CN210572029U - Multifunctional wafer cutting equipment detection device - Google Patents
Multifunctional wafer cutting equipment detection device Download PDFInfo
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- CN210572029U CN210572029U CN201921013374.1U CN201921013374U CN210572029U CN 210572029 U CN210572029 U CN 210572029U CN 201921013374 U CN201921013374 U CN 201921013374U CN 210572029 U CN210572029 U CN 210572029U
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Abstract
The utility model discloses a multifunctional wafer cutting equipment detection device, which comprises a fixed clamp, a CCD imager and a display, wherein the fixed clamp comprises a first support and a second support which are arranged relatively and can move relatively, the first support and the second support are respectively provided with a rotatable first matching part and a rotatable second matching part, and the first support and the second support are close to each other so that an object to be detected can be rotatably fixed on the fixed clamp; the CCD imager is used for shooting the surface image of the object to be detected and is arranged above the fixed clamp in a reciprocating manner; the display is connected with the CCD imager; the detection device can acquire the surface image of the object to be detected through the imaging equipment, so that a detector can comprehensively check the surface of the object to be detected, perform preventive check on the reasons of abnormal wafer cutting and wire breakage and the broken steel wires, and adopt corresponding preventive remedial measures to reduce the probability of wire breakage and the wafer loss.
Description
Technical Field
The utility model relates to a wafer production facility technical field, in particular to multi-functional wafer cutting equipment detection device.
Background
The steel wire groove wheel axle is an important device in semiconductor crystal production, and before production, the wire grooves on the steel wire groove wheel axle must be inspected to prevent the wire breakage phenomenon in the production process caused by the groove position defects (such as the ectopic position of a groove peak, the loss of the groove peak and the like) of the steel wire groove wheel axle from causing wafer loss.
At present, because the weight of a steel wire groove wheel shaft is large, continuous turning is difficult, the microstructure images of local steel wires and rolling shafts are very difficult to inspect, the microstructure inspection of the whole surfaces of the steel wires and the rolling shafts is more difficult, and the line pressing phenomenon cannot be well inspected by a common visual inspection method, so that the phenomenon of sudden line breaking of the steel wires with line pressing defects after the steel wires are installed on a machine is also caused.
Meanwhile, the steel wire breakage abnormality has the following reasons:
firstly, a large particle matter jumper wire is laid in a steel wire groove to cause two wires to be broken by friction in the groove;
secondly, the steel wire at the wire breakage position is seriously abraded to cause wire breakage;
a slurry valve is not opened during cutting, and no slurry causes wire breakage;
④, the mud scraper is not locked to cause wire breakage;
the actual tension is not consistent with the set tension;
sixthly, the wire breakage caused by abnormal operation due to the over-limit angle of the paying-off tension arm;
seventh, pressing steel wires in the pay-off wheel to cause wire breakage;
⑧, the steel wire is unqualified;
⑨, other reasons;
the abnormal reason of the broken wire can be better checked by microscopic conditions of broken ends and sections of the broken steel wires after the broken wire, and appearance inspection of V-shaped wheels and wire guide wheels of wafer cutting equipment for materials or inner grooves of the wheels after the operation, and the targeted measures of the broken wire problem can be processed according to the reason of the abnormal inspection.
Therefore, how to comprehensively and effectively detect the appearance quality of the rolling shaft and the steel wire is an important technical problem to be solved urgently by the technical personnel in the field.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a multi-functional wafer cutting equipment detection device to detect roller bearing, copper wire appearance quality comprehensively effectively, reduce because the trench is unusual, the broken string phenomenon that defects such as line ball caused reduces the wafer loss.
In order to achieve the above object, the utility model provides a following technical scheme:
a multifunctional wafer cutting device detection apparatus, comprising:
the fixing clamp comprises a first support and a second support which are arranged oppositely and can move relatively, a rotatable first matching part is arranged on the first support, a rotatable second matching part is arranged on the second support, and the first support and the second support are close to each other and are matched with an object to be detected through the first matching part and the second matching part respectively so that the object to be detected can be rotatably fixed on the fixing clamp;
the CCD imager is used for shooting the surface image of the object to be detected and can be arranged above the fixed clamp in a reciprocating manner between the first support and the second support;
and the display is connected with the CCD imager and is used for displaying the image shot by the CCD imager.
Preferably, a first driving device for driving the first matching portion to rotate is arranged on the first support, and a second driving device for driving the first support and the second support to move relatively is arranged on one of the first support and the second support.
