CN210519056U - Energy-saving self-heating circuit board package - Google Patents
Energy-saving self-heating circuit board package Download PDFInfo
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- CN210519056U CN210519056U CN201920769807.XU CN201920769807U CN210519056U CN 210519056 U CN210519056 U CN 210519056U CN 201920769807 U CN201920769807 U CN 201920769807U CN 210519056 U CN210519056 U CN 210519056U
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- circuit board
- heating
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- cover plate
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Abstract
The utility model discloses an energy-saving spontaneous heating circuit board package, include: a pair of self-heating plate bodies which are symmetrically arranged up and down; the circuit board unit is positioned between the pair of self-heating plate bodies; the self-heating plate body comprises a plate body and a heating layer arranged on the plate body and used for assisting in heating of the circuit board unit, and the circuit board unit is clamped between the heating layers through a lower cover plate and an upper cover plate. The energy-saving self-heating circuit board bag can effectively reduce energy consumption and has the advantages of energy conservation and consumption reduction.
Description
Technical Field
The utility model relates to a circuit board manufacture equipment technical field especially relates to energy-saving spontaneous heating circuit board package.
Background
Printed circuit boards, also known as printed circuit boards (pcbs), generally comprise copper foils, resins, and inner layers, and are manufactured by heating and pressing. A circuit board laminating machine, also called a circuit board laminating machine, is one of main production equipment of a circuit board, and has the function of laminating manufacturing materials of the circuit board together by applying a heating and pressurizing principle to achieve the effects of flatness and compact circuit.
Most of the existing laminating machines adopt an auxiliary heating mode of heating by an electric heating rod or heating kerosene, as shown in fig. 5 and 6, the laminating machines comprise a substrate 01, the electric heating rod 02 or a coil 02 for heating kerosene to flow is arranged in the substrate 01, and in the heating process, most of heat generated by the electric heating rod 01 or the heating kerosene is consumed by the substrate 01, so that the heat can not directly and effectively act on a circuit board product, which causes energy waste and has the defect of large energy consumption, therefore, an energy-saving self-heating circuit board package is necessary to be researched.
SUMMERY OF THE UTILITY MODEL
To the weak point that exists in the above-mentioned technique, the utility model provides a can effectively reduce energy consumption's energy-saving spontaneous heating circuit board package.
The utility model provides a technical scheme that its technical problem adopted is: an energy-saving self-heating circuit board package, comprising: a pair of self-heating plate bodies which are symmetrically arranged up and down; the circuit board unit is positioned between the pair of self-heating plate bodies; the self-heating plate body comprises a plate body and a heating layer arranged on the plate body and used for assisting in heating of the circuit board unit, and the circuit board unit is clamped between the heating layers through a lower cover plate and an upper cover plate.
Preferably, the plate body comprises a main plate body and a coating layer coated on the main plate body, wherein the heating layer is positioned on the outer layer surface of the coating layer.
Preferably, the thickness of the main plate body ranges from 0.3 mm to 50mm, the hardness HV ranges from 120 mm to 700 mm, the temperature resistance range is 400 ℃ to 1000 ℃, and the resistance is 0 ohm.
Preferably, the thickness of the coating layer ranges from 10 to 100 mu m, the hardness HV ranges from 300 to 800, the temperature resistance range is 400 to 2000 ℃, and the resistance is more than 106Europe.
Preferably, the thickness of the heating layer ranges from 5 to 50 μm, and the temperature resistance ranges from 100 to 1000 ℃.
Preferably, the heating layer is a conductor with a certain resistance and the resistance value range is 0-100 ohms.
Preferably, the lower cover plate is arranged at the bottom of the circuit board unit, the upper cover plate is arranged at the top of the circuit board unit, the lower cover plate is arranged between the circuit board unit and the heating layer at the bottom, the upper cover plate is arranged between the circuit board unit and the heating layer at the top, the heating layer at the bottom is arranged on the top end surface of the board body below, and the heating layer at the top is arranged on the bottom end surface of the board body above.
Preferably, the circuit board unit comprises circuit board products and pressing plates clamped between the circuit board products, wherein the circuit board products and the pressing plates are distributed at intervals.
