CN118102668A

CN118102668A - Vehicle-mounted charger

Info

Publication number: CN118102668A
Application number: CN202410190348.5A
Authority: CN
Inventors: 丘永琪; 杨江辉; 李小秋
Original assignee: Huawei Digital Power Technologies Co Ltd
Current assignee: Huawei Digital Power Technologies Co Ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2024-05-28
Also published as: CN113645812A; CN113645812B

Abstract

The application provides a vehicle-mounted charger. The vehicle-mounted charger comprises a heat dissipation structure, a printed circuit board and a plurality of devices. The radiating structure comprises a bottom plate, a plurality of protruding parts and a plurality of side plates, wherein the bottom plate, the protruding parts and the side plates are integrally formed, the side plates are located on the periphery of the bottom plate and are connected with the bottom plate to form a containing space with an opening, and the protruding parts protrude from the bottom plate and divide the containing space into a plurality of containing chambers. The at least one accommodating chamber includes a side wall formed of a protruding portion and a bottom wall formed of a bottom plate, and a hollow interior of the protruding portion serves as a first three-dimensional flow passage and a second three-dimensional flow passage through which a heat radiation medium flows, so that a heat generating device accommodated in the at least one accommodating chamber is laterally adjacent to the first three-dimensional flow passage and the second three-dimensional flow passage. A plurality of heat conducting clapboards are arranged between the first three-dimensional flow channel and the second three-dimensional flow channel and are connected with the bottom plate, the heat conducting clapboards are used for separating the accommodating chambers between the first three-dimensional flow channel and the second three-dimensional flow channel into a plurality of chambers, and gaps are reserved between the heat conducting clapboards and the printed circuit board.

Description

Vehicle-mounted charger

The present application is a divisional application, the application number of the original application is 202110956844.3, the original application date is 2021, month 08 and 19, and the whole content of the original application is incorporated by reference into the present application.

Technical Field

The application relates to the technical field of electronic equipment, in particular to a vehicle-mounted charger.

Background

In recent years, with the increase of energy saving and environmental protection requirements of people, the proportion of new energy automobiles in the market is also increased year by year. An On-board Charger (OBC) is an important component of an electric power system in a new energy automobile. The vehicle-mounted charger has the functions of rectifying charging, 12V direct current output, vehicle power distribution and the like. The main heating devices in the vehicle-mounted charger comprise a power tube, a magnetic device, copper sheet current, a capacitor, a resistor, a fuse, a chip and the like. When the vehicle-mounted charger works, if the heat of the heating devices is not discharged out of the vehicle-mounted charger for a long time, the performance of the vehicle-mounted charger is adversely affected, and even the vehicle-mounted charger is irreversibly damaged due to overheating.

Disclosure of Invention

The application provides a vehicle-mounted charger, which is used for realizing heat dissipation of the vehicle-mounted charger and simplifying assembly steps of the vehicle-mounted charger.

In a first aspect, the present disclosure provides a vehicle-mounted charger, where a heat dissipation structure of the vehicle-mounted charger may include a base plate and a protrusion. Specifically, the heat dissipation structure has a receiving space. The protruding part is arranged on the bottom plate and protrudes towards the accommodating space. The inside of the protruding part is hollow, so that a three-dimensional flow channel can be formed. The above-mentioned protruding portion may be provided with a heat-conductive rib. The protrusion and the thermally conductive rib may be connected to form a mounting cavity. When the heat radiation structure is applied to the electronic equipment, the first heat-generating device of the electronic equipment can be installed in the installation cavity and is in heat conduction connection with the protruding part, so that heat of the first heat-generating device can be transferred to a heat radiation medium in the three-dimensional flow channel through the protruding part, and heat radiation of the electronic equipment is realized. In addition, when the electronic device is assembled, the first heat generating device can be directly installed in the installation cavity after being electrically connected, so that the assembling step is simplified.

In this aspect, the thermally conductive connection of the first heat generating device to the protruding portion may include the first heat generating device being in direct contact with a surface of the protruding portion forming the mounting cavity, or a thermally conductive material being provided between the first heat generating device and the protruding portion, the heat of the first heat generating device being transferred to the protruding portion through the thermally conductive material.

The connection between the heat-conducting rib and the protruding portion is not limited, and the heat-conducting rib may be connected to the protruding portion by, for example, riveting, screwing, clamping, or bonding. In this technical solution, the heat-conducting rib may also be connected to the base plate, for example by riveting, screwing, clamping or bonding, without limitation; or the heat conducting rib part and the bottom plate can be integrated into a whole structure so as to enhance the structural strength of the heat conducting rib part and simplify the assembly steps of the heat dissipation structure.

Or the heat conducting rib part and the protruding part can be integrated into a whole structure so as to strengthen the structural strength of the protruding part and simplify the assembly steps of the heat dissipation structure.

In order to facilitate heat transfer between the first heat generating device and the protrusion, the heat conductive rib may be provided with a stopper. The limiting piece is located in the mounting cavity. When the first heating device of the electronic equipment is arranged in the mounting cavity, the limiting piece acts on the first heating device to enable the first heating device to be close to the protruding portion, so that the distance between the first heating device and the protruding portion is reduced, and the heat transfer efficiency is improved.

In a specific technical scheme, the connection mode of the limiting piece and the heat conducting rib is not limited, for example, the limiting piece can be connected with the heat conducting rib through riveting, threaded connection, clamping or bonding and the like. Or the limiting piece can be integrally formed with the heat conducting rib part, so that the structural strength of the heat conducting rib part is enhanced, and the assembly step of the heat dissipation structure is simplified.

Furthermore, the protruding portion may be provided with a first heat radiating tooth located in the mounting cavity. The first heat-generating device surface is provided with second heat-dissipating teeth. When the first heating device is installed in the installation cavity, the first heat dissipation tooth is meshed with the second heat dissipation tooth. The heat of the first heat generating device may be transferred to the protrusion through the second heat radiating tooth and the first heat radiating tooth in sequence. The first heat dissipation teeth are meshed with the second heat dissipation teeth, so that the heat transfer area can be increased, and the heat transfer efficiency is improved.

The above-mentioned projection may also form at least two walls of the mounting cavity. For example, the end of the projection facing away from the base plate may be L-shaped, such that the projection forms a bottom wall and one side wall of the mounting cavity, or forms two adjacent side walls of the mounting cavity. Or the protrusions may form the bottom wall and the adjacent two side walls of the mounting cavity. Alternatively, the protruding portion may form a bottom wall and three side walls of the installation cavity, the heat-conducting rib may form one wall of the installation cavity, and the protruding portion and the heat-conducting rib are connected to form the installation cavity, and the installation cavity is U-shaped in a plane perpendicular to the flow direction of the heat-dissipating medium. When the heat dissipation structure of the embodiment is applied to electronic equipment, the first heat-generating device of the electronic equipment can be arranged in the U-shaped mounting cavity, the U-shaped mounting cavity can bear the first heat-generating device, and heat of the first heat-generating device can be taken away through heat dissipation media flowing in the protruding part, so that heat dissipation of the first heat-generating device is achieved.

The three-dimensional flow channel may include a first three-dimensional flow channel and a second three-dimensional flow channel. The bottom plate is provided with a plane guide runner. The planar guide flow passage may communicate the first stereoscopic flow passage with the second stereoscopic flow passage, thereby enabling the heat dissipation medium to flow between the first stereoscopic flow passage, the second stereoscopic flow passage, and the planar guide flow passage.

The heat dissipation structure can be applied to electronic equipment, and a device of the electronic equipment is accommodated in the accommodating space of the heat dissipation structure and is in heat conduction connection with the heat dissipation structure. When the electronic equipment works, some heating devices of the electronic equipment generate heat, and the heat can be transferred to the heat dissipation structure and taken away by the heat dissipation medium flowing in the first three-dimensional flow channel, the second three-dimensional flow channel and the plane guide flow channel, so that the heat dissipation of the electronic equipment is realized. In addition, the protruding portion is located in the accommodating space, and may divide the accommodating space into a plurality of accommodating chambers. At least one of the accommodating chambers may include a side wall formed by the protruding portion and a bottom wall formed by the bottom plate, so that the heat generating device accommodated in the accommodating chamber is adjacent to the three-dimensional flow channel at the side surface and is adjacent to the plane guide flow channel at the bottom surface, thereby heat transfer can be performed at both the side surface and the bottom surface of the heat generating device to increase a heat transfer area, improve heat transfer efficiency, and thereby improve a heat dissipation effect to the electronic device.

Specifically, turbulence teeth can be respectively arranged in the first three-dimensional flow channel and the second three-dimensional flow channel; or the first three-dimensional flow channel is provided with turbulence teeth and the second three-dimensional flow channel is not provided with turbulence teeth; or the first three-dimensional flow channel is not provided with turbulence teeth and the second three-dimensional flow channel is provided with turbulence teeth.