Preferably, the first driving device includes a motor and a reduction pulley pair, a driving wheel of the reduction pulley pair is connected to a rotating shaft of the motor, a driven wheel of the reduction pulley pair is connected to the first matching portion, and a belt of the reduction pulley pair is respectively matched with the driving wheel and the driven wheel;
the second driving device comprises a mounting seat, a lead screw and a hand-operated wheel, the lead screw is rotatably arranged on the mounting seat, one end of the lead screw is connected with the hand-operated wheel, and the second support is slidably arranged on the mounting seat, and is matched with the lead screw through a screw hole in the bottom of the second support.
Preferably, a universal LED lamp is further arranged on the fixing clamp.
Preferably, the first and second mating portions are configured to accommodate female bore structure adapters of various bore sizes, tapered, cylindrical, or a combination thereof.
Preferably, still including being used for bearing the first load device of waiting to detect the object, first load device set up in first support and between the second support, first load device includes base, support and backing roll, two the backing roll parallel side by side, mutual interval and rotationally set up in the support, the support liftable set up in the base.
Preferably, the support includes the lead screw, the lead screw can set up in along self axial displacement ground in the base, be provided with worm gear mechanism on the base, worm gear of worm gear mechanism with the coaxial setting of lead screw, just the worm gear through its central screw with lead screw thread fit.
Preferably, the bracket is further provided with a guide rod parallel to the screw rod, and the guide rod is in sliding fit with the base.
Preferably, the CCD imager is arranged above the fixed clamp through a moving mechanism, the moving mechanism comprises a transverse moving mechanism and a longitudinal moving mechanism, the longitudinal moving mechanism comprises a longitudinal moving platform, a longitudinal slide rail and a longitudinal driving device are arranged on the longitudinal moving platform, the CCD imager is arranged on the longitudinal slide rail in a sliding way, and the CCD imager can move perpendicular to the relative movement direction of the first support and the second support under the driving of the longitudinal driving device, the transverse moving mechanism comprises a transverse sliding rail parallel to the relative moving direction of the first support and the second support and a transverse driving device arranged on the transverse sliding rail, the longitudinal moving platform is arranged on the transverse sliding rail in a sliding mode, and the transverse driving device is used for driving the longitudinal moving platform to move along the transverse sliding rail.
Preferably, still including being used for bearing the second load-bearing device who waits to detect the object, the second load-bearing device includes workstation, drive roller, third drive arrangement and spacing shelves, two the drive roller is parallel side by side, mutual interval and rotationally set up in the workstation, two the drive roller can be in synchronous rotation under third drive arrangement's the drive, it is a plurality of spacing shelves are followed drive roller length direction sets up in two with waiting to detect the object mutual interval the clearance of drive roller.
In order to achieve the above object, the utility model provides a multifunctional wafer cutting equipment detection device, including mounting fixture, CCD imager and display, wherein, mounting fixture includes relative setting and first support and the second support that can relatively move, is provided with rotatable first cooperation portion on the first support, is provided with rotatable second cooperation portion on the second support, first support and second support are close to each other and cooperate with the object to be detected through first cooperation portion and second cooperation portion respectively to make the object to be detected rotationally fix on mounting fixture; the CCD imager is used for shooting the surface image of the object to be detected and can be arranged above the fixed clamp in a reciprocating manner between the first support and the second support; the display is connected with the CCD imager and used for displaying the image shot by the CCD imager; when the detection device is applied, an object to be detected (a steel wire slot wheel shaft) is clamped between a first support and a second support, a CCD imager is used for shooting a surface image of the object to be detected, the shot image is amplified and displayed on a display so as to be convenient for a detector to observe, and after the local surface is detected, the detector can rotate the object to be detected to continue to detect the surfaces of other areas, so that the object to be detected is comprehensively detected; in conclusion, the multifunctional wafer cutting equipment detection device can rotatably fix the object to be detected, and acquire the surface image of the object to be detected through the imaging equipment, so that detection personnel can comprehensively check the surface of the object to be detected, perform preventive check on the reasons of abnormal wafer cutting and wire breakage and steel wire breakage, and take corresponding preventive and remedial measures to reduce the probability of wire breakage and the wafer loss.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an isometric view of a multifunctional wafer cutting device detection apparatus provided by an embodiment of the present invention;
fig. 2 is an isometric view of a first carrier according to an embodiment of the present invention;
fig. 3 is an isometric view of a second load bearing device provided by an embodiment of the present invention;
fig. 4 is a schematic view of an arrangement structure of a second carrying device according to an embodiment of the present invention.
