KR101204718B1 - Thermal conductive plate member having improved thermal conductivity - Google Patents

Abstract

PURPOSE: A thermal conductive plate member having improved thermal conductivity is provided to easily separate a thermal conductive plate member and a heat source by using the difference between adhesive power of a cooling unit and adhesive power of the heat source. CONSTITUTION: A thermal conductive plate member(100) transfers heat from a heat source mounted on a printed circuit board to a cooling unit. The thermal conductive plate member cools the heat. Thermal conductive silicon rubber(110) comprising the thermal conductive plate member has magneto-elasticity and self adhesive power. The adhesive power of the upper side(111) and lower side(112) of the thermal conductive silicon rubber have different adhesive power.

Description

Thermal conductive plate member having improved thermal conductivity

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermally conductive plate-like member, and more particularly, to a thermally-conductive plate-like member that can be efficiently used and is easily attached, easy to assemble, and has improved thermal conductivity.

As electronic devices and information communication devices are miniaturized and integrated, they are affected by heat, static electricity, or electromagnetic waves. For example, as an electronic component, a microprocessor has a higher processing speed and a memory semiconductor has an increased density, which generates a lot of heat and electromagnetic waves, and thus is affected by surrounding heat, static electricity, and electromagnetic waves.

Among these, it is important to quickly release heat generated from an electronic component such as an IC or an LED or a heat source such as an electronic component module to the outside.

To this end, a thermally conductive silicone rubber sheet is applied between a case accommodating an electronic component that generates heat and an electronic component that generates heat, and a case is used as a cooling unit to release heat through the case.

The thermally conductive silicone rubber sheet may be attached to the object using a silicone adhesive tape or attached to the object by the self adhesive force of the thermally conductive silicone rubber sheet.

However, when a thermally conductive silicone rubber sheet having a self-adhesive force is installed between a case and an electronic component, and then the case is separated from the electronic component, the thermally conductive silicone rubber sheet having a self-adhesive strength has a uniform adhesive force, so that the thermally conductive silicone rubber sheet has a uniform adhesive force. Sheets are disadvantageous in that they adhere to the case or adhere to the electronic components.

After separating the case and the electronic component, when the thermally conductive silicone rubber sheet having self-adhesive force is adhered to the electronic component, it is cumbersome and expensive to repair or inspect the electronic component.

In addition, since the electronic component is usually mounted on a printed circuit board, there is a disadvantage that the thermally conductive silicone rubber sheet is a barrier to separate and collect the printed circuit board on which the electronic component to which the thermally conductive silicone rubber sheet is adhered.

In addition, there is a problem in that the assembly efficiency is lowered when applying a method of attaching a thermally conductive silicone rubber sheet to the electronic component and covering the case thereon.

It is therefore an object of the present invention to provide a thermally conductive plate-like member that is easily separated from a heat source upon separation of a cooling unit facing the heating electronic component.

Another object of the present invention is to provide a thermally conductive plate-like member to which the thermally conductive plate-like member is reliably attached to the cooling unit upon separation of the cooling unit facing the heating electronic component.

Another object of the present invention is to provide a thermally conductive plate member having elasticity and flexibility, improved mechanical strength and improved thermal conductivity.

It is another object of the present invention to provide a thermally conductive plate-like member that is easy to attach so as to be interposed between the heat source and the cooling unit and is easy to transfer before the assembly step.

It is another object of the present invention to provide a thermally conductive plate-like member that is easy to post repair or waste disposal.

According to an aspect of the present invention, interposed between the heat source and the cooling unit is used to cool the heat of the heat source by transferring the heat discharged from the heat source to the cooling unit, the sheet-like magnetic elasticity and self-adhesive force It is provided with a heat conductive plate-like member, characterized in that the adhesive force of the upper and lower surfaces are different from each other and made of thermally conductive silicone rubber having a thickness of 0.10 mm to 2 mm.

