CN210641197U - Structure for mounting and welding semiconductor transistor of vehicle-mounted charger - Google Patents
Structure for mounting and welding semiconductor transistor of vehicle-mounted charger Download PDFInfo
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- CN210641197U CN210641197U CN201921588676.1U CN201921588676U CN210641197U CN 210641197 U CN210641197 U CN 210641197U CN 201921588676 U CN201921588676 U CN 201921588676U CN 210641197 U CN210641197 U CN 210641197U
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- semiconductor transistor
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- water channel
- mounted charger
- welding
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Abstract
The utility model provides a weld structure after earlier dress of on-vehicle machine semiconductor transistor that charges, include: the semiconductor transistor is adhered to one side of the plastic support, the elastic sheet is installed in the shell, one side of the semiconductor transistor on the plastic support is pressed and attached to the side wall of the water channel in the shell through the elastic sheet, the circuit board is fixedly installed above the semiconductor transistor and the water channel, and pins of the semiconductor transistor penetrate through welding through holes in the circuit board before welding. The utility model discloses weld earlier among the prior art and adorn the scheme improvement for weld the scheme after the dress earlier to pin, the solder joint of having avoided semiconductor transistor receive very big stress, cause the problem of functional failure, also avoided simultaneously because the semiconductor transistor pin is welded earlier and is recompressed, lead to the laminating that semiconductor transistor can not be fine on the radiator, lead to the bad problem of heat dissipation.
Description
Technical Field
The utility model relates to a vehicle-mounted machine technical field that charges, in particular to vehicle-mounted machine semiconductor transistor that charges's weld structure after dress earlier.
Background
With the requirements of energy conservation and emission reduction and air pollution control, new energy automobiles are gradually commercialized in the market, and electric automobiles are more the main force of the new energy automobiles. The electric vehicle is further classified into a pure electric vehicle and a hybrid electric vehicle, wherein a vehicle-mounted charger OBC and a voltage converter DCDC are important components of the electric vehicle, and a semiconductor transistor is also an important component of the vehicle-mounted charger OBC and the voltage converter DCDC. In the existing solution for welding and fixing the semiconductor transistor, a solution of welding first and then mounting (welding the semiconductor transistor first and then fixing the semiconductor transistor) is adopted, and the solution can cause that pins and welding points of the semiconductor transistor are subjected to great stress to cause functional failure, and simultaneously, the semiconductor transistor cannot be well attached to a radiator to cause poor heat dissipation.
SUMMERY OF THE UTILITY MODEL
The utility model provides a structure is welded after adorning earlier of on-vehicle machine semiconductor transistor that charges to solve at least one above-mentioned technical problem.
For solving the above problem, as an aspect of the utility model provides an on-vehicle machine semiconductor transistor that charges's dress welds structure after earlier, include: the semiconductor transistor is pasted on one side of the plastic support, the elastic sheet is installed in the shell and tightly presses and adheres one side of the semiconductor transistor on the plastic support onto the side wall of the water channel in the shell, the circuit board is fixedly installed above the semiconductor transistor and the water channel, and pins of the semiconductor transistor penetrate through welding through holes in the circuit board before welding.
Preferably, the plastic support comprises a back plate, a top plate and positioning pins, the top plate is vertically connected with the upper end of the back plate, the positioning pins are installed at the lower end of the back plate, and positioning insertion holes matched with the positioning pins are formed in the shell.
Preferably, a semiconductor transistor positioning boss is protrudingly formed on the back plate, and a pin positioning groove is formed on the top plate.
Preferably, the semiconductor transistor is bonded to the back plate by a double-sided tape.
Preferably, a thermally conductive insulating film is provided between the semiconductor transistor and the water passage.
Preferably, the housing is integrally formed with the waterway.
Preferably, the structure of welding after the dress of on-vehicle machine semiconductor transistor that charges still includes the water course apron, the water course passes through the sealing washer and with water course apron sealing connection.
Preferably, the semiconductor transistor is perpendicular to the circuit board and parallel to the water channel, the height of the water channel is far larger than the width of the water channel, and the height of the cooling liquid in the water channel reaches the heat dissipation surface of the semiconductor transistor.
Preferably, the cross-section of the water channel is L-shaped, and the bottom of the L-shaped water channel extends into the lower part of an installation cavity surrounded by the water channel.
Preferably, a power magnetic part is arranged in the mounting cavity.
Preferably, the power magnetic part conducts heat with the water channel by adopting a mode of point heat conduction glue, pouring heat conduction glue or padding a heat conduction pad.
