CN210651923U - Positioning platform for non-contact smart card production equipment - Google Patents
Positioning platform for non-contact smart card production equipment Download PDFInfo
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- CN210651923U CN210651923U CN201921286376.8U CN201921286376U CN210651923U CN 210651923 U CN210651923 U CN 210651923U CN 201921286376 U CN201921286376 U CN 201921286376U CN 210651923 U CN210651923 U CN 210651923U
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Abstract
The utility model discloses a positioning platform for non-contact smart card production equipment, which comprises a substrate, wherein the substrate is divided into a plurality of winding screens which are arranged in a matrix on the substrate; the winding clamping positions correspond to the winding clamping units on the plate material one by one; all be provided with the chip storage tank that is used for depositing the chip in every wire winding screens, the chip storage tank in the wire winding screens places the position one-to-one with the chip in the wire winding card unit. The utility model discloses a welded chip can be treated to positioning platform and fix a position for this chip is located the chip of the corresponding wire winding card unit in the sheet material accurately and places position department, makes chip welding module can weld the coil on the wire winding card unit in chip and the sheet material, thereby improves chip welding precision, guarantees the production quality of non-contact ability smart card. Additionally, the utility model discloses a positioning platform can also save the time that the chip made a round trip to carry, improves the non-production efficiency who connects the smart card.
Description
Technical Field
The utility model relates to a smart card manufacture equipment, concretely relates to a location platform for non-contact smart card production facility.
Background
In the production process of the non-contact smart card, the following processing procedures are generally required: the method comprises the following steps of a laser punching process, a winding process, a chip welding process, an ultrasonic composite welding process and a cutting process; after the processing procedures, an independent intelligent card board material unit is formed, and semi-finished raw materials are provided for subsequent other processing.
The existing intelligent card winding equipment, for example, the invention patent application with application publication number CN108000909A, discloses a non-contact intelligent card manufacturing production line, which comprises a rack, a PVC plate mounting rack, a plate mounting rack of a PVC cover plate coil, a laser punching module, an intelligent card winding processing module, a chip welding module, an ultrasonic composite welding module, a traction module for traction conveying of PVC plates and PVC cover plates, and a collection module; the laser punching module, the intelligent card winding processing module, the chip welding module, the ultrasonic composite welding module, the traction module and the collection module are sequentially arranged on the rack along the conveying direction of the PVC sheet; the PVC sheet mounting bracket is arranged behind the laser drilling module, and the sheet mounting bracket is arranged in front of the sheet mounting bracket. The utility model discloses can link together the processing module that each non-contact smart card was made to process in carrying each processing module in succession the PVC sheet material, reduced the transportation number of times to the PVC sheet material, improved production efficiency and machining precision.
However, the above-mentioned contactless smart card manufacturing line has the following disadvantages:
in the non-contact smart card manufacturing production line, in the process of producing the non-contact smart card, the PVC sheet material passes through the laser punching module and then reaches the winding processing module, and the winding processing module winds the PVC sheet material on the winding card unit. After the winding is finished, the PVC sheet is sent to a chip welding module, at the moment, a chip conveying device conveys a chip to be welded to a chip to be welded of each PVC winding card on a PVC winding card unit, and then the chip welding module welds the chip to be welded to the corresponding PVC winding card; and then, conveying the PVC plate to an ultrasonic composite welding module for compounding, and finally cutting and processing the compounded PVC plate to form an independent intelligent card plate material unit. In the process, the PVC sheet is wound, the chips to be welded are conveyed to the positions to be welded of the chips of the PVC winding cards in the PVC winding card units on the PVC sheet, and then the chips and the PVC winding cards are welded, so that when the chips deviate relative to the chip welding positions in the PVC sheet due to certain factors (such as vibration and wind power), the chips cannot be accurately placed at the chip welding positions, the chip welding module cannot smoothly weld the chips to the PVC winding cards, open circuit between the chips and the PVC winding cards is easily caused, and the production quality of non-contact intelligent cards is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art not enough, provide a positioning platform for non-contact smart card production facility, positioning platform can treat the welded chip and fix a position for this chip is located the chip of the corresponding wire winding card unit in the sheet material accurately and places position department, thereby improves chip welding precision, and then guarantees the production quality that non-contact can the smart card. In addition, the positioning platform can save the time spent by the chip carrying device for carrying the chips back and forth, and improve the production efficiency of the non-connected smart card.
The utility model provides a technical scheme of above-mentioned technical problem is:
a positioning platform for non-contact smart card production equipment comprises a substrate, wherein the substrate is divided into a plurality of winding screens which are arranged on the substrate in a matrix manner; the winding clamping positions correspond to the winding clamping units on the plate material one by one; all be provided with the chip storage tank that is used for depositing the chip in every wire winding screens, the chip storage tank in the wire winding screens places the position one-to-one with the chip in the wire winding card unit.
