CN203661309U - Thick film heating plate - Google Patents
Thick film heating plate Download PDFInfo
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- CN203661309U CN203661309U CN201320711203.2U CN201320711203U CN203661309U CN 203661309 U CN203661309 U CN 203661309U CN 201320711203 U CN201320711203 U CN 201320711203U CN 203661309 U CN203661309 U CN 203661309U
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- heating plate
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- thick film
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Abstract
The utility model relates to the technical field of electric heating device for fluid, in particular to a thick film heating plate, which comprises a substrate outer shell, wherein a layer of thick film is integrally sintered and formed outside the substrate outer shell. The thick film heating plate has the advantages of simple process, energy conservation, high efficiency, high applicability, high rate of finished products and low cost, has the insulating strength that can reach up to 3000V/AC, is not easy to break down, has the heat utilization rate that can reach more than 98%, and has long service life.
Description
Technical field
The utility model relates to fluid electric heating device technical field, espespecially a kind of thick-film heating plate.
Background technology
Thick-film heating technology is at a substrate, as adopted thick film silk-screen printing technique on stainless-steel sheet, pottery, glass or aluminium sheet, successively on substrate, prints dielectric, heating resistor, conductor and insulating protective layer, the heater element forming through high temperature sintering.Thick film heat energy printing technology is ripe gradually at present, has the advantages that heat conductivility is good, area of dissipation is large and security performance is high, is widely used in heating fields such as various household electrical appliances, instruments because its heat efficiency is high.
But, the current efficiency for fluid heating and performance also do not reach the designing requirement of fully effective utilization, and as electric kettle of the prior art, the one side of its heating plate directly contacts with fluid, and another side contacts with exterior part and air, cause the waste of part of waste heat.And for example in prior art, be used for making the thick-film heating plate of water heater, its general two heating plate laminatings welded seal of adopting, to avoid contacting between thick film circuit on heating plate and fluid to be heated, but heating plate one end because of energising requirement need with fluid isolation to be heated, the heating plate one end of establishing external contact is directly isolated in water heater housing outside by general employing, to avoid electric leakage, such design, not only make the heat exchange of heater be confined on two faces of heating plate, and waste the heat exchange that is provided with in use heating plate one end, external contact, fail fully effectively to utilize its heat efficiency.And, this heater in use, due to the gapless laminating of two heating plates, reduce the heat dispersion of heater, very easily cause heater internal temperature too high, make heater surfaces easily produce incrustation scale or cause heater texturing and burn, above-mentioned useful life of all reducing heater.
Summary of the invention
For the deficiencies in the prior art, the utility model aims to provide a kind of thick-film heating plate, not only technique is simple, energy savings, efficiency is high, applicability is strong, and rate of finished products is high, cost is low,, dielectric strength Gao Keda 3000V/AC, be difficult for puncturing, heat utilization efficiency can reach more than 98%, long service life.
In order to address the above problem, the utility model provides a kind of thick-film heating plate, comprises substrate package, and the outside one sinter molding of described substrate package has one deck thick film.
Described substrate package is cylinder type, and the side direction of axis line of described substrate package offers square groove, offers at least two radial grooves in the upper side of described substrate package.
Described thick film comprises polyimide film, dielectric, conductor and heating resistor, and described dielectric, conductor and heating resistor is printed on respectively on described polyimide film and by 350 DEG C of drying formings.
Upper end in described square groove is provided with temperature controller.
Substrate package top described in described conductor is arranged on is positioned at the both sides of square groove, and described heating resistor is arranged in described radial groove, and the bottom of described substrate package is provided with dielectric.
Beneficial effect: not only technique is simple for the utility model, energy savings, efficiency is high, applicability is strong, and rate of finished products is high, and cost is low,, dielectric strength Gao Keda 3000V/AC, is difficult for puncturing, heat utilization efficiency can reach more than 98%, long service life.
Brief description of the drawings
Fig. 1 is perspective view of the present utility model.
Description of reference numerals: substrate package 1, dielectric 2, conductor 3, heating resistor 4, temperature controller 5.
