CN110739383A - LED thermal sedimentation platform and COB packaging method - Google Patents
LED thermal sedimentation platform and COB packaging method Download PDFInfo
- Publication number
- CN110739383A CN110739383A CN201911053368.3A CN201911053368A CN110739383A CN 110739383 A CN110739383 A CN 110739383A CN 201911053368 A CN201911053368 A CN 201911053368A CN 110739383 A CN110739383 A CN 110739383A
- Authority
- CN
- China
- Prior art keywords
- led
- processor
- alarm
- induction
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004062 sedimentation Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 230000006698 induction Effects 0.000 claims abstract description 57
- 239000003292 glue Substances 0.000 claims abstract description 8
- 230000003993 interaction Effects 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 14
- 230000001939 inductive effect Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000741 silica gel Substances 0.000 abstract description 6
- 229910002027 silica gel Inorganic materials 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000000499 gel Substances 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 7
- 241000883990 Flabellum Species 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses an LED thermal sedimentation platform and a COB packaging method.A worker places an LED substrate after dispensing in an induction area of an induction table and heats the LED substrate by a sedimentation device, the adhesive force between silica gel and fluorescent powder in the LED substrate with the fluorescent glue is reduced when the LED substrate is heated, and the density of the fluorescent powder is greater than that of the silica gel, so that the sedimentation speed of the fluorescent powder is accelerated, the standing sedimentation time is greatly shortened, the production efficiency is improved, the sedimentation time can be automatically timed by the thermal sedimentation platform, the sedimentation time is accurately controlled, the difference between the fluorescent powder in the gel between products is reduced, and the uniformity of the light color and the yield of the products are greatly improved.
Description
Technical Field
The invention belongs to the technical field of LED packaging, and particularly relates to an LED thermal sedimentation platform and a COB packaging method.
Background
The settlement point powder process is a hot point used for LED packaging point gluing in recent years, the fluorescent powder is settled to the bottom close to an LED substrate during packaging, heat can be better radiated by the fluorescent powder, so that the reliability of the whole light source is improved, centrifugal settlement or natural settlement is usually adopted, the centrifugal settlement is limited by times of centrifugation, and is influenced by centrifugal force, when the settlement point powder process is used for a large COB light source of the substrate, the fluorescent powder is easy to be unevenly stressed, so that the fluorescent powder is unevenly distributed, and light spots of the light source are uneven.
However, the normal-temperature natural settling process has long settling time, is easy to generate color drift, has poor uniformity of settling , causes unstable uniformity of luminescent colors, is influenced by settling time, has no good control on settling time, and is easy to generate color drift, thereby causing difficulty in batch production, while the prior art always uses a timer to monitor the settling time by manpower in the problem, and the method is time-consuming, labor-consuming and low in efficiency.
Disclosure of Invention
In order to overcome the technical defects, the LED thermal sedimentation platforms and the COB packaging method provided by the invention can accelerate the sedimentation speed of the fluorescent powder, greatly shorten the standing sedimentation time, improve the production efficiency, reduce the difference between the fluorescent powders in the colloid among products by accurately controlling the sedimentation time, and greatly improve the quality of the light color of the products and the yield of the products.
In order to solve the problems, the invention is realized according to the following technical scheme:
kinds of LED thermal sedimentation platform, comprising a sedimentation device, a processor with a plurality of timers and a human-computer interaction device connected to the processor;
the sedimentation device comprises a box body, wherein a heating module, a circulating air module and an induction table with a plurality of induction areas are arranged in the box body; the heating module is used for generating heat; the circulating air module is used for generating circulating air in the box body to drive the heat to heat the LED substrate on the induction table;
the human-computer interaction device is used for receiving substrate information parameters input by a user and sending the substrate information parameters to the processor, wherein the substrate information parameters comprise product information of an LED substrate, a settling time parameter and an induction area parameter, and the processor is used for binding the timer with the induction area parameter and inputting the settling time parameter into the bound timer;
the sensor and the alarm are arranged on each sensing area and connected to the processor, the sensor is used for generating sensing signals when sensing the LED substrate and sending the sensing signals to the processor, the processor is used for acquiring sensing area parameters of the sensing area corresponding to the sensing signals when receiving the sensing signals and starting the timer bound with the sensing area parameters, and the timer is used for generating alarm signals when timing the settlement time parameters, so that the processor sends the alarm signals to the alarm to give an alarm.