In one aspect, the turbulator teeth reduce the cross-section of the flow channel perpendicular to the flow direction of the heat sink medium according to Bernoulli's principle, such that the flow velocity increases as the heat sink medium passes the turbulator teeth, thereby improving heat transfer efficiency. On the other hand, according to the hydrodynamics, when the heat dissipation medium flows in the three-dimensional flow channel, the heat dissipation medium forms a boundary layer at the flat inner wall surface of the three-dimensional flow channel, and the boundary layer is subjected to viscous shear stress to cause a reduction in the flow rate of the heat dissipation medium. The turbulent teeth on the inner wall of the three-dimensional flow channel can destroy the formation of a boundary layer, thereby solving the problem that the flow speed of a heat dissipation medium is reduced due to the boundary layer and improving the heat transfer efficiency. In addition, the turbulent teeth can also increase the contact area between the heat dissipation medium and the three-dimensional flow channel, thereby increasing the heat transfer area and improving the heat transfer efficiency.

The extending direction of the turbulence teeth can be intersected with the flowing direction of the heat dissipation medium, so that the contact area of the turbulence teeth and the heat dissipation medium is increased and turbulence is increased under the condition that the flow of the heat dissipation medium is not hindered.

In a specific technical scheme, the extending direction of the turbulence teeth can be perpendicular to the flowing direction of the heat dissipation medium, so that turbulence can be increased under the condition that the flowing of the heat dissipation medium is not hindered, heat transfer between the heat dissipation medium and the inner wall of the three-dimensional runner and heat transfer inside the heat dissipation medium are further accelerated, and the turbulence teeth can be manufactured by adopting molding.

Guide teeth can be arranged in the plane guide flow channel. The heat dissipation medium flows out of one of the first three-dimensional flow channel and the second three-dimensional flow channel and then flows through the plane guide flow channel, and the guide teeth can guide the heat dissipation medium to flow towards the other three-dimensional flow channel, so that a complete flow path is formed in the flow channel of the heat dissipation structure, and the heat dissipation function is realized.

In particular, a plurality of guide teeth may be disposed in the planar guide flow channel, and the specific disposition of the guide teeth is not limited, for example, the guide teeth may be disposed in parallel for easy manufacture; or the guide teeth may be arranged to converge toward the same direction.

In addition, when different heat dissipation mediums are used, the viscosity, heat conduction properties, etc. of the heat dissipation mediums may also be different. The height of the guide teeth may be set to be different, and the length of the guide teeth may be set to be different, depending on specific heat dissipation requirements.

A heat conducting partition board is arranged in the accommodating space and connected with the bottom plate. Specifically, the protruding portion is located in the accommodating space and divides the accommodating space into a plurality of accommodating chambers, and at least one of the accommodating chambers may be provided with a heat conductive partition. The heat conducting partition board is in heat conducting connection with the heating device, so that heat of the heating device can be transferred to the bottom plate through the heat conducting partition board, heat conducting resistance between the heating device and the heat radiating structure is reduced, and heat transfer efficiency is improved.

The heat conducting partition plate can be further provided with a heat conducting piece. The heat conductive member may be located at a side of the heat conductive partition plate remote from the bottom plate. When the electronic apparatus further includes a substrate provided with a circuit, a device of the electronic apparatus may be provided to the substrate. When the electronic equipment is assembled, the devices are contained in the containing space of the heat dissipation structure, the heat conducting pieces can be in contact with the substrate, and heat of some devices can be transferred to the heat conducting partition plates through the substrate and the heat conducting pieces in sequence, so that the distance between the substrate and the heat dissipation structure is reduced, and heat dissipation to the substrate is achieved.

In a specific technical scheme, the protruding portion may divide the accommodating space into a plurality of accommodating chambers. At least one of the receiving chambers may be provided with a heat conductive cover plate so that the heat conductive cover plate may cover the receiving chamber. Some specific devices of the electronic apparatus may be placed independently within the containment chamber without affecting the operation of other devices. In addition, the inner walls of the accommodating chamber can be subjected to heat transfer so as to increase the heat transfer contact area.

The heat dissipating structure of the present application may further include an inlet and an outlet. The heat dissipation medium can enter the flow channel through the inlet, and flows out of the outlet after passing through the first three-dimensional flow channel, the plane guide flow channel and the second three-dimensional flow channel, so that a complete flow path is formed in the flow channel of the heat dissipation structure, and the heat dissipation function is realized.

The specific number and location of the inlets and outlets described above is not limited. For example, the heat dissipating structure may include one inlet and one outlet, or may also include one inlet and two outlets. In addition, the inlet and the outlet may be disposed on the same side of the heat dissipating structure; or the inlet and the outlet can be arranged on two adjacent sides of the heat dissipation structure; or the inlet and the outlet can be arranged on two opposite sides of the heat radiation structure, so that the heat radiation medium with lower temperature at the inlet is far away from the heat radiation medium with higher temperature at the outlet, and the temperature of the heat radiation medium and the heat radiation medium are prevented from being influenced by each other.

The specific position of the plane guide runner arranged on the bottom plate is not limited. For example, the interior of the base plate may have a cavity that forms a planar pilot flow channel and communicates with the first and second stereo flow channels. Or the plane guide runner can be arranged on one side of the bottom plate, which is away from the accommodating space, and the heat dissipation structure can also comprise a sealing cover which is covered with the bottom plate. When the sealing cover and the bottom plate are covered, the first three-dimensional flow channel, the plane guide flow channel and the second three-dimensional flow channel can be sealed. Or the plane guide runner can be arranged on one side of the bottom plate facing the accommodating space, and the heat dissipation structure can further comprise a sealing cover which is covered with the bottom plate. When the sealing cover is covered with the bottom plate, the plane guide flow channel can be sealed.

The sealing cover has one or more protrusions protruding toward the base plate. For example, when the planar guide flow channel is located at a side of the bottom plate facing away from the accommodating space, the protrusion may be located in the planar guide flow channel or the first stereoscopic flow channel or the second stereoscopic flow channel. Taking the example that the protrusions are located in the plane guide flow channels, when the heat dissipation medium flows in the plane guide flow channels, the protrusions can disturb the flow of the heat dissipation medium in the plane guide flow channels, so that turbulence is generated, and heat transfer between the interiors of the heat dissipation medium and between the heat dissipation medium and the heat dissipation structure is accelerated. In addition, according to the Bernoulli principle, the protrusions reduce the cross section of the planar guide flow channel perpendicular to the flow direction of the heat dissipation medium, so that the flow velocity increases when the heat dissipation medium passes the protrusions, thereby improving the heat transfer efficiency.

In a second aspect, the present application provides an electronic apparatus, which includes the first heat generating device and the heat dissipating structure of the first aspect, where the first heat generating device is disposed in a mounting cavity of the heat dissipating structure and is thermally connected to the protruding portion. In the electronic equipment, the heat of the first heat generating device can be transferred to the heat dissipation medium in the three-dimensional flow channel through the protruding part, so that the heat dissipation of the electronic equipment is realized. In addition, when the electronic device is assembled, the first heat generating device can be directly installed in the installation cavity after being electrically connected, so that the assembling step is simplified.

In a specific technical scheme, one side of the first heat generating device may be provided with a limiting member, and the limiting member is used for making the first heat generating device approach the protruding portion. When the first heating device is installed in the installation cavity, the limiting piece acts on the first heating device to enable the first heating device to be close to the protruding portion, so that the distance between the first heating device and the protruding portion is reduced, and heat transfer efficiency is improved.

The connection mode of the limiting member and the first heating device is not limited, and for example, riveting, threaded connection, clamping or bonding can be performed.

The mounting cavity may be filled with a heat conductive glue. In the process that the first heating device is arranged in the installation cavity, the first heating device and the limiting piece are immersed in the heat-conducting glue. The limiting piece acts on the first heating device and enables the first heating device to be close to the protruding portion, the first heating device can be fixed relative to the mounting cavity after the heat-conducting glue is solidified, and the first heating device is not required to be fixed to the mounting cavity in other modes, so that the assembly steps of the electronic equipment are simplified.

In a third aspect, the present application provides a heat dissipating structure that may include a base plate and a protrusion. Specifically, the bottom plate and the protruding portion of the heat dissipation structure may form an accommodating space. The protruding part is arranged on the bottom plate and protrudes towards the accommodating space. The inside of the protruding part is hollow, so that a first three-dimensional flow passage and a second three-dimensional flow passage can be formed. The bottom plate is provided with a plane guide runner. The planar guide flow passage may communicate the first stereoscopic flow passage with the second stereoscopic flow passage, thereby enabling the heat dissipation medium to flow between the first stereoscopic flow passage, the second stereoscopic flow passage, and the planar guide flow passage.

The heat dissipation structure can be applied to electronic equipment, and a device of the electronic equipment is accommodated in the accommodating space of the heat dissipation structure and is in heat conduction connection with the heat dissipation structure. When the electronic equipment works, some heating devices of the electronic equipment generate heat, and the heat can be transferred to the heat dissipation structure and taken away by the heat dissipation medium flowing in the first three-dimensional flow channel, the second three-dimensional flow channel and the plane guide flow channel, so that the heat dissipation of the electronic equipment is realized. In addition, the protruding portion is located in the accommodating space, and may divide the accommodating space into a plurality of accommodating chambers. At least one of the accommodating chambers may include a side wall formed by the protruding portion and a bottom wall formed by the bottom plate, so that the heat generating device accommodated in the accommodating chamber is adjacent to the first three-dimensional flow channel and/or the second three-dimensional flow channel at the side surface and the plane guide flow channel at the bottom surface, thereby performing heat transfer at both the side surface and the bottom surface of the heat generating device to increase a heat transfer area and heat transfer efficiency, thereby improving a heat dissipation effect on the electronic device.