In the figure:
1 is a first support; 2 is a first matching part; 3 is a second support; 4 is a second matching part; 5 is a first driving device; 501 is a motor; 502 is a reduction pulley set; 6 is a second driving device; 601 is a lead screw; 602 is a mounting seat; 603 is a hand-operated wheel; 7 is a CCD imager; 8 is a moving mechanism; 801 is a longitudinal slide rail; 802 is a longitudinal driving device; 803 is a longitudinal moving platform; 804 is a transverse driving device; 805 is a transverse slide rail; 9 is a first bearing device; 901 is a supporting roller; 902 is a bracket; 903 is a base; 904 is a guide rod; 905 is a screw rod; 906 is a worm gear mechanism; 10 is a second bearing device; 1001 is a workbench; 1002 is a driving roller; 1003 is a third driving device; 1004 is a limit gear; 100 is a steel wire groove wheel axle; 200 is a V-shaped wheel and a wire guide wheel.
Detailed Description
An object of the utility model is to provide a multi-functional wafer cutting equipment detection device, this multi-functional wafer cutting equipment detection device's structural design can detect roller bearing, copper wire appearance quality comprehensively effectively, reduces because the trench is unusual, the broken string phenomenon that defects such as line ball caused reduces the wafer loss.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, fig. 1 is an isometric view of a multifunctional wafer cutting device detection apparatus according to an embodiment of the present invention.
The embodiment of the utility model provides a pair of multi-functional wafer cutting equipment detection device, including mounting fixture, CCD imager 7 and display.
The fixing clamp comprises a first support 1 and a second support 3 which are arranged oppositely and can move relatively, a rotatable first matching part 2 is arranged on the first support 1, a rotatable second matching part 4 is arranged on the second support 3, and the first support 1 and the second support 3 are close to each other and are matched with an object to be detected respectively through the first matching part 2 and the second matching part 4 so that the object to be detected can be fixed on the fixing clamp in a rotating mode; the CCD imager 7 is used for shooting the surface image of the object to be detected, and the CCD imager 7 can be arranged above the fixed clamp in a reciprocating manner between the first support 1 and the second support 3; the display is connected with the CCD imager 7 and is used for displaying the image shot by the CCD imager 7.
Compared with the prior art, the utility model provides a multi-functional wafer cutting equipment detection device is when using, will wait to detect the object (steel wire chase shaft) clamping between first support 1 and second support 3, utilize CCD imager 7 to shoot the surface image of waiting to detect the object, and will shoot the image when enlargiing the demonstration on the display, so that the inspection personnel observes, after having detected local surface, the inspection personnel can rotate to wait to detect the object and continue to detect the surface of other regions, thereby realize treating the comprehensive detection of inspection object; in conclusion, the multifunctional wafer cutting equipment detection device can rotatably fix the object to be detected, and acquire the surface image of the object to be detected through the imaging equipment, so that detection personnel can comprehensively check the surface of the object to be detected, perform preventive check on the reasons of abnormal wafer cutting and wire breakage and steel wire breakage, and take corresponding preventive and remedial measures to reduce the probability of wire breakage and the wafer loss.
Preferably, the first support 1 is provided with a first driving device 5 for driving the first matching portion 2 to rotate, when in use, the first driving device 5 drives the first matching portion 2 to rotate, so as to drive the object to be detected to rotate, and one of the first support 1 and the second support 3 is provided with a second driving device 6 for driving the first support 1 and the second support 3 to move relatively, that is, the second driving device 6 may be disposed on the first support 1 or may be disposed on the second support 3.
Specifically, in the embodiment of the present invention, as shown in fig. 1, the first driving device 5 includes a motor 501 and a reduction pulley pair 502, a driving wheel of the reduction pulley pair 502 is connected to a rotating shaft of the motor 501, a driven wheel of the reduction pulley pair 502 is connected to the first matching portion 2, a belt of the reduction pulley pair 502 is respectively matched with the driving wheel and the driven wheel, of course, the first driving device 5 may also adopt a manually controlled structure, and the detecting person manually controls the rotation of the first matching portion 2.
