CN210609913U - Film pressing device of PCB (printed Circuit Board) - Google Patents

Film pressing device of PCB (printed Circuit Board) Download PDF

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Publication number
CN210609913U
CN210609913U CN201921535084.3U CN201921535084U CN210609913U CN 210609913 U CN210609913 U CN 210609913U CN 201921535084 U CN201921535084 U CN 201921535084U CN 210609913 U CN210609913 U CN 210609913U
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CN
China
Prior art keywords
film pressing
film
plate
circuit board
pcb circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201921535084.3U
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Chinese (zh)
Inventor
郭永红
明成兴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinfeng Mingshengxing Electronic Co Ltd
Original Assignee
Xinfeng Mingshengxing Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xinfeng Mingshengxing Electronic Co Ltd filed Critical Xinfeng Mingshengxing Electronic Co Ltd
Priority to CN201921535084.3U priority Critical patent/CN210609913U/en
Application granted granted Critical
Publication of CN210609913U publication Critical patent/CN210609913U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a film pressing device of PCB circuit board, including the supporting baseplate, the upper surface one end fixed mounting of supporting baseplate has the support, and is equipped with the protection film on the support, the last position department that is close to the support of supporting baseplate is equipped with first electric putter, and the last fixed surface of supporting baseplate installs first pressure membrane frame, be provided with in the first pressure membrane frame and place the seat, and the last fixed surface of first pressure membrane frame installs the cylinder, be connected with on the cylinder and press the membrane piece, and be equipped with first guide pillar on the pressure membrane piece, the one end fixed mounting of pressing the membrane piece has shear structure. Film pressing device of PCB circuit board, can go on press mold, shearing simultaneously, simplify the press mold process, save time can form the buffering protection PCB circuit board, can adjust the interval of upper and lower squeeze roll, the pressure that bears when guaranteeing different thickness PCB circuit board press mold is unanimous, has guaranteed the uniformity of press mold effect.