, the circulating air module comprises a fan and a motor, wherein the fan is arranged on the inner wall of the box body, and the motor drives the fan to generate circulating air.
, the box body is provided with an air inlet and an air outlet, and the height of the air inlet is higher than that of the air outlet.
, the air inlet is arranged at the top of the box body, and the air outlet is arranged at the side or the bottom of the box body;
, the inlet and outlet are located on different sides of the housing.
, a display connected to the processor is further arranged on the box body and used for displaying the substrate information parameters, the state of the timer and the state of the alarm.
And , generating an off-position signal when the sensor senses that the LED substrate leaves the sensing area and sending the off-position signal to the alarm through the processor, and stopping alarming when the alarm receives the off-position signal.
, the LED lamp also comprises a radio frequency label and a coded label which are arranged on the LED substrate, wherein the coded label comprises the substrate information parameters;
the inductor is a radio frequency identifier and generates the induction signal by inducing the radio frequency tag;
and , the human-computer interaction device is an image recognition camera and receives the substrate information parameters by scanning the coded label.
, the processor further comprises a report generator, wherein the report generator is configured to generate a report by combining the substrate information parameters and the timing start time and the timing end time of the timer with a preset report text template.
The invention also discloses an LED COB packaging method, which comprises the following steps:
dispensing the dispensed fluorescent glue on an LED substrate to be packaged, and then placing the dispensed LED substrate on a induction area of an induction table of the LED thermal sedimentation platform as claimed in any claims 1-9;
the human-computer interaction device of the LED thermal settlement platform receives substrate information parameters input by a user and sends the substrate information parameters to the processor, wherein the substrate information parameters comprise product information, settlement time parameters and induction area parameters of the LED substrate, and the processor binds the timer with the induction area parameters and inputs the settlement time parameters into the bound timer;
the sensor on the sensing area generates a sensing signal when sensing the LED substrate and sends the sensing signal to the processor; when the processor receives the induction signal, acquiring the induction area parameter of the induction area corresponding to the induction signal, and starting the timer bound with the induction area parameter;
the heating module and the circulating air module of the LED thermal sedimentation platform heat the LED substrate at a preset temperature; the timer generates an alarm signal when the settlement time parameter is timed, and the processor sends the alarm signal to an alarm to give an alarm;
and taking out the LED substrate when the alarm gives an alarm, putting the LED substrate into a baking device for baking, and naturally cooling to room temperature after baking.
Compared with the prior art, the invention has the beneficial effects that:
the invention discloses an LED thermal sedimentation platform and a COB packaging method.A worker places an LED substrate after dispensing in an induction area of an induction table and heats the LED substrate by a sedimentation device, the adhesive force between silica gel and fluorescent powder in the LED substrate with the fluorescent glue is reduced when the LED substrate is heated, and the density of the fluorescent powder is greater than that of the silica gel, so that the sedimentation speed of the fluorescent powder is accelerated, the standing sedimentation time is greatly shortened, the production efficiency is improved, the sedimentation time can be automatically timed by the thermal sedimentation platform, the sedimentation time is accurately controlled, the difference between the fluorescent powder in the gel between products is reduced, and the uniformity of the light color and the yield of the products are greatly improved.