Preferably, the substrate is provided with a first air suction opening at the lower end of the chip storage groove, and the first air suction opening is communicated with an external negative pressure device.
Preferably, the base plate is further provided with a positioning part for positioning the plate, the positioning part comprises a plurality of positioning pins arranged on the base plate, and the plate is provided with positioning holes matched with the positioning pins at positions corresponding to the positioning pins.
Preferably, the number of the positioning pins is two, and the two positioning pins are arranged at two ends of the same side of the substrate.
Preferably, a plurality of second air suction openings are formed in the periphery of the winding clamping position and are uniformly arranged along the outer contour line of the winding clamping position; and each second air suction opening is communicated with an external negative pressure device.
Preferably, the base plate comprises an upper plate body and a lower plate body, the upper plate body is connected with the lower plate body through threads, an inner cavity is formed between the upper plate body and the lower plate body, and the inner cavity is communicated with the first air suction opening and the second air suction opening.
Preferably, the winding screens form a matrix of 5x 5.
The utility model discloses a theory of operation that is used for non-contact smart card production facility's location platform is:
during operation, through the utility model discloses a location platform can realize the location to the chip, and concrete process is: the chip carrying device carries the chips into the chip storage grooves of the winding clamping positions of the positioning platform in sequence, then the plate carrying device carries the plate into the positioning platform, a plurality of winding card units are arranged on the plate, the winding card units correspond to the winding clamping positions on the plate one by one, and each winding card unit corresponds to one non-contact intelligent card. Because each winding card position on the positioning platform is provided with a chip storage groove, the chip storage groove corresponds to the chip placement position of the corresponding winding card unit in the plate. After chip and sheet material realized the location on positioning platform, drive through conveyor the utility model discloses a positioning platform moves wire winding station department, winds on each wire winding card unit on the sheet material through the wire winding module, draws forth the solder joint contact on two wires and the chip at last. And finally, the conveying device continuously drives the positioning platform, the chip and the plate placed on the positioning platform to reach a subsequent processing station to complete a subsequent processing procedure.
In the process, the chip and the plate are accurately positioned on the positioning platform before winding, so that the chip and the plate are prevented from offsetting in the winding process, the lead led out from the coil of each winding card unit can be in contact with the welding point of the chip after winding, the welding point of the chip and the lead led out can be smoothly welded by the chip welding module, the welding precision is improved, and the production quality of the non-contact intelligent card is improved. In addition, because the chip all has placed in positioning platform's chip storage tank before the wire winding, and traditional non-connects smart card manufacturing line then places position department with the chip that the chip carried the wire winding card unit on the sheet material one by one after the wire winding is accomplished, consequently, compare in traditional chip transport mode, the utility model discloses a positioning platform can save the non-time that makes a round trip to carry the chip that connects smart card production line to spend, improves the non-production efficiency who connects the smart card production line.
Compared with the prior art, the utility model following beneficial effect has:
1. the positioning platform of the utility model is provided with a plurality of winding screens, each winding screen is provided with a chip storage groove, the winding screens correspond to the winding card units on the plate one by one, and the chip storage grooves on the winding screens correspond to the chip placement positions on the winding card units; like this, carry the chip to positioning platform's chip storage tank through chip handling device in, utilize the chip storage tank to carry on spacingly to the chip, prevent that the chip from taking place the skew in subsequent course of working to guarantee that chip welding set can be in the same place the wire welding of the coil in chip and the wire winding card unit, improve the welding precision, and then improve the production quality of non-contact smart card.
2. Through setting up the utility model discloses a positioning platform for the non-connects the smart card production line just can place the chip before the wire winding in positioning platform's chip storage tank to fix a position the chip through the chip storage tank, compare in traditional non-connect the smart card production line carry the chip of wire winding card unit one by one after the wire winding to the chip of chip place the mode of position department, the utility model discloses a positioning platform can save the non-time that the non-connects the smart card production line to make a round trip to carry the chip and spend, improves the non-production efficiency who connects the smart card production line.
Drawings
Fig. 1 is a schematic perspective view of the positioning platform for contactless smart card production equipment of the present invention.
Fig. 2 is a plan view.
Fig. 3 is a partially enlarged view of a portion a in fig. 1.
Fig. 4 is a partially enlarged view of fig. 2 at B.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
Referring to fig. 1-4, the positioning platform for non-contact smart card production equipment of the present invention comprises a substrate 1, wherein the substrate 1 is divided into a plurality of winding screens 2, the winding screens 2 are arranged in a matrix on the substrate 1, and the winding screens 2 correspond to the winding card units on the sheet material one by one; each winding card position 2 is provided with a chip storage groove 1-1 for storing a chip, and the chip storage groove 1-1 in the winding card position 2 corresponds to the chip placement position on the winding card unit in the plate.