The second driving device 6 is used for driving the second support 3 to move relative to the first support 1, the second driving device 6 specifically includes an installation base 602, a lead screw 601 and a hand wheel 603, the lead screw 601 is rotatably disposed on the installation base 602, one end of the lead screw 601 is connected with the hand wheel 603, the second support 3 is slidably disposed on the installation base 602 and the second support 3 is matched with the lead screw 601 through a screw hole at the bottom of the second support, the inspector rotates the lead screw 601 through the hand wheel 603 to drive the second support 3 to slide on the installation base 602 in a reciprocating manner, it should be noted that the above structure is only one of the feasible solutions of the second driving device 6 provided by the embodiment of the present invention, actually, but not limited thereto, the end of the lead screw 601 may be connected with a motor, or the second support 3 is directly connected with a piston cylinder, and the piston cylinder is used to drive the second support 3 to.
For making the image that CCD imager 7 was shot clear, be convenient for observe the embodiment of the utility model provides an in, still be provided with universal LED lamp on the mounting fixture, this universal LED lamp can illuminate and wait to detect the local surface that the object is located CCD imager 7 camera lenses down to improve the image clearness picture.
Furthermore, the universal LED lamp can emit strip-shaped light bands, and the strip-shaped light bands emitted by the universal LED lamp can irradiate the object to be detected along the length direction of the object to be detected by adjusting the universal LED lamp, so that the object to be detected can be observed conveniently.
The person skilled in the art easily understands that steel wire groove steel wire wheel axle models are different, and the size is different, and in order to improve the suitability of this multi-functional wafer cutting equipment detection device to different model steel wire groove wheel axles, first cooperation portion 2 and second cooperation portion 4 are constructed into the hole structure adapter piece of the shape of the toper of adaptable multiple aperture, cylindricality or toper and cylindricality combination, make multi-functional wafer cutting equipment detection device can the different model wire groove steel wire wheel axles of clamping.
Preferably, the steel wire chase axle has a heavy weight, and is difficult for the inspector to move, so that the inspector is not convenient to clamp the steel wire chase axle on the fixing fixture, and only the first support 1 and the second support 3 are used to fix the steel wire chase axle, and simultaneously the steel wire chase axle is required to rotate, so that the structure of the first support 1 and the second support 3 is required to be high, which easily causes the damage of the structure on the first support 1 and the second support 3, for this reason, in the embodiment of the present invention, the multifunctional wafer cutting device inspection apparatus further comprises a first bearing device 9 for bearing the object to be inspected, as shown in fig. 1 and 2, the first bearing device 9 is arranged between the first support 1 and the second support 3, the first bearing device 9 comprises a base 903, a support 902 and a support 901, the two support rollers 901 are arranged in parallel, side by side, spaced and rotatable on the support 902, the bracket 902 is arranged on the base 903 in a liftable manner, when the first bearing device 9 is used, a tester can place the bracket 902 at the lowest point, then place the steel wire raceway wheel shaft on two supporting rollers 901 of the bracket 902, then lift the bracket 902, make two ends of the steel wire raceway wheel shaft respectively align with the first matching part 2 and the second matching part 4, and then make the two supports approach each other to complete clamping.
Further, above-mentioned support 902 includes lead screw 905, and lead screw 905 can set up in base 903 along self axial displacement, is provided with worm gear mechanism 906 on the base 903, and worm gear and the coaxial setting of lead screw 905 of worm gear mechanism 906, and the worm wheel is through screw and the screw 905 screw-thread fit at its center, and the end connection of worm has hand wheel, and when using, only need rotate through hand wheel drive worm, can realize the lift of support 902, the operation of being convenient for.
Furthermore, the bracket 902 is further provided with a guide rod 904 parallel to the screw 905, and the guide rod 904 is slidably engaged with the base 903.
It is easily understood that, CCD imager 7 hardly encloses the lens with the local surface of steel wire raceway wheel axle in the whole length direction, and the great inconvenient removal of steel wire gyro wheel dead weight, therefore in the embodiment of the utility model, CCD imager 7 sets up above the mounting fixture through moving mechanism 8, moving mechanism 8 includes lateral shifting mechanism 8 and longitudinal movement mechanism 8, make CCD imager 7 can be at vertical direction and reciprocating motion between two supports, as shown in fig. 1, longitudinal movement mechanism 8 includes longitudinal movement platform 803, be provided with longitudinal slide rail 801 and longitudinal drive device 802 on longitudinal movement platform 803, CCD imager 7 slides and sets up in longitudinal slide rail 801, and CCD imager 7 can be perpendicular to first support 1 and the relative movement direction of second support 3 under the drive of longitudinal drive device 802 and move, lateral shifting mechanism 8 includes the lateral slide rail 805 parallel with first support 1 and the relative movement direction of second support 3 with the lateral slide rail 805 of first support 1 and the relative movement direction of second support 3 And a transverse driving device 804 disposed on the transverse sliding rail 805, wherein the longitudinal moving platform 803 is slidably disposed on the transverse sliding rail 805, the transverse driving device 804 is configured to drive the longitudinal moving platform 803 to move along the transverse sliding rail 805, and the longitudinal driving device 802 and the transverse driving device 804 may be of a manual structure or an automatic structure, which is not limited herein.