Description

Film pressing device of PCB (printed Circuit Board)
Technical Field
The utility model relates to a film pressing device field, in particular to film pressing device of PCB circuit board.
Background
PCB, also known as printed circuit board, is a provider of electrical connections for electronic components. The PCB is mainly designed in a layout mode for more than 100 years, the circuit board has the main advantages of greatly reducing errors of wiring and assembly, improving the automation level and the production labor rate, can be divided into a single-layer board, a double-layer board, a four-layer board, a six-layer board and other multilayer circuit boards according to the number of layers of the circuit board, and needs to be pasted with a film in the manufacturing process of the PCB, and a film pressing device is generally adopted; when carrying out the press mold, current press mold device need realize cuting the protection film and accomplish the back again and carry out the press mold, and the step is complicated, and is consuming time more to current press mold device can not form effectual buffering when carrying out the press mold, can not form the protection to the PCB circuit board, and when current press mold device used, can not adjust the interval of upper and lower squeeze roll, atress uniformity when can not guarantee the PCB circuit board press mold of different thickness.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides the film pressing device of PCB circuit board, can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the film pressing device of the PCB comprises a supporting base plate, one end of the upper surface of the supporting base plate is fixedly provided with a bracket, the support is provided with a protective film, a first electric push rod is arranged on the support bottom plate at a position close to the support, and the upper surface of the supporting bottom plate is fixedly provided with a first film pressing frame which is internally provided with a placing seat, and the upper surface of the first film pressing frame is fixedly provided with an air cylinder, the air cylinder is connected with a film pressing block, the film pressing block is provided with a first guide post, one end of the film pressing block is fixedly provided with a shearing structure, the other end of the upper surface of the supporting bottom plate is fixedly provided with a second film pressing box, and the inside bottom of second pressure membrane case is equipped with first squeeze roll, the upper end fixed mounting of second pressure membrane case has the drive case, and is equipped with the crane on the second pressure membrane case, the lower extreme of crane is equipped with the second squeeze roll.
Preferably, the lower surface of the supporting bottom plate is fixedly provided with a supporting leg, the upper surface of the supporting bottom plate is provided with a fixing rod, the fixing rod is provided with a first electric push rod, and the first electric push rod is fixedly connected with the supporting bottom plate through the fixing rod.
Preferably, the upper surface of the first film pressing frame is fixedly provided with a guide sleeve, the upper end of the first guide pillar penetrates through the guide sleeve, the second film pressing box is provided with a driving mechanism, and the driving mechanism is connected with the first squeezing roller.
Preferably, the film pressing block comprises a fixing seat, a spring, a buffer plate and a pressing plate, the spring is fixedly mounted inside the fixing seat, the lower end of the spring is connected with the buffer plate, and the pressing plate is fixedly mounted on the lower surface of the buffer plate.
Preferably, the shearing structure comprises a supporting plate, a second electric push rod, a movable plate, a second guide pillar and a shearing blade, the second electric push rod is fixedly mounted on the supporting plate, the movable plate is arranged at the lower end of the second electric push rod, the second guide pillar is arranged on the movable plate, the upper end of the second guide pillar penetrates through the supporting plate, and the shearing blade is fixedly mounted on the lower surface of the movable plate.
Preferably, the lifting frame comprises a servo motor, a gear, a movable frame, a lifting rod, a third guide pillar and a rack, the servo motor is fixed in the driving box, the gear is arranged on the servo motor, the lifting rod is arranged on the upper surface of the movable frame, the third guide pillar is fixedly arranged on the upper surface of the movable frame, the rack meshed with the gear is arranged at the upper end of the lifting rod, and the upper end of the third guide pillar is located in the driving box.
Compared with the prior art, the utility model discloses following beneficial effect has: this film pressing device of PCB circuit board, through the shearing structure that sets up, the cooperation is pressing the membrane mechanism and is using, can go on simultaneously with the press mold, the shearing, simplify the press mold process, save time adopts the pressure membrane piece, the spring fit is the clamp plate and is using, can form buffering protection PCB circuit board, through the crane that sets up, can adjust the interval of upper and lower squeeze roll, the pressure that bears when guaranteeing different thickness PCB circuit board press mold is unanimous, the uniformity of press mold effect has been guaranteed.
Drawings
Fig. 1 is a schematic view of the overall structure of the film pressing device for the PCB of the present invention;
FIG. 2 is a schematic structural view of a film pressing block of the film pressing device of the PCB of the present invention;
fig. 3 is a schematic structural view of a cutting structure of the film pressing device of the PCB of the present invention;
fig. 4 is the utility model discloses the structure schematic diagram of film pressing device crane department of PCB circuit board.