According to another aspect of the invention, it is interposed between the heat source and the cooling unit is used to cool the heat of the heat source by transferring the heat discharged from the heat source to the cooling unit, the sheet-like magnetic elasticity and self-adhesive force It is made of a thermally conductive acrylate having a thickness of 0.10 mm to 2 mm different from each other and the adhesive strength of the upper surface and the lower surface, In the thermal conductive acrylate, the strong adhesive surface is adhered to the cooling unit and the weak adhesive force is A thermally conductive plate-like member is provided, which is adhered to the heat source.

According to another aspect of the invention, the copper plate or graphite plate which is interposed between the heat source and the cooling unit and used to cool the heat of the heat source by transferring the heat emitted from the heat source to the cooling unit; And first and second thermally conductive silicone rubbers having self-elasticity and self-adhesive strength that are laminated and adhered to the upper and lower surfaces of the copper plate or graphite plate, respectively, wherein the adhesive strengths of the first and second thermally conductive silicone rubbers are mutually There is provided a thermally conductive plate-like member, which is characterized by another feature.

According to still another aspect of the present invention, there is provided a thermally conductive plate-like member interposed between a heat source and a cooling unit, the sheet-shaped thermally conductive silicone rubber having self-adhesion by electric non-conductive and adhering to the heat source; A copper plate or graphite plate laminated on one surface of the silicone rubber by the self-adhesiveness; A double-sided adhesive tape adhered to the copper plate or graphite plate and adhered to the cooling unit; And release paper adhered to the double-sided adhesive tape, wherein a) the thermal conductivity of the copper plate or the graphite plate is greater than that of the silicone rubber, and b) the area of the copper plate or the graphite plate is larger than that of the silicone rubber. c) The adhesive force of the double-sided adhesive tape is provided with a thermally conductive plate member, characterized in that greater than the adhesive strength of the silicone rubber.

According to still another aspect of the present invention, there is provided a thermally conductive plate-like member interposed between a heat source and a cooling unit, the sheet-shaped thermally conductive silicone rubber having self-adhesion by electric non-conductive and adhering to the heat source; A copper plate or graphite plate laminated on one surface of the silicone rubber by the self-adhesiveness; A first double-sided adhesive tape adhered to the copper plate or graphite plate and adhered to the cooling unit; And a second double-sided adhesive tape adhered to a portion of the copper plate or graphite plate on which the silicon rubber is not laminated. A first release paper and a second release paper adhered to the first and second double-sided adhesive tapes, wherein a) thermal conductivity of the copper plate or graphite plate is greater than that of the silicone rubber, and b) of the copper plate or graphite plate. An area is larger than that of the silicone rubber, and c) the adhesive force of the double-sided adhesive tape is greater than the adhesive strength of the silicone rubber is provided with a thermally conductive plate-like member.

The heat source may be a heating electronic component or a heating electronic component module, and the cooling unit may include a heat sink, a case, a cover, or a bracket.

Preferably, in the thermally conductive silicone rubber, a surface having strong self adhesive force is adhered to the cooling unit, and a surface having low self adhesive strength is adhered to the heat source.

Preferably, the difference in adhesion between the upper and lower surfaces of the thermally conductive silicone rubber may be 5gf / in or more.

Preferably, the first and second thermally conductive silicone rubbers are self-adhesive to the cooling unit and the heat source, respectively, and the self adhesive force of the first thermally conductive silicone rubber is greater than the self adhesive force of the second thermally conductive silicone rubber.

In addition, the self adhesive force of the upper surface of the second thermally conductive silicone rubber is greater than the self adhesive force of the lower surface of the second thermally conductive silicone rubber.

Preferably, the thickness of the thermally conductive silicone rubber may be thicker than the thickness of the copper plate or graphite plate, the thermally conductive silicone rubber may contain a phase changing material.

Preferably, the thermally conductive silicone rubber may be formed by casting a liquid thermally conductive silicone rubber on the copper plate or the graphite plate and then curing.

Preferably, the release paper is the same as or larger than the area of the double-sided adhesive tape.