Drawings
FIG. 1 is a schematic structural diagram of an LED thermal sedimentation platform according to embodiment 1 of the present invention;
FIG. 2 is a schematic structural diagram of a settling device of the LED thermal settling platform in embodiment 1 of the invention;
FIG. 3 is a schematic plan view of an induction table of the LED thermal sedimentation platform in embodiment 1 of the present invention;
FIG. 4 is a schematic diagram of module connection of the LED thermal sink platform described in example 1 of the present invention;
fig. 5 is a display schematic view of the display device described in embodiment 1 of the present invention;
FIG. 6 is a diagram illustrating a report generated by the report generator in embodiment 1 of the present invention;
fig. 7 is a schematic step diagram of the LED method described in embodiment 2 of the present invention.
In the figure:
10-settling device, 101-box body, 1011-box , 1012-air inlet, 1013-air outlet, 102-heating module, 103-circulating air module, 1031-motor, 1032-fan, 1-processor, 11-timer, 2-man-machine interaction device, 3-induction table, 31-induction area, 32-inductor and 33-alarm.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example 1
Fig. 1-4 show embodiment 1 of the invention, and specifically disclose kinds of LED thermal sedimentation platforms, which include a sedimentation device 10, a processor 1 having a plurality of timers 11, and a human-computer interaction device 2 connected to the processor 1, wherein the sedimentation device 10 has a structure as shown in fig. 1 and 2, and includes a box 101, a heating module 102, a circulating air module 103, and an induction table 3 having a plurality of induction areas 31 are disposed in the box 101, the heating module 102 is used for generating heat, the circulating air module 103 is used for generating circulating air in the box 101 to drive the heat to heat LED substrates on the induction table 3, specifically in this embodiment, the circulating air module 103 includes a motor 1031 and a fan 1032, the fan 1032 is disposed on an inner wall of the box 101, and the motor 1031 drives the fan 1032 to generate circulating air to drive the heat to heat the LED substrates on the induction table 3.
In the present embodiment, the box body is provided with a box 1011, an air inlet 1012 and an air outlet 1013, specifically, in the present embodiment, the heating module 102 is a heating wire arranged on the box 1011, and by such an arrangement, the design of the settling platform of the box body can be more concise.
Specifically, the air inlet 1012 is higher than the air outlet 1013, and this is set to make the hot air lighter, so the hot air will rise to the top of the box, and the air inlet can make the hot air form a circulating air flow by the inlet air, more specifically, the air inlet 1012 is set at the top of the box 101, the air outlet 1013 is set at the side of the box 101, and the air inlet 1012 and the air outlet 1013 are located at different sides of the box 101, so that circulating flows of the air inside the box can be achieved, and the step ensures that the heat inside the box is uniformly distributed.
In this embodiment, the box body is further provided with a heat insulation layer 1010, so that the heat loss rate in the box body can be reduced by arranging the heat insulation layer, and the load of the heating device is reduced.
Specifically, a schematic diagram of the sensing station 3 is shown in fig. 3, which includes a plurality of sensing areas 31, and a diagram of a module connection between the human-computer interaction device 2 and the processor 1 is shown in fig. 4.
The human-computer interaction device comprises a human-computer interaction device 2, a processor 1, a product information acquisition module, a settling time acquisition module, a sensing area 31 and a control module, wherein the human-computer interaction device 2 is used for receiving substrate information parameters input by a user and sending the substrate information parameters to the processor, the substrate information parameters comprise product information of an LED substrate, a settling time parameter and a sensing area parameter, and the processor 1 is used for binding the timer 11 with the sensing area 31 parameter and inputting the settling time parameter into the bound timer 11;
each induction area 31 is provided with an inductor 32 and an alarm 33 connected to the processor 1, the inductor 32 is used for generating induction signals and sending the induction signals to the processor 1 when inducing the LED substrate, the processor 1 is used for acquiring induction area parameters of the induction area corresponding to the induction signals and starting the timer 11 bound with the induction area parameters when receiving the induction signals, and the timer 11 is used for generating alarm signals when timing settlement time parameters, so that the processor 1 sends the alarm signals to the alarm 33 for alarming.
