CN210587677U - Automatic feeding and discharging ceramic wafer marking machine - Google Patents
Automatic feeding and discharging ceramic wafer marking machine Download PDFInfo
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- CN210587677U CN210587677U CN201921305301.XU CN201921305301U CN210587677U CN 210587677 U CN210587677 U CN 210587677U CN 201921305301 U CN201921305301 U CN 201921305301U CN 210587677 U CN210587677 U CN 210587677U
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Abstract
The utility model discloses an automatic feeding and discharging ceramic wafer marking machine, which is characterized in that the marking machine comprises a frame and a ceramic wafer feeding bin position, an empty bin recovery position, a bin lifting mechanism, a ceramic wafer taking mechanism, a ceramic wafer conveying line I, a ceramic wafer jacking mechanism I, a ceramic wafer jig, a laser main beam, a ceramic wafer jacking mechanism II, a ceramic wafer conveying line II, a ceramic wafer conveying mechanism, a ceramic wafer receiving bin position and an empty bin conveying position, wherein the ceramic wafer feeding bin position is provided with a bin lifting cylinder and a bin pushing cylinder; a ceramic wafer taking mechanism is arranged outside the bin lifting mechanism, and a ceramic wafer conveying line I corresponds to the ceramic wafer taking mechanism; the first ceramic wafer jacking mechanism and the ceramic wafer jig are respectively arranged below the laser main beam, and the laser main beam is provided with a laser marking device. The utility model discloses simple structure, convenient operation.
Description
Technical Field
The utility model relates to a laser beam machining technical field, more specifically relate to a potsherd marking machine.
Background
In the thermal printhead manufacturing industry, ceramic plates are generally used as the substrate of the printhead, and the substrate of the printhead is generally cut into small substrates with the same size on a fixed-size ceramic substrate. The production of a finished ceramic small substrate involves two processes, namely ceramic scribing (cutting into small substrates) and ceramic marking (marking bar codes and two-dimensional codes on the small substrates). At present, laser equipment is applied in China and is mature, and mainstream manufacturers basically adopt a laser cutting machine and a laser marking machine to complete the two processes.
Because the thermal printing head belongs to a consumable material, the market demand is very large, 1-2 operators are required to be equipped for each traditional single-station operation machine, the production efficiency is low, the labor intensity is high, and the production requirements of manufacturers cannot be met.
Disclosure of Invention
The utility model aims at solving the defects of the prior art, providing a simple structure, improving the production efficiency and reducing the labor cost.
The utility model discloses an adopt following technical solution to realize above-mentioned purpose: an automatic feeding and discharging ceramic wafer marking machine is characterized by comprising a machine frame, and a ceramic wafer feeding bin position, an empty bin recycling position, a bin lifting mechanism, a ceramic wafer taking mechanism, a ceramic wafer conveying line I, a ceramic wafer jacking mechanism I, a ceramic wafer jig, a laser main beam, a ceramic wafer jacking mechanism II, a ceramic wafer conveying line II, a ceramic wafer conveying mechanism, a ceramic wafer receiving bin position and an empty bin conveying position which are arranged on the machine frame, wherein the ceramic wafer feeding bin is placed on the ceramic wafer feeding bin position, the empty bin is placed on the empty bin conveying position, the ceramic wafer feeding bin position is provided with a bin upper pushing cylinder and a material pushing cylinder, the bin lifting mechanism is arranged on the outer side of the ceramic wafer feeding bin position, the bin lifting mechanism is provided with a clamping cylinder, the bin material pushing cylinder moves forwards for one station, then, the bin upper pushing cylinder descends, and a first bin is placed on the bin lifting mechanism, then, the bin pushing cylinder moves backwards for one station, and the clamping cylinder clamps the bin;
the ceramic wafer taking mechanism is arranged outside the bin lifting mechanism, the ceramic wafer conveying line I corresponds to the ceramic wafer taking mechanism, and after the bin lifting mechanism is in place, the ceramic wafer taking mechanism acts to place the ceramic wafer on the ceramic wafer conveying line I to finish the material taking action;
the first ceramic wafer jacking mechanism and the ceramic wafer jig are respectively arranged below the laser main beam, a laser marking device is arranged on the laser main beam, the first ceramic wafer jacking mechanism jacks up to support the ceramic wafer, the ceramic wafer jig clamps the ceramic wafer, and the ceramic wafer is moved to the position below the laser main beam to complete marking operation;
the ceramic wafer jacking mechanism II, the ceramic wafer conveying line II and the ceramic wafer conveying mechanism are arranged below the laser main beam respectively, the ceramic wafer jacking mechanism II supports the ceramic wafer which is used for completing marking operation and runs to the ceramic wafer conveying line II, the ceramic wafer conveying mechanism is arranged at the output end of the ceramic wafer conveying line II, the ceramic wafer receiving bin position and the empty ceramic bin conveying position are arranged on the outer side of the ceramic wafer conveying mechanism, and the ceramic wafer receiving bin position is conveyed into the ceramic wafer through the ceramic wafer conveying mechanism.