Preferably, silver (Ag) may be plated on the surface of the copper plate, and a mesh may be impregnated inside the silicone rubber.

Preferably, the mesh may be thermally conductive or electrically conductive.

Preferably, a plurality of the thermally conductive plate-like members are arranged on the base release paper, the lower surface of the thermally conductive plate-like member is self-adhesive on the base release paper, and the individual release paper is self-adhesive on the upper surface of each thermally conductive plate-like member.

According to the above configuration, in the thermally conductive plate-like member having a self-adhesive force, since the adhesive force of the portion adhered to the heat source is smaller than that of the portion adhered to the cooling unit, when the cooling unit is separated from the heat source, Separation of the heat source is facilitated.

In addition, since the self-adhesive force of the portion adhered to the heat generating electronic component as the heat source is smaller than the adhesion force of the portion adhered to the cooling unit, the thermally conductive plate-like member is reliably attached to the cooling unit when the cooling unit is separated from the heat source.

In addition, the thermally conductive plate-like member is strongly adhered to the cooling unit so that the thermally conductive plate-like member does not fall off during transport of the cooling unit, which is convenient, and assembly with the heat source is more economical in the state where the thermally conductive plate-like member is adhered to the cooling unit.

In addition, since heat is transferred through a copper plate or a graphite plate having a larger heat dissipation area and better thermal conductivity than a thermally conductive plate-like member adhered to the upper surface of the chip as a heat source, heat of the heat generating element can be cooled rapidly.

In addition, since the release paper has a larger area than the double-sided adhesive tape, it is easy to hold by hand and attach to a heat source.

In addition, the thermal conductivity of the copper plate or graphite plate having good thermal conductivity is improved as a whole, and mechanical deformation during processing or assembly is small.

In addition, since the thermally conductive plate-like member is mounted on a cooling unit such as a case, it is easy to repair or separate the printed circuit board on which the electronic component is mounted.

1 shows a thermally conductive plate-like member according to an embodiment of the present invention.
1A shows a thermally conductive plate-like member during manufacture.
FIG. 2 shows an example in which the thermally conductive plate-like member of FIG. 1 is applied.
3 is a cross-sectional view showing a thermally conductive plate-like member according to another embodiment of the present invention.
Figure 4 is a cross-sectional view showing a thermally conductive plate-like member according to another embodiment of the present invention.
FIG. 5 shows an example in which the thermally conductive plate member of FIG. 4 is applied.
6 is a sectional view showing a thermally conductive plate-like member according to another embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, and these embodiments are provided only to those skilled in the art as a thorough understanding of the present invention. Be careful.

1 shows a thermally conductive plate-like member 100 according to an embodiment of the present invention, FIG. 1A shows a thermally conductive plate-shaped member during manufacture, and FIG. 2 is an example of applying the thermally conductive plate-shaped member 100 of FIG. 1. Indicates.

As shown, the thermally conductive plate-like member 100 is interposed between a heat source 10 mounted on a printed circuit board 30, such as a semiconductor chip and a cooling unit 20, such as an aluminum case, from the heat source 10. The heat released is transferred to the cooling unit 20 and used to cool the heat of the heat source 10.

The thermally conductive silicone rubber 110 constituting the thermally conductive plate-like member 100 has a magnetic shape and a magnetic adhesive force in a sheet shape, and the adhesive strengths of the upper surface 111 and the lower surface 112 are different from each other. Here, the self-adhesive force includes the adhesive force due to sticky.

Here, of course, instead of the thermally conductive silicone rubber, thermally conductive acrylates having magnetic elasticity and magnetic adhesive force may be used. In other words, inexpensive thermally conductive acrylates may be used when not used in high temperature environments.

Preferably, the thermally conductive plate-like member 100 may have a sheet-like thickness of 0.10 mm to 2 mm, and has a thermal conductivity of 1 W / m · K or more. In particular, since the thermally conductive plate-like member 100 is thin, it can be effectively used in a mobile communication terminal of a light and thin end, such as a smart phone.