Preferably, an electrolytic capacitor and an AC common mode inductor are arranged in the housing, and the electrolytic capacitor and the AC common mode inductor conduct heat with the housing in a manner of applying a thermal conductive adhesive, pouring a thermal conductive adhesive, or padding a thermal conductive pad.
Preferably, the elastic sheet is fixed on the shell through a screw, and the section of the elastic sheet is L-shaped.
Since the technical scheme is used, the utility model discloses weld earlier among the prior art and adorn the scheme improvement for weld earlier after the dress and weld the scheme to pin, the solder joint of having avoided semiconductor transistor receive very big stress, cause the problem of functional failure, also avoided semiconductor transistor pin to be welded earlier simultaneously and recompressed, lead to the laminating that the semiconductor can not be fine on the radiator, lead to the bad problem of heat dissipation.
Drawings
Figure 1 schematically shows an exploded view of the present invention;
figure 2 schematically shows a perspective view of the present invention;
figure 3 schematically illustrates a bottom view of the present invention;
fig. 4 schematically shows a structural view of the housing;
FIG. 5 schematically illustrates a schematic view of a plastic carrier;
FIG. 6 schematically shows a side view of a plastic carrier;
FIG. 7 schematically illustrates a mounting of a plastic carrier with a semiconductor transistor;
FIG. 8 schematically illustrates the mounting of the plastic bracket into the housing;
FIG. 9 schematically shows a cross-sectional view of FIG. 8;
FIG. 10 schematically illustrates a mounting schematic of a circuit board;
FIG. 11 schematically illustrates a cross-sectional view after mounting of a circuit board;
FIG. 12 schematically illustrates a mounting schematic of the power magnet, electrolytic capacitor and AC common mode inductor;
fig. 13 schematically shows a schematic view of a spring plate;
fig. 14 schematically shows a mounting structure of the electrolytic capacitor to the case.
Reference numbers in the figures: 1. a housing; 2. a plastic bracket; 3. a spring plate; 4. a semiconductor transistor; 5. a circuit board; 6. a water channel; 7. a back plate; 8. a top plate; 9. a positioning leg; 10. a semiconductor transistor positioning boss; 11. a pin positioning groove; 12. double-sided adhesive tape; 13. a thermally conductive insulating film; 14. a water channel cover plate; 15. a seal ring; 16. a power magnetic member; 17. an electrolytic capacitor; 18. an AC common mode inductor; 19. an upper cover; 20. a water gap; 21. positioning holes; 22. and (4) heat-conducting glue.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
Problem and not enough to exist among the prior art, the utility model provides a welding and fixed solution that is used for on-vehicle machine OBC that charges, voltage converter DCDC and the semiconductor transistor of relevant integrated product, the on-vehicle machine OBC that charges based on this scheme, voltage converter DCDC or the semiconductor transistor of relevant integrated product do not have welding stress, do not have installation stress, heat dissipation that can be fine.
The utility model discloses an aspect provides an on-vehicle machine semiconductor transistor that charges's welding structure after dress relates to on-vehicle machine OBC that charges, voltage converter DCDC and relevant integrated product's semiconductor transistor's that welds and fixes
The utility model discloses an aspect provides an on-vehicle machine semiconductor transistor that charges's dress welds structure after earlier, include: the novel solar water heater comprises a shell 1, a plastic support 2, an elastic sheet 3, a semiconductor transistor 4 and a circuit board 5, wherein the semiconductor transistor 4 is pasted on one side of the plastic support 2, the elastic sheet 3 is installed in the shell 1, one side of the semiconductor transistor 4 on the plastic support 2 is tightly pressed and attached to the side wall of a water channel 6 in the shell 1, the circuit board 5 is fixedly installed above the semiconductor transistor 4 and the water channel 6, and pins of the semiconductor transistor 4 penetrate through welding through holes in the circuit board 5 before welding. Preferably, the semiconductor transistor 4 is perpendicular to the circuit board 5 and parallel to the water channel 6, the height of the water channel 6 is much larger than the width, and the height of the cooling liquid in the water channel 6 reaches the heat dissipation surface of the semiconductor transistor 4.
In the technical solution, the utility model discloses can be earlier through plastic support 2 and shell fragment 3 with semiconductor transistor 4 install casing 1 in, then install the circuit board on casing 1 again, make semiconductor transistor 4's pin wear out from corresponding welding through-hole on circuit board 5 to make things convenient for the circuit board to carry out wave-soldering in subsequent process, weld semiconductor transistor 4 on circuit board 5. Therefore, the problem that the semiconductor transistor 4 is subjected to extra stress due to the welding process when the semiconductor transistor 4 is mounted on the plastic support 2 and then the plastic support 2 is fixed in the housing can be solved.
Since the technical scheme is used, the utility model discloses weld earlier among the prior art and adorn the scheme improvement for weld earlier after the dress and weld the scheme to pin, the solder joint of having avoided semiconductor transistor receive very big stress, cause the problem of functional failure, also avoided semiconductor transistor pin to be welded earlier simultaneously and recompressed, lead to the laminating that semiconductor transistor can not be fine on the radiator, lead to the bad problem of heat dissipation.
Preferably, the plastic support 2 comprises a back plate 7, a top plate 8 and positioning pins 9, the top plate 8 is vertically connected with the upper end of the back plate 7, the positioning pins 9 are mounted at the lower end of the back plate 7, and positioning insertion holes matched with the positioning pins 9 are formed in the shell 1. The back plate 7 and the top plate 8 form an L-shaped structure, and after the positioning pins 9 are inserted into the positioning insertion holes in the shell, the plastic support 2 can be positioned in the length direction and the height direction, and in addition, the positioning of the elastic sheet 3 is pressed, so that the positioning of the whole plastic support 2 can be realized.
Preferably, a semiconductor transistor positioning boss 10 is protrudingly formed on the back plate 7, and a pin positioning slot 11 is formed on the top plate 8. The semiconductor transistor positioning boss 10 is inserted into the mounting hole of the semiconductor transistor, and then the pins of the semiconductor transistor are placed in the pin positioning grooves 11, so that the height and the left-right direction of the screw pins can be correctly positioned, and the pins can be kept in a correct posture after being mounted on the plastic support 2 so as to accurately penetrate through the welding through holes on the circuit board 5.
In one embodiment, the semiconductor transistor 4 is preferably bonded to the backplane 7 by a double-sided adhesive 12. The double-sided adhesive tape 12 is a high-temperature-resistant double-sided adhesive tape, and of course, the bonding can be realized in other manners.
Preferably, a thermally conductive insulating film 13 is provided between the semiconductor transistor 4 and the water channel 6. The use of the heat conductive insulating film 13 can further contribute to heat conduction and heat dissipation.
In the prior art, the shell and the water channel are separately and separately manufactured, and then the water channel is installed and fixed in the shell through fasteners and the like, so that certain extra volume needs to be occupied, the size is large, corresponding assembly time needs to be spent, and the heat conduction contact is not uniform enough due to the separate devices, and the heat dissipation performance is affected. For this purpose, the housing 1 is preferably integrally formed with the waterway 6. Under this structure, casing 1 and the integrative die-casting of water course 6 are formed, not only need not the equipment assembly, and the integral type structure is more favorable to the heat dissipation moreover, has also saved the required volume of installation, has realized the miniaturization of volume.
Preferably, the structure of the semiconductor transistor of the vehicle-mounted charger, which is assembled before welding, further comprises a water channel cover plate 14, and the water channel 6 is hermetically connected with the water channel cover plate 14 through a sealing ring 15. The use of the sealing ring 15 allows the housing to enclose the waterway in this application together with the waterway cover plate 14.
Preferably, said water channel 6 extends in a U-shape. Preferably, the cross section of the water channel 6 is L-shaped, and the bottom of the L-shape extends into the lower part of the cavity surrounded by the water channel 6. Preferably, a power magnetic piece 16 is arranged in the mounting cavity. Because the L-shaped shape is adopted, and the cross section of the internal flow passage of the water passage 6 is L-shaped, the circumferential side surface and the bottom surface of the power magnetic piece 16 can be cooled, and the heat dissipation effect is improved.
Preferably, the power magnetic member 16 conducts heat with the water channel 6 by using a point heat conducting glue, a pouring heat conducting glue, or a pad heat conducting pad. Referring to fig. 14, preferably, an electrolytic capacitor 17 and an AC common mode inductor 18 are disposed in the housing 1, and the electrolytic capacitor 17 and the AC common mode inductor 18 conduct heat with the housing 1 by using a point heat conduction glue, a thermal filling glue, or a thermal pad. By adopting the heat conduction mode, the heat conduction effect of the components can be improved.
