CN210491528U - Composite protective film with efficient heat conduction and shielding effects - Google Patents
Composite protective film with efficient heat conduction and shielding effects Download PDFInfo
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- CN210491528U CN210491528U CN201921398753.7U CN201921398753U CN210491528U CN 210491528 U CN210491528 U CN 210491528U CN 201921398753 U CN201921398753 U CN 201921398753U CN 210491528 U CN210491528 U CN 210491528U
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Abstract
The utility model discloses a composite protective film with high-efficiency heat conduction and shielding effects, the thickness range of the composite protective film is 0.1-5mm, the composite protective film comprises a carrier layer positioned in the middle, and a shielding adhesive layer and a heat-conducting adhesive layer which are respectively coated on the upper surface and the lower surface of the carrier layer, the carrier layer is used for the composition between the shielding adhesive layer and the heat-conducting adhesive layer, and the thickness of the shielding adhesive layer and/or the heat-conducting adhesive layer is larger than that of the carrier layer; the utility model discloses an adopt single complex film structure to realize the effect to electronic equipment's high-efficient heat conduction and electromagnetic shield simultaneously, greatly saved the installation space of electronic equipment terminal product, simple structure simultaneously, just the utility model discloses a relative prior art of manufacturing cost can obviously reduce.
Description
Technical Field
The utility model belongs to a compound protecting film, concretely relates to compound protecting film who has high-efficient heat conduction and shielding effect simultaneously.
Background
When the electronic device works, the electronic device is not expected to be interfered by external electromagnetic waves, and is also not expected to radiate the electromagnetic waves to interfere the external device and cause radiation damage to human bodies, so that the electromagnetic wave propagation path is required to be blocked, and the electromagnetic wave propagation path is generally called electromagnetic shielding. The working principle of electromagnetic shielding is based on the reflection and absorption of electromagnetic waves.
The function of the heat-conducting interface material is to fill the air gap between the heating element and the heat-radiating element, thereby improving the heat-conducting efficiency. When the heat-conducting interface device is not adopted, the effective contact area between the heating element and the radiating element is mostly separated by air, the air is a poor heat conductor and cannot conduct heat effectively, the effective transfer of heat can be realized after the heat-conducting interface device is adopted, and the working stability and the service life of the product are improved.
Electromagnetic shielding and heat dissipation are technical problems that must be overcome when electronic equipment normally operates, and therefore electromagnetic shielding materials and heat conduction materials are widely applied to electronic equipment. In the prior art, people generally apply a heat conducting structure and a shielding structure to electronic equipment respectively to achieve the functions of heat conducting and electromagnetic shielding. With the continuous development demand of miniaturization and system integration of electronic equipment, too much heat conducting and shielding material is difficult to load in a narrow space, and the miniaturization and integration development of the electronic equipment is greatly restricted in order to ensure the heat conducting and shielding effects of the electronic equipment.
Disclosure of Invention
In view of this, the utility model aims at providing a have high-efficient heat conduction and shielding effect's compound protecting film simultaneously, realized adopting single complex film structure to realize the effect to electronic equipment's high-efficient heat conduction and electromagnetic shield simultaneously, greatly saved the installation space of electronic equipment terminal product, simple structure simultaneously, just the utility model discloses a manufacturing cost can obviously reduce compared with prior art.
The utility model adopts the technical scheme as follows:
the utility model provides a compound protecting film that has high-efficient heat conduction simultaneously and shield effect, the thickness scope of compound protecting film is 0.1-5mm, including the carrier layer that is located the centre, and coats respectively the shielding glue film and the heat-conducting glue layer of carrier layer upper and lower surface, the carrier layer is used for the complex between shielding glue film and the heat-conducting glue layer, just shielding glue film and/or the thickness of heat-conducting glue layer is greater than the thickness of carrier layer.
Preferably, the surface of shielding glue film sets up first from type protective film layer the surface of heat-conducting glue film sets up the second from type protective film layer.
Preferably, the thickness of the carrier layer ranges from 20 to 80 μm, the thickness of the shielding adhesive layer ranges from 40 to 200 μm, and the thickness of the thermal conductive adhesive layer ranges from 40 to 200 μm.
Preferably, the thickness of the first release protecting film layer ranges from 20 to 80 μm, the thickness of the second release protecting film layer ranges from 20 to 80 μm, and the thickness of the first release protecting film layer is equal to the thickness of the second release protecting film layer.
Preferably, the support layer is selected from one of a polyimide film, a polyethylene naphthalate film, a PET film, a glass cloth, and a non-woven fabric.