The above-mentioned protruding portion may be provided with a heat-conductive rib. The protrusion and the thermally conductive rib may be connected to form a mounting cavity. When the heat radiation structure is applied to the electronic equipment, the first heat-generating device of the electronic equipment can be installed in the installation cavity and is in heat conduction connection with the protruding part, so that heat of the first heat-generating device can be transferred to a heat radiation medium in the first three-dimensional flow channel or the second three-dimensional flow channel through the protruding part, and the heat of the first heat-generating device can be radiated. In addition, when the electronic device is assembled, the first heat generating device can be directly installed in the installation cavity after being electrically connected, so that the assembling step is simplified.

In order to facilitate heat transfer between the first heat generating device and the protrusion, the heat conductive rib may be provided with a stopper. The limiting piece is positioned in the mounting cavity. When the first heating device of the electronic equipment is arranged in the mounting cavity, the limiting piece acts on the first heating device to enable the first heating device to be close to the protruding portion, so that the distance between the first heating device and the protruding portion is reduced, and the heat transfer efficiency is improved.

The heat conducting partition plate can be further provided with a heat conducting piece. The heat conductive member may be located at a side of the heat conductive partition plate remote from the bottom plate. When the electronic apparatus further includes a substrate provided with a circuit, a device of the electronic apparatus may be electrically connected to the substrate. When the device is accommodated in the accommodating space of the heat dissipation structure, the heat conducting piece can be in contact with the substrate, and heat of the substrate can be transferred to the heat conducting substrate through the heat conducting piece, so that the distance between the substrate and the heat dissipation structure is reduced, and heat dissipation of the substrate is achieved.

The specific position of the plane guide runner arranged on the bottom plate is not limited. For example, the interior of the base plate may have a cavity that forms a planar pilot flow channel and communicates with the first and second stereo flow channels. Or the plane guide runner can be arranged on one side of the bottom plate, which is away from the accommodating space, and the heat dissipation structure can also comprise a sealing cover which is covered with the bottom plate. When the sealing cover and the bottom plate are covered, the first three-dimensional flow channel, the plane guide flow channel and the second three-dimensional flow channel can be sealed.

In a fourth aspect, the present application provides an electronic apparatus including a heat generating device and the heat dissipating structure of the third aspect, wherein the heat generating device is disposed in the heat dissipating structure. In the electronic device, the heat generating device may be accommodated in the accommodating space of the heat dissipating structure. When the electronic equipment works, the heating device heats. The heating device is in heat conduction connection with the heat dissipation structure, so that heat can be transferred to the heat dissipation structure and taken away by the heat dissipation medium flowing in the first three-dimensional flow channel, the second three-dimensional flow channel and the plane guide flow channel, and heat dissipation of the electronic equipment is realized. In addition, the protruding portion is located in the accommodating space, and may divide the accommodating space into a plurality of accommodating chambers. At least one of the accommodating chambers may include a side wall formed by the protruding portion and a bottom wall formed by the bottom plate, such that the heat generating device accommodated in the accommodating chamber is laterally adjacent to the first and/or second three-dimensional flow channels and is laterally adjacent to the planar guide flow channel, thereby allowing heat transfer at both the side and bottom surfaces of the heat generating device to increase a heat transfer area and heat transfer efficiency.

The heat generating device may include a first heat generating device, and the protruding portion is provided with a mounting cavity. The first heat generating device may be mounted to the mounting cavity and thermally connected to the protrusion, so that heat of the first heat generating device may be transferred to the heat dissipation medium in the first or second three-dimensional flow passage through the protrusion. In this aspect, the thermally conductive connection of the first heat generating device to the protruding portion may include the first heat generating device being in direct contact with a surface of the protruding portion forming the mounting cavity, or a thermally conductive material being provided between the first heat generating device and the protruding portion, the heat of the first heat generating device being transferred to the protruding portion through the thermally conductive material.

The mounting cavity may be filled with a heat conductive glue. When the first heating device is installed in the installation cavity, the first heating device and the limiting piece are immersed in the heat-conducting glue. The limiting piece acts on the first heating device and enables the first heating device to be close to the protruding portion, and the heat-conducting glue can fix the first heating device relative to the mounting cavity.

Drawings

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of another structure of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a heat dissipation structure according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a heat dissipation structure according to an embodiment of the present application;

FIG. 5 is a schematic diagram of another heat dissipating structure according to the present application;

FIG. 6 is a schematic diagram of another heat dissipation structure according to the present application;

FIG. 7 is a cross-sectional view of the heat dissipating structure of FIG. 6 along the direction A-A;

FIG. 8 is a schematic view of a mounting cavity according to an embodiment of the present application;

FIG. 9 is a schematic view of a stopper disposed in a mounting cavity according to an embodiment of the present application;

FIG. 10 is a schematic view of another stop member disposed in a mounting cavity according to an embodiment of the present application;

FIG. 11 is a schematic view of another stop member disposed in a mounting cavity according to an embodiment of the present application;

FIG. 12 is a schematic view of another stop member disposed in a mounting cavity according to an embodiment of the present application;

FIG. 13 is a schematic view of another stop member disposed in a mounting cavity according to an embodiment of the present application;

FIG. 14 is a schematic view of another stop member disposed in a mounting cavity according to an embodiment of the present application;

FIG. 15 is a schematic view of a limiting member disposed on a first heat generating device according to an embodiment of the present application;

FIG. 16 is a schematic view of another spacing member disposed on a first heat generating device according to an embodiment of the present application;

FIG. 17 is a schematic view of another spacing member disposed on a first heat generating device according to an embodiment of the present application;

FIG. 18 is a schematic view of a stop member according to an embodiment of the present application;

FIG. 19 is a schematic view of a portion of an electronic device according to an embodiment of the application;

FIG. 20 is a schematic view of a portion of an electronic device according to an embodiment of the application;

FIG. 21 is a schematic cross-sectional view of the heat dissipating structure of FIG. 5 along the B-B direction;

FIG. 22 is a schematic cross-sectional view of the heat dissipating structure of FIG. 5 along the direction C-C;

FIG. 23 is a schematic view of an arrangement of a first three-dimensional flow channel, a second three-dimensional flow channel, and a planar pilot flow channel in an embodiment of the application;

FIG. 24 is a schematic view of another arrangement of a first three-dimensional flow channel, a second three-dimensional flow channel, and a planar pilot flow channel in an embodiment of the application;

FIG. 25 is a schematic view of another arrangement of a first three-dimensional flow channel, a second three-dimensional flow channel, and a planar pilot flow channel in an embodiment of the application;

FIG. 26 is a schematic view of another arrangement of a first three-dimensional flow channel, a second three-dimensional flow channel, and a planar pilot flow channel in an embodiment of the application;

FIG. 27 is a schematic diagram of a heat dissipation structure according to an embodiment of the application;

FIG. 28 is a cross-sectional view of the heat dissipating structure of FIG. 27 along the direction D-D;

fig. 29 is a cross-sectional view of the electronic device of fig. 2 in the direction of arrow E;

Fig. 30 is a flowchart illustrating a method for assembling an electronic device according to an embodiment of the application.

Reference numerals:

10-an electronic device; 11-devices;

12-a heat dissipation structure; 13-a housing;

15-mounting a bracket; 16-second heat dissipating teeth;

17-a substrate; 18-heat conducting glue;

20-accommodating space; 21-a bottom plate;

22-protrusions; 23-thermally conductive ribs;

24-side plates; 25-mounting cavity;

26-limiting piece; 27-first heat dissipating teeth;

28-inlet; 29-outlet;

30-sealing the cover; 31-a heat conducting separator;

32-a heat conducting cover plate; 111-a first heat generating device;

112-an ac input filter device; 201-a housing chamber;

211-plane guide flow channel; 212-guide teeth;

221-a first three-dimensional flow channel; 222-a second stereoscopic flow channel;

223-turbulence teeth; 301-bump.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings.

With the gradual development of new energy automobiles and heat dissipation technologies, a liquid cooling architecture is mainly adopted to dissipate heat of a vehicle-mounted charger at present. The shell of the vehicle-mounted charger is made of a heat conducting material, and a heat dissipation runner for a heat dissipation medium to flow is arranged, and the heat dissipation medium can be cooling liquid, antifreezing solution and the like. When the vehicle-mounted charger works, the heating device generates heat, the heat is guided to the shell, and then a heat dissipation medium in the cooling system of the whole automobile flows through the heat dissipation flow channel and takes away the heat of the shell.

However, how to set a heat dissipation flow channel to achieve good heat dissipation of the vehicle-mounted charger is a problem to be solved.

