CN210469420U - Improved main board support supporting cushion structure - Google Patents
Improved main board support supporting cushion structure Download PDFInfo
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- CN210469420U CN210469420U CN201922435492.8U CN201922435492U CN210469420U CN 210469420 U CN210469420 U CN 210469420U CN 201922435492 U CN201922435492 U CN 201922435492U CN 210469420 U CN210469420 U CN 210469420U
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Abstract
The utility model discloses an improved main board support supporting cushion structure, which comprises a heat-conducting adhesive layer, a bent thin sheet layer, an upper end pressure-sensitive adhesive layer, a foam layer, a lower end pressure-sensitive adhesive layer and a waterproof rubber layer which are sequentially arranged in a stacking way from top to bottom; the bent thin sheet layer is in a wavy bent and extended thin sheet structure and is respectively bonded with the lower surface of the heat-conducting adhesive layer and the upper surface of the upper-end pressure-sensitive adhesive layer; the upper surface of the foam layer is adhered to the lower surface of the upper end pressure-sensitive adhesive layer, the lower surface of the foam layer is adhered to the upper surface of the lower end pressure-sensitive adhesive layer, and the upper surface of the waterproof rubber layer is adhered to the lower surface of the lower end pressure-sensitive adhesive layer; the upper surface of the heat-conducting adhesive layer is adhered with a release film layer. Through the structure design, the utility model has the advantages of structural design is novel, the buffering is effectual, the heat conduction radiating effect is good.
Description
Technical Field
The utility model relates to a mobile phone motherboard bearing structure technical field especially relates to a mainboard support cushion structure of improvement.
Background
As an important electronic component inside the mobile phone, the main board is particularly important for the mobile phone. In the production and processing layer of the mobile phone, the mainboard inside the mobile phone is generally installed by the auxiliary supporting cushion of the corresponding mainboard support.
For the existing mobile phone mainboard support cushion, the defects of unreasonable design and poor heat dissipation effect generally exist.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mainboard support cushion structure of improvement to prior art's not enough, the mainboard support cushion structural design of this improvement is novel, buffering effect is good, heat conduction radiating effect is good.
In order to achieve the above purpose, the present invention is achieved by the following technical solutions.
An improved main board support supporting cushion structure comprises a heat-conducting adhesive layer, a bent thin sheet layer, an upper end pressure-sensitive adhesive layer, a foam layer, a lower end pressure-sensitive adhesive layer and a waterproof rubber layer which are sequentially arranged in a stacking mode from top to bottom;
the bent thin sheet layer is in a wavy bent and extended thin sheet structure and is respectively bonded with the lower surface of the heat-conducting adhesive layer and the upper surface of the upper-end pressure-sensitive adhesive layer;
the upper surface of the foam layer is adhered to the lower surface of the upper end pressure-sensitive adhesive layer, the lower surface of the foam layer is adhered to the upper surface of the lower end pressure-sensitive adhesive layer, and the upper surface of the waterproof rubber layer is adhered to the lower surface of the lower end pressure-sensitive adhesive layer;
the upper surface of the heat-conducting adhesive layer is adhered with a release film layer.
Wherein, the bent thin sheet layer is of a metal thin sheet structure.
Wherein, the bent thin sheet layer is a copper sheet structure which is bent and extended in a wave shape.
Wherein, the curved thin sheet layer is an aluminum sheet structure which is curved and extends in a wave shape.
The utility model has the advantages that: the utility model relates to an improved main board support supporting cushion structure, which comprises a heat conducting adhesive layer, a bent thin sheet layer, an upper end pressure sensitive adhesive layer, a foam layer, a lower end pressure sensitive adhesive layer and a waterproof rubber layer which are sequentially arranged in a stacking way from top to bottom; the bent thin sheet layer is in a wavy bent and extended thin sheet structure and is respectively bonded with the lower surface of the heat-conducting adhesive layer and the upper surface of the upper-end pressure-sensitive adhesive layer; the upper surface of the foam layer is adhered to the lower surface of the upper end pressure-sensitive adhesive layer, the lower surface of the foam layer is adhered to the upper surface of the lower end pressure-sensitive adhesive layer, and the upper surface of the waterproof rubber layer is adhered to the lower surface of the lower end pressure-sensitive adhesive layer; the upper surface of the heat-conducting adhesive layer is adhered with a release film layer. Through the structure design, the utility model has the advantages of structural design is novel, the buffering is effectual, the heat conduction radiating effect is good.
Drawings
The invention will be further described with reference to the drawings, but the embodiments in the drawings do not constitute any limitation of the invention.
Fig. 1 is a schematic structural diagram of the present invention.
In fig. 1, included are:
1-thermal conductive adhesive layer 2-curved thin sheet layer
3-upper pressure sensitive adhesive layer 4-foam layer
5-lower pressure sensitive adhesive layer 6-waterproof rubber layer
7-Release film layer.
Detailed Description
The present invention will be described with reference to specific embodiments.
As shown in fig. 1, an improved supporting cushion structure for a motherboard bracket comprises a heat-conducting adhesive layer 1, a curved thin sheet layer 2, an upper-end pressure-sensitive adhesive layer 3, a foam layer 4, a lower-end pressure-sensitive adhesive layer 5 and a waterproof rubber layer 6 which are sequentially arranged from top to bottom in a stacked manner.