Preferably, the circuit board unit includes circuit board products, mirror plates clamped between the circuit board products, and copper foils wound between the mirror plates and the circuit board products in an S-shaped manner, wherein top ends of the copper foils are connected to the upper cover plate, and bottom ends of the copper foils are connected to the lower cover plate.
Compared with the prior art, the utility model, its beneficial effect is: the utility model provides an energy-saving spontaneous heating circuit board package, its spontaneous heating plate body package includes the plate body and generates heat the layer, and the layer that generates heat sets up on the surface of this plate body, and the layer that generates heat can effectually directly transmit the heat to circuit board unit to avoid unnecessary heat transfer and produce the energy consumption, the effectual energy consumption that has reduced.
Drawings
Fig. 1 is a schematic structural view of the energy-saving self-heating circuit board package of the present invention;
fig. 2 is one of the schematic structural diagrams of the circuit board unit of the present invention;
fig. 3 is a second schematic structural diagram of the circuit board unit of the present invention;
fig. 4 is a schematic sectional structure view of the plate body of the present invention;
FIG. 5 is a schematic view of a structure of an auxiliary heating plate in a conventional laminator;
fig. 6 is a schematic sectional view showing an auxiliary heating plate in a conventional laminator.
In the figure: 10. a plate body; 11. a main board body; 12. a coating layer; 20. a heat generating layer; 30. a circuit board unit; 31. a circuit board product; 32. pressing a plate; 33. a mirror plate; 34. copper foil; 40. a lower cover plate; 50. and an upper cover plate.
Detailed Description
The present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.
As shown in fig. 1, the utility model provides an energy-saving spontaneous heating circuit board package, include: a pair of self-heating plate bodies which are symmetrically arranged up and down; a circuit board unit 30 located between a pair of the self-heating plate bodies; the self-heating plate body comprises a plate body 10 and a heating layer 20 arranged on the plate body 10 and used for assisting in heating the circuit board unit 30, wherein the circuit board unit 30 is clamped between the heating layer 20 through a lower cover plate 40 and an upper cover plate 50. As shown in fig. 5 and 6, the plate 10 in this embodiment corresponds to the substrate 01, the heat generating layer 20 in this embodiment corresponds to the electrical bar 02 or the coil 02 for flowing hot kerosene, a heat source (electrical bar or hot kerosene) of a conventional laminator is disposed inside the substrate 01, heat generated by the heat source needs to be transferred to the circuit board unit 30 through the substrate 01, and unnecessary loss of heat exists.
As an embodiment of this aspect, as shown in fig. 4, the plate 10 includes a main plate 11 and a coating layer 12 coated on the main plate 11, wherein the heat generating layer 20 is located on an outer surface of the coating layer 12.
As an embodiment of the solution, as shown in fig. 4, the thickness of the main board 11 ranges from 0.3 mm to 50mm, the hardness HV ranges from 120 to 700, the temperature resistance ranges from 400 ℃ to 1000 ℃, and the resistance is 0 ohm.
As an embodiment of the scheme, as shown in FIG. 4, the thickness of the coating layer 12 ranges from 10 to 100 μm, the hardness HV ranges from 300 to 800, the temperature resistance ranges from 400 to 2000 ℃, and the resistance is greater than 106Europe.
As an embodiment of the solution, as shown in fig. 1, the thickness of the heat generating layer 20 ranges from 5 to 50 μm, and the temperature resistance ranges from 100 to 1000 ℃.
In an embodiment of the present disclosure, the heating layer 20 is a conductor having a certain resistance and a resistance value range of 0 to 100 ohms.
As an embodiment of the present invention, as shown in fig. 1, the lower cover plate 40 is disposed at the bottom of the circuit board unit 30, and the upper cover plate 50 is disposed at the top of the circuit board unit 30, wherein the lower cover plate 40 is located between the circuit board unit 30 and the bottom heat generating layer 20, the upper cover plate 50 is located between the circuit board unit 30 and the top heat generating layer 20, the bottom heat generating layer 20 is located on the top end surface of the board 10 below, and the top heat generating layer 20 is located on the bottom end surface of the board 10 above.