Preferably, the material of the shielding adhesive layer is selected from one of wave-absorbing material, conductive adhesive, graphite and graphene; the material of the heat-conducting adhesive layer is selected from heat-conducting composite materials or organic silicon heat-conducting silica gel with flexibility or phase change property, and the heat-conducting adhesive layer can also be prepared from acrylic acid, polyurethane and the like.
Preferably, the first release protecting film layer and the second release protecting film layer are made of film or paper materials removed from the pressure sensitive adhesive, and may specifically be made of PET release films or release papers.
The utility model discloses a set up and coat shielding glue film and heat-conducting glue film respectively on carrier layer upper and lower surface, this structure forms compound protective film, and the shielding glue film mainly plays and blocks the propagation path of electromagnetic wave, realizes the electromagnetic shield function to the electronic equipment chip, and the carrier layer is used for shielding the compound between glue film and the heat-conducting glue film; the heat conduction glue film effectively in time transmits away the heat that the electronic equipment chip produced, will the utility model discloses a can have high-efficient heat conduction and shielding effect simultaneously after the complex film is applied to electronic equipment, has greatly saved the installation space of electronic equipment terminal product, simple structure simultaneously, just the utility model discloses a manufacturing cost is equivalent to prior art and adopts heat conduction structure and shielding structure's the cost of controlling half respectively.
Drawings
Fig. 1 is a schematic structural diagram of a composite protective film in embodiment 1 of the present invention.
Detailed Description
The embodiment of the utility model discloses compound protecting film that has high-efficient heat conduction simultaneously and shield effect, the thickness scope of compound protecting film is 0.1-5mm, including the carrier layer that is located the centre to and coating respectively at the shielding glue film and the heat-conducting glue film of carrier layer upper and lower surface, the carrier layer is used for the complex between shielding glue film and the heat-conducting glue film, and the thickness of shielding glue film and/or heat-conducting glue film is greater than the thickness of carrier layer.
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Example 1: referring to fig. 1, a composite protective film with high heat conduction and shielding effects includes a polyimide film 10 as a carrier layer in the middle, the polyimide film having a thickness of about 25 μm, and a shielding adhesive layer 20 and a heat conduction adhesive layer 30 respectively coated on the upper and lower surfaces of the polyimide film, wherein the polyimide film 10 is used for the composite between the shielding adhesive layer 20 and the heat conduction adhesive layer 30; in the embodiment, the shielding adhesive layer 20 is made of a wave-absorbing material prepared from carbonyl iron powder and has a thickness of about 50 μm, the heat-conducting adhesive layer 30 is made of organic silicon heat-conducting silica gel and has a thickness of about 50 μm, the first release protective film layer 40a and the second release protective film layer 40b are the same, and the first release protective film layer 40a and the second release protective film layer 40b are made of a PET release film and have a thickness of about 25 μm; in other embodiments, the thicknesses of the carrier layer, the shielding adhesive layer 20, the heat-conducting adhesive layer 30, the first release protective film layer 40a and the second release protective film layer 40b can be adjusted according to actual needs, so that the thickness of the composite protective film is effectively controlled within the range of 0.1-5mm, and the installation space of a terminal product of the electronic equipment is greatly saved;
it should be noted that the materials of the polyimide film 10, the shielding adhesive layer 20, the thermal conductive adhesive layer 30, and the first release protecting film layer 40a and the second release protecting film layer 40b according to the present embodiment are all obtained from direct purchase in the market, and do not involve improvement of new materials.
In the specific preparation of the embodiment 1, the following preparation methods can be referred to:
(1) and carrier layer pretreatment: wet-coating a pretreatment solution on the surface of the polyimide film 10 and drying to form a dry film, wherein the pretreatment solution can contain one of a hydrosilation cross-linking agent, a coupling agent, a catalyst and naphtha or other pretreatment solutions in the prior art;
(2) coating the heat-conducting glue layer 30: coating organic silicon heat-conducting silica gel on one outer surface of the pretreated polyimide film 10 and curing the silica gel to form a film;
(3) coating a shielding adhesive layer 30: coating a wave-absorbing material glue layer on the other outer surface of the polyimide film 10 and curing to form a film;
(4) and setting a release protective film layer: the outer surfaces of the heat conducting adhesive layer 30 and the shielding adhesive layer 20 are sequentially provided with PET release films as a first release protective film layer 40a and a second release protective film layer 40 b.
Of course, the skilled person can prepare the composite protective film having both high-efficiency heat conduction and shielding effects in this embodiment according to the layer structure of this embodiment and the common general knowledge in this field, and the application has no particular limitation on the preparation method.
