CN210579416U - Four-layer soft and hard combined board capable of reducing uncapping flow - Google Patents

Abstract

The utility model discloses a reduce four layers of soft and hard combination boards of flow of uncapping belongs to circuit board technical field, including the PI substrate, the upper and lower surface distribution of PI substrate covers has substrate copper and lower substrate copper, the top of going up the substrate copper covers and has two copperplating in. The utility model discloses when using, the last copper facing and the last calendering copper of first hole top are fallen in the etching, then lower copper facing and the lower calendering copper of second hole below are fallen in the etching, can spill the last substrate copper and the lower substrate copper of PI substrate upper and lower surface, directly use, need not use laser to get rid of panel, it is more convenient to get up, the time cost that laser uncapped has been practiced thrift, the artifical base plate expense that strips of having practiced thrift, the gross thickness of panel has been reduced simultaneously, traditional circuit board compares, neotype reduction four layers soft and hard combined plate of the flow of uncapping, thickness is more frivolous, the processing cost is cheaper, machining efficiency is better, bring better economic benefits.

Description

Four-layer soft and hard combined board capable of reducing uncapping flow

Technical Field

The utility model belongs to the technical field of the circuit board, specifically be a four-layer soft and hard combination board that reduces flow of uncapping.

Background

Industrial, medical, cell phone, LCD television and other consumer electronics such as: the market demand for portable electronic products such as hard disk drives, floppy disk drives, mobile phones, notebook computers, cameras, camcorders, and PDAs for electronic computers is continuously expanding, and electronic devices are increasingly developing in the direction of being light, thin, short, small, and multifunctional. Particularly, the application of the flexible board for High Density Interconnect (HDI) will greatly promote the rapid development of flexible printed circuit technology, and along with the development and improvement of printed circuit technology, the development and research of Rigid-Flex PCB (rib-Flex PCB) will be applied in large quantities, and the supply of Rigid-Flex PCB in the future in the world will be expected to increase greatly. Meanwhile, the durability and flexibility of the rigid-flex printed circuit board make the rigid-flex printed circuit board more suitable for application in the fields of medical treatment and military affairs, and gradually increase the market share of rigid PCBs.

In particular, Camera modules with more than 1300 ten thousand pixels almost use rigid-flexible boards, but the thickness of the rigid-flexible board is required to be less than 0.4mm and tends to be closer to 0.3mm in the limited space of mobile phones. However, in the past, the whole four-layer soft-hard combined plate structure adopts an upper hard plate and a lower hard plate and a middle soft plate, but the structure is limited to 0.4mm in plate thickness, and gradually cannot meet the requirement of the market for the light and thin plate thickness of 0.3 mm.

The traditional rigid-flexible board in the prior art needs to firstly remove the rigid board in the bending area or uncover the rigid board in a laser mode afterwards, so that the production time is wasted, the process flow is increased, and meanwhile, the finished board is thick.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in order to solve the problem that the traditional rigid-flexible board in the prior art needs to firstly remove the rigid board in the bending area or uncover the rigid board in a laser mode afterwards, the method wastes production time, increases the process flow and simultaneously solves the problem that the finished board is thick, and the four-layer rigid-flexible board reduces the uncovering flow is provided.

The utility model adopts the technical scheme as follows:

a four-layer soft-hard combined board for reducing the uncapping process comprises a PI base material, wherein the upper surface and the lower surface of the PI base material are distributed and covered with upper base material copper and lower base material copper, a middle second copper plating is covered above the upper base material copper, the upper surface of the middle second copper plating is covered with an upper insulating material, the upper layer of the upper insulating material is upper rolled copper, the upper layer of the upper rolled copper is covered with upper copper plating, the lower layer of the lower base material copper is a middle third copper plating layer, the lower layer of the middle third copper plating layer is a lower insulating material, the lower layer of the lower insulating material is lower rolled copper, the lower layer of the lower rolled copper is lower plated copper, a first hole is reserved between the upper rolled copper and the upper substrate copper, a third hole is reserved between the first hole and the lower base material copper, the upper copper plating layer and the lower copper plating layer are communicated through a fourth hole, and the upper rolled copper layer and the lower rolled copper layer are communicated through a second hole.

The upper copper plating, the middle copper plating, the third copper plating and the lower copper plating are connected through copper foils.

The number of the second holes is two, and the two second holes are symmetrically distributed on the left side and the right side of the first hole.

Wherein, the inside of the second hole is filled with an upper insulating material and a lower insulating material.

Wherein, the second hole sets up to "worker" style of calligraphy.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that: the utility model discloses when using, the last copper facing and the last calendering copper of first hole top are fallen in the etching, then lower copper facing and the lower calendering copper of second hole below are fallen in the etching, can spill the last substrate copper and the lower substrate copper of PI substrate upper and lower surface, directly use, need not use laser to get rid of panel, it is more convenient to get up, the time cost that laser uncapped has been practiced thrift, the artifical base plate expense that strips of having practiced thrift, the gross thickness of panel has been reduced simultaneously, traditional circuit board compares, neotype reduction four layers soft and hard combined plate of the flow of uncapping, thickness is more frivolous, the processing cost is cheaper, machining efficiency is better, bring better economic benefits.

Drawings

Fig. 1 is a schematic diagram of the structure of the present invention.