As an embodiment of the present disclosure, as shown in fig. 2, the circuit board unit 30 includes circuit board products 31 and pressing plates 32 sandwiched between the circuit board products 31, where the circuit board products 31 and the pressing plates 32 are distributed at intervals.
As an embodiment of the present disclosure, as shown in fig. 3, the circuit board unit 30 includes circuit board products 31, mirror plates 33 sandwiched between the circuit board products 31, and copper foils 34 wound between the mirror plates 33 and the circuit board products 31 in an "S" shape, wherein top ends of the copper foils 34 are connected to the upper cover plate 50, and bottom ends of the copper foils 34 are connected to the lower cover plate 40.
While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields of application suitable for this invention, and further modifications may be readily made by those skilled in the art, and the invention is therefore not limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.
Claims (9)
1. An energy-saving spontaneous heating circuit board package which is characterized by comprising:
a pair of self-heating plate bodies which are symmetrically arranged up and down;
a circuit board unit (30) located between the pair of self-heating plate bodies;
the self-heating plate body comprises a plate body (10) and a heating layer (20) which is arranged on the plate body (10) and is used for assisting in heating of the circuit board unit (30), and the circuit board unit (30) is clamped between the heating layer (20) through a lower cover plate (40) and an upper cover plate (50).
2. The energy-saving self-heating circuit board package according to claim 1, wherein the board body (10) comprises a main board body (11) and a coating layer (12) coated on the main board body (11), wherein the heating layer (20) is positioned on an outer surface of the coating layer (12).
3. The energy-saving self-heating circuit board package according to claim 2, wherein the thickness of the main board body (11) ranges from 0.3 mm to 50mm, the hardness HV ranges from 120 mm to 700 mm, the temperature resistance ranges from 400 ℃ to 1000 ℃, and the resistance is 0 ohm.
4. The energy-saving self-heating circuit board package according to claim 2, wherein the thickness of the coating layer (12) ranges from 10 to 100 μm, the hardness HV ranges from 300 to 800, the temperature resistance ranges from 400 to 2000 ℃, and the resistance is more than 106Europe.
5. The energy-saving self-heating circuit board package according to claim 1, wherein the thickness of the heating layer (20) ranges from 5 to 50 μm, and the temperature resistance ranges from 100 to 1000 ℃.
6. The energy-saving self-heating circuit board package according to claim 1, wherein the heating layer (20) is a conductor having a certain resistance and a resistance value range of 0-100 ohms.
7. The energy-saving self-heating circuit board pack according to claim 1, wherein the lower cover plate (40) is disposed at the bottom of the circuit board unit (30), and the upper cover plate (50) is disposed at the top of the circuit board unit (30), wherein the lower cover plate (40) is disposed between the circuit board unit (30) and the bottom heat generating layer (20), the upper cover plate (50) is disposed between the circuit board unit (30) and the top heat generating layer (20), the bottom heat generating layer (20) is disposed on the top end surface of the board body (10) below, and the top heat generating layer (20) is disposed on the bottom end surface of the board body (10) above.
8. The energy-saving self-heating circuit board package according to claim 1, wherein the circuit board unit (30) comprises circuit board products (31), and pressing plates (32) sandwiched between the circuit board products (31), wherein the circuit board products (31) and the pressing plates (32) are distributed at intervals.
9. The energy-saving self-heating circuit board pack according to claim 1, wherein the circuit board unit (30) comprises circuit board products (31), mirror plates (33) sandwiched between the circuit board products (31), and copper foils (34) wound between the mirror plates (33) and the circuit board products (31) in an S-shaped manner, wherein top ends of the copper foils (34) are connected with the upper cover plate (50), and bottom ends of the copper foils (34) are connected with the lower cover plate (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920769807.XU CN210519056U (en) | 2019-05-27 | 2019-05-27 | Energy-saving self-heating circuit board package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920769807.XU CN210519056U (en) | 2019-05-27 | 2019-05-27 | Energy-saving self-heating circuit board package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210519056U true CN210519056U (en) | 2020-05-12 |
Family
ID=70576726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920769807.XU Active CN210519056U (en) | 2019-05-27 | 2019-05-27 | Energy-saving self-heating circuit board package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210519056U (en) |
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2019
- 2019-05-27 CN CN201920769807.XU patent/CN210519056U/en active Active
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