In order to manufacture the thermally conductive silicone rubber 110 having the self-adhesive force of which the self-adhesive force of the upper surface 111 and the lower surface 112 is different, it is manufactured by laminating thermally conductive silicone rubber sheets having different self-adhesive forces, or overall self-adhesive force. After casting by manufacturing the strong thermally conductive silicone rubber (110), the surface to be made small adhesion is buried fine powder, such as aluminum having a thickness of 3㎛ or less than the self-adhesion of thermally conductive silicone rubber or silicone oil and The same liquid organic material may be prepared by thinly coating a thickness of 3 μm or less. In addition, when manufacturing a thermally conductive silicone rubber sheet having a self-adhesive force, the self-adhesive force of the upper and lower surfaces may be different by partially changing working conditions for curing the upper and lower surfaces (for example, UV curing or thermal curing). As such, there are various methods of manufacturing to have different adhesive strengths.

For example, since the self-adhesion of the thermally conductive silicone rubber 110 on the gel can adjust the magnitude of the self-adhesion by the degree of cross-link, it is necessary to adjust the cross-linking conditions or the amount of catalyst and the silicone oil. By adjusting the amount of, the self-adhesive force of the upper and lower surfaces can be different.

That is, according to a conventional technique, the self-adhesive force of the upper and lower surfaces of the thermally conductive silicone rubber 110 may be different from each other during or after manufacturing the thermally conductive silicone rubber 110 having the same self-adhesive force.

The thermally conductive silicone rubber 110 having a different self-adhesive force between the upper surface 111 and the lower surface 112 is manufactured by hardening after casting a liquid thermally conductive silicone rubber.

In order to easily adhere to the object to be adhered, the adhesive strength of the thermally conductive silicone rubber 110 may range from 5 gf / in to 1 kgf / in, but the greater the self-adhesive force, the better. here. 5gf / in means the amount of self-adhesive force that prevents the release paper from detaching during handling such as when the release paper is self-adhesive in actual application, 1kgf / in is reliably adhered to the cooling unit and the cooling unit is separated from the heat source If the mean means the size of the self-adhesive force for maintaining a state of reliably adhered to the cooling unit, the range of these self-adhesive forces should be interpreted to be suitable for the use of the thermally conductive plate-like member of the present invention.

In addition, the difference between the self-adhesive force of the upper surface 111 and the lower surface 112 is preferably 5 gf / in or more, but the greater the difference in the possible self-adhesive force is, the better.

The thermally conductive silicone rubber 110 may be manufactured by casting and curing a liquid thermally conductive silicone rubber in which a thermally conductive inorganic powder such as alumina powder is mixed. Thermally conductive silicone rubber 110 is electrically insulated, but the invention is not so limited.

In addition, the thermally conductive silicone rubber 110 is cast and cured in a sheet shape of a large area on the base release paper 122 and continuously manufactured, and then cut into a required size using a Thompson press blade.

Referring to FIG. 1A, a plurality of thermally conductive plate-shaped members 100 are adhered onto a base release paper 122, and individual release papers 120 are adhered to an upper surface of each of the thermally conductive plate-shaped members 100, each of which is an individual release paper 120. By making the size of the thermally conductive plate-like member 100 larger than the size of the individual release paper 120 can be easily separated.

As described above, using the Thomson press blade, it is possible to cut each of the thermally conductive plate-like member 100 with the individual release paper 120 adhered to the upper surface is arranged on the base release paper 122.

In addition, the thermally conductive silicone rubber 110 may include a phase changing material such as paraffin to change phase when heat is applied, thereby improving thermal conductivity.

In addition, a mechanical reinforcement such as a mesh may be impregnated inside the thermally conductive silicone rubber 110, and the impregnated mesh may have thermal conductivity. In particular, when using an electrically conductive mesh has an electromagnetic shielding effect or an antistatic effect.

In Figure 2, the relative dimensions of each component are shown to be ignored to highlight the features of the thermally conductive plate-like member 100 of the present invention.

