CN210535691U

CN210535691U - COB packaging equipment

Info

Publication number: CN210535691U
Application number: CN201921327416.9U
Authority: CN
Inventors: 李蕾; 苏佳槟
Original assignee: Guangzhou Ledteen Optoelectronics Co ltd
Current assignee: Silicon Energy Photoelectric Semiconductor Guangzhou Co ltd
Priority date: 2019-08-14
Filing date: 2019-08-14
Publication date: 2020-05-15
Anticipated expiration: 2029-08-14

Abstract

The utility model discloses a COB encapsulation equipment, include: at least one layer of working units; the single-layer working unit comprises: the device comprises a horizontal platform, a horizontal sensor, an electric lifting rod and an ultrasonic generator; the horizontal plate platform is used for placing a COB plate; the horizontal sensor is used for detecting the levelness of the horizontal plate platform; the plurality of electric lifting rods are fixedly arranged at the bottom of the horizontal platform; the ultrasonic generator is arranged on the horizontal platform and used for emitting high-frequency sound wave to vibrate the fluorescent glue; the levelness controller is in signal connection with the level sensor; the levelness controller is connected with the electric lifting rod through signals to drive the electric lifting rod to move. The utility model discloses utilize supersonic generator's high frequency sound wave to vibrate the phosphor powder granule in the dispersion fluorescent glue, phosphor powder granule evenly distributed with higher speed has solved the phosphor powder and has subsided the uneven problem of thickness distribution at LED chip and substrate surface, and the photochromic that makes the COB light source send is even, has improved the quality of COB light source.

Description

COB packaging equipment

Technical Field

The utility model relates to a light source lighting technology field, concretely relates to COB encapsulation equipment.

Background

COB packaging is full-name chip on Board packaging (Chips on Board), is a packaging technology of directly binding LED Chips on a PCB, specifically is directly packaging a plurality of LED Chips on a metal base printed circuit Board, directly radiating through a substrate as a lighting module, not only reducing the manufacturing process and cost of a support, but also having the advantage of reducing heat resistance, and therefore becoming a packaging mode mainly pushed by lighting enterprises.

At present, the mainstream COB packaging glue dispensing process is to mix fluorescent powder and encapsulation silica gel to form fluorescent glue, then coat the surface of an LED chip in a glue extruding mode, and the LED chip can excite the fluorescent powder to generate light and can emit light to form mixed white light.

After the dispensing process is finished, the fluorescent glue can be spread on the whole light-emitting surface only after flowing on the printed circuit board fixed with the LED chip for a period of time; however, due to the influence of various factors such as the arrangement of the LED chips, the viscosity degree of the fluorescent glue, the sedimentation velocity of the fluorescent powder in the fluorescent glue, the standing time after dispensing, and the like, most of the sedimentation thicknesses of the fluorescent powder on the substrate and the chips are not uniformly distributed, so that the light emitted by the COB light source is partially yellowish or bluish, and in addition, the transmission and scattering of the package housing itself cause the uneven light color of the COB light source to be more obvious. And the thicker position of the fluorescent powder is easy to generate temperature singularity, so that the reliability of the product is greatly influenced.

In order to solve the problem of uneven distribution of the sedimentation thickness of the fluorescent powder, some new COB packaging modes are also developed in the industry, for example: preparing a fluorescent powder film, spraying fluorescent powder on the surface of the LED chip, naturally settling the fluorescent powder and the like. Although the above three packaging modes can meet the requirements of customers on the performance parameters of the products, they cannot achieve the low cost and high productivity sought by the packaging manufacturers. Specifically, new equipment needs to be introduced for preparing the fluorescent powder film and adopting a spraying technology, the requirement on the precision of the equipment is high, the product yield is greatly influenced if the fluorescent powder layer has thickness difference, and the production cost and the quality cost are high; the fluorescent powder natural sedimentation mode does not need to introduce extra production equipment, but the production process is complicated, the production period is long, a large amount of experiments are needed to determine the dispensing amount of each product, and the controllability of the production yield is poor.

Therefore, how to solve the problems of uneven light color and poor reliability of the COB light source caused by uneven distribution of the sedimentation thickness of the fluorescent powder, reduce the influence of viscosity change on the position distribution of the fluorescent powder in the curing process, and control the light color difference among COB light source batches, thereby improving the light source quality is a technical problem to be solved in the LED packaging industry.