The labels in the figure are: 1. plating copper; 2. upper rolling copper; 3. an upper insulating material; 4. plating copper on the second intermediate; 5. upper base material copper; 6. a PI substrate; 7. a lower substrate copper; 8. plating copper in the third step; 9. a lower insulating material; 10. down-rolling copper; 11. plating copper; 12. a first hole; 13. a second hole; 14. a third hole; 15. and a fourth hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1, a four-layer rigid-flex board for reducing a cover opening process comprises a PI substrate 6, wherein upper and lower surfaces of the PI substrate 6 are respectively covered with upper substrate copper 5 and lower substrate copper 7, a middle second copper plating 4 is covered above the upper substrate copper 5, an upper insulating material 3 is covered on the upper surface of the middle second copper plating 4, the upper layer of the upper insulating material 3 is upper rolled copper 2, the upper layer of the upper rolled copper 2 is covered with upper copper plating 1, the lower layer of the lower substrate copper 7 is middle third copper plating 8, the lower layer of the middle third copper plating 8 is a lower insulating material 9, the lower layer of the lower insulating material 9 is lower rolled copper 10, the lower layer of the lower rolled copper 10 is lower copper plating 11, a first hole 12 is reserved between the upper rolled copper 2 and the upper substrate copper 5, a third hole 14 is reserved between the first hole 12 and the lower substrate copper 7, the upper copper plating 1 and the lower copper plating 11 are communicated through a fourth hole 15, and the upper rolled copper plating 2 and the lower rolled copper plating 10 are communicated through a second, the utility model discloses when using, the last copper facing 1 and the last calendering copper 2 above first hole 12 are fallen in the etching, then lower copper facing 11 and the lower calendering copper 10 of third hole 14 below are fallen in the etching, can spill the last substrate copper 5 and the lower substrate copper 7 of PI substrate 6 upper and lower surface, directly use, need not use laser to get rid of panel, it is more convenient to get up, the time cost that laser was uncapped has been practiced thrift, the artifical base plate expense that strips of having practiced thrift, the gross thickness of panel has been reduced simultaneously, traditional circuit board compares, neotype reduction four layers soft and hard combined plate of the flow of uncapping, thickness is more frivolous, the processing cost is cheaper, machining efficiency is better, bring better economic benefits.

Further, the upper copper plating 1, the middle second copper plating 4, the middle third copper plating 8 and the lower copper plating 11 are connected through copper foils, as shown in fig. 1, the upper copper plating 1, the middle second copper plating 4, the middle third copper plating 8 and the lower copper plating 11 can be removed conveniently at one time.

Further, the number of the second holes 13 is two, and the two second holes 13 are symmetrically distributed on the left and right sides of the first hole 12, as shown in fig. 1, the second holes 13 facilitate customizing a more complex circuit.

Further, the inside of the second hole 13 is filled with the upper insulating material 3 and the lower insulating material 9, and the upper insulating material 3 and the lower insulating material 9 are beneficial to protecting the circuit.

Further, the second holes 13 are arranged in an i shape, as shown in fig. 1, the upper insulating material 3 and the lower insulating material 9 are filled in the i-shaped second holes 13, which is beneficial to protecting the circuit and is convenient for customizing a complex circuit.

The working principle is as follows: the utility model discloses when using, the last copper facing 1 and the last calendering copper 2 above first hole 12 are fallen in the etching, then lower copper facing 11 and the lower calendering copper 10 of third hole 14 below are fallen in the etching, can spill the last substrate copper 5 and the lower substrate copper 7 of PI substrate 6 upper and lower surface, directly use, need not use laser to get rid of panel, it is more convenient to get up, the time cost that laser was uncapped has been practiced thrift, the artifical base plate expense that strips of having practiced thrift, the gross thickness of panel has been reduced simultaneously, traditional circuit board compares, neotype reduction four layers soft and hard combined plate of the flow of uncapping, thickness is more frivolous, the processing cost is cheaper, machining efficiency is better, bring better economic benefits.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (5)

1. The utility model provides a reduce four layers of soft and hard combination boards of flow of uncapping, includes PI substrate (6), its characterized in that: the upper and lower surface distribution of PI substrate (6) has last substrate copper (5) and lower substrate copper (7), the top of going up substrate copper (5) covers well two copper-plated (4), well two copper-plated (4) upper surface covers has last insulating material (3), the upper strata of going up insulating material (3) is last calendering copper (2), the upper strata of going up calendering copper (2) covers and has last copper-plated (1), the lower floor of lower substrate copper (7) is well three copper-plated (8), the lower floor of well three copper-plated (8) is insulating material (9) down, the lower floor of insulating material (9) is for calendering copper (10) down, the lower floor of calendering copper (10) is copper-plated (11) down, it has first hole (12) to reserve between calendering copper (2) and last substrate copper (5), first hole (12) and lower substrate copper (7) reserve third hole (14), go up copper facing (1) and link up through fourth hole (15) between copper facing (11) down, go up calendering copper (2) and link up through second hole (13) between calendering copper (10) down.

2. The four-layer rigid-flex board for reducing the decap process of claim 1, wherein: the upper copper plating (1), the middle second copper plating (4), the middle third copper plating (8) and the lower copper plating (11) are connected through copper foils.

3. The four-layer rigid-flex board for reducing the decap process of claim 1, wherein: the number of the second holes (13) is two, and the two second holes (13) are symmetrically distributed on the left side and the right side of the first hole (12).

4. The four-layer rigid-flex board for reducing the decap process of claim 1, wherein: the interior of the second hole (13) is filled with an upper insulating material (3) and a lower insulating material (9).

5. The four-layer rigid-flex board for reducing the decap process of claim 1, wherein: the second holes (13) are arranged in an I shape.

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