Specifically, in this embodiment, the box 1 is further provided with a display 4 connected to the processor 1 for displaying the substrate information parameters, the status of the timer and the status of the alarm, and an example of an interface of the display 4 is shown in fig. 5, which can be used to comprehensively display various information.
Specifically, in the embodiment, the sensor is used for generating a deviation signal when sensing that the LED substrate leaves the sensing area and sending the deviation signal to the alarm through the processor, and the alarm is used for stopping alarming when receiving the deviation signal, so that the alarm can give an alarm at until an operator takes the LED substrate away for next steps of operation, and the LED substrate preparation work is supervised.
Specifically, in this embodiment, the LED module further includes a radio frequency tag and a coding tag disposed on the LED substrate; the coded label comprises substrate information parameters;
the inductor is a radio frequency identifier and generates an induction signal by inducing the radio frequency tag; the radio frequency identifier is used for sensing the radio frequency label, so that the LED substrate can be quickly confirmed to be in place.
In this embodiment, the human-computer interaction device may be a keyboard.
Specifically, in this embodiment, the human-computer interaction device is an image recognition camera, and receives the substrate information parameters by scanning the coded label, specifically, the coded label may be an image code such as an -dimensional code or a two-dimensional code.
Specifically, the example of the report is shown in fig. 6, and comprehensive data collection and display can be performed on the production process, so as to facilitate subsequent error tracing or data analysis.
Specifically, the inductor can be gravity inductor or infrared inductor, so then need not set up the label on the LED base plate, and direct placing LED base plate can respond to.
Specifically, in this embodiment, the alarm may be a buzzer alarm or a flashing alarm lamp or a combination of the buzzer alarm and the flashing alarm lamp, and an operator may select the alarm according to actual conditions in actual operation.
The above-mentioned heat settlement platform that discloses, through heater strip on the box generates heat, be provided with the flabellum on the inner wall of box, motor drive flabellum rotates, the flabellum is suitable for letting the air of the inside of box is in the internal loop of box flows to heat settlement platform, after heat settlement platform reached the temperature of requirement, through the material heat release settlement platform after will gluing, the LED COB who has the fluorescent glue is under the heated state, wherein the cohesion between silica gel and the fluorescent powder will reduce, and the density of fluorescent powder is greater than the density of silica gel, thereby make fluorescent powder settling velocity accelerate, shorten settling time of standing greatly, production efficiency has been promoted, operating personnel only need pass through the time-recorder of human-computer interaction ware input treater with settling time simultaneously, the inductor sends sensing signal to the treater when sensing the LED base plate and with the start-up time-recorder, the time of standing through the alarm after the settling time of input reports to the police, can indicate operating personnel LED base plate's fluorescent powder has subsided the completion, step operation can carry out the solidification, can effectively avoid settling time of standing after the encapsulation to report to the product to the accuracy guarantee that the effectual settling time of standing makes the product , the effectual quality of the product drift of depositing can reduce the effectual spot colour and the effectual quality of the product, the effectual quality of the encapsulation area of unloading, the effectual automation of the product, the chip, the effectual quality of the effectual automation of the chip improves the quality of the product.
Example 2
As shown in fig. 7, the present embodiment discloses an kinds of LED COB packaging method, which includes the following steps:
s1, preparing fluorescent glue by blending and mixing the packaging glue and the fluorescent powder uniformly, dispensing the prepared fluorescent glue on an LED substrate to be packaged, and then placing the dispensed LED substrate on a induction area of an induction table of the LED thermal sedimentation platform in the embodiment 1;
s2, receiving the substrate information parameters input by a user through a human-computer interaction device of the LED thermal sedimentation platform, and sending the substrate information parameters to a processor;
specifically, the substrate information parameters comprise product information, sedimentation time parameters and induction area parameters of the LED substrate; in the method, the settling time is 0.5-2.5 hours.