As a further explanation of the above scheme, the ceramic chip feeding bin is provided with a ceramic chip feeding base and a feeding translation base movably arranged in the ceramic chip feeding base, the bin pushing cylinder is transversely arranged and connected with the driving feeding translation base, and the bin upper ejection cylinder is arranged on the feeding translation base and connected with the driving ceramic chip upper bin.
Further, feed bin elevating system sets up the servo module of lift on the support frame with the activity including standing to the support frame, is connected with lifting support on the servo module of lift, and die clamping cylinder sets up on lifting support.
Further, the ceramic wafer taking mechanism comprises a ceramic wafer taking base, a movable support arranged on the ceramic wafer taking base and a ceramic wafer taking plate frame movably arranged on the movable support, the movable support is connected with a lifting cylinder, and the lifting cylinder drives the movable support to move vertically; get ceramic plate frame and be connected with and get the material cylinder, get the flexible removal of ceramic plate frame of material cylinder drive, realize getting the material operation.
Furthermore, the ceramic wafer conveying line I comprises a conveying support I, a conveying motor I and a conveying belt I, wherein the conveying motor I is arranged on the conveying support I, the conveying belt I is mainly driven by the conveying motor I, and the ceramic wafer jacking mechanism I is arranged on the conveying support I and comprises a ceramic wafer jacking cylinder and a ceramic wafer jacking cylinder which are connected with and driven by a lifting support.
Furthermore, the ceramic plate jacking mechanism II and the ceramic plate jacking mechanism have the same structure.
Furthermore, the ceramic wafer conveying line II and the ceramic wafer conveying line are consistent in structure.
Further, the ceramic wafer feeding mechanism and the ceramic wafer taking mechanism are consistent in structure.
Furthermore, the ceramic plate receiving bin position is consistent with the ceramic plate feeding bin position in structure.
The utility model adopts the beneficial effect that above-mentioned technical solution can reach is:
the utility model discloses a mainly by potsherd feed bin position, empty feed bin retrieve the position, feed bin elevating system, get potsherd mechanism, potsherd transfer chain one, potsherd jack-up mechanism one, potsherd tool, potsherd jack-up mechanism two, potsherd transfer chain two, send potsherd mechanism, potsherd to receive the feed bin position, the automatic unloading mechanism structure of empty feed bin transfer position constitution matches potsherd laser marking device to realize the automatic unloading of unloading in many feed bins, realize that 1 workman operates 5-10 machines, improve production efficiency, reduce the human cost.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the ceramic plate feeding bin of the present invention;
FIG. 3 is a schematic structural view of the ceramic wafer jacking mechanism of the present invention;
FIG. 4 is a schematic structural view of the ceramic wafer taking mechanism of the present invention;
fig. 5 is a schematic structural view of the ceramic wafer conveying line of the present invention;
fig. 6 is a schematic structural view of the ceramic wafer jacking mechanism of the present invention.
