CN210548911U - Same-light-source double-galvanometer picosecond laser galvanometer equipment - Google Patents
Same-light-source double-galvanometer picosecond laser galvanometer equipment Download PDFInfo
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- CN210548911U CN210548911U CN201920518472.4U CN201920518472U CN210548911U CN 210548911 U CN210548911 U CN 210548911U CN 201920518472 U CN201920518472 U CN 201920518472U CN 210548911 U CN210548911 U CN 210548911U
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Abstract
The utility model discloses a same-light-source double-vibrating-mirror picosecond laser vibrating mirror device, which comprises a frame, a marble base, a power distribution cabinet, a control system, a display system, a gating mechanism, an outer cover component, a vacuum generator, a vacuum adsorption system, an XYZ-axis moving system, a laser, an optical path integration, a vibrating mirror and a telecentric variable focusing mirror; the marble base is formed by integrating a base, a vertical seat and a top seat, and is sequentially provided with a Y-axis moving system, an X-axis moving system, two Z-axis moving systems and a vacuum adsorption system; the telecentric variable focusing lens and the vibrating lens are coaxially arranged; the distances between the axes are consistent; the laser is a picosecond laser generating device. The utility model ensures the consistency of product quality with the light source; the marble base adopts an integrated structure, and realizes high-precision curve cutting, punching, grooving and edge grinding by matching a galvanometer with a telecentric variable focusing lens; the processing precision, the product quality and the production efficiency are improved; the process has good adaptability and remarkable practical effect.
Description
Technical Field
The invention relates to laser processing equipment, in particular to picosecond laser galvanometer precision equipment, and mainly relates to the technical field of precision cutting equipment for cutting glass.
Background
At present, glass products are used in various fields in the aspect of daily life, and the demand is large. The cutting and processing of corresponding different glass materials also has a great deal of market demands.
With the development of the technology, the cutting method of glass is also continuously updated, and at present, the cutting method mainly uses a laser cutting process method, and has many advantages compared with the traditional mechanical cutting method, and the cutting method mainly comprises several cutting methods such as fusion cutting, stress cutting (crack control method), ablation (ablation) cutting and the like. (1) The laser power required by the fusion cutting method is high, the cutting size is difficult to control accurately, the cutting surface is rough, and the processing quality needs to be improved. (2) The stress cutting method cannot solve the problem of curved surface and special-shaped cutting. (3) The cutting speed of laser ablation (ablation) is relatively slow, and the processing efficiency is not high.
With the increasing market demand for glass curve cutting, especially in the mobile phone manufacturing industry, manufacturers desire to produce screens with more complex geometries, including punching holes in the material to accommodate keys, controls, LEDs, and camera lenses; meanwhile, the processing thickness of the glass such as a mobile phone touch screen, a cover plate, a display panel and the like ranges from 0.03mm to more than 20 mm; the glass materials are also different: some glasses have been chemically strengthened. Therefore, the processing precision of the existing glass for cutting various curved surfaces and special shapes such as curve cutting, punching, grooving, bending, edge grinding and the like is more and more required. The existing laser equipment for cutting glass has a single marble base structure, and the structure of the marble base cannot meet the requirements of strength and stability; meanwhile, the galvanometer system is usually arranged on a movable Y-axis or Z-axis motion platform, so that the high-precision requirements of the glass on the aspects of cutting contour, cutting precision, processing efficiency, cutting cracks, cutting strength, process adaptability and the like cannot be comprehensively met, and the method has great limitation.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the problems and the defects in the prior art, the invention aims to provide the same-light-source double-galvanometer picosecond laser galvanometer equipment which is stable in structure, strong in technological adaptability, high in cutting precision and high in production efficiency.