In addition to the steel wire chase wheel axle, the V-wheel, the wire guide wheel and other equipments are also indispensable equipments in the semiconductor crystal production, the V-wheel, the wire guide wheel are usually used in cooperation with the steel wire chase wheel axle, so it is also necessary to inspect the surface before use, in order to inspect the V-wheel, the wire guide wheel, the multifunctional wafer cutting equipment detection device further includes a second bearing device 10 for bearing the object to be detected (the V-wheel, the wire guide wheel), as shown in fig. 3 and 4, the second bearing device 10 includes a workbench 1001, a driving roller 1002, a third driving device 1003 and a limit stop 1004, the two driving rollers 1002 are parallel, side by side, spaced and rotatably disposed on the workbench 1001, the two driving rollers 1002 can synchronously rotate under the driving of the third driving device 1003, and the limit stop 1004 and the objects to be detected (the V-wheel, the wire guide wheel) are arranged along the length direction of the driving roller 1002, Wire guide wheels) are arranged at intervals between the two driving rollers 1002, when in use, the detected V-shaped wheel and the wire guide wheels are placed between the two adjacent limiting stops 1004, the driving rollers 1002 carry out limiting support on the detected V-shaped wheel and the wire guide wheels, meanwhile, the driving rollers 1002 drive the detected V-shaped wheel and the wire guide wheels to rotate, and the CCD imager 7 shoots the surface images of the detected V-shaped wheel and the wire guide wheels for inspection.
As shown in fig. 4, since the stage 1001 is used only for detecting a wheel body such as a V-wheel or a wire guide wheel in the present detection device, and cannot be used for detecting a wire chase wheel shaft, when detecting a wire chase wheel shaft, it is necessary to move the stage 1001 out of a detection position between two supports, and a plurality of universal wheels may be provided at the bottom of the stage 1001 in order to facilitate movement of the stage 1001.
As shown in fig. 3, in an embodiment of the present invention, the third driving device 1003 includes a motor, a driving wheel, a tensioning wheel, a belt, and two driven wheels, the driving wheel is disposed at the end of the motor, the two driven wheels are disposed at the ends of the two driving rollers 1002, the belt bypasses the driving wheel and the two driven wheels, and the tensioning wheel tensions the belt.
To sum up, the embodiment of the utility model provides a multi-functional wafer cutting equipment detection device can be to copper wire groove shaft, V type wheel, semiconductor polycrystal production facilities such as wire wheel carry out the preventive inspection before producing, with the emergence that reduces the broken string phenomenon, reduce the loss, except examining new copper wire groove shaft, V type wheel, the wire wheel, multi-functional wafer cutting equipment detection device can also return to the broken string when the copper wire broken string and contract, crackle or layering, mix with granule or impurity, whether it is unusual to have a pressure line at copper wire wheel winding's copper wire during the copper wire broken string, whether there is burr or damage on the copper wire wheel surface, the interior miscellaneous gallium arsenide of clamp of polyester wire wheel or indium phosphide piece etc. examine, the maintainer of being convenient for takes corresponding remedy measure.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A multifunctional wafer cutting equipment detection device is characterized by comprising:
the fixing clamp comprises a first support and a second support which are arranged oppositely and can move relatively, a rotatable first matching part is arranged on the first support, a rotatable second matching part is arranged on the second support, and the first support and the second support are close to each other and are matched with an object to be detected through the first matching part and the second matching part respectively so that the object to be detected can be rotatably fixed on the fixing clamp;
the CCD imager is used for shooting the surface image of the object to be detected and can be arranged above the fixed clamp in a reciprocating manner between the first support and the second support;
and the display is connected with the CCD imager and is used for displaying the image shot by the CCD imager.
2. The multifunctional wafer cutting device detecting apparatus as claimed in claim 1, wherein a first driving device for driving the first engaging portion to rotate is disposed on the first support, and a second driving device for driving the first support and the second support to move relatively is disposed on one of the first support and the second support.