Thermally conductive silicone rubber interposed between a chip 10 (eg, a semiconductor chip) that generates heat mounted on a printed circuit board 30 and a case 20 provided to face the chip 10 and cooling the heat. 110 is adhered by self-adhesion.

The thermally conductive silicone rubber 110 is self-adhesive to the case 20, and then the case 20 is assembled to the chip 10 so that the thermally conductive silicone rubber 110 is interposed between the chip 10 and the case 20. This reduces work costs, increases convenience in parts repair, and facilitates separate collection for disposal.

Here, as described above, the self-adhesive force of the upper surface 111 and the lower surface 112 of the thermally conductive silicone rubber 110 having a self-adhesive strength is different from each other, the upper surface 111 having a large adhesive force is applied to the case 20 such as aluminum. The lower surface 112 that is adhered and the adhesive force is relatively small is adhered to the chip 10.

In addition to the chip 10, the heat source may be an electronic component such as an IC and an LED, or an electronic component module using the electronic component. In addition to the case 20, the cooling unit may be a heat sink, a cover, or a bracket.

According to this configuration, when the chip 10 operates as a heat source to release heat during driving, the released heat is transferred to the case 20 through the thermally conductive silicone rubber 110.

In particular, when the case 20 is opened because the adhesive force of the upper surface 111 of the thermally conductive silicone rubber 110 adhered to the case 20 is greater than that of the lower surface 112 adhered to the chip 10. The lower surface 112 of the thermally conductive silicone rubber 110 is separated from the chip 10 so that the thermally conductive silicone rubber 110 is adhered to the case 20.

In addition, the thermally conductive silicone rubber 110 is strongly adhered to the case 20 so that the thermally conductive silicone rubber 110 does not fall during the transfer of the case 20, and the thermally conductive silicone rubber 110 is the case 20. The assembly with the chip 10 in the attached state is much more economical.

3 is a cross-sectional view illustrating a thermally conductive plate-like member 200 according to another embodiment of the present invention.

According to this embodiment, the thermally conductive silicone rubbers 210 and 220 are laminated on the upper and lower surfaces, respectively, with the copper plate or the graphite plate 230 interposed therebetween.

Here, the adhesive force of the thermally conductive silicone rubber 210 adhered to the upper surface of the copper plate or graphite plate 230 is greater than the adhesive force of the thermally conductive silicone rubber 220 adhered to the lower surface.

Here, the thermally conductive silicone rubber 210 adhered to the upper surface of the copper plate or graphite plate 230 is self-adhesive to the case 20, and the thermally conductive silicone rubber 220 adhered to the lower surface is self-adhesive to the chip 10.

Preferably, the thermally conductive silicone rubber 220 adhered to the lower surface of the copper plate or graphite plate 230 is a thermally conductive silicone rubber 110 of FIG. 1 is applied to the lower surface of the copper plate or graphite plate 230. The adhesive force of the upper surface of the silicone rubber 220 is greater than the adhesive force of the lower surface of the thermally conductive silicone rubber 220 adhered to the chip 10.

According to this structure, as in the above embodiment, the self-adhesive force of the thermally conductive silicone rubber 210 adhered to the case 20 is larger than the self-adhesive force of the thermally conductive silicone rubber 220 adhered to the chip 10. Therefore, when the case 20 is opened, the thermally conductive silicone rubber 220 is separated from the chip 10 and the thermally conductive silicone rubber 110 not only maintains a state of being adhered to the case 20, but also the thermally conductive silicone rubber ( 220) Since the adhesive force of the upper surface is greater than the adhesive force of the lower surface in itself, the case where the upper surface of the copper plate or the graphite plate 230 and the thermally conductive silicone rubber 220 does not occur.

The thermal conductivity of the thermally conductive plate-like member 200 according to this embodiment is 3W / m.K or more, and the thickness of the thermally conductive silicone rubbers 210 and 220 is formed thicker than the thickness of the copper plate or the graphite plate 230.