To this end, the present application provides a heat dissipation structure for an electronic device and an electronic device to achieve heat dissipation of the electronic device and to simplify assembly of the electronic device.

In the embodiment of the application, the application field of the electronic device is not limited, and the application field of the electronic device can be applied to: vehicles, such as new energy automobiles, rail locomotives, and the like; industrial manufacturing equipment such as machine tools, semiconductor processing equipment, and the like; an air conditioning system, and the like. The present application is not described in detail. In particular, for example, in the application of a new energy automobile, the electronic device may be an on-board charger, a controller, an air conditioning system, or the like of the vehicle.

The technical scheme of the present application will be described below by taking an electronic device as an example of a vehicle-mounted charger.

Fig. 1 and fig. 2 are schematic structural diagrams of an electronic device according to an embodiment of the present application. As shown in fig. 1 and 2, the electronic apparatus 10 may include a plurality of devices 11 and a heat dissipation structure 12, wherein the heat dissipation structure 12 has an accommodating space 20, the plurality of devices 11 may be accommodated in the accommodating space 20, and the devices 11 may be thermally connected with the heat dissipation structure 12. In an embodiment of the present application, these devices 11 include heat generating devices and non-heat generating devices. The heating device can comprise a power tube, a magnetic device, a copper sheet through-current, a capacitor, a resistor, a fuse, a chip and the like. When the electronic device 10 is in operation, the heat generating components generate heat, which may be transferred to the heat dissipating structure 12.

As shown in fig. 1, the electronic device 10 may also include a housing 13. The plurality of devices 11 may be disposed within the housing 13. The heat dissipation structure 12 may be mounted to the housing 13, for example, by riveting, screwing, clamping, or bonding. Or the heat dissipating structure 12 may be integrally formed with the housing 13, that is, the heat dissipating structure 12 may form part of the housing 13, for example, the heat dissipating structure 12 may be a bottom shell portion of the housing 13.

The structure of the heat dissipation structure 12 and the heat dissipation principle will be described in detail below.

Fig. 3 and fig. 4 are schematic structural diagrams of a heat dissipation structure according to an embodiment of the application. Fig. 3 shows the bottom structure of the heat dissipation structure in this embodiment, i.e. the structure of the bottom plate 21 of the heat dissipation structure 12 facing away from the device 11 side of the electronic device 10, and fig. 4 shows the top structure of the heat dissipation structure in this embodiment, i.e. the structure of the bottom plate 21 of the heat dissipation structure 12 facing toward the device 11 side of the electronic device 10.

As shown in fig. 3 and 4, the heat dissipation structure 12 may include a base plate 21 and a plurality of protrusions 22. In an embodiment of the present application, the protrusion 22 may be integrally formed with the base plate 21, thereby facilitating manufacture using an integral molding process. Or the protruding portion 22 may be connected to the base plate 21 by riveting, screwing, clamping or bonding, etc. to facilitate the disassembly of the heat dissipation structure 12 when maintaining or cleaning the heat dissipation structure 12.

In some embodiments of the present application, when the heat dissipating structure 12 is integrally formed with the housing 13 of the electronic device 10, the bottom plate 21 may be a part of the housing 13 itself, for example, the bottom plate 21 may be connected to other components of the housing 13 by riveting, screwing, clamping or bonding, or the bottom plate 21 may be formed with other components (such as a side plate) of the housing 13 by an integral molding process. In this embodiment, the chassis 21 may be used to carry the device 11 of the electronic apparatus 10. In other embodiments of the application, the base plate 21 may be independent of the housing 13 and may be attached to the housing 13 by riveting, screwing, clamping or bonding. The chassis 21 may be a part of the heat dissipation structure 12, or may be an intermediate member that connects the electronic device 10 to other external devices. Accordingly, the bottom plate 21 may be configured as a frame body in addition to a plate-like structure.

The material of the base plate 21 may be a heat conductive material to accelerate heat transfer between the heat dissipating structure 12 and the heat generating device of the electronic device 10. For example, in some embodiments of the present application, the heat dissipating structure 12 may comprise a metal base plate. The metal material can not only accelerate heat transfer, but also facilitate manufacturing and reduce cost.

Fig. 5 and 6 are schematic diagrams of another heat dissipation structure according to the present application. As shown in fig. 5 and 6, the heat dissipation structure 12 includes a bottom plate 21 and a plurality of side plates 24. These side plates 24 are located on the peripheral side of the bottom plate 21, and are connected to the bottom plate 21 to form the accommodation space 20 having an opening. Through which the device 11 of the electronic apparatus 10 can be placed in the receiving space 20. The side plates 24 may also be made of a thermally conductive material, for example, in one specific embodiment, the heat dissipating structure 12 may include a metal bottom plate and a plurality of metal side plates, and the bottom plate 21 and the side plates 24 may be made of the same material, so that the heat dissipating structure 12 may be integrally formed, for example, by using a casting process to manufacture the heat dissipating structure 12 of a unitary structure.

As shown in fig. 3 and 5, in an embodiment of the present application, the inside of the protruding portion 22 is hollow. The hollow interior of the protrusion 22 may serve as a first three-dimensional flow passage 221 and a second three-dimensional flow passage 222 through which the heat dissipation medium flows. As shown in fig. 4 and 6, the protruding portion 22 protrudes from the bottom plate 21 and divides the accommodating space 20 into a plurality of accommodating chambers 201. Wherein, at least one accommodation chamber 201 may include a side wall formed by the protrusion 22 and a bottom wall formed by the bottom plate 21, such that the heat generating device accommodated in the accommodation chamber 201 is laterally adjacent to the first three-dimensional flow channel 221, or adjacent to the second three-dimensional flow channel 222, or adjacent to the first three-dimensional flow channel 221 and the second three-dimensional flow channel 222.

The protruding portion 22 may protrude from the bottom plate 21 at an angle, for example, 30 degrees, 40 degrees, 55 degrees, 73 degrees, 87 degrees, or the like, with respect to the bottom plate 21. In a particular embodiment, the protrusions 22 may be perpendicular to the base plate 21 to facilitate manufacturing by casting or stamping, etc.

Fig. 7 is a cross-sectional view of the heat dissipation structure of fig. 6 along A-A. As shown in fig. 7, the heat dissipating structure 12 may further include thermally conductive ribs 23. The heat-conducting rib 23 is located in the accommodating space 20 and is connected with the protruding portion 22 to form a mounting cavity 25. The heat generating devices of the electronic device 10 may include a first heat generating device 111, such as a power tube of an on-board charger. The first heat generating device 111 may be mounted to the mounting cavity 25 and thermally connected to the protrusion 22. In this aspect, the thermally conductive connection of the first heat generating device 111 and the protrusion 22 may include the first heat generating device 111 and the protrusion 22 forming the surface of the mounting cavity 25 in direct contact, or the first heat generating device 111 and the protrusion 22 being spaced apart. When the first heat generating device 111 is disposed at a distance from the protrusion 22, in order to make heat transfer between the first heat generating device 111 and the protrusion 22 more efficient, a heat conductive material may be disposed between the first heat generating device 111 and the protrusion 22, so that heat of the first heat generating device 111 is transferred to the protrusion 22 through the heat conductive material.

Fig. 8 is a schematic view of a mounting cavity according to an embodiment of the present application. The heat conductive rib 23 in the above embodiment may be connected to the protrusion 22 and fixed to the base plate 21. The connection between the heat-conducting rib 23 and the protrusion 22 and the connection between the heat-conducting rib 23 and the bottom plate 21 are not limited, and connection such as screw connection, caulking, or adhesion is used. In order to reduce the assembling steps of the heat dissipating structure 12 and to enhance the structural strength of the heat conducting rib 23, the heat conducting rib 23 may be integrally formed with the protrusion 22, or the heat conducting rib 23 may be integrally formed with the bottom plate 21.

Taking the protrusion 22, in which the first three-dimensional flow channel 221 is formed, as an example, in the embodiment of the present application, in a plane perpendicular to the flow direction of the heat dissipation medium in the first three-dimensional flow channel 221, the cross section of the first three-dimensional flow channel 221 may be T-shaped or I-shaped, and the cross section of the heat conduction rib 23 may be L-shaped, I-shaped or T-shaped. As shown in fig. 8, in this embodiment, the protruding portion 22 and the heat conducting rib 23 are connected to form a mounting cavity 25, and the mounting cavity 25 is U-shaped in cross section in a plane perpendicular to the flow direction of the heat dissipation medium in the first three-dimensional flow passage 221. When the first heat generating device 111 is placed in the mounting cavity 25, both the side surface and the bottom surface of the first heat generating device 111 may be adjacent to the three-dimensional flow channel, so as to increase the heat transfer area between the first heat generating device 111 and the protruding portion 22, and the mounting cavity 25 may also function to carry the first heat generating device 111.

