CN210578462U - SMD resonator - Google Patents

Abstract

The utility model discloses a SMD resonator, which comprises a base, a cover plate and a resonance sheet, wherein the base comprises a bottom plate and a side plate, and the base and the cover plate jointly enclose a cavity of the resonance sheet; the side plate is provided with a groove; the resonance sheet is bonded with the groove through a conductive adhesive point. The cross section of the groove is triangular, trapezoidal, rectangular or circular arc. The resonance sheet is a quartz resonance sheet. The utility model has the advantages that: firstly, the position consistency of the glue dots on the resonance sheet is improved, and further the product performance consistency is improved; and secondly, the overall size of the device is reduced or the size of the resonator plate is increased, and the stability is improved.

Description

SMD resonator

Technical Field

The utility model relates to a syntonizer especially relates to a SMD syntonizer.

Background

Quartz crystal resonators are commonly used electronic devices and are widely used in various oscillating circuits of electronic products such as color tvs, computers, remote controllers, mobile phones, etc., for example, in communication systems for frequency generators, for generating clock signals for data processing equipment, and for providing reference signals for specific systems.

A quartz crystal resonator is a resonant device made by using the piezoelectric effect of quartz crystal (crystal of silicon dioxide), and its basic constitution is roughly: a slice (quartz crystal wafer for short, which can be square, rectangular or circular) is cut from a quartz crystal according to a certain azimuth angle, silver layers are coated on two corresponding surfaces of the quartz crystal wafer to be used as electrodes, a lead is welded on each electrode and connected to a pin, and a packaging shell is added to form a quartz resonator, crystal oscillator for short. The product is generally packaged by a metal shell, and also packaged by a glass shell, ceramics or plastics.

If an electric field is applied to both electrodes of the quartz wafer coated with the electrodes, the quartz wafer is mechanically deformed. On the contrary, if mechanical pressure is applied to both sides of the quartz wafer, an electric field is generated in a corresponding direction of the quartz wafer, and this physical phenomenon is called a piezoelectric effect. If alternating voltage is applied to two poles of the quartz wafer, the quartz wafer generates mechanical vibration, and the mechanical vibration of the quartz wafer generates an alternating electric field. In general, the amplitude of mechanical vibration of the quartz wafer and the amplitude of the alternating electric field are very small, but when the frequency of the applied alternating voltage is the natural frequency of the quartz wafer, the amplitude is significantly large and much larger than the amplitude at other frequencies, and this phenomenon is called piezoelectric resonance, and the frequency of the alternating voltage at this time is called the resonance frequency of the quartz wafer. The resonant frequency of a quartz wafer is essentially only related to the way, geometry, and dimensions of the quartz wafer.

With the development of the electronic industry, a chip-type quartz crystal resonator emerges, and the structure of the existing chip-type quartz crystal resonator is shown in fig. 1, and mainly comprises a base 1, a cover plate 2 and a resonator 3, wherein a dispensing platform 1-1 is arranged in the base 1, one end of the resonator 3 is placed on the dispensing platform 1-1, and then a crystal oscillator body is glued on the dispensing platform 1-1 through a conductive glue dispensing body 4.

The prior art has the following problems: because the working frequency and stability of the resonant chip mainly depend on the cutting mode, the geometric shape and the size of the resonant chip, the conductive adhesive dots which are used for bonding the resonant chip on the adhesive dispensing platform can directly occupy the main electrode surface of the resonant chip, and the main electrode surface of the resonant chip is influenced by the position shape difference of the adhesive dots, the parameter indexes of individual crystals can be reduced, the parameter consistency of a batch of crystals can be influenced, and the yield is further influenced. In the past, when the size of the resonant chip is relatively large, such as 3225 type products, the relative proportion of the occupied area of the glue dots is small, and the influence is not obvious; however, with the development of further miniaturization of electronic products, such as 2016, 1612, 1210 models, and even 0806 models, the length of the resonator plate inside the chip-type quartz crystal resonator has been reduced to within 0.5mm, and the width is only within 0.4mm, while the minimum glue dot controllable by the existing glue dispensing technology is 0.15mm, and the size of the glue dot cannot be further reduced by the existing technology, but the size of the resonator plate is further reduced, so that the relative area of the glue dot occupying the electrode surface of the resonator plate is larger and larger, and the working stability and the production yield of the quartz crystal resonator are seriously affected.