SUMMERY OF THE UTILITY MODEL

For overcoming the not enough of prior art, the utility model aims to provide a COB packaging apparatus, its levelness that can pass through adjusting device and through ultrasonic oscillation messenger phosphor powder's more even law of particle distribution, avoid phosphor powder at base plate and the uneven phenomenon of chip surface thickness distribution, improve COB light source quality.

The utility model discloses a following technical scheme realizes:

a COB encapsulation apparatus, comprising: at least one layer of working units; the working unit of a single layer includes: the device comprises a horizontal platform, a horizontal sensor, an electric lifting rod and an ultrasonic generator; the horizontal plate platform is used for placing a COB plate; the horizontal sensor is fixedly arranged in the horizontal platform to detect the levelness of the horizontal platform; the plurality of electric lifting rods are fixedly arranged at the bottom of the horizontal plate platform; the ultrasonic generator is arranged on the horizontal platform and used for emitting high-frequency sound waves to vibrate the fluorescent glue on the COB; the levelness controller is in signal connection with the level sensor to receive a levelness signal; the levelness controller is in signal connection with each electric lifting rod and drives the electric lifting rods to move according to the levelness signals so as to regulate and control the levelness of the horizontal platform.

Further, the working unit also comprises a far infrared reflow oven; the far infrared reflow furnace is arranged above the horizontal plate table to emit radiation to cure the fluorescent glue in a segmented manner.

Further, the COB packaging apparatus further includes a timer; the timer is electrically connected with the ultrasonic generator so as to control the working state of the ultrasonic generator; the timer is also electrically connected with the far infrared reflow oven so as to control the working time of the far infrared reflow oven.

Further, the COB packaging equipment further comprises an alarm; the alarm is in signal connection with the timer, and the alarm selects whether to send out an alarm signal according to the received signal of the timer.

Further, the working unit also comprises an equipment outer box; the horizontal platform ultrasonic generator level sensor is all fixed to be set up in the equipment outer container, the far infrared reflow oven is fixed to be set up upper portion in the equipment outer container, electric lift rod is fixed to be set up the bottom of equipment outer container, the fixed setting of levelness control appearance is in the outside of equipment outer container.

Furthermore, the number of the electric lifting rods is 4, and the electric lifting rods are respectively arranged at the four corners of the horizontal plate platform.

Further, the COB packaging apparatus includes a plurality of layers of the work units; the working units are arranged on high and low floors, and the electric lifting rod on the high floor is arranged on the top of the equipment outer box on the adjacent low floor.

Compared with the prior art, the utility model discloses the beneficial effect that can reach does: the levelness of the horizontal plate table is detected through the level sensor, and the electric lifting rod is driven to do lifting motion through the levelness controller, so that the levelness condition of the horizontal plate table is monitored in real time and accurately regulated, and the condition that fluorescent powder is unevenly distributed due to the fact that human factors shake an inclined fluorescent glue surface and the like is avoided; on the premise of ensuring the levelness of the fluorescent glue surface, the high-frequency sound wave of the ultrasonic generator is utilized to vibrate and disperse fluorescent powder particles in the fluorescent glue, so that the uniform distribution of the fluorescent powder particles is accelerated, the problem that the sedimentation thickness of the fluorescent powder on the surfaces of the LED chip and the substrate is not uniformly distributed is solved, the light emitted by the COB light source is uniform, the quality of the COB light source is improved, meanwhile, temperature singularity is not easy to generate due to the fact that a certain position of the fluorescent powder is too thick, and the stability and the reliability of a product are improved.

Drawings

Fig. 1 is a schematic diagram of an embodiment of the present invention.

In the figure: 10. a horizontal plate table; 20. a level sensor; 30. an electric lifting rod; 40. an ultrasonic generator; 50. a levelness controller; 60. a far infrared reflow furnace; 70. a timer; 80. an alarm; 90. an equipment outer box.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

Referring to fig. 1, the utility model discloses a COB packaging apparatus. This kind of COB encapsulation equipment includes: at least one layer of working units, wherein the single layer of working units comprises a horizontal plate table 10, a horizontal sensor 20, an electric lifting rod 30 and an ultrasonic generator 40; the horizontal plate table 10 is used for placing the glued COB, and the horizontal sensor 20 is fixedly arranged in the horizontal plate table 10 and used for detecting the levelness of the horizontal plate table 10; the electric lifting rods 30 are fixedly arranged at the bottom of the horizontal plate platform 10 and used for coordinately performing lifting movement so as to regulate and control the levelness of the horizontal plate platform 10, so that the levelness of the COB plate placed on the electric lifting rods can be ensured; and the ultrasonic generator 40 is used for emitting high-frequency sound waves to vibrate and disperse fluorescent powder particles in the fluorescent glue and accelerate the uniform distribution of the fluorescent powder particles. The COB packaging equipment further comprises a levelness controller 50, wherein the levelness controller 50 is in signal connection with the level sensor 20 to receive levelness signals of the horizontal plate table 10; the levelness controller 50 is further connected to the electric lift rod 30 through a signal, compares the levelness signal monitored by the level sensor 20 with a preset levelness parameter after receiving the levelness signal, and sends a height adjustment signal to the electric lift rod 30 of each layer of working unit respectively to drive the electric lift rod 30 to complete a lifting and lowering action command, so as to ensure the levelness of the COB board on the horizontal board table 10.