S3, the processor binds the timer with the induction area parameters and inputs the settlement time parameters into the bound timer;
s4, when the sensor on the sensing area senses the LED substrate, generating a sensing signal and sending the sensing signal to the processor; when the processor receives the induction signal, acquiring induction area parameters of an induction area corresponding to the induction signal, and starting a timer for binding the induction area parameters;
s5, heating the LED substrate at a preset temperature by a heating module and a circulating air module of the LED thermal sedimentation platform; the timer generates an alarm signal when the settlement time parameter is measured, and the processor sends the alarm signal to the alarm to give an alarm; specifically, in the method, the preset temperature is 35-80 ℃.
S6, taking out the LED substrate when the alarm gives an alarm, putting the LED substrate into a baking device for baking, and naturally cooling to room temperature after baking.
In a more preferred embodiment of this embodiment, the settling time in step S2 is 0.5 hour, and the settling temperature in step S5 is 60 ℃.
The packaging method disclosed by the embodiment utilizes the thermal sedimentation platform disclosed in the embodiment 1, can accurately control sedimentation degree by controlling sedimentation time, only needs to precipitate points half-way down points, does not need to completely precipitate, reduces waste of fluorescent powder, and simultaneously, excessive precipitated fluorescent powder can play a role in shading.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention will still fall within the scope of the technical solution of the present invention.
Claims (10)
- LED thermal sedimentation platform, which is characterized by comprising a sedimentation device, a processor with a plurality of timers and a human-computer interaction device connected to the processor;the sedimentation device comprises a box body, wherein a heating module, a circulating air module and an induction table with a plurality of induction areas are arranged in the box body; the heating module is used for generating heat; the circulating air module is used for generating circulating air in the box body to drive the heat to heat the LED substrate on the induction table;the human-computer interaction device is used for receiving substrate information parameters input by a user and sending the substrate information parameters to the processor, wherein the substrate information parameters comprise product information of an LED substrate, a settling time parameter and an induction area parameter, and the processor is used for binding the timer with the induction area parameter and inputting the settling time parameter into the bound timer;the sensor and the alarm are arranged on each sensing area and connected to the processor, the sensor is used for generating sensing signals when sensing the LED substrate and sending the sensing signals to the processor, the processor is used for acquiring sensing area parameters of the sensing area corresponding to the sensing signals when receiving the sensing signals and starting the timer bound with the sensing area parameters, and the timer is used for generating alarm signals when timing the settlement time parameters, so that the processor sends the alarm signals to the alarm to give an alarm.
- 2. The LED thermal sedimentation platform of claim 1, wherein the circulating air module comprises a fan and a motor; the fan is arranged on the inner wall of the box body, and the motor drives the fan to generate circulating air.
- 3. The LED thermal sedimentation platform of claim 1, wherein the box is provided with an air inlet and an air outlet; the air inlet is higher than the air outlet.
- 4. The LED thermal sedimentation platform of claim 3, wherein the air inlet is provided at a top of the tank, and the air outlet is provided at a side or a bottom of the tank.
- 5. The LED thermal sedimentation platform of claim 4, wherein the air inlet and the air outlet are located on different sides of the tank.
- 6. The LED thermal sedimentation platform of claim 1, wherein the box body is further provided with a display connected to the processor for displaying the substrate information parameters, the status of the timer and the status of the alarm.
- 7. The LED thermal sedimentation platform of claim 1, wherein the sensor is configured to generate an out-of-position signal when sensing that the LED substrate leaves the sensing area and send the out-of-position signal to the alarm through the processor; the alarm is used for stopping alarming when the off-position signal is received.
- 8. The LED thermal sedimentation platform of claim 1 further comprising a radio frequency tag and a coded tag disposed on the LED substrate; the coded label comprises the substrate information parameters;the inductor is a radio frequency identifier, and the induction signal is generated by inducing the radio frequency tag.
- 9. The LED thermal sedimentation platform of claim 1 wherein the human-machine-interaction device is an image recognition camera that receives the substrate information parameters by scanning the coded label.