In addition, in the prior art, due to the structure that the wafer is placed on the dispensing platform, the structure in the resonator is complex, the dispensing platform occupies a certain space, and further miniaturization of the volume of the quartz crystal resonator is severely restricted; in addition, the wafer is bonded on the spot gluing platform, so that the contact areas of the two electrode surfaces of the wafer and the conductive adhesive are different, the consistency is poor, and the final yield of the product is influenced. In other words, a resonator processed according to a conventional SMD (Surface Mounted device) resonator structure cannot achieve miniaturization of the SMD resonator, and cannot meet the miniaturization requirement of the intelligent society on electronic products.

Disclosure of Invention

The utility model discloses the technical problem that will solve is: an SMD resonator having high yield and stable performance and facilitating the reduction of device size is provided.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:

an SMD resonator comprises a base, a cover plate and a resonator plate, wherein the base comprises a bottom plate and a side plate, and the base and the cover plate jointly enclose a cavity of the resonator plate; and a groove is arranged at the position of the side plate, which is glued with the resonance plate, and the resonance plate is bonded with the groove through a conductive glue.

Compared with the prior art, the utility model discloses following technological effect has: because the side surface of the resonance sheet is fixed with the side plate of the base, compared with the traditional structure that the resonance sheet is arranged on the base dispensing platform, the position consistency of the glue dots on the resonance sheet is improved, and the yield is improved; secondly, because the resonance piece is arranged on the side plate and the glue dispensing platform is not needed, the whole size of the element is favorably reduced, or the size of the resonance piece can be increased, and the stability is favorably improved; and thirdly, the grooves are arranged, so that more glue bodies can be hung on the side plates, and the fixing effect on the resonance sheet is better.

Generally, the resonant plate has a flat rectangular parallelepiped shape, including an upper surface, a lower surface, and side surfaces.

On the basis of the technical scheme, the utility model discloses can also do following improvement.

Furthermore, the base is rectangular, the number of the side plates is four, and at least one side plate is provided with a groove.

The beneficial effects of the further measures are as follows: the rectangular base is convenient to process and manufacture.

Further, the resonance sheet comprises a wafer, and a main electrode A and a main electrode B which are respectively arranged on the upper surface and the lower surface of the wafer; (ii) a The conductive adhesive dots comprise first conductive adhesive dots and second conductive adhesive dots; the first conductive adhesive point is connected with the auxiliary electrode A; the second conductive adhesive point is connected with the auxiliary electrode B; the first conductive adhesive dots and the second conductive adhesive dots are insulated.

The beneficial effects of the further measures are as follows: the purpose of electrically connecting the resonance plates is realized while the resonance plates are fixed on the side plate of the base, the production process is simplified, and the production efficiency is improved.

Further, the cross section of the groove is triangular, trapezoidal, rectangular or circular arc. The cross section is perpendicular to the main electrode surface of the resonant plate and perpendicular to the plane of the side plate of the glued resonant plate.

The further measures have the advantages that different groove shapes can be selected according to the processing technology from the consideration of convenient realization of processing, the fixing effect of the resonance sheet is better, and the base is more convenient to produce and lower in cost due to the cross section shape.

Further, the resonant chip is a quartz resonant chip.

The further measures have the advantages of mature production process and low manufacturing cost of the quartz resonance chip.

Further, the base is a ceramic base.

The ceramic base has the advantages of mature production process and low manufacturing cost.

Drawings

Fig. 1 is a schematic structural diagram of an SMD resonator of the prior art;

fig. 2 is a schematic structural diagram of an SMD resonator according to embodiment 1 of the present invention;

fig. 3 is a schematic structural diagram of a resonator plate in the present invention;

fig. 4 is a schematic top view of the SMD resonator according to the present invention with the cover plate removed;

fig. 5 is a schematic diagram of the position of the bottom electrode of the SMD resonator according to the present invention;

3 fig. 3 6 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 the 3 direction 3 a 3- 3 a 3 in 3 fig. 32 3 with 3 the 3 resonator 3 plate 3 removed 3; 3

Fig. 7 is a schematic structural diagram of an SMD resonator of embodiment 2 of the present invention;

3 fig. 3 8 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 the 3 direction 3 a 3- 3 a 3 in 3 fig. 3 7 3 with 3 the 3 resonator 3 plate 3 removed 3; 3

Fig. 9 is a schematic structural diagram of embodiment 3 of the SMD resonator of the present invention;

3 fig. 3 10 3 is 3 a 3 schematic 3 sectional 3 view 3 of 3 the 3 resonator 3 plate 3 shown 3 in 3 fig. 3 9 3 with 3 the 3 resonator 3 plate 3 removed 3 from 3 the 3 direction 3 a 3- 3 a 3; 3