The technical scheme is as follows: in order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a with two mirror picosecond laser mirror equipment that shakes of light source, includes frame, marble base, switch board, control system, display system, gate mechanism, dustcoat subassembly, vacuum generator, vacuum adsorption system, X axle moving system, Y axle moving system, Z axle moving system, still includes: the device comprises a laser, an optical path integration, a vibrating mirror and a telecentric variable focusing mirror; the left side and the right side above the rack are provided with power distribution cabinets, and a marble base is arranged in the middle of the power distribution cabinets; the marble base is integrally formed by a base, a left vertical seat, a right vertical seat and a top seat, the left vertical seat and the right vertical seat are arranged at the left part and the right part of the rear end of the base, and the strip-shaped top seat is arranged on the front ends of the left vertical seat and the right vertical seat;
a Y-axis moving system is arranged on the base, an X-axis moving system is arranged above the Y-axis moving system, and two Z-axis moving systems are arranged on the X-axis moving system in parallel; a vacuum adsorption system is arranged above the Z-axis moving system; the vacuum adsorption system is connected with the vacuum generator;
the optical path integration is a system which divides laser emitted from a laser into two optical paths with the same light source through a light splitting crystal, the system is arranged on a top seat, the rear end of the system is connected with the laser, the front end of the system is connected with two vibrating mirrors which are arranged in parallel along the X-axis direction, a telecentric variable focusing mirror is arranged below the vibrating mirrors, and the telecentric variable focusing mirror and the vibrating mirrors are coaxially arranged; the distance between the axes of the two galvanometers is consistent with the distance between the centers of the two Z-axis moving systems; a visual positioning system is arranged on the front side surface of the top seat outside the right galvanometer; the laser is a picosecond laser generating device.
The optical path integration comprises an optical path bottom plate, an optical path sealing plate, a reflector base, a beam splitter crystal, a split crystal base, a beam expander and a beam expander support; the light path bottom plate is provided with grooves which are intersected vertically and horizontally and are mutually vertical; the reflector base and the split crystal base are both arranged in a groove on a light path line; the reflecting mirrors are arranged on the reflecting mirror base, the first group of reflecting mirrors reflect the laser emitted from the laser by 90 degrees and project the laser onto the second group of reflecting mirrors, and the second group of reflecting mirrors reflect the laser by 90 degrees to the light splitting crystal; the light splitting crystal is arranged on the split crystal base and is arranged behind the group of beam expanders; the beam splitting crystal splits laser into two light paths, one light path directly passes through the beam expanding lens to the vibrating mirror at the front end, and the other light path passes through the third group of reflectors, is reflected to the other group of beam expanding lenses and then to the vibrating mirror at the front end. Therefore, the laser of the double-vibrating mirror comes from the same light source, the power is the same, the same quality of products under the double-vibrating mirror can be processed at the same time, and the consistency of double-vibrating mirror double-station processed products is guaranteed. The special design of the groove can be used for quickly positioning the light path, and the accurate angle positioning of the light path can be realized from the process machining angle by matching with the installation and positioning of the base; the adjustment and the replacement are also very convenient.
Specifically, the Y-axis moving system includes: the Y-axis travel limiting device comprises two movable guide rails, a Y-axis movable platform and a Y-axis driving motor, wherein Y-axis travel limiting strips are arranged at the front end and the rear end of a base; the X-axis moving system includes: the X-axis travel limiting device comprises an X-axis fixed platform, two X-axis moving guide rails, an X-axis driving motor and an X-axis moving platform, wherein the X-axis fixed platform is fixedly connected to the Y-axis moving platform, the X-axis moving guide rails and the X-axis moving platform are sequentially arranged on the X-axis fixed platform, and X-axis travel limiting strips are arranged on the left side and the right side of the X-axis moving platform; the Z-axis moving system is arranged on the X-axis moving platform and comprises a Z-axis driving device and a lifting platform.
Preferably, the Y-axis driving motor and the X-axis driving motor are both arranged at the rear end of the base.
Preferably, the vertical seat is provided with a hollow structure, and the vacuum generator is installed in the hollow structure.
Optimized, the frame is the metal structure of boss formula structure, and the marble base is installed on middle boss, and the switch board setting is in the low platform department of left and right sides. The whole height and size of the equipment can be effectively reduced by the arrangement, and the structure is more compact and reasonable.
Has the advantages that: compared with the prior art, the picosecond laser galvanometer equipment with the same light source and double galvanometers has the same power as the double galvanometers with the same light source laser, so that the consistency of the product quality is guaranteed; the marble base adopts an integrated structure, an Y, X, Z-axis moving system of the whole equipment is sequentially overlapped and arranged from bottom to top, a galvanometer optical path is integrated and is also arranged on a top seat of the marble base, the requirements of strength and stability are met structurally, and the high-precision curve cutting, punching, grooving and edging of various materials of glass including tempered glass are realized by matching the galvanometer with a telecentric variable focusing lens; the processing precision, the product quality and the production efficiency are improved; the process has good adaptability, and is particularly suitable for the precision processing of glass laser in the electronic industry; has obvious practical effect.
