210 can be set according to actual needs, such as the side of the housing 30.

Referring to fig. 8, a semiconductor refrigeration device 300 according to a third embodiment of the present invention is substantially the same as the semiconductor refrigeration device according to the first embodiment, and the differences are: the semiconductor cooling device 300 further includes a heat sink 310. Specifically, the first heat-diffusion heat-conduction element disposed on the sealing cover 11 is replaced with the heat sink 310. The first semiconductor refrigeration piece is connected with the sealing cover 11, and the radiator 310 is arranged on the upper surface of the sealing cover 11 and used for radiating the first semiconductor refrigeration piece packaged in the sealing cover 11, so that the refrigeration efficiency of the first semiconductor refrigeration piece is further improved. The heat sink 310 includes a plurality of heat dissipation fins 311 arranged in parallel. It is understood that the position of the heat sink 310 can be set according to actual needs, for example, the heat sink 310 is used to replace a second heat-diffusion heat-conduction element disposed on the housing 30 for dissipating heat of a second semiconductor cooling plate packaged in the housing 30.

Referring to fig. 9, a semiconductor refrigeration apparatus 400 according to a fourth embodiment of the present invention is substantially the same as the semiconductor refrigeration apparatus according to the third embodiment, and the differences are: the semiconductor cooling device 400 further includes a heat dissipation fan 410. The heat dissipation fan 410 is disposed on the heat sink 310, and configured to dissipate heat from the heat sink 310, so as to further improve the cooling efficiency of the first semiconductor cooling fin packaged in the sealing cover 11. It is understood that the position of the heat dissipation fan 410 can be set according to actual needs, for example, the position is set at the bottom or the side of the housing.

Referring to fig. 10, a semiconductor refrigeration device 500 according to a fifth embodiment of the present invention includes a housing 510 and a semiconductor refrigeration module 10 disposed on the housing 510. An inner cavity 513 is arranged inside the outer shell 510, and the inner cavity 513 is a closed cavity. The semiconductor refrigeration module 10 is accommodated in the inner cavity 513 and is used for refrigerating the articles accommodated in the inner cavity 513. It is understood that the semiconductor refrigeration module 10 may be disposed outside the housing 510, for example, on the outer sidewall of the housing 510, according to actual requirements. The semiconductor refrigeration device 500 may be a refrigerator, a medical incubator, or the like.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims

1. The semiconductor refrigeration module comprises a first semiconductor refrigeration piece and is characterized by further comprising a sealing cover, a containing cavity is formed in the sealing cover, a vacuum is formed in the containing cavity, and the first semiconductor refrigeration piece is contained in the containing cavity.

2. The semiconductor refrigeration module of claim 1 wherein said hermetic enclosure comprises a first enclosure and a second enclosure connected to said first enclosure, said second enclosure and said first enclosure together forming said receiving cavity.

3. The semiconductor refrigeration module according to claim 2, wherein the first housing and the second housing are made of metal, glass or ceramic, and the first housing and the second housing are hermetically connected by welding or sintering.

4. The semiconductor refrigeration module according to claim 1, further comprising a first exhaust pipe, the first exhaust pipe is hermetically inserted into the sealing cover and is communicated with the accommodating cavity, and one end of the first exhaust pipe, which is far away from the accommodating cavity, is of a closed structure.

5. The semiconductor refrigeration module of claim 1 further comprising a first heat spreading and conducting element disposed on the enclosure and coupled to the first semiconductor chilling plate.

6. The semiconductor refrigeration module of claim 1 further comprising a terminal, wherein the terminal is insulatedly and hermetically inserted on the sealing cover and electrically connected with the first semiconductor refrigeration sheet.

7. A semiconductor refrigeration device comprising a semiconductor refrigeration module according to any one of claims 1 to 6.

8. The semiconductor refrigeration device according to claim 7, further comprising a housing, wherein the housing defines a receiving cavity, and the semiconductor refrigeration module is disposed on the housing and covers the receiving cavity.

9. The semiconductor refrigeration device according to claim 8, wherein the housing includes a first housing portion, a second housing portion, and a connecting wall, the second housing portion is disposed outside the first housing portion and spaced from the first housing portion by a predetermined distance, the connecting wall connects the first housing portion and the second housing portion, and the first housing portion, the second housing portion, and the connecting wall surround to form an interstitial space.

10. The semiconductor cooling device according to claim 9, wherein a vacuum is formed in the gap space, and further comprising a second semiconductor cooling fin disposed in the gap space.

11. The semiconductor cooling device according to claim 10, further comprising a second heat spreading and conducting element disposed on the housing and coupled to the second semiconductor chilling plate.

12. The semiconductor refrigeration device according to claim 10, further comprising a second exhaust pipe sealingly inserted in the housing and communicating with the interstitial space, wherein an end of the second exhaust pipe remote from the interstitial space is of a closed structure.

13. The semiconductor cooling device according to claim 10, wherein the first housing portion, the second housing portion, and the connecting wall are made of metal, glass, or ceramic, and the first housing portion, the second housing portion, and the connecting wall are connected by welding or sintering.

14. The semiconductor cooling device of claim 9, further comprising a heating element housed in the interstitial space.

15. The semiconductor refrigeration device according to claim 8 further comprising a seal ring disposed on the housing and abutting the semiconductor refrigeration module for sealing the receiving cavity.

16. The semiconductor cooling device of claim 8, further comprising a heat sink disposed on the containment cap.

17. The semiconductor cooling device of claim 16, further comprising a heat sink fan disposed on the heat sink.

18. The semiconductor refrigeration device according to claim 7, further comprising a housing, wherein an inner cavity is disposed inside the housing, the inner cavity is a closed cavity, and the semiconductor refrigeration module is disposed on the housing for refrigerating an article received in the inner cavity.