In the figure: 1. a support base plate; 2. a support; 3. a protective film; 4. a first electric push rod; 5. a first film pressing frame; 6. a placing seat; 7. a cylinder; 8. pressing the membrane block; 801. a fixed seat; 802. a spring; 803. a buffer plate; 804. pressing a plate; 9. a first guide post; 10. shearing the structure; 1001. a support plate; 1002. a second electric push rod; 1003. a movable plate; 1004. a second guide post; 1005. a shearing blade; 11. a second film pressing box; 12. a first squeeze roll; 13. a drive box; 14. a lifting frame; 1401. a servo motor; 1402. a gear; 1403. a movable frame; 1404. a lifting rod; 1405. a third guide post; 1406. a rack; 15. a second squeeze roll; 16. a support leg; 17. and (4) guiding a sleeve.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a film pressing device for a PCB comprises a supporting base plate 1, a support 2 is fixedly mounted at one end of the upper surface of the supporting base plate 1, a protective film 3 is disposed on the support 2, a first electric push rod 4 is disposed at a position on the supporting base plate 1 close to the support 2, a first film pressing frame 5 is fixedly mounted on the upper surface of the supporting base plate 1, a placing seat 6 is disposed in the first film pressing frame 5, a cylinder 7 is fixedly mounted on the upper surface of the first film pressing frame 5, a film pressing block 8 is connected to the cylinder 7, a first guide post 9 is disposed on the film pressing block 8, a shearing structure 10 is fixedly mounted at one end of the film pressing block 8, a second film pressing box 11 is fixedly mounted at the other end of the upper surface of the supporting base plate 1, a first squeezing roller 12 is disposed at the bottom end of the inside of the second film pressing box 11, a driving box 13 is fixedly mounted at the upper end of the second film pressing box 11, and, the lower end of the lifting frame 14 is provided with a second extrusion roller 15;
the lower surface of the supporting bottom plate 1 is fixedly provided with supporting legs 16, the upper surface of the supporting bottom plate 1 is provided with a fixed rod, the fixed rod is provided with a first electric push rod 4, and the first electric push rod 4 is fixedly connected with the supporting bottom plate 1 through the fixed rod; a guide sleeve 17 is fixedly arranged on the upper surface of the first film pressing frame 5, the upper end of the first guide post 9 penetrates through the guide sleeve 17, and a driving mechanism is arranged on the second film pressing box 11 and is connected with the first extrusion roll 12; the film pressing block 8 comprises a fixed seat 801, a spring 802, a buffer plate 803 and a pressing plate 804, wherein the spring 802 is fixedly installed inside the fixed seat 801, the lower end of the spring 802 is connected with the buffer plate 803, and the pressing plate 804 is fixedly installed on the lower surface of the buffer plate 803; the shearing structure 10 comprises a supporting plate 1001, a second electric push rod 1002, a movable plate 1003, a second guide pillar 1004 and a shearing blade 1005, wherein the second electric push rod 1002 is fixedly mounted on the supporting plate 1001, the movable plate 1003 is arranged at the lower end of the second electric push rod 1002, the second guide pillar 1004 is arranged on the movable plate 1003, the upper end of the second guide pillar 1004 penetrates through the supporting plate 1001, and the shearing blade 1005 is fixedly mounted on the lower surface of the movable plate 1003; the lifting frame 14 comprises a servo motor 1401, a gear 1402, a movable frame 1403, a lifting rod 1404, a third guide post 1405 and a rack 1406, the servo motor 1401 is fixed in the driving box 13, the gear 1402 is arranged on the servo motor 1401, the lifting rod 1404 is arranged on the upper surface of the movable frame 1403, the third guide post 1405 is fixedly arranged on the upper surface of the movable frame 1403, the rack 1406 connected with the gear 1402 in a meshed mode is arranged at the upper end of the lifting rod 1404, and the upper end of the third guide post 1405 is located in the driving box 13.
It should be noted that, when the film pressing device for PCB of the present invention is used, the worker places the supporting base plate 1 at a suitable position through the supporting leg 16, connects the related components on the device to the controller, places the PCB on the placing seat 6 in the first film pressing frame 5, ensures that one end of the PCB is close to the opening on the placing seat 6, pulls the protective film 3 on the support 2, so that the protective film 3 covers the PCB, starts the cylinder 7 through the controller, the cylinder 7 operates to drive the film pressing block 8 to descend, after descending to a certain degree, the pressing plate 804 contacts the protective film 3, thereby pressing the protective film 3, the cylinder 7 continues to operate, the buffer plate 803 on the pressing plate 804 compresses the spring 802 in the fixing seat 801, the spring 802 forms effective buffering, and ensures the integrity of the PCB, during this process, the first guide pillar 9 moves in the guide sleeve 17, the stability of the film pressing block 8 during operation is ensured, after the film pressing block 8 compresses the protective film 3, the shearing structure 10 is started, the second electric push rod 1002 on the support plate 1001 extends, the movable plate 1003 drives the shearing blade 1005 to descend along the second guide post 1004 together until the shearing blade 1005 shears the protective film 3, after the protective film 3 is sheared, the protective film 3 is wound, the first electric push rod 4 and the first squeeze roller 12 are started, the PCB is pushed to the position between the first squeeze roller 12 and the second squeeze roller 15 in the second film pressing box 11 by the first electric push rod 4, the first squeeze roller 12 is driven by the driving mechanism to rotate so as to drive the PCB to move, and finally the PCB is moved out from the other end of the second film pressing box 11, in the process, the first squeeze roller 12 and the second squeeze roller 15 act together, so that the protective film 3 is further attached to the PCB, and the film adhesion degree is ensured, the PCB film laminating machine is characterized in that the PCB film laminating machine is transported to the next process to continue processing after finishing the film laminating of the PCB, then the film laminating work of a subsequent PCB is carried out, if the thickness of the PCB circuit board changes, a worker can adjust the distance between the first squeeze roller 12 and the second squeeze roller 15 through the lifting frame 14, the effect of secondary film laminating is guaranteed, during the adjustment, the worker starts the servo motor 1401 in the driving box 13 through the controller, the servo motor 1401 drives the gear 1402 to work and enables the rack 1406 to lift, the rack 1406 drives the lifting rod 1404 to lift, so that the movable frame 1403 drives the second squeeze roller 15 to lift along the third guide pillar 1405 together, further the adjustment of the distance between the squeeze rollers is finished, then the film laminating work of the PCB circuit board can be carried out according to the steps, after the use of the PCB film laminating machine is finished, the worker stops related elements, and the.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