Fig. 11 is a schematic structural diagram of an SMD resonator according to embodiment 4 of the present invention;

3 fig. 3 12 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 the 3 direction 3 a 3- 3 a 3 in 3 fig. 3 11 3 with 3 the 3 resonator 3 plate 3 removed 3; 3

In the drawings, the parts names represented by the respective reference numerals are listed as follows:

1. a base;

1-1, dispensing platform;

1-2, a bottom plate;

1-3, side plates;

1-4, a groove;

2. a cover plate;

3. a resonant chip;

3-1, upper surface;

3-1-1, main electrode a;

3-1-2, a secondary electrode A;

3-2, lower surface;

3-2-2, a secondary electrode B;

3-3, side;

4. conducting resin dots;

4-1, first conductive adhesive dots;

4-2, second conductive adhesive dots;

5-1, a first bottom electrode;

5-2, a second bottom electrode;

5-3, a third bottom electrode;

5-4, and a fourth bottom electrode.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.

Example 1

Please refer to fig. 2, which is a schematic structural diagram of an SMD resonator according to embodiment 1 of the present invention, where the SMD resonator includes a base 1, a cover plate 2 and a quartz resonator plate 3, the base 1 is rectangular, the base 1 includes a bottom plate 1-2 and side plates 1-3, the number of the side plates is four, the side plates 1-3 are fixed on the bottom plate 1-2, and the base 1 and the cover plate 2 together enclose a cavity of the quartz resonator plate 3; a groove with a trapezoidal cross section is arranged at the position where one side plate 1-3 is glued with the quartz resonance plate 3.

As shown in fig. 3, the quartz resonator plate 3 comprises a quartz wafer, a main electrode a3-1-1 is disposed on an upper surface 3-1 of the quartz wafer, and a main electrode B (not shown) is disposed on a lower surface 3-2 of the quartz wafer; the device also comprises a secondary electrode A3-1-2 electrically connected with the primary electrode A3-1-1, and a secondary electrode B3-2-2 electrically connected with the primary electrode B; the auxiliary electrode A3-1-2 and the auxiliary electrode B3-2-2 of the resonance sheet are fixed on the side plate 1-3 of the base 1 through a conductive adhesive dot 4.

In a specific implementation, the upper surface 3-1 or the lower surface 3-2 of the quartz resonator plate is parallel to the cover plate and the bottom plate, and a gap is respectively kept between the upper surface and the bottom plate.

Referring to fig. 4, which is a schematic top view structure diagram of the SMD resonator according to the present invention after removing the cover plate, a side surface 3-3 of the quartz resonator plate 3 is glued to a side plate 1-3 of the base 1 through a first conductive glue point 4-1 and a second conductive glue point 4-2; the first conductive adhesive dot 4-1 is connected with the auxiliary electrode A3-1-2; the second conductive adhesive dot 4-2 is connected with the secondary electrode B3-2-2; the first conductive adhesive dots 4-1 and the second conductive adhesive dots 4-2 are insulated.

Referring to fig. 5, a first bottom surface electrode 5-1, a second bottom surface electrode 5-2, a third bottom surface electrode 5-3, and a fourth bottom surface electrode 5-4 are disposed at the bottom of a base 1 of the SMD resonator, and in the base 1, a metalized through hole or a metal plating film is disposed between a first conductive adhesive point 4-1 and the first bottom surface electrode 5-1 to electrically connect the first conductive adhesive point 4-1 and the first bottom surface electrode 5-1; a metalized through hole and/or a coated conductive layer is/are arranged between the second conductive adhesive point 4-2 and the third bottom electrode 5-3, so that the second conductive adhesive point 4-2 is electrically connected with the third bottom electrode 5-3.

3 fig. 3 6 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 of 3 the 3 resonator 3 plate 3 taken 3 along 3 the 3 direction 3 a 3- 3 a 3 in 3 fig. 32 3. 3

In fig. 6a, grooves are only formed on the first conductive adhesive dots and the second conductive adhesive dots;

in fig. 6b, a through groove is integrally formed on a side plate 1-3 of the glued resonance plate;

in fig. 6c, grooves are provided on all the side plates 1-3 of the whole base;

the benefits of this are: 1. more conductive adhesive can be hung in the groove, so that the fixing effect on the quartz resonance sheet 3 is better; 2. the wafer position is fixed relatively centered.