The thermally conductive silicone rubbers 210 and 220 may be formed by casting a liquid thermally conductive silicone rubber on the copper plate or the graphite plate 230 and then curing.

As described above, the thermal conductivity of the thermally conductive plate-shaped member 200 is improved by the copper plate or the graphite plate 230, and the mechanical strength is improved.

4 is a cross-sectional view illustrating a thermally conductive plate member 300 according to another exemplary embodiment of the present invention, and FIG. 5 illustrates an example in which the thermally conductive plate member of FIG. 4 is applied.

As shown, a copper plate or graphite plate 320 is laminated on a sheet-shaped thermally conductive silicone rubber 310 adhered to the chip 10 as a heat source, and a double-sided adhesive tape 330 is laminated thereon, and a double-sided adhesive tape ( The release paper 340 is adhered on the 330.

Here, the total thickness of the thermally conductive plate-like member 300 including the silicone rubber 310, the copper plate or the graphite plate 320, and the double-sided adhesive tape 330 is preferably 1.5 mm or less, and the smartphone in this thickness range. It can be effectively used in the mobile communication terminal of the light and thin terminal.

The thermally conductive silicone rubber 310 has the same adhesive force as a whole, or as shown in Figure 1, the adhesive force of the upper surface may be formed larger than the adhesive force of the lower surface. In either case, it has elasticity and flexibility and is self-adhesive so that it can be easily attached or detached from the chip 10.

The silicone rubber 310 may be formed to be the same as or slightly smaller than the area of the top surface of the chip 10 to which the silicone rubber 310 is adhered, and the thermal conductivity of the silicone rubber 310 is 1 W / mK or more. The thickness of the 310 is formed thicker than the thickness of the copper plate or graphite plate (320).

A reinforcing material such as a mesh may be impregnated inside the silicone rubber 310, and the impregnated mesh may have thermal conductivity or electrical conductivity.

The copper plate or graphite plate 320 is larger than the area of the silicone rubber 310, has a thickness of approximately 5 μm to 30 μm, and has a larger thermal conductivity than the silicon rubber 310. In addition, the thickness of the copper plate or graphite plate 320 may be thinner than the thickness of the silicone rubber (310).

In the case of a copper plate, either a rolled or electrolytic copper plate is applied, there is no dimensional deformation and does not increase, and has its own strength, and in particular, may have an electromagnetic shielding effect. Optionally, silver (Ag) having excellent thermal conductivity may be plated on the surface of the copper plate to improve thermal conductivity and additionally prevent corrosion, and graphite or graphene may be coated.

In addition, when a graphite plate is applied, it has excellent horizontal thermal conductivity and has an electromagnetic shielding effect.

The area of the copper plate or graphite plate 320 may be larger than that of the heat sink 40 so that the copper plate or the graphite plate 320 itself may be used as a heat radiating member. That is, the limit of thermal conductivity of the heat sink 40 and the double-sided adhesive tape 330 made of aluminum may be assisted by using the copper plate or the graphite plate 320.

The double-sided adhesive tape 330 may be made of acrylic or silicon-based material, and may have an area equal to or larger than that of the copper plate or the graphite plate 320.

The double-sided adhesive tape 330 has a greater adhesive force than the self-adhesive force of the silicone rubber 310 and may have thermal conductivity. In order for the double-sided adhesive tape 330 to have thermal conductivity, it may be implemented by adding a thermally conductive powder. In this case, although the adhesive strength is somewhat reduced, the double-sided adhesive tape 330 may be at least larger than the self adhesive strength of the silicone rubber 310.

The release paper 340 is formed to be the same as or larger than the area of the double-sided adhesive tape 330, in particular, when formed large as shown in Figure 4, the release paper 340 can be easily removed from the double-sided adhesive tape 330.

Preferably, the thermal conductivity of the thermally conductive plate-like member 300 having the above structure may be 3W / m.K or more.