Preferably, the work unit of each layer further includes a far infrared reflow oven 60. The far infrared reflow furnace 60 is arranged above the horizontal plate table 10 to emit radiation to perform segmented curing on the fluorescent glue; specifically, the far infrared reflow furnace 60 controls the radiant energy and radiant time of the far infrared heating pipes thereon to cure the fluorescent glue in a segmented manner, i.e., the fluorescent glue is rapidly pre-cured and then is cured and baked in the next step, and the fluorescent glue standing procedure is seamlessly connected with the fluorescent glue curing procedure, so that the influence of the viscosity change of the silicon glue on the position distribution of the fluorescent powder in the curing process is reduced, and the light color difference among COB light source batches is controlled.

Preferably, the COB encapsulation apparatus further includes a timer 70. The timer 70 is electrically connected with the ultrasonic generator 40, and the starting time, the working time and the pause interval time after the working of the ultrasonic generator 40 are set through the timer 70; the timer 70 is also electrically connected to the far infrared reflow oven 60, and the operating time of the far infrared reflow oven 60 is set by the timer 70. The ultrasonic generators 40 and the far infrared reflow furnaces 60 of different working units are not connected with each other through signals.

Specifically, the whole COB packaging apparatus may be configured with a single or multiple timers 70, and the ultrasonic oscillation and curing baking time of each layer of working units of the whole apparatus may be controlled in a unified manner, or each timer 70 may be controlled individually for each layer of working units.

Preferably, the COB encapsulation apparatus further includes an alarm 80. The alarm 80 is in signal connection with the timer 70, and whether an alarm signal is sent out or not is selected according to the received signal of the timer 70. After the ultrasonic generator 40 and the far infrared reflow oven 60 are finished, the timer 70 sends a signal for stopping working to the alarm 80, and the alarm 80 sends an alarm after receiving the signal to prompt a worker to take out the materials in time after the equipment finishes working.

Preferably, the work cell also includes an equipment housing 90 for supporting and housing the various components. Horizontal platform 10, supersonic generator 40, level sensor 20 all fix and set up in equipment outer box 90, and far infrared reflow oven 60 is fixed to be set up the upper portion in equipment outer box 90, and electric lift rod 30 is fixed to be set up in the bottom of equipment outer box 90, and levelness controller 50 is fixed to be set up in the outside of equipment outer box 90.

Preferably, in one embodiment, the number of the electric lift pins 30 is preferably 4, and the electric lift pins are respectively provided at four corners of the horizontal plate table 10 to achieve stable support.

Preferably, the COB encapsulation equipment includes the work unit of multilayer, and the work unit is high-low layer's arranging, and the electric lift pole 30 of the work unit of high-level sets up at the equipment outer container 90 top of the work unit of adjacent bottom. Referring to fig. 1, in one embodiment, there are 2 working units, an alarm 80 is provided on the top of the equipment outer box 90 of the upper working unit, a timer 70 is provided on the side of the equipment outer box 90 of the upper working unit, and the electric lift pin 30 of the upper working unit is provided on the top of the equipment outer box 90 of the lower working unit.