Referring to fig. 1 to 4, the substrate 1 is provided with a first air suction port 1-2 at a lower end of the chip storage groove 1-1, and the first air suction port 1-2 is communicated with an external negative pressure device. Therefore, the chips are adsorbed in the chip storage groove 1-1 through vacuum pumping of the negative pressure device, and the chips are prevented from shifting due to other factors (such as vibration) in the subsequent processing process and are always located at the chip placement positions of the corresponding winding card units in the plate, so that the chip welding precision is improved, and the production quality of the non-contact smart card is guaranteed.
Referring to fig. 1-4, a positioning element for positioning a sheet material is further disposed on the substrate 1, the positioning element includes a plurality of positioning pins 1-3 disposed on the substrate 1, and positioning holes matched with the positioning pins 1-3 are disposed at positions corresponding to the positioning pins 1-3 on the sheet material.
Its aim at, the utility model discloses a location platform not only can realize fixing a position the chip, can also fix a position flaky sheet material, and concrete process is: firstly, handling device transports the sheet material on the positioning platform of the utility model discloses a locating pin 1-3 on the positioning platform, because locating pin 1-3 have many, corresponding, locating hole on the sheet material also has a plurality ofly, just so can the accurate restriction sheet material of a plurality of location take place the displacement on the horizontal direction. The advantage of adopting above-mentioned structure lies in: (1) and through the utility model discloses a location of chip and sheet material can be realized earlier to the locating platform, then winds again in the wire winding card unit of sheet material, carries out the welding between the wire that the coil on chip and the wire winding card unit was drawn forth at last. Therefore, compared with the traditional processing mode of a non-contact smart card production line, the mode has the advantages that the plate and the chips are positioned before winding, so that the plate can be prevented from being deviated in the winding process, the chip placing positions on the plate correspond to the chips one to one, the chip welding precision is improved, and the production quality of the non-contact smart card is ensured. (2) Because the plate and the chip are positioned on the positioning platform before winding, the chip and the plate are prevented from shifting in the subsequent processing process, and the welding precision of the chip and the production quality of the non-contact smart card are further improved.
The number of the positioning pins 1 to 3 in this embodiment is two, and the two positioning pins 1 to 3 are disposed at two ends of the same side of the substrate 1.
Referring to fig. 1-4, a plurality of second air suction openings 2-1 are formed around the winding card 2, and the second air suction openings 2-1 are uniformly arranged along the outer contour line of the winding card 2; each second air suction opening 2-1 is communicated with an external negative pressure device. Therefore, the negative pressure device is used for vacuumizing, so that the plate is adsorbed on the surface of the substrate 1, and the plate is prevented from deviating in the processing process. And because every wire winding screens 2 on the base plate 1 all are provided with the second inlet scoop 2-1 all around, the second inlet scoop 2-1 is along the outer contour line align to grid 2, just so can guarantee wire winding screens 2 on the base plate 1 and wire winding card unit one-to-one on the sheet material, also mean to leave the chip on the locating platform and chip on the sheet material and place the position one-to-one, thus further improve the positioning accuracy of sheet material.
Referring to fig. 1 and 2, it can be seen that the substrate 1 is divided into 25 wire winding position clamps 2 by the second air suction opening 2-1 disposed on the substrate 1, and the 25 wire winding position clamps 2 are arranged in a matrix of 5 × 5 on the substrate 1. Correspondingly, the number of the winding card units on the plate is also 25, and the winding card units are also arranged on the plate in a matrix of 5x 5.
Referring to fig. 1-4, the base plate 1 includes an upper plate body 1-4 and a lower plate body 1-5, the upper plate body 1-4 is connected to the lower plate body 1-5 through threads, an inner cavity is disposed between the upper plate body 1-4 and the lower plate body 1-5, and the inner cavity is communicated with the first air suction port 1-2 and the second air suction port 2-1. Therefore, air in the inner cavity of the substrate 1 is extracted through the negative pressure device, so that the air pressure in the inner cavity is smaller than the atmospheric pressure, and therefore, the chip and the plate material on the surface of the substrate 1 are pressed on the surface of the substrate 1 under the action of the atmospheric pressure, and the chip and the plate material are prevented from deviating in the processing process. In addition, the first air suction opening 1-2 and the second air suction opening 2-1 are communicated with the inner cavity, so that the adsorption force of the first air suction opening 1-2 and the second air suction opening 2-1 on the chip and the plate material can be ensured to be the same.
Referring to fig. 1-4, the working principle of the positioning platform for the non-contact smart card production equipment of the present invention is:
during operation, through the utility model discloses a location platform can realize the location to the chip, and concrete process is: the chip carrying device carries the chips into the chip storage grooves 1-1 of the winding clamping positions 2 of the positioning platform in sequence, then the sheet material carrying device carries the sheet material into the positioning platform, a plurality of winding clamping units are arranged on the sheet material, the winding clamping units correspond to the winding clamping positions 2 on the sheet material one by one, and each winding clamping unit corresponds to one non-connected intelligent card. And because each winding card position 2 on the positioning platform is provided with a chip storage groove 1-1, the chip storage groove 1-1 corresponds to the chip placement position of the corresponding winding card unit in the plate material. After chip and sheet material realized the location on positioning platform, drive through conveyor the utility model discloses a positioning platform moves wire winding station department, winds on each wire winding card unit on the sheet material through the wire winding module, draws forth the solder joint contact on two wires and the chip at last. And finally, the conveying device continuously drives the positioning platform, the chip and the plate placed on the positioning platform to reach a subsequent processing station to complete a subsequent processing procedure.
In the process, the chip and the plate are accurately positioned on the positioning platform before winding, so that the chip and the plate cannot deviate in the winding process, the lead led out from the coil in each winding card unit can be in contact with the welding point of the chip after winding, the welding point of the chip and the lead led out can be smoothly welded by the chip welding module, the welding precision is improved, and the production quality of the non-contact intelligent card is improved. In addition, because the chip all has been placed in positioning platform's chip storage tank 1-1 before the wire winding, and traditional non-connects smart card manufacturing line then places position department with the chip of carrying the wire winding card unit on the sheet material one by one after the wire winding is accomplished, consequently, compare in traditional chip transport mode, the utility model discloses a positioning platform can save the non-time that makes a round trip to carry the chip that connects smart card production line, improves the production efficiency that non-connects the smart card production line.
The above is the preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.
Claims (7)
1. A positioning platform for non-contact smart card production equipment is characterized by comprising a substrate, wherein the substrate is divided into a plurality of winding screens which are arranged on the substrate in a matrix manner; the winding clamping positions correspond to the winding clamping units on the plate material one by one; all be provided with the chip storage tank that is used for depositing the chip in every wire winding screens, the chip storage tank in the wire winding screens places the position one-to-one with the chip in the wire winding card unit.
2. The positioning platform for contactless smart card production apparatus of claim 1, wherein the base plate is provided with a first suction port at a lower end of the chip storage groove, the first suction port being in communication with an external negative pressure device.
3. The positioning platform for the non-contact smart card production equipment according to claim 2, wherein a positioning member for positioning a sheet material is further disposed on the substrate, the positioning member includes a plurality of positioning pins disposed on the substrate, and the sheet material is provided with positioning holes at positions corresponding to the positioning pins, the positioning holes being matched with the positioning pins.
4. The positioning platform for the non-contact smart card production equipment according to claim 3, wherein there are two positioning pins, and the two positioning pins are disposed at two ends of the same side of the substrate.
5. The positioning platform for the contactless smart card production equipment according to claim 3, wherein a plurality of second air suction openings are arranged around the bobbin position, and are arranged along an outer contour line of the bobbin position; and each second air suction opening is communicated with an external negative pressure device.
6. The positioning platform for non-contact smart card production equipment as claimed in claim 5, wherein the base plate comprises an upper plate body and a lower plate body, the upper plate body and the lower plate body are connected through threads, an inner cavity is arranged between the upper plate body and the lower plate body, and the inner cavity is communicated with the first air suction opening and the second air suction opening.
7. The positioning platform for contactless smart card production equipment of claim 6, wherein the winding card positions form a matrix of 5x 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921286376.8U CN210651923U (en) | 2019-08-08 | 2019-08-08 | Positioning platform for non-contact smart card production equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921286376.8U CN210651923U (en) | 2019-08-08 | 2019-08-08 | Positioning platform for non-contact smart card production equipment |
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| Publication Number | Publication Date |
|---|---|
| CN210651923U true CN210651923U (en) | 2020-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921286376.8U Active CN210651923U (en) | 2019-08-08 | 2019-08-08 | Positioning platform for non-contact smart card production equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524890A (en) * | 2019-08-08 | 2019-12-03 | 广州明森合兴科技有限公司 | A kind of locating platform for contactless smart card production equipment |
| CN112350129A (en) * | 2020-11-18 | 2021-02-09 | 广州展丰智能科技有限公司 | Non-contact smart card winding butt-welding production process and system |
-
2019
- 2019-08-08 CN CN201921286376.8U patent/CN210651923U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524890A (en) * | 2019-08-08 | 2019-12-03 | 广州明森合兴科技有限公司 | A kind of locating platform for contactless smart card production equipment |
| CN112350129A (en) * | 2020-11-18 | 2021-02-09 | 广州展丰智能科技有限公司 | Non-contact smart card winding butt-welding production process and system |
| CN112350129B (en) * | 2020-11-18 | 2021-12-03 | 广州展丰智能科技有限公司 | Non-contact smart card winding butt-welding production process and system |
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