Drawings
FIG. 1 is a structural layout of the major components of the present invention;
FIG. 2 is a schematic view of the overall structure of the present invention;
FIG. 3 is a schematic view of a partial structure of the present invention;
FIG. 4 is a perspective view of the structure layout of the optical integrated circuit of the present invention;
fig. 5 is a top view of the structure layout of the optical circuit integration part in the present invention.
Wherein: 1 power distribution cabinet, 2 lasers, 3 optical path integration, 4 marble bases, 5Y-axis moving systems, 6X-axis moving systems (an X-axis fixed platform 61, an X-axis moving guide rail 62, an X-axis moving platform 64 and an X-axis stroke limit strip 63), 7Z-axis moving systems, 8 vision positioning systems, 9 galvanometers, 10 telecentric variable focusing mirrors, 11 racks, 12 vacuum generators, 13 vacuum adsorption systems, 14 door control mechanisms, 15 outer cover assemblies, 16 control systems and 17 display systems;
in optical circuit integration 3: a 31 optical path bottom plate, a 32 optical path closing plate, a 33 reflector, a 34 reflector base, a 35 beam splitter crystal, a 36 beam splitter crystal base, a 37 beam expander and a 38 beam expander support;
in a 4 marble base: 41 base, 42 vertical base and 43 top base;
in a 5Y-axis motion system: 51 moving guide rails, 52 moving platforms and 53Y-axis stroke limit strips;
in a 6X axis movement system: the device comprises a 61X-axis fixed platform, a 62X-axis movable guide rail, a 64X-axis movable platform and a 63X-axis stroke limit strip.
Detailed Description
The present invention is further illustrated by the following figures and specific examples, which are to be understood as illustrative only and not as limiting the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalent modifications thereof which may occur to those skilled in the art upon reading the present specification.
As shown in fig. 1, fig. 2 and fig. 3, a picosecond laser galvanometer device with a light source and double galvanometers comprises a rack 11, a marble base 4, a power distribution cabinet 1, a control system 16, a display system 17, a door control mechanism 14, an outer cover assembly 15, a vacuum generator 12, a vacuum adsorption system 13, an X-axis moving system 6, a Y-axis moving system 5 and a Z-axis moving system 7, and further comprises: the device comprises a laser 2, an optical path integration 3, a vibrating mirror 9 and a telecentric variable focusing mirror 10; the left side and the right side above the rack 11 are provided with power distribution cabinets 1, and a marble base 4 is arranged in the middle; the marble base 4 is composed of a base 41, a left vertical seat 42, a right vertical seat 42 and a top seat 43, wherein the left vertical seat 42 and the right vertical seat 42 are arranged at the left and right positions of the rear end of the base 41, and the strip-shaped top seat 43 is arranged on the front ends of the left vertical seat 42 and the right vertical seat 42; the setting of this of the integration structure mode of marble base can be about standing the seat and the firm connection of footstock on the base, ensures that other equipment part installation that use this as the installation benchmark is firm, satisfies the requirement of equipment intensity and stability, has promoted the machining precision.
A Y-axis moving system 5 is arranged on the base 41, an X-axis moving system 6 is arranged above the Y-axis moving system 5, and two Z-axis moving systems 7 are arranged on the X-axis moving system 6 in parallel; a vacuum adsorption system 13 is arranged above the Z-axis moving system 7; the vacuum adsorption system 13 is connected with the vacuum generator 12; due to the arrangement, X, Y, Z three-direction operation of the machined workpiece is all set on the motion reference of the Y-axis platform, and the cutting precision of the machined workpiece is greatly improved.