Embodiment
Describe specific embodiment of the utility model in detail according to Figure of description below:
A kind of thick-film heating plate, comprise substrate package 1, described substrate package 1 is cylinder type, the side direction of axis line of described substrate package 1 offers square groove, in the upper side of described substrate package 1, offer at least two radial grooves, the outside one sinter molding of described substrate package 1 has one deck thick film; Described thick film comprises polyimide film, dielectric 2, conductor 3 and heating resistor 4, and described dielectric 2, conductor 3 and heating resistor 4 is printed on respectively on described polyimide film and by 350 DEG C of drying formings; Upper end in described square groove is provided with temperature controller 5; Substrate package 1 top described in described conductor 3 is arranged on is positioned at the both sides of square groove, and described heating resistor 4 is arranged in described radial groove, and the bottom of described substrate package 1 is provided with dielectric 2.
First, the first step is first cut into polyimide film needed size, then in polyimide film plane, print dielectric 2, and through 350 DEG C of drying and processings, repeat above-mentioned steps 3 times, and then printing heating resistor 4 through 350 DEG C of drying and processings, and then printed conductor 3 form normal temperature dry films through 350 DEG C of drying and processings; Second step, by the dry film of making, be attached to the surface through degreasing substrate package 1, then with the water bag of hydraulic press that water bag is housed, the surface from multiaspect toward substrate package 1 compresses, make close the sticking together of the tight shell of dry film and substrate, pressurize was unclamped after 5 minutes, took out the sticky thick film substrate that is pressed with dry film and put into the high temperature furnace sintering 15 minutes of 850 DEG C, formed the thick-film heating plate that a substrate and normal temperature dry film combine together; Finally NTC temperature controller 5, external power supply and electrical control circuit are installed on thick-film heating plate and are become a complete special-shaped thick-film heating plate.
This product can be widely used in space flight, military, high ferro auxiliary heating, water heater, coffee machine, Barbecuing plate, medical-dental equipment, operation table, air conditioning for automobiles, defroster etc.
The above, it is only preferred embodiment of the present utility model, not technical scope of the present utility model is made to any restriction, therefore any trickle amendment, equivalent variations and modification that every foundation technical spirit of the present utility model is done above embodiment, all still belong in the scope of the technical solution of the utility model.
Claims (2)
1. a thick-film heating plate, is characterized in that: comprise substrate package, the outside one sinter molding of described substrate package has one deck thick film; Described substrate package is cylinder type, and the side direction of axis line of described substrate package offers square groove, offers at least two radial grooves in the upper side of described substrate package; Described thick film comprises polyimide film, dielectric, conductor and heating resistor, and described dielectric, conductor and heating resistor is printed on respectively on described polyimide film and by 350 DEG C of drying formings.
2. a kind of thick-film heating plate according to claim 1, is characterized in that: the upper end in described square groove is provided with temperature controller.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320711203.2U CN203661309U (en) | 2013-11-11 | 2013-11-11 | Thick film heating plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320711203.2U CN203661309U (en) | 2013-11-11 | 2013-11-11 | Thick film heating plate |
Publications (1)
Publication Number | Publication Date |
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CN203661309U true CN203661309U (en) | 2014-06-18 |
Family
ID=50927653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320711203.2U Expired - Fee Related CN203661309U (en) | 2013-11-11 | 2013-11-11 | Thick film heating plate |
Country Status (1)
Country | Link |
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CN (1) | CN203661309U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105142244A (en) * | 2015-08-19 | 2015-12-09 | 成都隆芯科技有限公司 | Heating device capable of heating from bottom part and heating method |
CN105142247A (en) * | 2015-08-19 | 2015-12-09 | 成都隆芯科技有限公司 | Heating device capable of simultaneously heating from bottom part and lateral parts and heating method |
-
2013
- 2013-11-11 CN CN201320711203.2U patent/CN203661309U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105142244A (en) * | 2015-08-19 | 2015-12-09 | 成都隆芯科技有限公司 | Heating device capable of heating from bottom part and heating method |
CN105142247A (en) * | 2015-08-19 | 2015-12-09 | 成都隆芯科技有限公司 | Heating device capable of simultaneously heating from bottom part and lateral parts and heating method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20151111 |