- 10, LED COB packaging method, characterized by comprising the following steps:dispensing the dispensed fluorescent glue on an LED substrate to be packaged, and then placing the dispensed LED substrate on a induction area of an induction table of the LED thermal sedimentation platform as claimed in any claims 1-9;the human-computer interaction device of the LED thermal settlement platform receives substrate information parameters input by a user and sends the substrate information parameters to the processor, wherein the substrate information parameters comprise product information, settlement time parameters and induction area parameters of the LED substrate, and the processor binds the timer with the induction area parameters and inputs the settlement time parameters into the bound timer;the sensor on the sensing area generates a sensing signal when sensing the LED substrate and sends the sensing signal to the processor; when the processor receives the induction signal, acquiring the induction area parameter of the induction area corresponding to the induction signal, and starting the timer bound with the induction area parameter;the heating module and the circulating air module of the LED thermal sedimentation platform heat the LED substrate at a preset temperature; the timer generates an alarm signal when the settlement time parameter is timed, and the processor sends the alarm signal to an alarm to give an alarm;and taking out the LED substrate when the alarm gives an alarm, putting the LED substrate into a baking device for baking, and naturally cooling to room temperature after baking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911053368.3A CN110739383A (en) | 2019-10-31 | 2019-10-31 | LED thermal sedimentation platform and COB packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911053368.3A CN110739383A (en) | 2019-10-31 | 2019-10-31 | LED thermal sedimentation platform and COB packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110739383A true CN110739383A (en) | 2020-01-31 |
Family
ID=69270576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911053368.3A Pending CN110739383A (en) | 2019-10-31 | 2019-10-31 | LED thermal sedimentation platform and COB packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110739383A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111889310A (en) * | 2020-07-17 | 2020-11-06 | 常州铭赛机器人科技股份有限公司 | Dispensing machine and dispensing method thereof |
-
2019
- 2019-10-31 CN CN201911053368.3A patent/CN110739383A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111889310A (en) * | 2020-07-17 | 2020-11-06 | 常州铭赛机器人科技股份有限公司 | Dispensing machine and dispensing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109545946B (en) | High-efficiency conductive silver adhesive die-bonding wire sealing process for semiconductor | |
| CN110739383A (en) | LED thermal sedimentation platform and COB packaging method | |
| CN104576454A (en) | Tunnel-type hardening furnace for semiconductor device | |
| CN107546314A (en) | A kind of packaging technology of LED fluorescent powder sedimentation | |
| WO2013064110A1 (en) | Fluorescent powder cover for led light and manufacturing method thereof | |
| CN104157748A (en) | LED full period-luminosity light source and manufacturing method thereof | |
| CN210692582U (en) | LED thermal sedimentation platform | |
| CN104588472B (en) | Automatic hot stamping device | |
| CN206324192U (en) | One kind has temperature controlled sesame seed roasting device | |
| CN109671655B (en) | LED fluorescent powder sedimentation control device and method | |
| CN109950181B (en) | Production and processing technological process of LED nixie tube | |
| JP5375777B2 (en) | Resin coating device in LED package manufacturing system | |
| WO2012032691A1 (en) | Led package manufacturing system | |
| WO2012032692A1 (en) | Led-package manufacturing system | |
| CN207534165U (en) | A kind of laser code apparatus | |
| JP2013048130A (en) | Resin coating device and resin coating method | |
| CN107782142A (en) | One kind can stablize LED elargol sintering baking oven for dispensing glue | |
| CN115016408A (en) | Method and system for managing and controlling process flow of line body equipment | |
| CN110394259A (en) | A kind of molecular sieve particle spray process equipment | |
| CN210535691U (en) | COB packaging equipment | |
| CN110534630A (en) | COB packaging equipment | |
| CN200952879Y (en) | Double drying box structure for vehicle rear partition production line | |
| CN107860227A (en) | A kind of elargol sintering baking oven of LED | |
| CN209389008U (en) | A kind of LED fluorescent powder settlement Control device | |
| WO2021026959A1 (en) | Cob encapsulation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |