CN210535690U

CN210535690U - Novel LED packaging structure

Info

Publication number: CN210535690U
Application number: CN201921828454.2U
Authority: CN
Inventors: 胡海强
Original assignee: Hebei Sanneng Technology Co ltd
Current assignee: Hebei Sanneng Technology Co ltd
Priority date: 2019-10-29
Filing date: 2019-10-29
Publication date: 2020-05-15
Anticipated expiration: 2029-10-29

Abstract

The utility model discloses a novel LED packaging structure relates to semiconductor packaging technology field, specifically is a novel LED packaging structure, including the silicon body, the top joint of silicon body has the glass cover, the buckle has been seted up to the bottom of glass cover, and the top of silicon body set up with buckle matched with draw-in groove, the below fixed mounting of silicon body inner chamber has the heat conduction copper post, and the top fixed mounting of heat conduction copper post has the LED wafer, the bottom fixed mounting of LED wafer has the fixed column. This novel LED packaging structure supplies power through P electrode and N electrode LED wafer, makes LED wafer normally work, works for a long time as LED wafer and produces the heat, because the specific heat capacity of heat conduction copper post is greater than the specific heat capacity of LED wafer, the heat major part that the LED wafer produced can conduct to in the heat conduction copper post, has reduced the heat of LED wafer, and the device has solved heat accumulation in the past, influences the problem of product life, has improved the life of LED wafer.

Description

Novel LED packaging structure

Technical Field

The utility model relates to a semiconductor package technical field specifically is a novel LED packaging structure.

Background

The semiconductor lighting industry is a new future industry, the LED lighting is the main key of future lighting, and under the past international large environment, the living environment of people is influenced due to the shortage of resources and the severe environment; energy conservation and emission reduction become important and urgent problems to be solved in all countries, so that measures are taken in all countries, and LED illumination is listed as the core of future illumination.

However, as a commercial product, the existing partial LED packaging technology has the following problems: the LED chip has high thermal resistance, and because the light emitted by the LED chip is excited by the electronic compounding process, a large amount of heat is generated while light is generated, as is known, the generation of heat adversely affects the efficiency of converting electricity into light, and the luminous performance of the LED is reduced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a novel LED packaging structure, it is good, equipment advantage such as convenient, simple structure to have the radiating effect, has solved the problem of proposing among the above-mentioned background art.

(II) technical scheme

Good, the equipment is convenient, the simple structure purpose of radiating effect more than realizing, the utility model discloses a following technical scheme realizes: the utility model provides a novel LED packaging structure, includes the silicon body, the top joint of silicon body has the glass cover, the buckle has been seted up to the bottom of glass cover, and the top of silicon body set up with buckle matched with draw-in groove, the below fixed mounting of silicon body inner chamber has the heat conduction copper post, and the top fixed mounting of heat conduction copper post has the LED wafer, the bottom fixed mounting of LED wafer has the fixed column, and the top of heat conduction copper post set up with fixed column matched with rectangular channel, the bottom fixed mounting of silicon body has the heat dissipation copper bar, and the bottom fixed mounting of silicon body has the metal welding post.

Preferably, the top of the silicon body is provided with a cavity, the side surface of the cavity is an arc surface, the side surface of the cavity is fixedly provided with a light reflecting layer, and the bottom of the cavity and the top of the heat conducting copper column are positioned on the same horizontal plane.

Preferably, the top of the heat conduction copper column and the inside fixed mounting of rectangular channel have the insulating layer, the quantity of fixed column is four, and four fixed columns equipartition in the bottom of LED wafer.

Preferably, the left side of the LED chip is fixedly mounted with a P electrode and an N electrode penetrating to the left side of the silicon body, and the outer portions of the P electrode and the N electrode are fixedly sleeved with an insulating layer.

Preferably, the shape of the heat-conducting copper column is convex, and a cementing layer is fixedly arranged between the heat-conducting copper column and the inner cavity of the silicon body.

Preferably, the number of the heat dissipation copper bars is twenty five, the twenty five heat dissipation copper bars are uniformly distributed at the bottom of the silicon body, and the length of the heat dissipation copper bars is the same as the width of the bottom of the silicon body.

Preferably, the number of the metal welding columns is four, the four metal welding columns are uniformly distributed at the bottom of the silicon body, and an insulating medium is fixedly arranged between the metal welding columns and the silicon body.

Preferably, the glass cover is of a hollow structure, and the inner part of the glass cover is an arc surface.

(III) advantageous effects

The utility model provides a novel LED packaging structure possesses following beneficial effect:

1. in the novel LED packaging structure, the LED wafer is powered through the P electrode and the N electrode, so that the LED wafer normally works, when the LED wafer works for a long time to generate heat, most of the heat generated by the LED wafer is transmitted into the heat-conducting copper column due to the fact that the specific heat capacity of the heat-conducting copper column is larger than that of the LED wafer, the heat of the LED wafer is reduced, the problem that the service life of a product is influenced due to the fact that the heat is accumulated in the past is solved, the service life of the LED wafer is prolonged, in addition, the LED wafer works for a long time, the heat can be continuously transmitted into the heat-conducting copper column, the bottom of the heat-conducting copper column is fixedly provided with the heat-radiating copper strip, the heat in the heat-conducting copper column is transmitted to the outside of the silicon body, the temperature inside the device is reduced, meanwhile, when the silicon body is fixed on the circuit board, a gap can be generated between, the service life of the LED wafer is prolonged.

2. This novel LED packaging structure, advance silicon body bottom with heat conduction copper post card, then, advance the rectangular channel at heat conduction copper post top with the fixed column card of LED wafer bottom, realize the device's equipment, the problem of fixed difficulty is glued to soldering tin point in the past has been solved, the work efficiency is improved, the operation degree of difficulty has been reduced, furthermore, at the die cavity internal fixation installation reflector layer at silicon body top, the refracting index of light has been increased, the illumination intensity has been improved, and then the illumination intensity of light inside the silicon body has been reduced, the inside temperature of silicon body has been reduced, the service life of the device is further prolonged.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the heat dissipation structure of the present invention;

fig. 3 is a schematic view of the fixing structure of the present invention.

In the figure: 1. a silicon body; 2. a glass cover; 3. a metal welding column; 4. a P electrode; 5. an N electrode; 6. buckling; 7. a light-reflecting layer; 8. an LED wafer; 9. fixing a column; 10. an insulating layer; 11. a thermally conductive copper pillar; 12. a cementing layer; 13. and (4) radiating copper strips.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1 to 3, the present invention provides a technical solution: the utility model provides a novel LED packaging structure, including silicon body 1, silicon body 1's top joint has glass cover 2, buckle 6 has been seted up to glass cover 2's bottom, and silicon body 1's top seted up with buckle 6 matched with draw-in groove, the below fixed mounting of silicon body 1 inner chamber has heat conduction copper post 11, and the top fixed mounting of heat conduction copper post 11 has LED wafer 8, LED wafer 8's bottom fixed mounting has fixed column 9, and heat conduction copper post 11's top seted up with fixed column 9 matched with rectangular channel, silicon body 1's bottom fixed mounting has heat dissipation copper bar 13, and silicon body 1's bottom fixed mounting has metal welding post 3.

Wherein, the die cavity has been seted up at the top of silicon body 1, and the side of die cavity is the arc surface, the side fixed mounting of die cavity has reflector layer 7, the bottom of die cavity is in on the same horizontal plane with the top of heat conduction copper post 11, fixed mounting reflector layer 7 in the die cavity at silicon body 1 top, the refracting index of light has been increased, the illumination intensity has been improved, and then the intensity of illumination of light in silicon body 1 inside has been reduced, the inside temperature of silicon body 1 has been reduced, the device's life has further been improved.

Wherein, there is insulating layer 10 at the top of heat conduction copper post 11 and the inside fixed mounting of rectangular channel, the quantity of fixed column 9 is four, and four fixed column 9 equipartitions in the bottom of LED wafer 8, advance silicon body 1 bottom with heat conduction copper post 11 card, then, in advancing the rectangular channel at heat conduction copper post 11 top with the fixed column 9 card of LED wafer 8 bottom, realize the device's equipment, solved the problem of soldering tin point glue fixation difficulty in the past, improved work efficiency, the operation degree of difficulty has been reduced.

Wherein, the left side fixed mounting of LED wafer 8 has run through to 1 left P electrode 4 and N electrode 5 of silicon body, and the external fixation of P electrode 4 and N electrode 5 has cup jointed the insulating layer, supply power to LED wafer 8 through P electrode 4 and N electrode 5, make LED wafer 8 normally work, work for a long time when LED wafer 8 produces heat, because the specific heat capacity of heat conduction copper post 11 is greater than LED wafer 8's specific heat capacity, the heat that LED wafer 8 produced is the heat in the major part can conduct to heat conduction copper post 11, the heat of LED wafer 8 has been reduced, the device has solved heat accumulation in the past, influence the problem of product life, the life of LED wafer 8 has been improved.

Wherein, the shape of heat conduction copper post 11 is the type of protruding font, and fixed mounting has cementing layer 12 between heat conduction copper post 11 and the 1 inner chamber of silicon body, when heat conduction copper post 11 card advances silicon body 1 inside and fix silicon body 1, the step face of the 1 inner chamber of silicon body is withstood to the 11 step faces of heat conduction copper post of type of protruding font, restriction heat conduction copper post 11 reciprocates, thereby guarantee LED wafer 8's fixed, reduced the device and rocked the probability that causes the damage, improved the device's life.

Wherein, the quantity of heat dissipation copper bar 13 is twenty five, and twenty five heat dissipation copper bars 13 evenly distributed are in the bottom of silicon body 1, the length of heat dissipation copper bar 13 is the same with the width of silicon body 1 bottom, LED wafer 8 works for a long time, can be continually conduct heat to heat conduction copper post 11 in, heat conduction copper post 11 bottom fixed mounting has heat dissipation copper bar 13, conduct the heat in the heat conduction copper post 11 to silicon body 1 outside, the inside temperature of the device has been reduced, and simultaneously, when silicon body 1 is fixed on the circuit board, heat dissipation copper bar 13 can produce the space with the circuit board, increase the air flow, further reduced the inside temperature of silicon body 1, the life of LED wafer 8 has been improved.

Wherein, the quantity of metal welding column 3 is four, and four metal welding column 3 evenly distributed are in the bottom of silicon body 1, and fixed mounting has insulating medium between metal welding column 3 and the silicon body 1, and three metal welding column 3 has guaranteed the device's is fixed, has reduced the phenomenon that appears connecting and drops, has improved the device's life.

Wherein, glass cover 2 is hollow structure, and 2 inside arc surfaces that are of glass cover, and the arc surface has increased the refracting index of light, has improved illumination intensity, and then has reduced the intensity of illumination of light in 1 inside of silicon body, has reduced the inside temperature of silicon body 1, has further improved the device's life.

In conclusion, when the novel LED packaging structure is used, whether each structure is complete or not is checked, after the structure is correct, the heat-conducting copper column 11 is clamped into the bottom of the silicon body 1, then the fixing column 9 at the bottom of the LED wafer 8 is clamped into the rectangular groove at the top of the heat-conducting copper column 11, the device is assembled, the metal welding column 3 is clamped into the circuit board and is welded and fixed, the reflecting layer 7 is fixedly arranged in the cavity at the top of the silicon body 1, the refractive index of light is increased, the illumination intensity is improved, the illumination intensity of the light in the silicon body 1 is further reduced, the temperature in the silicon body 1 is reduced, the LED wafer 8 is powered through the P electrode 4 and the N electrode 5, the LED wafer 8 works normally, when the LED wafer 8 works for a long time to generate heat, because the heat capacity of the heat-conducting copper column 11 is larger than the heat capacity of the LED wafer 8, most of the heat generated by the LED wafer 8 is conducted into the heat-conducting copper column, the heat of the LED wafer 8 is reduced, the LED wafer 8 works for a long time, the heat can be continuously conducted to the heat conduction copper column 11, the heat dissipation copper bar 13 is fixedly arranged at the bottom of the heat conduction copper column 11, the heat in the heat conduction copper column 11 is conducted to the outside of the silicon body 1, the temperature inside the device is reduced, and the device is overhauled regularly.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A novel LED packaging structure comprises a silicon body (1), and is characterized in that: the top joint of silicon body (1) has glass cover (2), buckle (6) have been seted up to the bottom of glass cover (2), and the top of silicon body (1) seted up with buckle (6) matched with draw-in groove, the below fixed mounting of silicon body (1) inner chamber has heat conduction copper post (11), and the top fixed mounting of heat conduction copper post (11) has LED wafer (8), the bottom fixed mounting of LED wafer (8) has fixed column (9), and the top of heat conduction copper post (11) seted up with fixed column (9) matched with rectangular channel, the bottom fixed mounting of silicon body (1) has heat dissipation copper bar (13), and the bottom fixed mounting of silicon body (1) has metal welding post (3).

2. The novel LED package structure of claim 1, wherein: the light-emitting diode is characterized in that a cavity is formed in the top of the silicon body (1), the side face of the cavity is an arc face, a light reflecting layer (7) is fixedly mounted on the side face of the cavity, and the bottom of the cavity and the top of the heat conducting copper column (11) are located on the same horizontal plane.

3. The novel LED package structure of claim 1, wherein: the LED chip is characterized in that an insulating layer (10) is fixedly mounted at the top of the heat conduction copper column (11) and inside the rectangular groove, the number of the fixing columns (9) is four, and the four fixing columns (9) are uniformly distributed at the bottom of the LED chip (8).

4. The novel LED package structure of claim 1, wherein: the left side of the LED wafer (8) is fixedly provided with a P electrode (4) and an N electrode (5) which penetrate through the left side of the silicon body (1), and the outer parts of the P electrode (4) and the N electrode (5) are fixedly sleeved with an insulating layer.

5. The novel LED package structure of claim 1, wherein: the shape of heat conduction copper post (11) is the font of protruding, and fixed mounting has cementing layer (12) between heat conduction copper post (11) and silicon body (1) inner chamber.

6. The novel LED package structure of claim 1, wherein: the number of the heat dissipation copper bars (13) is twenty-five, the twenty-five heat dissipation copper bars (13) are uniformly distributed at the bottom of the silicon body (1), and the length of the heat dissipation copper bars (13) is the same as the width of the bottom of the silicon body (1).

7. The novel LED package structure of claim 1, wherein: the number of the metal welding columns (3) is four, the four metal welding columns (3) are uniformly distributed at the bottom of the silicon body (1), and an insulating medium is fixedly arranged between the metal welding columns (3) and the silicon body (1).

8. The novel LED package structure of claim 1, wherein: the glass cover (2) is of a hollow structure, and the inside of the glass cover (2) is an arc surface.