  1. The film pressing device of the PCB is characterized in that: the film pressing device comprises a supporting base plate (1), a support (2) is fixedly installed at one end of the upper surface of the supporting base plate (1), a protective film (3) is arranged on the support (2), a first electric push rod (4) is arranged at a position, close to the support (2), on the supporting base plate (1), a first film pressing frame (5) is fixedly installed on the upper surface of the supporting base plate (1), a placing seat (6) is arranged in the first film pressing frame (5), an air cylinder (7) is fixedly installed on the upper surface of the first film pressing frame (5), a film pressing block (8) is connected onto the air cylinder (7), a first guide pillar (9) is arranged on the film pressing block (8), a shearing structure (10) is fixedly installed at one end of the film pressing block (8), a second film pressing box (11) is fixedly installed at the other end of the upper surface of the supporting base plate (1), and a first extrusion roller (12) is arranged at the bottom end of the second film pressing box (, the upper end fixed mounting of second pressure membrane case (11) has drive case (13), and is equipped with crane (14) on second pressure membrane case (11), the lower extreme of crane (14) is equipped with second squeeze roll (15).
  2. 2. A film laminating apparatus for PCB circuit board according to claim 1, wherein: the lower fixed surface of supporting baseplate (1) installs landing leg (16), and the upper surface of supporting baseplate (1) is equipped with the dead lever, is equipped with on the dead lever first electric putter (4), and first electric putter (4) pass through dead lever and supporting baseplate (1) fixed connection.
  3. 3. A film laminating apparatus for PCB circuit board according to claim 1, wherein: the upper surface of the first film pressing frame (5) is fixedly provided with a guide sleeve (17), the upper end of the first guide post (9) penetrates through the guide sleeve (17), and the second film pressing box (11) is provided with a driving mechanism which is connected with the first extrusion roller (12).
  4. 4. A film laminating apparatus for PCB circuit board according to claim 1, wherein: the film pressing block (8) comprises a fixing seat (801), a spring (802), a buffer plate (803) and a pressing plate (804), wherein the spring (802) is fixedly arranged inside the fixing seat (801), the lower end of the spring (802) is connected with the buffer plate (803), and the pressing plate (804) is fixedly arranged on the lower surface of the buffer plate (803).
  5. 5. A film laminating apparatus for PCB circuit board according to claim 1, wherein: the shearing structure (10) comprises a supporting plate (1001), a second electric push rod (1002), a movable plate (1003), a second guide column (1004) and a shearing blade (1005), wherein the second electric push rod (1002) is fixedly mounted on the supporting plate (1001), the movable plate (1003) is arranged at the lower end of the second electric push rod (1002), the second guide column (1004) is arranged on the movable plate (1003), the upper end of the second guide column (1004) penetrates through the supporting plate (1001), and the shearing blade (1005) is fixedly mounted on the lower surface of the movable plate (1003).
  6. 6. A film laminating apparatus for PCB circuit board according to claim 1, wherein: the lifting frame (14) comprises a servo motor (1401), a gear (1402), a movable frame (1403), a lifting rod (1404), a third guide post (1405) and a rack (1406), wherein the servo motor (1401) is fixed in the driving box (13), the gear (1402) is arranged on the servo motor (1401), the lifting rod (1404) is arranged on the upper surface of the movable frame (1403), the third guide post (1405) is fixedly arranged on the upper surface of the movable frame (1403), the rack (1406) meshed with the gear (1402) is arranged at the upper end of the lifting rod (1404), and the upper end of the third guide post (1405) is located in the driving box (13).
CN201921535084.3U 2019-09-16 2019-09-16 Film pressing device of PCB (printed Circuit Board) Expired - Fee Related CN210609913U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921535084.3U CN210609913U (en) 2019-09-16 2019-09-16 Film pressing device of PCB (printed Circuit Board)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921535084.3U CN210609913U (en) 2019-09-16 2019-09-16 Film pressing device of PCB (printed Circuit Board)

Publications (1)

Publication Number Publication Date
CN210609913U true CN210609913U (en) 2020-05-22

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ID=70687875

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921535084.3U Expired - Fee Related CN210609913U (en) 2019-09-16 2019-09-16 Film pressing device of PCB (printed Circuit Board)

Country Status (1)

Country Link
CN (1) CN210609913U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111669897A (en) * 2020-06-01 2020-09-15 赣州逸豪新材料股份有限公司 Aluminum substrate foil plate pressing device based on light path positioning
CN112672526A (en) * 2020-12-14 2021-04-16 珠海韦田智科精密机械有限公司 FPC laminating film automation equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111669897A (en) * 2020-06-01 2020-09-15 赣州逸豪新材料股份有限公司 Aluminum substrate foil plate pressing device based on light path positioning
CN112672526A (en) * 2020-12-14 2021-04-16 珠海韦田智科精密机械有限公司 FPC laminating film automation equipment
CN112672526B (en) * 2020-12-14 2022-04-08 珠海韦田智科精密机械有限公司 FPC laminating film automation equipment

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200522

Termination date: 20210916