The optical path integration 3 is a system which divides laser emitted from a laser into two optical paths of the same light source through a light splitting crystal, and is arranged on the top seat 43, the rear end of the system is connected with the laser 2, the front end of the system is connected with two vibrating mirrors 9 which are arranged in parallel along the X-axis direction, a telecentric variable focusing mirror 10 is arranged below the vibrating mirrors 9, and the telecentric variable focusing mirror 10 and the vibrating mirrors 9 are coaxially arranged; the distance between the axes of the two vibrating mirrors 9 is consistent with the distance between the centers of the two Z-axis moving systems 7; a visual positioning system 8 is arranged on the front side surface of the top seat outside the right vibrating mirror 9; the laser 2 is a picosecond laser generator. The optical path integration of the galvanometer is installed on the fixed top seat, the optical path integration is firm and stable, and the cutting operation of relative motion is realized through the laser immobilization of the galvanometer and the movement of a processing workpiece.
As shown in fig. 4 and 5, the optical circuit assembly 3 includes an optical circuit base plate 31, an optical circuit closing plate 32, a reflector 33, a reflector base 34, a beam splitter crystal 35, a split crystal base 36, a beam expander 37, and a beam expander support 38; grooves which are intersected vertically and horizontally and are mutually vertical are arranged on the light path bottom plate 31; the reflector base 34 and the split crystal base 36 are both arranged in a groove on the optical path; the reflecting mirror 33 is installed on the reflecting mirror base 34, the first group of reflecting mirrors 33 reflect the laser emitted from the laser by 90 degrees to project on the second group of reflecting mirrors 33, and the second group of reflecting mirrors 33 reflect the laser by 90 degrees to the light splitting crystal; the light splitting crystal 35 is arranged on the split crystal base 36 and is arranged behind the group of beam expanders 37; the beam splitting crystal 35 splits the laser light into two optical paths, one optical path directly passes through the beam expander 37 to the front vibrating mirror 9, and the other optical path passes through the third set of reflector 33, and is reflected to the other set of beam expander 37 to the front vibrating mirror 9. Therefore, the laser of the double-vibrating mirror comes from the same light source, the power is the same, the same quality of products under the double-vibrating mirror can be processed at the same time, and the consistency of double-vibrating mirror double-station processed products is guaranteed. The special design of the groove can be used for quickly positioning the light path, and the accurate angle positioning of the light path can be realized from the process machining angle by matching with the installation and positioning of the base; the adjustment and the replacement are also very convenient.
As shown in fig. 3: specifically, the Y-axis moving system 5 includes: the device comprises two movable guide rails 51, a Y-axis movable platform 52 and a Y-axis driving motor, wherein Y-axis stroke limit strips 53 are arranged at the front end and the rear end of a base 41; an X-axis movement system 6, comprising: the X-axis travel limiting device comprises an X-axis fixing platform 61, two X-axis moving guide rails 62, an X-axis driving motor and an X-axis moving platform 64, wherein the X-axis fixing platform 61 is fixedly connected to a Y-axis moving platform 52, the X-axis moving guide rails 62 and the X-axis moving platform 64 are sequentially arranged on the X-axis fixing platform 61, and X-axis travel limiting strips 63 are arranged on the left side and the right side of the X-axis moving platform 64; the Z-axis moving system 7 is arranged on the X-axis moving platform 64 and comprises a Z-axis driving device and a lifting platform.
Preferably, the Y-axis driving motor and the X-axis driving motor are both disposed at the rear end of the base 41.
Preferably, the stand 42 is provided with a hollow structure in which the vacuum generator 12 is mounted.
Optimized, frame 11 is boss formula structure metal structure, and marble base 4 is installed on middle boss, and switch board 1 sets up in the low platform department of the left and right sides. The whole height and size of the equipment can be effectively reduced by the arrangement, and the structure is more compact and reasonable.
The vacuum adsorption system is a small adsorption platform with a cavity inside, the upper surface of the vacuum adsorption system is provided with a plurality of small holes communicated with the cavity, the side surface or the lower part of the vacuum adsorption system is provided with a plurality of through holes communicated with the cavity, and at least one through hole is connected with the vacuum generator. When the precision glass product is processed, the workpiece is adsorbed on the adsorption platform, and the processing is finished.
In order to ensure the processing precision, the left and right vibrating mirrors are positioned on the axis in the same X direction, and the front-back distance deviation is adjusted to be within a smaller deviation range after the alignment detection is carried out by the visual positioning system, so that the processing quality and the precision of the glass processing piece on the left and right vacuum adsorption systems can be ensured to be consistent.