Preferably, the elastic sheet 3 is fixed on the housing 1 through a screw, and the section of the elastic sheet 3 is L-shaped. For example, still can set up locating hole 21 on the shell fragment 3, be provided with the reference column with locating hole 21 complex correspondingly on the casing, during the installation, the shell fragment 3 can be earlier through the cooperation realization preliminary location of locating hole 21 and reference column, then the installation screw, reliably fixes the shell fragment 3.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (13)
1. The utility model provides a structure is welded after dress of on-vehicle machine semiconductor transistor that charges which characterized in that includes: casing (1), plastic support (2), shell fragment (3), semiconductor transistor (4) and circuit board (5), semiconductor transistor (4) are fixed one side of plastic support (2), install shell fragment (3) in casing (1), shell fragment (3) will one side of semiconductor transistor (4) on plastic support (2) compresses tightly the laminating and is in on water course (6) lateral wall in casing (1), circuit board (5) are installed fixedly semiconductor transistor (4) reach the top of water course (6), the pin of semiconductor transistor (4) is worn to establish before the non-welding in the welding through-hole on circuit board (5).
2. The structure of the vehicle-mounted charger semiconductor transistor that is welded after being installed firstly according to claim 1, characterized in that the plastic support (2) comprises a back plate (7), a top plate (8) and a positioning pin (9), the top plate (8) is vertically connected with the upper end of the back plate (7), the positioning pin (9) is installed at the lower end of the back plate (7), and a positioning jack matched with the positioning pin (9) is arranged in the housing (1).
3. The semiconductor transistor mounting-welding structure of the vehicle-mounted charger according to claim 2, characterized in that a semiconductor transistor positioning boss (10) is protrudingly formed on the back plate (7), and a pin positioning groove (11) is formed on the top plate (8).
4. The structure of the vehicle-mounted charger semiconductor transistor of claim 2, characterized in that the semiconductor transistor (4) is bonded to the back plate (7) by a double-sided adhesive tape (12).
5. The structure of the semiconductor transistor of the vehicle-mounted charger according to claim 1, characterized in that a heat-conducting insulating film (13) is arranged between the semiconductor transistor (4) and the water channel (6).
6. The structure of a semiconductor transistor of a vehicle-mounted charger according to claim 1, characterized in that the casing (1) is integrally formed with the water channel (6).
7. The structure for mounting and welding the semiconductor transistor of the vehicle-mounted charger according to claim 6, characterized in that the structure for mounting and welding the semiconductor transistor of the vehicle-mounted charger further comprises a water channel cover plate (14), and the water channel (6) is hermetically connected with the water channel cover plate (14) through a sealing ring (15).
8. The structure for mounting a semiconductor transistor of a vehicle-mounted charger according to claim 6, wherein the cross section of the water channel (6) is L-shaped, and the bottom of the L-shaped water channel extends into the lower part of the mounting cavity surrounded by the water channel (6).
9. The structure for the semiconductor transistor of the vehicle-mounted charger according to claim 1, characterized in that the semiconductor transistor (4) is perpendicular to the circuit board (5) and parallel to the water channel (6), the height of the water channel (6) is much greater than the width thereof, and the height of the cooling liquid in the water channel (6) reaches the heat dissipation surface of the semiconductor transistor (4).
10. The structure for the semiconductor transistor of the vehicle-mounted charger according to claim 8, characterized in that a power magnetic member (16) is arranged in the mounting cavity.
11. The semiconductor transistor structure of the vehicle-mounted charger according to claim 10, wherein the power magnetic member (16) conducts heat with the water channel (6) by applying a thermal conductive paste or pouring a thermal conductive paste or padding a thermal conductive pad.
12. The semiconductor transistor structure of the vehicle-mounted charger according to claim 1, wherein an electrolytic capacitor (17) and an AC common mode inductor (18) are arranged in the housing (1), and the electrolytic capacitor (17) and the AC common mode inductor (18) conduct heat with the housing (1) in a manner of dispensing heat-conducting glue, pouring heat-conducting glue, or padding a heat-conducting pad.
13. The structure of the vehicle-mounted charger semiconductor transistor, which is welded after being assembled, according to claim 1, is characterized in that the elastic sheet (3) is fixed on the shell (1) through a screw, and the section of the elastic sheet (3) is L-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921588676.1U CN210641197U (en) | 2019-09-23 | 2019-09-23 | Structure for mounting and welding semiconductor transistor of vehicle-mounted charger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921588676.1U CN210641197U (en) | 2019-09-23 | 2019-09-23 | Structure for mounting and welding semiconductor transistor of vehicle-mounted charger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210641197U true CN210641197U (en) | 2020-05-29 |
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ID=70798575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921588676.1U Active CN210641197U (en) | 2019-09-23 | 2019-09-23 | Structure for mounting and welding semiconductor transistor of vehicle-mounted charger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210641197U (en) |
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2019
- 2019-09-23 CN CN201921588676.1U patent/CN210641197U/en active Active
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