In Figure 5, the relative dimensions of each component are shown to be neglected to highlight the features of the thermally conductive plate-like member 300 of the present invention.

Silicone rubber 310 is adhered to the upper surface of the chip 10 mounted on the substrate 30 by self-adhesion, as described above, the adhesive area of the silicone rubber 310 is equal to the area of the upper surface of the chip 10. Or slightly smaller.

At this time, the release paper 340 attached to the top of the thermal conductive plate-like member 300 is peeled off. The release paper 340 can be easily separated by forming an area of the release paper 340 larger than that of the double-sided adhesive tape 330. have.

The heat dissipation member, for example, the heat sink 40 is positioned on the upper surface of the double-sided adhesive tape 330, and as a result, the double-sided adhesive tape 330 is adhered to the heat sink 40.

According to this configuration, when the chip 10 operates as a heat source and releases heat during driving, the released heat is transferred to the heat sink 40 through the copper plate or graphite plate 320 and the double-sided adhesive tape 330. .

Therefore, since heat is transferred through the copper plate or the graphite plate 320 having a larger heat dissipation area and greater thermal conductivity than the silicon rubber 310 adhered to the upper surface of the chip 10, which is a heat source, heat conduction can be made quickly.

In addition, although the area of the copper plate or the graphite plate 320 is larger than the area of the silicone rubber 310, the silicon rubber 310 is not adhered to the double-sided adhesive tape 330 adhered to the heat sink 40. The part that does not fall down does not fall down.

In addition, since the adhesive force of the double-sided adhesive tape 330 adhered to the heat sink 40 is greater than that of the thermally conductive silicone rubber 310 adhered to the chip 10, the heat sink 40 is separated from the chip 10. In this case, the thermally conductive silicone rubber 310 is separated from the chip 10 so that the double-sided adhesive tape 330 is not only adhered to the heat sink 40 but also the upper surface of the thermally conductive silicone rubber 310 itself. Since the adhesive force is greater than the adhesive force of the lower surface, the case where the upper surface of the copper plate or the graphite plate 320 and the thermally conductive silicone rubber 310 is separated does not occur.

In addition, since the release paper 340 has a larger area than the double-sided adhesive tape 330, the release paper 340 is easily attached to the chip 10 by the hand.

6 is a cross-sectional view showing a thermally conductive plate member 400 according to another embodiment of the present invention.

As shown, a copper plate or a graphite plate 420 is laminated on the sheet-shaped thermally conductive silicone rubber 410 adhered to the chip 10, and a double-sided adhesive tape 430 is laminated thereon, and on the double-sided adhesive tape 430. Release paper 440 is attached to constitute a thermally conductive plate-like member 400.

According to this embodiment, the double-sided adhesive tape (on the bottom of the copper plate or graphite plate 420 is not attached to the portion of the silicone rubber 410, that is, the edge portion of the outer side of the silicone rubber 410 around the silicone rubber 410 ( 450 is adhered, and the release paper 460 is adhered on the double-sided adhesive tape 450.

Double-sided adhesive tape 450 is formed to extend wider than the edge of the copper plate or graphite plate 420 to form a sag down.

Therefore, unlike FIG. 4, in the structure in which the chip 10 is mounted on the substrate 30 by the bump electrodes formed on the bottom surface thereof, the silicone rubber 410 is adhered to the upper surface of the chip 10, and the substrate ( 30) or the double-sided adhesive tape 450 is adhered to the structure.

According to this configuration, although the adhesive strength of the silicone rubber 410 is slightly smaller, the adhesive strength with the chip 10 is inferior, but the double-sided adhesive tape 450 having a large adhesive force may be auxiliary to the substrate 30 to improve the adhesive force. have.

On the other hand, as a whole, the adhesive area between the double-sided adhesive tape 430 and the heat sink 40 is larger than the adhesive area between the double-sided adhesive tape 450 and the substrate 30 and the double-sided adhesive tape 450 is stretched to partially cover the substrate ( 30, the boundary between the silicone rubber 410 and the chip 10 and the boundary between the double-sided adhesive tape 450 and the substrate 30 are separated even when the heat sink 40 is pulled out as described above. do.