3. The multifunctional wafer cutting device detecting device of claim 2, wherein the first driving device comprises a motor and a reduction pulley pair, a driving wheel of the reduction pulley pair is connected to a rotating shaft of the motor, a driven wheel of the reduction pulley pair is connected to the first matching portion, and a belt of the reduction pulley pair is matched with the driving wheel and the driven wheel respectively;
the second driving device comprises a mounting seat, a lead screw and a hand-operated wheel, the lead screw is rotatably arranged on the mounting seat, one end of the lead screw is connected with the hand-operated wheel, and the second support is slidably arranged on the mounting seat, and is matched with the lead screw through a screw hole in the bottom of the second support.
4. The multifunctional wafer cutting device detection apparatus as claimed in any one of claims 1 to 3, wherein a universal LED lamp is further disposed on the fixing clamp.
5. The multifunctional wafer dicing apparatus inspection device of any one of claims 1-3, wherein the first engagement portion and the second engagement portion are configured as female structural adapters that can fit shapes of taper, cylinder, or a combination of both of a variety of apertures.
6. The multifunctional wafer cutting device detection device according to any one of claims 1 to 3, further comprising a first bearing device for bearing the object to be detected, wherein the first bearing device is arranged between the first support and the second support, the first bearing device comprises a base, a support and two supporting rollers, the two supporting rollers are parallel, side by side, spaced from each other and rotatably arranged on the support, and the support is arranged on the base in a liftable manner.
7. The device for detecting the multifunctional wafer cutting equipment according to claim 6, wherein the bracket comprises a screw rod, the screw rod is arranged on the base in a manner of moving along the axial direction of the screw rod, a worm gear mechanism is arranged on the base, a worm wheel of the worm gear mechanism is coaxially arranged with the screw rod, and the worm wheel is in threaded fit with the screw rod through a screw hole in the center of the worm wheel.
8. The multifunctional wafer cutting device detecting apparatus as claimed in claim 7, wherein a guide bar parallel to the lead screw is further disposed on the bracket, and the guide bar is slidably engaged with the base.
9. The multifunctional wafer cutting device detecting apparatus of any one of claims 1 to 3 and 7 to 8, wherein the CCD imager is disposed above the fixing clamp through a moving mechanism, the moving mechanism comprises a transverse moving mechanism and a longitudinal moving mechanism, the longitudinal moving mechanism comprises a longitudinal moving platform, a longitudinal slide rail and a longitudinal driving device are disposed on the longitudinal moving platform, the CCD imager is slidably disposed on the longitudinal slide rail, the CCD imager can move perpendicular to the relative moving direction of the first support and the second support under the driving of the longitudinal driving device, the transverse moving mechanism comprises a transverse slide rail parallel to the relative moving direction of the first support and the second support, and a transverse driving device disposed on the transverse slide rail, the longitudinal moving platform is arranged on the transverse sliding rail in a sliding mode, and the transverse driving device is used for driving the longitudinal moving platform to move along the transverse sliding rail.
10. The multifunctional wafer cutting equipment detection device according to any one of claims 1-3 and 7-8, further comprising a second bearing device for bearing an object to be detected, wherein the second bearing device comprises a workbench, two driving rollers, a third driving device and a limiting stop, the two driving rollers are parallel, side by side, spaced from each other and rotatably disposed on the workbench, the two driving rollers can be driven by the third driving device to rotate synchronously, and the limiting stop and the object to be detected are disposed at a gap between the two driving rollers at a distance from each other along the length direction of the driving rollers.
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| CN201921013374.1U CN210572029U (en) | 2019-06-29 | 2019-06-29 | Multifunctional wafer cutting equipment detection device |
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| CN201921013374.1U CN210572029U (en) | 2019-06-29 | 2019-06-29 | Multifunctional wafer cutting equipment detection device |
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| CN210572029U true CN210572029U (en) | 2020-05-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110146518A (en) * | 2019-06-29 | 2019-08-20 | 广东先导先进材料股份有限公司 | A kind of multiple-function chip cutting equipment detection device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110146518A (en) * | 2019-06-29 | 2019-08-20 | 广东先导先进材料股份有限公司 | A kind of multiple-function chip cutting equipment detection device |
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Assignee: Guangdong lead Microelectronics Technology Co.,Ltd. Assignor: FIRST SEMICONDUCTOR MATERIALS Co.,Ltd. Contract record no.: X2023990000449 Denomination of utility model: A multifunctional chip cutting equipment detection device Granted publication date: 20200519 License type: Common License Record date: 20230505 |