In some embodiments of the application, as shown in fig. 9, the heat-conducting rib 23 may be further provided with a stopper 26, and the stopper 26 is located in the mounting cavity 25. Fig. 9 is a schematic view of a limiting member disposed in a mounting cavity according to an embodiment of the present application. The limiting member 26 may enable the first heat generating device 111 to be close to the protrusion 22 and limit it to the mounting cavity 25 during the process of placing the first heat generating device 111 in the mounting cavity 25, thereby reducing the distance between the first heat generating device 111 and the protrusion 22 and improving the heat transfer efficiency. For example, in one particular embodiment, the stop 26 may be provided at a surface of the thermally conductive rib 23 that forms a sidewall of the mounting cavity 25. When the first heat generating device 111 is placed in the mounting cavity 25, the first heat generating device 111 is closer to the surface of the protrusion 22 forming the side wall of the mounting cavity 25 due to the force of the limiting member 26 when the limiting member 26 is pressed, so that the heat transfer efficiency between the first heat generating device 111 and the protrusion 22 is improved.

The limiting member 26 may be connected to the surface of the heat-conducting rib 23 forming the installation cavity 25, for example, by screwing, riveting, or bonding. As shown in fig. 9, the stopper 26 may have an arc shape in a plane perpendicular to the flow direction of the heat dissipation medium in the first three-dimensional flow channel 221. Or another stopper 26 provided in the mounting cavity 25 in the embodiment of the present application as shown in fig. 10, the stopper 26 may have an arc shape, but the curvature and length thereof may be different from those of the stopper 26 of fig. 9. Or another stopper 26 provided in the mounting cavity 25 in the embodiment of the present application as shown in fig. 11, the stopper 26 may be in a straight line shape. In these embodiments, the stop 26 may be a resilient member, such as a spring, leaf spring, membrane, or the like.

The stopper 26 may be integrally formed with the heat-conducting rib 23. Fig. 12 is a schematic view of a limiting member disposed in a mounting cavity according to an embodiment of the present application. As shown in fig. 12, the stopper 26 may have a polygonal shape in a plane perpendicular to the flow direction of the heat dissipation medium in the first three-dimensional flow channel 221. Alternatively, in another stop member 26 according to the embodiment of the present application shown in fig. 13, the stop member 26 may have an irregular shape. Alternatively, in another stop member 26 according to the embodiment of the present application shown in fig. 14, the stop member 26 may be wedge-shaped.

In other embodiments of the present application, a stopper 26 may be provided at one side of the first heat generating device 111. During the process of placing the first heat generating device 111 in the mounting cavity 25, the stopper 26 is pressed by the heat conducting rib 23 to act on the first heat generating device 111, so that the first heat generating device 111 is closer to the surface of the protrusion 22 forming the side wall of the mounting cavity 25, thereby reducing the distance between the first heat generating device 111 and the protrusion 22 and improving the heat transfer efficiency. Fig. 15 is a schematic view of a limiting member disposed on a first heat generating device according to an embodiment of the present application. As shown in fig. 15, the stopper 26 may have an arc shape in a plane perpendicular to the flow direction of the heat dissipation medium in the first three-dimensional flow channel 221. Alternatively, in another stop member of the embodiment of the present application shown in fig. 16, the stop member 26 may be arcuate in shape, but may have a different curvature and length than the stop member 26 of fig. 15. Or in another stop 26 in the embodiment of the application shown in fig. 17, the stop 26 may be linear.

In one embodiment, as shown in fig. 18 and 19, the stopper 26 may also be fixed to the first heat generating device 111 by the mounting bracket 15. When the first heat generating device 111 is placed in the mounting cavity 25 formed by the heat conducting rib 23 and the protrusion 22, the stopper 26 interacts with the inner wall of the mounting cavity 25 such that the first heat generating device 111 is closer to the surface of the protrusion 22, thereby improving the heat transfer efficiency between the first heat generating device 111 and the protrusion 22.

In some embodiments of the present application, the mounting cavity 25 includes a first mounting cavity adjacent to the first stereoscopic flow channel 221 and a second mounting cavity adjacent to the second stereoscopic flow channel 222. For example, in one specific embodiment, the first mounting cavity is provided with a first limiting member, and the first limiting member and the inner wall of the first mounting cavity are in an integral structure; the second installation cavity is internally provided with a second limiting piece, and the second limiting piece and the inner wall of the second installation cavity are of an integrated structure, that is, the first limiting piece and the second limiting piece can be arranged in the same mode. Or the first and second stoppers may be provided in different manners. For example, in another specific embodiment, a first limiting member is disposed in the first mounting cavity, and the first limiting member is integrally formed with an inner wall of the first mounting cavity; the second installation cavity is internally provided with a second limiting piece, and the second limiting piece is fixedly arranged on the inner wall of the second installation cavity through threaded connection. Or in another specific embodiment, the first mounting cavity is internally provided with a first limiting piece, and the first limiting piece and the inner wall of the first mounting cavity are of an integral structure; the first heating device correspondingly placed in the second mounting cavity is provided with a second limiting piece.

The space between the first heat generating device 111 and the inner wall of the mounting cavity 25 may be further filled with a heat conductive paste 18. When the first heat generating device 111 is mounted in the mounting cavity 25, the first heat generating device 111 and the stopper 26 are immersed in the heat conductive paste 18. The limiting member 26 acts on the first heat generating device 111 and brings it close to the protruding portion 22, and the heat conductive paste 18 can fix the first heat generating device 11 with respect to the mounting cavity 25 after curing, without otherwise fixing the first heat generating device 111 to the mounting cavity 25.

Fig. 20 is a schematic diagram of a portion of an electronic device according to an embodiment of the application. As shown in fig. 20, in some embodiments of the application, the protrusion 22 may also be provided with a first heat dissipating tooth 27, which first heat dissipating tooth 27 is located within the mounting cavity 25. The first heat dissipating teeth 27 may be integrally formed with the protruding portion 22, that is, the surface of the protruding portion 22 forming the mounting cavity 25 has a tooth-like structure. Alternatively, the first heat dissipating tooth 27 may be a separately manufactured component, and may be connected to the protruding portion 22 by screwing, riveting, bonding, or the like. The first heat generating device 111 may be provided at a surface thereof with second heat dissipating teeth 16, and the second heat dissipating teeth 16 may be engaged with the first heat dissipating teeth 27. The second heat dissipating tooth 16 may be fixed to the surface of the first heat generating device 111 by screwing, riveting, bonding, or the like.

When the first heat generating device 111 is mounted to the mounting cavity 25, the first heat radiating teeth 27 are engaged with the second heat radiating teeth 16, thereby increasing the heat transfer area between the first heat generating device 111 and the protrusion 22. When the heat conductive paste 18 is filled between the first heat generating device 111 and the protruding portion 22, the engagement of the first heat dissipating teeth 27 and the second heat dissipating teeth 16 may reduce the heat conductive resistance between the first heat generating device 111 and the protruding portion 22, and may increase the heat transfer area, thereby improving the heat transfer efficiency.

Fig. 21 is a schematic cross-sectional view of the heat dissipation structure in fig. 5 along the B-B direction. As shown in fig. 21, in some embodiments of the present application, turbulence teeth 223 may be provided in the first and/or second stereo channels 221, 222. Specifically, the turbulence teeth 223 may be provided in the first three-dimensional flow passage 221, and the turbulence teeth 223 are not provided in the second three-dimensional flow passage 222. Alternatively, the turbulence teeth 223 may not be provided in the first three-dimensional flow path 221, and the turbulence teeth 223 may be provided in the second three-dimensional flow path 222. Alternatively, the turbulence teeth 223 may be disposed in the first three-dimensional flow path 221 and the second three-dimensional flow path 222, respectively. The turbulence teeth 223 may be used to disrupt the flow of the heat dissipating medium within the flow channel, thereby causing turbulence to the heat dissipating medium, accelerating heat transfer between the heat dissipating medium and the heat dissipating structure 12, and heat transfer within the heat dissipating medium.

Specifically, according to the bernoulli principle, the turbulence teeth 223 reduce the cross section of the three-dimensional flow passage perpendicular to the flow direction of the heat dissipation medium, so that the flow velocity increases when the heat dissipation medium passes the turbulence teeth 223, thereby improving the heat transfer efficiency. On the other hand, according to the hydrodynamics, when the heat dissipation medium flows in the three-dimensional flow channel, the heat dissipation medium forms a boundary layer at the flat inner wall surface of the three-dimensional flow channel, and the boundary layer is subjected to viscous shear stress to cause a reduction in the flow rate of the heat dissipation medium. The turbulence teeth 223 of the inner wall of the three-dimensional flow channel can destroy the formation of the boundary layer, thereby improving the problem that the flow velocity of the heat dissipation medium is reduced due to the boundary layer and improving the heat transfer efficiency. In addition, the turbulence teeth 223 can also increase the contact area between the heat dissipation medium and the three-dimensional flow channel, thereby increasing the heat transfer area and improving the heat transfer efficiency.