The present invention has been described above with reference to the preferred embodiments, and various changes can be made at the level of those skilled in the art. Therefore, the scope of the present invention should not be construed as being limited to the above embodiment, but should be interpreted by the claims described below.

100, 200, 300, 400: thermally conductive plate member
110, 210, 220, 310, 410: thermally conductive silicone rubber
230, 320, 420: copper plate or graphite plate
330, 430: double sided adhesive tape
340, 440: release paper

Claims (25)

It consists of a single body, has a magnetic elasticity and self-adhesive force, the adhesive force of the upper surface is made of a thermally conductive silicone rubber sheet greater than the adhesive force of the lower surface,
The top surface of the thermally conductive silicone rubber sheet is self-adhesive to the cooling unit, and the bottom surface of the thermally conductive silicone rubber sheet is self-adhesive to the heat source to transfer heat emitted from the heat source to the cooling unit and at the same time. When the thermally conductive silicone rubber sheet is separated from the heat source and maintains a state of adhesion to the cooling unit,
The difference between the self adhesion of the upper and lower surfaces of the thermally conductive silicone rubber sheet is
Iii) different working conditions for curing the upper and lower surfaces when manufacturing the thermally conductive silicone rubber sheet;
Ii) A thermally conductive plate-like member, which is implemented by any one of a method of adjusting the crosslinking conditions of the thermally conductive silicone rubber sheet or controlling the amount of catalyst or silicone oil. delete delete delete The method according to claim 1,
The heat source includes a heating electronic component or a heating electronic component module,
The cooling unit is a heat conductive plate-like member, characterized in that it comprises a heat sink, case, cover or bracket. delete delete delete delete delete delete delete The method according to claim 1,
And the thermally conductive silicone rubber sheet contains a phase changing material. The method according to claim 1,
Thermally conductive plate-like member, characterized in that the mesh (impregnated) inside the thermally conductive silicone rubber sheet. delete delete The method according to claim 14,
And the mesh is thermally conductive or electrically conductive. First and second thermally conductive silicone rubber sheets made of a single body, having magnetic elasticity and self-adhesive force, and the adhesive force on the upper surface thereof being greater than the adhesive force on the lower surface thereof; And
It comprises a copper plate or graphite plate interposed between the first and second thermally conductive silicone rubber sheet,
The self adhesive force of the first thermally conductive silicone rubber sheet is greater than the self adhesive force of the second thermally conductive silicone rubber sheet,
The difference in the self-adhesive force of the upper and lower surfaces of each of the first and second thermally conductive silicone rubber sheets is
Iii) different working conditions for curing the upper and lower surfaces when manufacturing the thermally conductive silicone rubber sheet,
Ii) a thermally conductive plate-like member, which is implemented by any one of a method of adjusting the crosslinking conditions of the thermally conductive silicone rubber sheet or controlling the amount of catalyst or silicone oil. 19. The method of claim 18,
And the first and second thermally conductive silicone rubber sheets are formed by casting a liquid thermally conductive silicone rubber on the copper plate or the graphite plate and then curing the sheet. 19. The method of claim 18,
Silver (Ag) is plated on the surface of the copper plate, characterized in that the thermally conductive plate-like member. The method according to claim 1 or 18,
A plurality of the thermally conductive plate-like member is arranged on the base release paper, the bottom surface of the thermally conductive plate-like member is self-adhesive on the base release paper, the individual release paper is self-adhesive on the upper surface of each thermally conductive plate-like member Plate-like member. The method according to claim 1 or 18,
The difference between the adhesive force between the upper surface and the lower surface is a thermally conductive plate member, characterized in that more than 5gf / in. delete delete The method according to claim 1 or 18,
The thermally conductive plate-like member is a thermally conductive plate-like member, characterized in that applied to the mobile communication terminal including a mobile phone.

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