According to the picosecond laser galvanometer equipment with the same light source and double galvanometers, Y, X, Z shaft moving systems of the whole equipment are sequentially overlapped and arranged from bottom to top, the moving systems with three dimensions are novel and compact in structural arrangement and are suitable for laser processing of small glass products with high-precision processing requirements, a running platform with two dimensions is formed by combining Y, X shaft moving systems, and processing requirements such as curve cutting, bending and edge grinding can be met at will; on the basis of the operation platform with two dimensions, after a Z-axis moving system is added, the combined motion of the three-dimension motion platform can realize the high-precision processing of punching, grooving and the like in glass cutting, and the processing requirements of glass materials with different depths and different thicknesses can be met by moving up and down through the interval staggered layer embedded processing.
Meanwhile, a laser optical path system consisting of a laser, an optical path integration, a vibrating mirror and a telecentric variable focusing mirror is fixed in the installation position, so that the focusing influence caused by movement or vibration or installation errors of installation and fixation parts is avoided, and the focusing stability and continuity are good; the vibrating mirror and the high-precision telecentric variable focusing mirror are coaxially combined, so that the obtained focusing light spot is smaller, and the high-precision processing requirement can be met. (1) Laser output of the same optical path and the same cutting head for picosecond stress cutting and ablation cutting is realized by matching a galvanometer with a telecentric variable focusing lens; (2) the glass is punched, grooved and even edged by ablation cutting; (3) the curved surface profile, the cutting precision, the processing efficiency and the cutting strength are greatly improved through the vibrating mirror and the stress cutting; (4) through the mode of interval staggered layer embedding, realize deep glass processing, let glass separate easily, and the crackle is very little. The problems of the prior art such as precision and strength of the existing melt cutting, edging and deslagging after processing and the like are comprehensively solved; the technical problems that the stress cutting cannot be used for punching, grooving and cutting on a curved surface are solved; and simultaneously, the problem of low efficiency of the laser ablation cutting equipment is solved. The invention can realize high-precision curve cutting, punching, grooving and edging of various materials of glass from 0.03mm to 20mm, including tempered glass.
The picosecond laser galvanometer equipment with the same light source and double galvanometers has the same power as the double galvanometers with the same light source laser, and ensures the consistency of product quality; the marble base adopts an integrated structure, an Y, X, Z-axis moving system of the whole equipment is sequentially overlapped and arranged from bottom to top, a galvanometer optical path is integrated and is also arranged on a top seat of the marble base, the requirements of strength and stability are met structurally, and the high-precision curve cutting, punching, grooving and edging of various materials of glass including tempered glass are realized by matching the galvanometer with a telecentric variable focusing lens; the processing precision, the product quality and the production efficiency are improved; the process has good adaptability, and is particularly suitable for the precision processing of glass laser in the electronic industry; has obvious practical effect.
Claims (6)
1. The utility model provides a with two galvanometer picosecond laser galvanometer equipment of light source, includes frame (11), marble base (4), switch board (1), control system (16), display system (17), gating mechanism (14), dustcoat subassembly (15), vacuum generator (12), vacuum adsorption system (13), X axle moving system (6), Y axle moving system (5), Z axle moving system (7), its characterized in that: the device also comprises a laser (2), an optical path integration (3), a galvanometer (9) and a telecentric variable focusing lens (10); the power distribution cabinets (1) are arranged on the left side and the right side above the rack (11), and the marble bases (4) are arranged in the middle of the power distribution cabinets; the marble base (4) is integrally composed of a base (41), a left vertical seat (42), a right vertical seat (42) and a top seat (43), the left vertical seat and the right vertical seat (42) are arranged at the left and right positions of the rear end of the base (41), and the strip-shaped top seat (43) is arranged on the front ends of the left vertical seat and the right vertical seat (42);
a Y-axis moving system (5) is arranged on the base (41), an X-axis moving system (6) is arranged above the Y-axis moving system (5), and two Z-axis moving systems (7) are arranged on the X-axis moving system (6) in parallel; a vacuum adsorption system (13) is arranged above the Z-axis moving system (7); the vacuum adsorption system (13) is connected with the vacuum generator (12);
the optical path integration (3) is a system which divides laser emitted from a laser into two optical paths of the same light source through a light splitting crystal, and is arranged on a top seat (43), the rear end of the optical path integration is connected with the laser (2), the front end of the optical path integration is connected with two vibrating mirrors (9) which are arranged in parallel along the X-axis direction, a telecentric variable focusing mirror (10) is arranged below the vibrating mirrors (9), and the telecentric variable focusing mirror (10) and the vibrating mirrors (9) are arranged coaxially; the distance between the axes of the two galvanometers (9) is consistent with the distance between the centers of the two Z-axis moving systems (7); a visual positioning system (8) is arranged on the front side surface of the top seat outside the right galvanometer (9); the laser (2) is a picosecond laser generating device.