The turbulence teeth 223 of the first three-dimensional flow path 221 are taken as an example. The first three-dimensional flow channel 221 may be provided with a plurality of turbulence teeth 223, and the turbulence teeth 223 may be disposed at an inner sidewall of the first three-dimensional flow channel 221 and aligned in a direction in which the heat dissipation medium flows. In the embodiment of the present application, the turbulence teeth 223 may be disposed at the same side wall of the first three-dimensional flow channel 221, or may be alternately disposed at two opposite side walls of the first three-dimensional flow channel 221. For example, in one embodiment of the present application, the first three-dimensional flow channel 221 has a first side wall and a second side wall opposite to each other, the first side wall and the second side wall are provided with a plurality of turbulence teeth 223, and the turbulence teeth 223 of the two side walls are staggered. Similarly, the turbulence teeth 223 in the second stereo flow channel 222 may also be arranged in the manner described above. When the turbulence teeth 223 are disposed in both the first three-dimensional flow channel 221 and the second three-dimensional flow channel 222, the turbulence teeth 223 in the second three-dimensional flow channel 222 may be disposed in the same or different manner from the turbulence teeth 223 in the first three-dimensional flow channel 221.

As shown in fig. 21, in order to increase the turbulence of the heat dissipation medium, the extending direction of the turbulence teeth 223 may be at an angle to the flow direction of the heat dissipation medium, or the extending direction of the turbulence teeth 223 may intersect with the flow direction of the heat dissipation medium. The extending direction of the turbulence teeth 223 may be substantially perpendicular to the flowing direction of the heat dissipation medium, so that not only the contact area between the heat dissipation medium and the turbulence teeth 223 may be increased, but also the turbulence may be increased, the heat transfer between the heat dissipation medium and the heat dissipation structure 12 and the heat transfer inside the heat dissipation medium may be further accelerated, and in addition, the casting process may be further facilitated to manufacture the turbulence teeth 223. It should be noted that, in the embodiment of the present application, the extending direction of the spoiler tooth 223 refers to the length direction of the spoiler tooth 223. For example, when the spoiler tooth 223 is elongated, the extending direction of the spoiler tooth 223 is the length direction of the spoiler tooth 223. The extending direction of the turbulence teeth 223 may be substantially perpendicular to the flow direction of the heat dissipation medium, which may mean that the extending direction of the turbulence teeth 223 is perpendicular to the flow direction of the heat dissipation medium, or that an angle between the extending direction of the turbulence teeth 223 and the flow direction of the heat dissipation medium is approximately 90 degrees, for example, 85 degrees or 89 degrees, etc. For example, as shown in fig. 21, in a specific embodiment, the turbulence teeth 223 are elongated, and extend perpendicular to the flow direction of the heat dissipation medium, i.e., the elongated turbulence teeth extend perpendicular to the bottom plate 21.

With continued reference to fig. 3 and 5, in some embodiments of the application, the base plate 21 may have planar guide channels 211. The planar guide flow channel 211 may be provided on the side of the bottom plate 21 facing away from the device 11 of the electronic device 10 or on the side of the bottom plate 21 facing toward the device 11 of the electronic device 10, or the bottom plate 21 may be hollow, the hollow interior forming the planar guide flow channel 211. The first and second three-dimensional flow channels 221 and 222 may communicate through the planar guide flow channel 211, so that the heat dissipation medium may flow between the first and second three-dimensional flow channels 221 and 222 and the planar guide flow channel 211. Wherein, in at least one accommodating chamber 201, the protrusion 22 may be used as a side wall of the accommodating chamber 201, and the bottom plate 21 may be used as a bottom of the accommodating chamber 201, so that the heat generating device accommodated in the accommodating chamber 201 is laterally adjacent to the first three-dimensional flow channel 221, or adjacent to the second three-dimensional flow channel 222, or adjacent to the first three-dimensional flow channel 221 and the second three-dimensional flow channel 222, and is laterally adjacent to the planar guide flow channel 211 at the bottom surface, thereby performing heat transfer at both sides and the bottom surface of the heat generating device to increase a heat transfer area and heat transfer efficiency.

Fig. 22 is a schematic cross-sectional view of the heat dissipation structure in fig. 5 along the C-C direction. As shown in fig. 22, one or more guide teeth 212 may be provided in the planar guide flow path 211. For example, in one particular embodiment, the heat dissipating medium flows from the first solid flow channel 221 and through the planar pilot flow channel 211. In the planar guide flow channel 211, the extending direction of the guide teeth 212 faces the junction of the planar guide flow channel 211 and the second three-dimensional flow channel 222, and the heat dissipation medium flows toward the second three-dimensional flow channel 222 under the guiding action of the guide teeth 212. At the same time, the guide teeth 212 can also increase the contact area between the heat dissipation medium and the heat dissipation structure 12, thereby increasing the heat transfer area and accelerating the heat transfer.

As shown in fig. 22, in some embodiments of the present application, a plurality of guide teeth 212 may be disposed in the planar guide flow channel 211, and the guide teeth 212 may be disposed in parallel, for example. In another specific embodiment, the guide teeth 212 may be arranged at an angle to each other and extend toward the junction of the planar guide flow path 211 and the second three-dimensional flow path 222, or the guide teeth 212 may be arranged in an S-shape or V-shape.

In the embodiment of the present application, the lengths of the guide teeth 212 may be set to be the same or different, and the heights of the guide teeth 212 protruding from the base plate 21 may be set to be the same or different. For example, in some embodiments of the present application, since the heat dissipation medium flowing out of the first three-dimensional flow channel 221 may have a large turbulence, the guide teeth 212 near the first three-dimensional flow channel 221 may be provided in a long bar shape, so that the heat dissipation medium flow may be guided to flow toward the second three-dimensional flow channel 222. The height and length of the guide teeth 212 may be maintained constant in a direction toward the second solid flow passage 222. Or the size of the accommodating chambers 201 accommodating these devices 11 may be different according to the size of the devices 11 of the electronic apparatus 10, and the height and length of the guide teeth 212 may be set to be different according to the change in volume of the accommodating chambers 201.

As shown in fig. 23, the heat dissipation structure 12 may further be provided with an inlet 28 into which the heat dissipation medium flows and an outlet 29 from which the heat dissipation medium flows, so that a complete flow path is formed in the flow channel of the heat dissipation structure 12, thereby realizing the heat dissipation function. Specifically, the first three-dimensional flow channel 221 may be in communication with the inlet 28, and the second three-dimensional flow channel 222 may be in communication with the outlet 29, and the heat dissipation medium may flow through the first three-dimensional flow channel 221, the planar guide flow channel 211, and the second three-dimensional flow channel 222 in this order. Or the first three-dimensional flow passage 221 may be in communication with the outlet 29 and the second three-dimensional flow passage 222 may be in communication with the inlet 28, at which time the heat dissipation medium may flow through the second three-dimensional flow passage 222, the plane guide flow passage 211, and the first three-dimensional flow passage 221 in this order.

The specific number of inlets 28 and outlets 29 described above may not be limited. For example, the heat dissipating structure 12 may include one inlet 28 and one outlet 29, or the heat dissipating structure 12 may include one inlet 28 and multiple outlets 29, or the heat dissipating structure 12 may include multiple inlets 28 and one outlet 29, or the heat dissipating structure 12 may include multiple inlets 28 and multiple outlets 29. Furthermore, the specific locations of the inlet 28 and the outlet 29 are not limited, and the inlet 28 and the outlet 29 may be disposed on the same side of the heat dissipation structure 12, or disposed on adjacent sides of the heat dissipation structure 12, or disposed on opposite sides of the heat dissipation structure 12.

In a specific embodiment, as shown in fig. 23, the heat dissipation structure 12 includes an inlet 28 and an outlet 29, the inlet 28 is in communication with the first three-dimensional flow channel 221, the outlet 29 is in communication with the second three-dimensional flow channel 222, the inlet 28 and the outlet 29 are disposed on opposite sides of the heat dissipation structure 12, the heat dissipation medium flows through the first three-dimensional flow channel 221, the planar guiding flow channel 211 and the second three-dimensional flow channel 222 in sequence along the arrow direction, and the flow path of the heat dissipation medium is in a Z shape. In another specific embodiment, as shown in fig. 24, the heat dissipation structure 12 includes an inlet 28 and an outlet 29, the inlet 28 is communicated with the first three-dimensional flow channel 221, the outlet 29 is communicated with the second three-dimensional flow channel 222, the inlet 28 and the outlet 29 are disposed on the same side of the heat dissipation structure 12, the heat dissipation medium sequentially flows through the first three-dimensional flow channel 221, the plane guiding flow channel 211 and the second three-dimensional flow channel 222 along the arrow direction, and the flow path of the heat dissipation medium is M-shaped. In another specific embodiment, as shown in fig. 25, the heat dissipating structure 12 includes one inlet 28 and two outlets 29, the inlet 28 is in communication with the planar guide flow channel 211, one outlet 29 may be in communication with the first three-dimensional flow channel 221, and the other outlet 29 may be in communication with the second three-dimensional flow channel 221, and the heat dissipating medium sequentially flows through the planar guide flow channel 211 and the first three-dimensional flow channel 221, or sequentially flows through the planar guide flow channel 211 and the second three-dimensional flow channel 222 in the direction of the arrow. As shown in fig. 26, in another specific embodiment, the heat dissipating structure 12 includes two inlets 28 and one outlet 29, one inlet 28 may be in communication with the first three-dimensional flow channel 221, the other inlet 28 may be in communication with the second three-dimensional flow channel 222, and the outlet 29 may be in communication with the planar guide flow channel 211, and the heat dissipating medium may sequentially flow through the first three-dimensional flow channel 221 and the planar guide flow channel 211 in the direction of the arrow, or sequentially flow through the second three-dimensional flow channel 222 and the planar guide flow channel 211.