Description of reference numerals: 1. the ceramic wafer lifting device comprises a rack 2, a ceramic wafer feeding bin position 2-1, a ceramic wafer feeding base 2-2, a feeding translation base 3, an empty bin recovery position 4, a bin lifting mechanism 4-1, a vertical support frame 4-2, a lifting servo module 4-3, a lifting support 5, a ceramic wafer taking mechanism 5-1, a ceramic wafer base 5-2, a movable support 5-3, a ceramic wafer taking frame 5-4, a lifting cylinder 6, a ceramic wafer conveying line I6-1, a conveying support I6-2, a conveying motor I7, a ceramic wafer jacking mechanism I7-1, a ceramic wafer jacking cylinder 7-2, a lifting support 8, a jig ceramic wafer 9, a laser main beam 10, a ceramic wafer jacking mechanism II 11, a ceramic wafer conveying line II 12, a ceramic wafer jacking mechanism II 12, a ceramic wafer lifting mechanism II 12, the ceramic chip conveying mechanism 13, the ceramic chip receiving bin position 14, the empty bin conveying position 15, the bin upper jacking cylinder 16, the bin pushing cylinder 17 and the laser marking device.
Detailed Description
The technical solution is described in detail with reference to specific embodiments below.
As shown in figures 1-6, the utility model relates to an automatic feeding and discharging ceramic wafer marking machine, which comprises a frame 1 and a ceramic wafer feeding bin position 2, an empty bin recovery position 3, a bin lifting mechanism 4, a ceramic wafer taking mechanism 5, a ceramic wafer conveying line I6, a ceramic wafer jacking mechanism I7, a ceramic wafer jig 8, a laser girder 9, a ceramic wafer jacking mechanism II 10, a ceramic wafer conveying line II 11, a ceramic wafer conveying mechanism 12, a ceramic wafer receiving bin position 13 and an empty bin conveying position 14, wherein the ceramic wafer feeding bin is arranged on the ceramic wafer feeding bin position, the empty bin is arranged on the empty bin conveying position, the ceramic wafer feeding bin position is provided with a bin upper jacking cylinder 15 and a bin pushing cylinder 16, the bin lifting mechanism is arranged on the outer side of the ceramic wafer feeding bin position, the bin lifting mechanism is provided with a clamping cylinder, the bin pushing cylinder moves forward by one station, then, the bin upper jacking cylinder descends, a first bin is placed on the bin lifting mechanism, then the bin pushing cylinder retreats to move one station, and the clamping cylinder clamps the bin;
the ceramic wafer taking mechanism 5 is arranged on the outer side of the bin lifting mechanism, the ceramic wafer conveying line I corresponds to the ceramic wafer taking mechanism, and after the bin lifting mechanism is in place, the ceramic wafer taking mechanism acts to place the ceramic wafer on the ceramic wafer conveying line I to finish the material taking action;
the first ceramic wafer jacking mechanism and the ceramic wafer jig are respectively arranged below the laser main beam 9, the laser marking device 17 is arranged on the laser main beam, the first ceramic wafer jacking mechanism jacks up to support the ceramic wafer, the ceramic wafer jig clamps the ceramic wafer, and the ceramic wafer is moved to the position below the laser main beam to complete marking operation; the ceramic wafer jacking mechanism II, the ceramic wafer conveying line II and the ceramic wafer conveying mechanism are arranged below the laser main beam respectively, the ceramic wafer jacking mechanism II supports the ceramic wafer which is used for completing marking operation and runs to the ceramic wafer conveying line II, the ceramic wafer conveying mechanism is arranged at the output end of the ceramic wafer conveying line II, the ceramic wafer receiving bin position and the empty ceramic bin conveying position are arranged on the outer side of the ceramic wafer conveying mechanism, and the ceramic wafer receiving bin position is conveyed into the ceramic wafer through the ceramic wafer conveying mechanism. The ceramic chip feeding bin position 2 is provided with a ceramic chip feeding base 2-1 and a feeding translation base 2-2 movably arranged in the ceramic chip feeding base, a bin pushing cylinder 16 is transversely arranged and connected with the feeding translation base, and a bin upper jacking cylinder 15 is arranged on the feeding translation base and connected with the ceramic chip upper bin.