2. The picosecond laser galvanometer device with a light source and a double galvanometer according to claim 1, wherein: the optical path assembly (3) comprises an optical path bottom plate (31), an optical path sealing plate (32), a reflector (33), a reflector base (34), a beam splitter crystal (35), a split crystal base (36), a beam expander (37) and a beam expander bracket (38); grooves which are intersected vertically and horizontally and are mutually vertical are arranged on the light path bottom plate (31); the reflector base (34) and the split crystal base (36) are both arranged in a groove on an optical path; the reflecting mirror (33) is arranged on the reflecting mirror base (34), the first group of reflecting mirrors (33) reflect the laser emitted from the laser by 90 degrees and project the laser onto the second group of reflecting mirrors (33), and the second group of reflecting mirrors (33) reflect the laser by 90 degrees to the light splitting crystal (35); the light splitting crystal (35) is arranged on the split crystal base (36) and is arranged behind the group of beam expanders 37; the laser is split into two light paths by the light splitting crystal (35), one light path directly passes through the beam expander (37) to the vibrating mirror (9) at the front end, and the other light path passes through the third group of reflectors (33) and is reflected to the other group of beam expanders (37) and then to the vibrating mirror (9) at the front end.
3. The picosecond laser galvanometer device with a light source and a double galvanometer according to claim 1, wherein: the Y-axis movement system (5) comprises: the Y-axis travel limiting device comprises two movable guide rails (51), a Y-axis movable platform (52) and a Y-axis driving motor, wherein Y-axis travel limiting strips (53) are arranged at the front end and the rear end of a base (41); the X-axis movement system (6) comprising: the X-axis travel limiting device comprises an X-axis fixing platform (61), two X-axis moving guide rails (62), an X-axis driving motor and an X-axis moving platform (64), wherein the X-axis fixing platform (61) is fixedly connected to the Y-axis moving platform (52), the X-axis moving guide rails (62) and the X-axis moving platform (64) are sequentially arranged on the X-axis fixing platform (61), and X-axis travel limiting strips (63) are arranged on the left side and the right side of the X-axis moving platform; the Z-axis moving system (7) is arranged on the X-axis moving platform (64) and comprises a Z-axis driving device and a lifting platform.
4. The picosecond laser galvanometer device with a light source and a double galvanometer according to claim 3, wherein: the Y-axis driving motor and the X-axis driving motor are both arranged at the rear end of the base (41).
5. The picosecond laser galvanometer device with a light source and a double galvanometer according to claim 1, wherein: the vertical seat (42) is provided with a hollow structure, and the vacuum generator (12) is installed in the hollow structure.
6. The picosecond laser galvanometer device with a light source and a double galvanometer according to claim 1, wherein: frame (11) are the metallic structure spare of boss formula structure, and marble base (4) are installed on middle boss, and switch board (1) sets up in the low platform department of the left and right sides.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920518472.4U CN210548911U (en) | 2019-04-17 | 2019-04-17 | Same-light-source double-galvanometer picosecond laser galvanometer equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920518472.4U CN210548911U (en) | 2019-04-17 | 2019-04-17 | Same-light-source double-galvanometer picosecond laser galvanometer equipment |
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| CN210548911U true CN210548911U (en) | 2020-05-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114986349A (en) * | 2022-06-01 | 2022-09-02 | 成都迈锐捷激光技术有限公司 | Laser-assisted grinding device |
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2019
- 2019-04-17 CN CN201920518472.4U patent/CN210548911U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114986349A (en) * | 2022-06-01 | 2022-09-02 | 成都迈锐捷激光技术有限公司 | Laser-assisted grinding device |
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