Example 2

Fig. 7 is a schematic structural diagram of an SMD resonator according to embodiment 2 of the present invention. Different from embodiment 1, embodiment 2 has the advantages that the side plates 1-3 and the quartz resonator plate 3 are provided with the grooves with the triangular cross sections at the positions where the side plates are glued, and the advantages are as follows: 1. more conductive adhesive can be hung in the groove, so that the fixing effect on the quartz resonance plate 3 is better. 2. The wafer position is fixed relatively centered. 3. Triangular grooves are easier to machine.

3 referring 3 to 3 fig. 3 8 3, 3 fig. 3 8 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 of 3 the 3 resonator 3 plate 3 taken 3 along 3 the 3 direction 3 a 3- 3 a 3 in 3 fig. 3 7 3; 3

In fig. 8a, grooves are provided only at the first conductive paste spots and the second conductive paste spots;

in fig. 8b, a through groove is formed on a side plate 1-3 of the glued resonance plate;

in fig. 8c, groove-shaped grooves are formed in all the side plates 1-3 of the whole base;

example 3

Fig. 9 is a schematic structural diagram of an SMD resonator according to embodiment 3 of the present invention. Unlike embodiment 1, embodiment 3 has the advantages that the side plates 1-3 are provided with the grooves with rectangular cross sections at the positions where the quartz resonator plate 3 is glued, and the grooves are as follows: 1. more conductive adhesive can be hung in the groove, so that the fixing effect on the quartz resonance plate 3 is better. 2. The wafer position is fixed relatively centered.

3 referring 3 to 3 fig. 3 10 3, 3 fig. 3 10 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 of 3 the 3 resonator 3 plate 3 taken 3 along 3 the 3 direction 3 a 3- 3 a 3 in 3 fig. 3 9 3; 3

In fig. 10a, grooves are formed only in the first conductive adhesive dots and the second conductive adhesive dots;

in fig. 10b, a through groove is integrally formed on a side plate 1-3 of the glued resonance plate;

in fig. 10c, grooves are provided on all the side plates 1-3 of the entire base;

example 4

Fig. 11 is a schematic structural diagram of an SMD resonator according to embodiment 4 of the present invention.

Different from embodiment 1, embodiment 4 has the advantages that the side plates 1-3 and the quartz resonator plate 3 are provided with the grooves with the circular arc-shaped cross sections at the glued joint positions, and the advantages are as follows: 1. more conductive adhesive can be hung in the groove, so that the fixing effect on the quartz resonance plate 3 is better. 2. The wafer position is fixed relatively centered.

3 referring 3 to 3 fig. 3 12 3, 3 fig. 3 12 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 of 3 the 3 resonator 3 plate 3 taken 3 along 3 the 3 direction 3 a 3- 3 a 3 in 3 fig. 3 11 3; 3

In fig. 12a, grooves are formed only in the first conductive adhesive dots and the second conductive adhesive dots;

in fig. 12b, a through groove is integrally formed on a side plate 1-3 of the glued resonance plate;

in fig. 12c, grooves are provided on all the side plates 1-3 of the entire base;

the above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims (6)

1. The SMD resonator comprises a base, a cover plate and a resonator plate, wherein the base comprises a bottom plate and a side plate, the base and the cover plate jointly enclose a cavity of the resonator plate, and the SMD resonator is characterized in that a groove is formed in the side plate, and the resonator plate is bonded with the groove through a conductive adhesive.

2. The SMD resonator according to claim 1, wherein the base is rectangular, the side plates are four, and at least one side plate is provided with a groove.

3. The SMD resonator according to claim 1, wherein the resonator plate comprises a chip and main electrodes a and B provided on an upper surface and a lower surface of the chip, respectively; the electrode also comprises a secondary electrode A electrically connected with the main electrode A and a secondary electrode B electrically connected with the main electrode B;

the conductive adhesive dots comprise first conductive adhesive dots and second conductive adhesive dots; the first conductive adhesive point is connected with the auxiliary electrode A; the second conductive adhesive point is connected with the auxiliary electrode B; the first conductive adhesive dots and the second conductive adhesive dots are insulated.

4. The SMD resonator according to any one of claims 1-3, characterised in that the cross-section of said grooves is triangular, trapezoidal, rectangular or circular.

5. The SMD resonator according to any of claims 1-3, wherein the resonator plate is a quartz resonator plate.

6. -the SMD resonator according to any of the claims 1 to 3, characterised in that the base is a ceramic base.

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