The utility model discloses a concrete working process as follows: before COB board encapsulation point glued process is accomplished, the staff can look over and set up the levelness parameter of every layer horizontal plate platform 10 through the display screen of levelness controller 50 in advance, level sensor 20 that horizontal plate platform 10 is built-in feeds back levelness data as the layer to levelness controller 50 in real time, after parameter contrast, levelness controller 50 gives electric lift rod 30 with the signal transmission that the conversion was handled, electric lift rod 30 realizes the action instruction of rising, falling, until the levelness of each layer of horizontal plate platform 10 reaches the setting value. When the levelness of the horizontal plate table 10 reaches a set value, the COB plates subjected to glue dispensing are placed on the horizontal plate table 10. Before the fluorescent glue curing and baking process is started, the on time, the working time, the pause time after the working and the working time of the far infrared reflow oven 60 of the ultrasonic generator 40 are set by the timer 70. When the curing and baking process is started, the ultrasonic generator 40 emits high-frequency sound waves to vibrate the fluorescent powder particles, so that the fluorescent powder particles are uniformly dispersed on the LED chip and the substrate, and after the fluorescent powder particles are sufficiently and uniformly distributed, the vibrated COB is cured in a segmented manner through the far infrared reflow oven 60, namely, the COB is rapidly pre-cured and then is cured and baked in the next step. After the fluorescent glue curing and baking process is finished, the alarm 80 monitors a work stopping signal sent by the timer 70, and the alarm 80 sends out an alarm to prompt a worker to take out materials in the equipment in time.

Through the detailed explanation to the above embodiments, it can be understood that the beneficial effects of the present invention at least include: (1) on the premise of ensuring the levelness of the fluorescent glue surface, the high-frequency sound wave of the ultrasonic generator 40 is utilized to vibrate and disperse fluorescent powder particles in the fluorescent glue, so that the uniform distribution of the fluorescent powder particles is accelerated, the problem that the sedimentation thickness of the fluorescent powder on the surfaces of the LED chip and the substrate is not uniformly distributed is solved, the light emitted by the COB light source is uniform, the quality of the COB light source is improved, meanwhile, temperature singularity is not easy to generate due to the fact that a certain position of the fluorescent powder is too thick, and the stability and the reliability of a product are improved. (2) The fluorescent glue is cured in sections, namely the fluorescent glue is rapidly pre-cured and then cured and baked in the next step, the fluorescent glue standing procedure is seamlessly connected with the fluorescent glue curing procedure, the influence of the viscosity change of the silicon glue on the position distribution of the fluorescent powder in the curing process is reduced, and the light color difference among COB light source batches is controlled.

The utility model discloses having compensatied current COB packaging technology's technical defect, having solved the painful point problem of trade, the photochromic difference between control COB light source batch improves the photochromic uneven problem with the reliability difference of COB light source, promotes COB light source quality to a great extent.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. A COB encapsulation apparatus, comprising:

at least one layer of working units;

the working unit of a single layer includes: the device comprises a horizontal platform, a horizontal sensor, an electric lifting rod and an ultrasonic generator; the horizontal plate platform is used for placing a COB plate; the horizontal sensor is fixedly arranged in the horizontal platform to detect the levelness of the horizontal platform; the plurality of electric lifting rods are fixedly arranged at the bottom of the horizontal plate platform; the ultrasonic generator is arranged on the horizontal platform and used for emitting high-frequency sound waves to vibrate the fluorescent glue on the COB;

the levelness controller is in signal connection with the level sensor to receive a levelness signal; the levelness controller is in signal connection with each electric lifting rod and drives the electric lifting rods to move according to the levelness signals so as to regulate and control the levelness of the horizontal platform.

2. The COB encapsulating apparatus of claim 1, wherein the work unit further includes a far infrared reflow oven; the far infrared reflow furnace is arranged above the horizontal plate table to emit radiation to cure the fluorescent glue in a segmented manner.

3. The COB packaging apparatus of claim 2, wherein the COB packaging apparatus further includes a timer; the timer is electrically connected with the ultrasonic generator so as to control the working state of the ultrasonic generator; the timer is also electrically connected with the far infrared reflow oven so as to control the working time of the far infrared reflow oven.

4. The COB packaging apparatus of claim 3, wherein the COB packaging apparatus further includes an alarm; the alarm is in signal connection with the timer, and the alarm selects whether to send out an alarm signal according to the received signal of the timer.

5. The COB packaging apparatus of claim 4, wherein the work unit further includes an apparatus outer case; the horizontal platform ultrasonic generator level sensor is all fixed to be set up in the equipment outer container, the far infrared reflow oven is fixed to be set up upper portion in the equipment outer container, electric lift rod is fixed to be set up the bottom of equipment outer container, the fixed setting of levelness control appearance is in the outside of equipment outer container.

6. The COB encapsulating apparatus of claim 1, wherein the number of the electric lift pins is 4, and the electric lift pins are provided at four corners of the horizontal plate table, respectively.

7. The COB packaging apparatus of claim 5, wherein the COB packaging apparatus includes a plurality of layers of the work unit; the working units are arranged on high and low floors, and the electric lifting rod on the high floor is arranged on the top of the equipment outer box on the adjacent low floor.