The present application also verifies the technical effect of this embodiment 1 with reference to the existing detection standard, and the specific test results are shown in table 1 below:
table 1 technical effect verification data of this example 1
| Performance (Unit) | Example 1 | Test method |
| Coefficient of thermal conductivity (W/m.K) | 2 | Hot Disc |
| Density (g/cc) | 4.5 | ASTM D792 |
| Hardness (Shore 00) | 56 | ASTM D2240 |
| Tensile Strength (psi) | 60 | ASTM D638 |
| Operating temperature range (. degree.C.) | -40-180 | / |
| Fire rating | V-0 | UL94 |
| Volume resistivity (Ohm-cm) | 2*1013 | ASTM D257 |
| Dielectric constant @1KHz/1MHz | 5.3/5.1 | ASTM D150 |
| EMI attenuation (dB/cm) @10GHz | 37 | |
| EMI attenuation (dB/cm) @20GHz | 25 |
As can be seen from table 1 above, the thermal conductivity coefficient in this embodiment 1 reaches 2W/m.k, the thermal conductivity effect is excellent, and the application requirements of the electronic device can be completely met in terms of hardness, tensile strength, fire-proof rating and insulating property, and the electromagnetic shielding effect is excellent, and the production cost of this embodiment 1 is equal to half the cost of adopting the thermal conductivity structure and the shielding structure in the prior art respectively.
Example 2: the technical solution of this embodiment 2 is the same as that of embodiment 1, except that: in this example 2, a glass cloth was used as the carrier layer, and the thickness was about 0.6 mm.
Example 3: the technical solution of this embodiment 3 is the same as that of embodiment 1, except that: in this embodiment 3, the material of the shielding glue layer is graphene coated, and the thickness is about 40 μm.
Example 4: the technical solution of this embodiment 4 is the same as that of embodiment 1, except that: in this embodiment 4, the material of the thermal conductive adhesive layer is a thermal conductive composite material in the prior art.
Experiments prove that the embodiment 2-4 also has high-efficiency heat conduction and shielding effects, and is very suitable for scale popularization and application.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides a compound protecting film that has high-efficient heat conduction simultaneously and shield effect which characterized in that, compound protecting film's thickness scope is 0.1-5mm, including the carrier layer that is located the centre, and coats respectively the shielding glue film and the heat-conducting adhesive layer of carrier layer upper and lower surface, the carrier layer is used for the complex between shielding glue film and the heat-conducting adhesive layer, just shielding glue film and/or the thickness of heat-conducting adhesive layer is greater than the thickness of carrier layer.
2. The composite protective film with high-efficiency heat conduction and shielding effects as claimed in claim 1, wherein a first release protective film layer is disposed on the outer surface of the shielding adhesive layer, and a second release protective film layer is disposed on the outer surface of the heat conduction adhesive layer.
3. The composite protective film with high efficiency in heat conduction and shielding as claimed in claim 1, wherein the thickness of the carrier layer is in the range of 20-80 μm, the thickness of the shielding adhesive layer is in the range of 40-200 μm, and the thickness of the heat-conducting adhesive layer is in the range of 40-200 μm.
4. The composite protective film with high-efficiency heat conduction and shielding effects as claimed in claim 2, wherein the thickness of the first release protective film layer is in the range of 20-80 μm, the thickness of the second release protective film layer is in the range of 20-80 μm, and the thickness of the first release protective film layer is equal to the thickness of the second release protective film layer.
5. The composite protective film with high-efficiency heat conduction and shielding effects as claimed in claim 1 or 2, wherein the carrier layer is selected from one of polyimide film, polyethylene naphthalate film, PET film, glass fiber cloth and non-woven fabric.
6. The composite protective film with high-efficiency heat conduction and shielding effects as claimed in claim 1 or 2, wherein the material of the shielding adhesive layer is selected from one of wave-absorbing materials, conductive rubber, graphite and graphene; the material of the heat-conducting glue layer is selected from a heat-conducting composite material or organic silicon heat-conducting silica gel.
7. The composite protective film with both high-efficiency heat conduction and shielding effects as claimed in claim 2, wherein the first release protective film layer and the second release protective film layer are made of PET release film or release paper.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921398753.7U CN210491528U (en) | 2019-08-27 | 2019-08-27 | Composite protective film with efficient heat conduction and shielding effects |
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| CN201921398753.7U CN210491528U (en) | 2019-08-27 | 2019-08-27 | Composite protective film with efficient heat conduction and shielding effects |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023115695A1 (en) * | 2021-12-23 | 2023-06-29 | 清远高新华园科技协同创新研究院有限公司 | Wave-absorbing thermally-conductive composite material, and preparation method therefor and use thereof |
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2019
- 2019-08-27 CN CN201921398753.7U patent/CN210491528U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023115695A1 (en) * | 2021-12-23 | 2023-06-29 | 清远高新华园科技协同创新研究院有限公司 | Wave-absorbing thermally-conductive composite material, and preparation method therefor and use thereof |
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