The curved thin sheet layer 2 is a thin sheet structure extending in a wave-shaped curved manner, and the curved thin sheet layer 2 is respectively bonded with the lower surface of the heat-conducting adhesive layer 1 and the upper surface of the upper-end pressure-sensitive adhesive layer 3.
Further, the upper surface of the foam layer 4 is bonded with the lower surface of the upper end pressure-sensitive adhesive layer 3, the lower surface of the foam layer 4 is bonded with the upper surface of the lower end pressure-sensitive adhesive layer 5, and the upper surface of the waterproof rubber layer 6 is bonded with the lower surface of the lower end pressure-sensitive adhesive layer 5.
In addition, a release film layer 7 is adhered to the upper surface of the heat-conducting adhesive layer 1.
It is to be explained that the flex foil layer 2 is of a foil construction; further preferably, the curved foil layer 2 is a copper sheet structure or an aluminum sheet structure extending in a wave-shaped curve.
The utility model discloses in the use, tear from the upper surface of heat-conducting adhesive layer 1 with parting film layer 7, and later paste the upper surface of heat-conducting adhesive layer 1 on mobile phone motherboard surface. When the mobile phone is in work, heat generated by a mobile phone mainboard is conducted to the heat-conducting adhesive layer 1, the heat-conducting adhesive layer 1 conducts the heat to the bent thin sheet layer 2, and the heat-conducting adhesive layer 1 has the advantage of high heat-conducting efficiency; for the curved sheet layer 2 of the present invention, the structure extending in a wave-shaped curved shape can form a plurality of convection heat dissipation channels, and the convection heat dissipation channels can effectively improve the convection heat dissipation efficiency; and the wave-shaped bent and extended structure can effectively increase the heat dissipation area, thereby improving the heat dissipation efficiency.
The utility model discloses a waterproof rubber layer 6 is as waterproof layer structure, and it can improve effectively the utility model discloses a water-proof effects.
Still what is more, the bending thin sheet layer 2 of the utility model can bear the extrusion acting force, when the longitudinal extrusion acting force acts on the utility model, the bending thin sheet layer 2 can generate certain elastic deformation; when the longitudinal pressing force is removed, the curved foil layer 2 is elastically restored. In addition, steep cotton layer 4 and do the utility model discloses a buffering main part layer structure, it can increase effectively the utility model discloses a buffering guard action, just the utility model discloses a crooked thin slice layer 2 can further improve buffering guard action.
Synthesize the above-mentioned condition and know, through above-mentioned structural design, the utility model has the advantages of structural design is novel, buffering effect is good, heat conduction radiating effect is good.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (4)
1. The utility model provides a mainboard support cushion structure of improvement which characterized in that: comprises a heat-conducting adhesive layer (1), a bent thin sheet layer (2), an upper-end pressure-sensitive adhesive layer (3), a foam layer (4), a lower-end pressure-sensitive adhesive layer (5) and a waterproof rubber layer (6) which are sequentially arranged in a laminated manner from top to bottom;
the curved thin sheet layer (2) is of a wavy curved extending thin sheet structure, and the curved thin sheet layer (2) is respectively bonded with the lower surface of the heat-conducting adhesive layer (1) and the upper surface of the upper-end pressure-sensitive adhesive layer (3);
the upper surface of the foam layer (4) is bonded with the lower surface of the upper end pressure-sensitive adhesive layer (3), the lower surface of the foam layer (4) is bonded with the upper surface of the lower end pressure-sensitive adhesive layer (5), and the upper surface of the waterproof rubber layer (6) is bonded with the lower surface of the lower end pressure-sensitive adhesive layer (5);
the upper surface of the heat-conducting adhesive layer (1) is adhered with a release film layer (7).
2. An improved motherboard bracket supporting cushioning structure as recited in claim 1, wherein: the bent thin sheet layer (2) is of a metal thin sheet structure.
3. An improved motherboard bracket supporting cushioning structure as recited in claim 2, wherein: the bent thin sheet layer (2) is a copper sheet structure which is bent and extended in a wave shape.
4. An improved motherboard bracket supporting cushioning structure as recited in claim 2, wherein: the curved thin sheet layer (2) is an aluminum sheet structure which is curved and extends in a wave shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922435492.8U CN210469420U (en) | 2019-12-30 | 2019-12-30 | Improved main board support supporting cushion structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922435492.8U CN210469420U (en) | 2019-12-30 | 2019-12-30 | Improved main board support supporting cushion structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210469420U true CN210469420U (en) | 2020-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922435492.8U Active CN210469420U (en) | 2019-12-30 | 2019-12-30 | Improved main board support supporting cushion structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN210469420U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114474904A (en) * | 2022-02-11 | 2022-05-13 | 武汉华星光电半导体显示技术有限公司 | Buffer composite film, preparation method thereof and display device |
-
2019
- 2019-12-30 CN CN201922435492.8U patent/CN210469420U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114474904A (en) * | 2022-02-11 | 2022-05-13 | 武汉华星光电半导体显示技术有限公司 | Buffer composite film, preparation method thereof and display device |
| CN114474904B (en) * | 2022-02-11 | 2024-03-08 | 武汉华星光电半导体显示技术有限公司 | Buffer composite film, preparation method thereof and display device |
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