Further, the bin lifting mechanism 4 comprises a vertical support frame 4-1 and a lifting servo module 4-2 movably arranged on the vertical support frame, the lifting servo module is connected with a lifting support 4-3, and the clamping cylinder is arranged on the lifting support. The ceramic wafer taking mechanism 5 comprises a ceramic wafer taking base 5-1, a movable support 5-2 arranged on the ceramic wafer taking base and a ceramic wafer taking plate frame 5-3 movably arranged on the movable support, wherein the movable support is connected with a lifting cylinder 5-4, and the lifting cylinder drives the movable support to move vertically; get ceramic plate frame and be connected with and get the material cylinder, get the flexible removal of ceramic plate frame of material cylinder drive, realize getting the material operation. The ceramic chip conveying line I6 comprises a conveying support I6-1, a conveying motor I6-2 arranged on the conveying support I and a conveying belt I mainly driven by the conveying motor I, and a ceramic chip jacking mechanism I7 is arranged on the conveying support I and comprises a ceramic chip jacking cylinder 7-1 and a lifting support 7-2 driven by the ceramic chip jacking cylinder in a connecting mode. In this embodiment, the second ceramic wafer jacking mechanism and the ceramic wafer jacking mechanism have the same structure. And the ceramic wafer conveying line II and the ceramic wafer conveying line have the same structure. The ceramic wafer feeding mechanism and the ceramic wafer taking mechanism have the same structure. The ceramic plate receiving bin position is consistent with the ceramic plate feeding bin position in structure.
The working principle is as follows:
after the equipment is powered on and returns to the original point, manually placing the bin filled with the ceramic wafer in the ceramic wafer feeding bin position, placing 1-3 bins in the ceramic wafer feeding bin position, placing the empty bins in the empty bin conveying position, placing 1-3 empty bins in the empty bin conveying position, and starting the equipment to operate.
The first step is as follows: firstly, a bin jacking cylinder jacks up, and a bin pushing cylinder moves forwards by a station; then, the air cylinder on the upper part of the storage bin descends, and the first storage bin is placed on the storage bin lifting mechanism; and then, the bin pushing cylinder moves backwards for one station, and the clamping cylinder clamps the bin.
The second step is that: and after the bin lifting mechanism is in place, the ceramic chip taking mechanism acts. And the material taking cylinder moves one station before, the lifting cylinder pushes up, the material taking cylinder moves one station after retreating, the lifting cylinder descends, and the ceramic wafer is placed on the ceramic wafer conveying line I to finish the material taking action.
The third step: the conveying motor operates to convey the ceramic wafer to a ceramic wafer jig material taking position; the ceramic wafer jacking cylinder jacks up to jack up the ceramic wafer, the ceramic wafer is clamped by the ceramic wafer jig and moves to the lower part of the laser main beam, and marking operation is completed.
The fourth step, the fifth step and the sixth step, which are opposite to the above actions, are not described herein.
After the ceramic chip in the storage bin is completely taken out, the lifting servo module descends to the empty storage bin recovery position structure to take materials at the same height, and the action of the empty storage bin taking structure is opposite to that of the feeding bin, and the description is omitted.
Compared with the prior art, the utility model, realize that the automatic unloading of many feed bins of potsherd marking machine goes up, realize 1 workman and operate 5-10 machines, improve production efficiency, sustainability and save the user cost, can perfectly solve the automatic problem of unloading of going up of potsherd marking machine.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, many modifications and improvements can be made without departing from the inventive concept, and all of them belong to the protection scope of the present invention.
Claims (9)
1. An automatic feeding and discharging ceramic wafer marking machine is characterized by comprising a rack, and a ceramic wafer feeding bin position, an empty bin recovery position, a bin lifting mechanism, a ceramic wafer taking mechanism, a ceramic wafer conveying line I, a ceramic wafer jacking mechanism I, a ceramic wafer jig, a laser main beam, a ceramic wafer jacking mechanism II, a ceramic wafer conveying line II, a ceramic wafer conveying mechanism, a ceramic wafer receiving bin position and an empty bin conveying position which are arranged on the rack;
a ceramic wafer taking mechanism is arranged outside the bin lifting mechanism, and a ceramic wafer conveying line I corresponds to the ceramic wafer taking mechanism;
the first ceramic piece jacking mechanism and the ceramic piece jig are respectively arranged below the laser main beam, and the laser main beam is provided with a laser marking device;
the ceramic wafer jacking mechanism II, the ceramic wafer conveying line II and the ceramic wafer conveying mechanism are respectively arranged below the laser main beam, the ceramic wafer conveying mechanism is arranged at the output end of the ceramic wafer conveying line II, the ceramic wafer receiving bin position and the empty bin conveying position are arranged on the outer side of the ceramic wafer conveying mechanism, and the ceramic wafer is conveyed into the ceramic wafer receiving bin position through the ceramic wafer conveying mechanism.