Fig. 27 is another schematic view of a heat dissipating structure according to an embodiment of the present application, and fig. 28 is a cross-sectional view of the heat dissipating structure of fig. 27 along the direction D-D. As shown in fig. 27, the heat dissipation structure 12 may further include a sealing cover 30. When the flat guide flow path 211 is located at a side of the bottom plate 21 away from the device 11 of the electronic apparatus 10, the sealing cover 30 is also located at a side of the bottom plate 21 away from the device 11 of the electronic apparatus 10 and covers the bottom plate 21, so that the first and second three-dimensional flow paths 221, 222 and the flat guide flow path 211 can be sealed. When the flat guide flow path 211 is located on the side of the bottom plate 21 facing the device 11 of the electronic apparatus 10, the sealing cover 30 is also located on the side of the bottom plate 21 facing the device 11 of the electronic apparatus 10 and covers the bottom plate 21, so that the flat guide flow path 211 can be sealed.

The side of the sealing cover 30 facing the base plate 21 may have one or more protrusions 301. The protrusion 301 may be located at the planar guide flow channel 211 or the first stereoscopic flow channel 221 or the second stereoscopic flow channel 222. Taking the example that the protrusion 301 is located in the plane guide flow channel 211, when the heat dissipation medium flows in the plane guide flow channel 211, the protrusion 301 may disturb the flow of the heat dissipation medium in the plane guide flow channel 211, thereby generating turbulence, accelerating heat transfer between the inside of the heat dissipation medium and between the heat dissipation medium and the heat dissipation structure 12. As shown in fig. 28, after the sealing cover 30 is covered with the base plate 21 according to the bernoulli principle, the cross section of the plane guide flow channel 211 perpendicular to the flow direction of the heat dissipation medium is reduced due to the presence of the protrusion 301, so that the speed of the heat dissipation medium passing through the protrusion 301 is increased, and the heat transfer efficiency is improved. In this embodiment, the protrusion 301 may be formed by press molding. The specific shape of the protrusion 301 is not limited, and may be, for example, rectangular, circular, conical, elliptical, elongated, or drop-shaped, which is not described in detail in the present application. In addition, the inner walls of the planar guide flow channel 211, the first stereoscopic flow channel 221 and the second stereoscopic flow channel 222 may be provided with protrusions 301 to increase the flow rate of the heat dissipation medium and improve the heat transfer efficiency. In addition, the height of the guide teeth 212 may also be varied to follow the protrusion 301 of the sealing cover 30 to enhance the turbulence effect. As shown in fig. 8, the guide teeth 212 may be smaller in height relative to the protrusions 301.

As shown in fig. 4 and 6, a heat-conducting partition plate 31 may be further disposed in the accommodating space 20, and the heat-conducting partition plate 31 is connected to the bottom plate 21. Specifically, the protrusion 22 is located in the accommodating space 20 and divides the accommodating space 20 into a plurality of accommodating chambers 201, and at least one accommodating chamber 201 of the accommodating chambers 201 may be provided with one or more heat conductive partitions 31. The heat conductive separator plate 31 may be thermally connected to the heat generating device, so that heat of the heat generating device may be transferred to the base plate 21 to increase a heat transfer area and heat transfer efficiency. For example, in one embodiment of the present application, a plurality of thermally conductive spacers 31 are disposed between the first and second three-dimensional flow channels. The heat conductive partitions 31 divide the accommodating chamber 201 between the first and second three-dimensional flow channels 221 and 222 into a plurality of chambers, so that the side surfaces and the bottom surfaces of the heat generating devices disposed in the chambers are surrounded by the heat conductive material, thereby further increasing the heat transfer area between the heat generating devices and the heat dissipation structure 12 and improving the heat transfer efficiency.

As shown in fig. 4 and 6, the thermally conductive barrier 31 may extend toward the device 11 of the electronic apparatus 10. The electronic device may further comprise a substrate 17 to carry part of the device. The thermally conductive spacer 31 may be in thermally conductive contact with the substrate 17 of the electronic device 10 when the device 11 of the electronic device 10 is mounted to the heat dissipating structure 12. In some embodiments of the present application, the substrate 17 of the electronic device 10 may be used as a printed circuit board on the surface of which the semiconductor device may be disposed using a chip-on-package process. When the electronic device 10 is in operation, these semiconductor devices of the substrate 17 may also generate heat, which may then be transferred to the heat-dissipating structure 12 through the thermally conductive barrier 31, thereby lowering the temperature of the substrate 17. In a specific embodiment, the first heat generating device 111 is mounted on the substrate 17, the mounting cavity 25 of the heat dissipating structure 12 is filled with the heat conducting glue 18, and the inner wall is provided with a limiting member 26. When the electronic device 10 of this embodiment is assembled, the substrate 17 is covered with the top of the heat dissipation structure 12, and at this time, the first heat generating device 111 faces the mounting cavity 25 and is immersed in the heat conducting glue 18, and under the action of the limiting member 26, the first heat generating device 111 is close to the protruding portion 22. After curing the heat conductive paste 18, the first heat generating device 111 is fixed in the mounting cavity 25. The assembly steps of the electronic device 10 of this embodiment are simple and convenient, and the assembly efficiency of the electronic device 10 is improved.

A heat conductive member may be further provided on top of the heat conductive partition plate 31. When the device 11 of the electronic apparatus 10 is accommodated in the accommodating space 20, the heat conductive member may be in contact with the substrate 17, and heat of the substrate 17 may be transferred to the heat conductive barrier 31 through the heat conductive member to increase a heat transfer area. Further, since there is a gap between the heat conductive spacer 31 and the substrate 17, in order to prevent the heat conductive spacer 31 from accidentally colliding with the substrate 17 due to the gap, the heat conductive member between the heat conductive spacer 31 and the substrate 17 may be a flexible heat conductive member. For example, the heat conductive member may be a heat conductive pad or a heat conductive glue block.

Fig. 29 is a cross-sectional view of the electronic device of fig. 2 in the direction of arrow E. As shown in fig. 29, in some embodiments of the present application, the electronic device 10 may further include a number of separately provided devices 11, such as an ac input filter device 112. Taking the ac input filter 112 as an example, it may be placed in a housing 201 within the heat dissipating structure 12. In the accommodation chamber 201, the side surfaces and the bottom surface of the ac input filter 112 are surrounded by the heat dissipation structure 12. In addition, to increase the heat transfer area between the ac input filter device 112 and the heat dissipating structure 12, a heat conducting cover plate 32 may be disposed on top of the accommodating chamber 201 to independently place the ac input filter device 112 in the accommodating chamber 201 without affecting the operation of other devices. At this time, each side of the ac input filter 112 may be in thermal communication with the heat dissipation structure 12 to increase the thermal transfer contact area.

Fig. 30 is a flowchart illustrating a method for assembling an electronic device according to an embodiment of the application. As shown in fig. 30, in the present application, the electronic device 10 of the above-described embodiment may be assembled in the following steps:

step S101, filling the heat dissipation structure with heat conduction glue.

In step S101, the accommodating space 20 of the heat dissipating structure 12 may be partially or completely filled with the heat-conducting glue 18. For example, the installation cavity 25 and a part of the accommodation chamber 201 are filled with the heat conductive adhesive 18, or only the installation cavity 25 is filled with the heat conductive adhesive 18.

Step S102, the substrate and the heat dissipation structure are covered, and a plurality of devices of the electronic equipment are immersed in the heat conduction glue.

In the embodiment of the present application, the location where the protruding portion 22 is disposed on the bottom plate 21 may be according to the specific structural design of the electronic device 10, so that the protruding portion 22 divides the accommodating space 20 into a plurality of accommodating chambers 201, and the accommodating chambers 201 may correspondingly accommodate a plurality of devices 11 of the electronic device 10. Some devices 11 of the electronic device 10 may be provided on a substrate 17. These devices 11 disposed on the substrate 17 are immersed in the heat conductive paste 18 as the substrate 17 and the heat dissipation structure 12 are covered.

Step S103, vacuumizing the plurality of devices and the heat dissipation structure.

In step S102, when the device 11 is immersed in the heat conductive paste 18, bubbles are inevitably brought into the heat conductive paste 18. In addition, since the heat-conducting glue 18 has high viscosity and low fluidity, in actual operation, the heat-conducting glue 18 cannot completely fill the accommodating space 20 of the heat dissipation structure 12. Therefore, in order to improve the heat transfer efficiency between the device 11 and the heat dissipation structure 12 of the electronic apparatus 10, a vacuum may be drawn between the assembled device 11 and the heat dissipation structure 12.