2. The automatic feeding and discharging ceramic wafer marking machine according to claim 1, wherein the ceramic wafer feeding bin is provided with a ceramic wafer feeding base and a feeding translation base movably arranged in the ceramic wafer feeding base, the bin pushing cylinder is transversely arranged and connected with and drives the feeding translation base, and the bin upper jacking cylinder is arranged on the feeding translation base and connected with and drives the ceramic wafer upper bin.
3. The automatic feeding and discharging ceramic wafer marking machine of claim 1, wherein the bin lifting mechanism comprises a vertical support frame and a lifting servo module movably arranged on the vertical support frame, the lifting servo module is connected with a lifting support, and the clamping cylinder is arranged on the lifting support.
4. The automatic feeding and discharging ceramic wafer marking machine as claimed in claim 1, wherein the ceramic wafer taking mechanism comprises a ceramic wafer taking base, a movable support arranged on the ceramic wafer taking base, and a ceramic wafer taking plate frame movably arranged on the movable support, the movable support is connected with a lifting cylinder, and the lifting cylinder drives the movable support to move vertically; get ceramic plate frame and be connected with and get the material cylinder.
5. The automatic feeding and discharging ceramic wafer marking machine as claimed in claim 1, wherein the ceramic wafer conveying line I comprises a conveying support I and a conveying motor I arranged thereon and a conveying belt I mainly driven by the conveying motor I, and the ceramic wafer jacking mechanism I is arranged on the conveying support I and comprises a ceramic wafer jacking cylinder and a lifting support connected and driven by the ceramic wafer jacking cylinder.
6. The automatic feeding and discharging ceramic wafer marking machine of claim 5, wherein a second ceramic wafer jacking mechanism is consistent with the first ceramic wafer jacking mechanism in structure.
7. The automatic feeding and discharging ceramic wafer marking machine of claim 5, wherein the ceramic wafer conveying line two and the ceramic wafer conveying line have the same structure.
8. The automatic feeding and discharging ceramic wafer marking machine of claim 4, wherein the ceramic wafer feeding mechanism and the ceramic wafer taking mechanism have the same structure.
9. The automatic loading and unloading ceramic wafer marking machine of claim 2, wherein the ceramic wafer receiving bin is consistent with the ceramic wafer loading bin in structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921305301.XU CN210587677U (en) | 2019-08-12 | 2019-08-12 | Automatic feeding and discharging ceramic wafer marking machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921305301.XU CN210587677U (en) | 2019-08-12 | 2019-08-12 | Automatic feeding and discharging ceramic wafer marking machine |
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| Publication Number | Publication Date |
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| CN210587677U true CN210587677U (en) | 2020-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921305301.XU Active CN210587677U (en) | 2019-08-12 | 2019-08-12 | Automatic feeding and discharging ceramic wafer marking machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113523582A (en) * | 2021-07-23 | 2021-10-22 | 广东镭泰激光智能装备有限公司 | Battery laser coding and tracing device |
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2019
- 2019-08-12 CN CN201921305301.XU patent/CN210587677U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113523582A (en) * | 2021-07-23 | 2021-10-22 | 广东镭泰激光智能装备有限公司 | Battery laser coding and tracing device |
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Address after: 528311 1st floor, building 5, Qide real estate Park, No.2, Xingye East Road, Shunjiang Neighborhood Committee Industrial Park, Beijiao Town, Shunde District, Foshan City, Guangdong Province Patentee after: Guangdong Guoyu Technology Co.,Ltd. Address before: 528311 1st floor, building 5, Qide real estate Park, No.2, Xingye East Road, Shunjiang Neighborhood Committee Industrial Park, Beijiao Town, Shunde District, Foshan City, Guangdong Province Patentee before: GUANGDONG NATIONAL BOWLDER TECHNOLOGY CO.,LTD. |
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| CP01 | Change in the name or title of a patent holder |