The terminology used in the above embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in another embodiment," "in some embodiments," "in other embodiments," and the like in various places throughout this specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

The foregoing is merely illustrative embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present application, and the application should be covered. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

1. The vehicle-mounted charger is characterized by comprising a heat dissipation structure (12), a printed circuit board (17) and a plurality of devices (11), wherein the devices (11) comprise heating devices, and the vehicle-mounted charger comprises:

The heat dissipation structure (12) comprises a bottom plate (21), a plurality of protruding parts (22) and a plurality of side plates (24) which are integrally formed, wherein the plurality of side plates (24) are positioned on the periphery side of the bottom plate (21) and are connected with the bottom plate (21) to form a containing space (20) with an opening, and the plurality of protruding parts (22) protrude out of the bottom plate (21) and divide the containing space (20) into a plurality of containing chambers (201);

At least one of the accommodating chambers (201) includes a side wall formed by the protruding portion (22) and a bottom wall formed by the bottom plate (21), and a hollow interior of the protruding portion (22) serves as a first three-dimensional flow passage (221) and a second three-dimensional flow passage (222) through which a heat dissipation medium flows such that the heat generating device accommodated in the at least one accommodating chamber (201) is laterally adjacent to the first three-dimensional flow passage (221) and the second three-dimensional flow passage (222);

a plurality of heat conducting clapboards (31) are arranged between the first three-dimensional flow channel (221) and the second three-dimensional flow channel (222), the heat conducting clapboards (31) are connected with the bottom plate (21), and the plurality of heat conducting clapboards (31) are used for separating the accommodating chamber (201) between the first three-dimensional flow channel (221) and the second three-dimensional flow channel (222) into a plurality of chambers, so that the side surfaces and the bottom surfaces of the heating devices arranged in the chambers are surrounded by heat conducting materials;

The printed circuit board (17) is used for bearing part of the device (11), the printed circuit board (17) is covered with the top of the heat dissipation structure (12), and a gap is formed between the heat conduction baffle (31) and the printed circuit board (17).

2. The vehicle-mounted charger according to claim 1, wherein a flexible heat conducting member is further provided on top of the heat conducting partition plate (31), the flexible heat conducting member is in contact with the printed circuit board (17), and heat of the printed circuit board (17) is transferred to the heat conducting partition plate (31) through the flexible heat conducting member.

3. The vehicle-mounted charger according to any one of claims 1-2, wherein a portion of the housing (201) is filled with a heat-conducting glue (18), and a portion of the device (11) disposed on the printed circuit board (17) is immersed in the heat-conducting glue (18) as the printed circuit board (17) and the heat-dissipating structure (12) are covered.

4. A vehicle-mounted charger according to any one of claims 1-3, characterized in that the vehicle-mounted charger comprises an ac input filter device (112), the ac input filter device (112) is placed in one of the receiving chambers (201), a heat conducting cover plate (32) is arranged on top of the one receiving chamber (201), and the side surfaces and the bottom surface of the ac input filter device (112) are surrounded by the heat dissipation structure (12).

5. The vehicle-mounted charger according to any one of claims 1 to 4, wherein the heat generating device comprises a first heat generating device (111), the first heat generating device (111) being a power tube of the vehicle-mounted charger, the first heat generating device (111) being in heat conductive connection with the protruding portion (22).

6. The vehicle-mounted charger according to claim 5, wherein the first heat generating device (111) surface is provided with second heat radiating teeth (16), and the second heat radiating teeth (16) are fixed to the first heat generating device (111) surface, thereby increasing a heat transfer area between the first heat generating device (111) and the protruding portion (22).

7. The vehicle-mounted charger according to claim 6, wherein the protruding portion (22) is provided with a first heat radiation tooth (27), the first heat radiation tooth (27) is formed integrally with the protruding portion (22), and the first heat radiation tooth (27) is engaged with the second heat radiation tooth (16).

8. The vehicle-mounted charger according to any one of claims 5 to 7, wherein the heat dissipation structure (12) further comprises a heat conduction rib (23), the heat conduction rib (23) is located in the accommodating space 20 and is connected with the protruding portion (22) to form a mounting cavity (25), the first heat generating device (111) is mounted in the mounting cavity (25), and the mounting cavity (25) is used for filling heat conduction glue (18).

9. The vehicle-mounted charger according to claim 8, wherein the mounting cavity (25) comprises a first mounting cavity adjacent to the first three-dimensional flow channel (221) and a second mounting cavity adjacent to the second three-dimensional flow channel (222), a first limiting member is arranged in the first mounting cavity, the first limiting member and the inner wall of the first mounting cavity are integrated, the second limiting member is arranged in the second mounting cavity, and the second limiting member and the inner wall of the second mounting cavity are integrated.

10. The vehicle-mounted charger according to claim 8, wherein a limiting member (26) is disposed on one side of the first heating device (111), the limiting member (26) is fixed to the first heating device (111) through a mounting bracket (15), and the limiting member (26) is pressed by the heat conducting rib (23) to act on the first heating device (111) so that the first heating device (111) is close to the surface of the protruding portion (22).

11. The vehicle-mounted charger is characterized by comprising a heat dissipation structure (12) and a plurality of devices (11), wherein the devices (11) comprise heating devices, and the vehicle-mounted charger comprises:

The base plate (21) is provided with a plane guide runner (211), the heating device accommodated in the at least one accommodating chamber (201) is close to the plane guide runner (211) at the bottom surface, the plane guide runner (211) is provided with one or more guide teeth (212), and the heights of the guide teeth (212) protruding from the base plate (21) are set to be different.

12. The vehicle-mounted charger according to claim 11, comprising a printed circuit board (17), wherein a plurality of heat conducting partition boards (31) are arranged between the first three-dimensional flow channel (221) and the second three-dimensional flow channel (222), the heat conducting partition boards (31) are connected with the bottom plate (21), and the plurality of heat conducting partition boards (31) are used for separating the accommodating chamber (201) between the first three-dimensional flow channel (221) and the second three-dimensional flow channel (222) into a plurality of chambers, so that the side surfaces and the bottom surface of the heating device placed in the chambers are surrounded by heat conducting materials;

13. The vehicle-mounted charger of any of claims 11-12, wherein said heat dissipating structure (12) comprises an inlet (28) and an outlet (29), said inlet (28) being in communication with said first solid flow channel (221) and said outlet (29) being in communication with said second solid flow channel (222), wherein:

The inlet (28) and the outlet (29) are arranged on two opposite sides of the heat dissipation structure (12), a heat dissipation medium sequentially flows through the first three-dimensional flow channel (221), the plane guide flow channel (211) and the second three-dimensional flow channel (222), and the flow path of the heat dissipation medium is Z-shaped; or alternatively, the first and second heat exchangers may be,

The inlet (28) and the outlet (29) are arranged on the same side of the heat dissipation structure (12), the heat dissipation medium sequentially flows through the first three-dimensional flow channel (221), the plane guide flow channel (211) and the second three-dimensional flow channel (222), and the flow path of the heat dissipation medium is M-shaped.

14. The vehicle-mounted charger of any of claims 11-12, wherein the heat dissipating structure (12) comprises two inlets (28) and one outlet (29), the two inlets (28) and the one outlet (29) being disposed on the same side of the heat dissipating structure (12), wherein:

The inlet (28) is communicated with the plane guide flow channel (211), one outlet (29) is communicated with the first three-dimensional flow channel (221), and the other outlet (29) is communicated with the second three-dimensional flow channel (222); or alternatively, the first and second heat exchangers may be,

One inlet (28) is communicated with the first three-dimensional flow channel (221), the other inlet (28) is communicated with the second three-dimensional flow channel (222), and one outlet (29) is communicated with the plane guide flow channel (211).

15. The vehicle-mounted charger of any of claims 11-14, wherein the plurality of guide teeth (212) are disposed in parallel or at an angle to each other.

16. The vehicle-mounted charger according to any one of claims 11 to 15, wherein the extending directions of the plurality of guide teeth (212) converge toward the junction of the planar guide flow path (211) and the second three-dimensional flow path (222).

17. The vehicle-mounted charger according to any one of claims 11 to 16, wherein the plurality of guide teeth (212) are provided to be identical or different in length.

18. The vehicle-mounted charger according to any one of claims 11 to 17, wherein the planar guide flow channel (211) is provided on a side of the bottom plate (21) facing away from the device (11); or the plane guide runner (211) is arranged on one side of the bottom plate (21) facing the device (11);

the heat dissipation structure (12) comprises a sealing cover (30), and the sealing cover (30) is covered with the bottom plate (21), so that the plane guide flow channel (211) or the first three-dimensional flow channel (222), the second three-dimensional flow channel (222) and the plane guide flow channel (211) are sealed.

19. The vehicle-mounted charger according to claim 18, wherein the sealing cover (30) has a protrusion (301), and the height of the guide tooth (212) follows the protrusion (301) of the sealing cover (30).

20. The vehicle-mounted charger according to any one of claims 11 to 17, wherein the bottom plate (21) is hollow, and the hollow interior of the bottom plate (21) forms the planar guide flow passage (211).