CN210468376U - Semiconductor laser chip welding jig - Google Patents
Semiconductor laser chip welding jig Download PDFInfo
- Publication number
- CN210468376U CN210468376U CN201921697339.6U CN201921697339U CN210468376U CN 210468376 U CN210468376 U CN 210468376U CN 201921697339 U CN201921697339 U CN 201921697339U CN 210468376 U CN210468376 U CN 210468376U
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- briquetting
- laser chip
- mount
- semiconductor laser
- avris
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 title claims abstract description 17
- 230000002146 bilateral effect Effects 0.000 claims abstract description 4
- 230000006978 adaptation Effects 0.000 claims description 5
- 230000006835 compression Effects 0.000 abstract description 6
- 238000007906 compression Methods 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses a semiconductor laser chip welding jig, the on-line screen storage device comprises a base, the bilateral symmetry fixed mounting of base up end has two supports, the support is "T" shape structure, two of falling be provided with the mount between the support, the centre of mount bottom is provided with middle briquetting, one side of mount bottom is provided with the avris briquetting, the up end of base is provided with the casing, the inside of casing is provided with the fixing base. This semiconductor laser chip welding jig adopts avris briquetting and bottom to fix the laser chip when the middle briquetting of ladder shape is to the semiconductor laser welding, fixes same laser chip through two adjacent briquetting, and the power of a briquetting acts on two laser chips simultaneously, guarantees the inside laser chip atress homogeneity of whole laser, effectively promotes laser chip welded planarization, effectively promotes the maneuverability of laser facula compression plastic.
Description
Technical Field
The utility model relates to a laser technical field specifically is a semiconductor laser chip welding jig.
Background
Semiconductor lasers are the most practical and important class of lasers. It has small size and long service life, can be pumped by adopting a simple current injection mode, and has the working voltage and current compatible with an integrated circuit, so that the integrated circuit can be monolithically integrated with the integrated circuit. And may also be directly current modulated at frequencies up to GHz to obtain high speed modulated laser output. Because of these advantages, semiconductor diode lasers have found wide applications in laser communication, optical storage, optical gyros, laser printing, ranging, and radar.
Semiconductor laser need weld laser chip in process of production, but present semiconductor laser welding jig when fixed to laser chip, the power that acts on laser chip is inhomogeneous, has reduced laser chip welding's planarization, is not convenient for use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor laser chip welding jig to the current semiconductor laser welding jig is appearing offering in solving above-mentioned background art when fixed to laser chip, and the power that acts on laser chip is inhomogeneous, has reduced laser chip welded planarization, the problem of not being convenient for to use.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor laser chip welding jig, includes the base, the bilateral symmetry fixed mounting of base up end has two supports, the support is for falling "T" shape structure, two be provided with the mount between the support, the centre of mount bottom is provided with middle briquetting, one side of mount bottom is provided with the avris briquetting, the up end of base is provided with the casing, be provided with ladder heat sink (7) in casing (6), be provided with laser chip (8) on ladder heat sink (7).
Preferably, the upper end surface of the base is provided with a groove, the shell is positioned in the groove, and the groove is matched with the shell.
Preferably, the shaft hole has been seted up to the avris of support, the both ends fixed mounting of mount has the connecting axle, the mount passes shaft hole and support fixed connection through the connecting axle.
Preferably, the through-hole has been seted up to the up end equidistant of mount, the inside of through-hole is provided with the screw, equal fixed mounting has the spring between mount and middle briquetting and the avris briquetting, the screw is located the inboard of spring, threaded connection between screw and middle briquetting and the avris briquetting.
Preferably, the bottom of the middle pressing block is step-shaped, the upper end face of the fixing seat is also step-shaped, the step at the bottom of the middle pressing block is matched with the step at the upper end face of the stepped heat sink, the upper end face and the lower end face of the fixing frame are both step-shaped, and the step at the bottom of the fixing frame is matched with the upper end faces of the middle pressing block and the side pressing block.
Compared with the prior art, the beneficial effects of the utility model are that: this semiconductor laser chip welding jig adopts avris briquetting and bottom to fix the laser chip when the middle briquetting of ladder shape is to the semiconductor laser welding, fixes same laser chip through two adjacent briquetting, and the power of a briquetting acts on two laser chips simultaneously, guarantees the inside laser chip atress homogeneity of whole laser, effectively promotes laser chip welded planarization, effectively promotes the maneuverability of laser facula compression plastic.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the three-dimensional structure of the present invention;
FIG. 3 is a schematic view of the structure at the position A of the present invention;
FIG. 4 is a schematic view of the base structure of the present invention;
FIG. 5 is a schematic view of the fixing frame of the present invention;
FIG. 6 is a schematic view of the structure of the middle pressing block of the present invention;
fig. 7 is a schematic view of the structure of the side pressing block of the present invention.
In the figure: 1. a base; 2. a support; 3. a fixed mount; 4. pressing the middle block; 5. side pressing blocks; 6. a housing; 7. a stepped heat sink; 8. a laser chip; 9. a groove; 10. a shaft hole; 11. a connecting shaft; 12. a through hole; 13. a screw; 14. a spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a semiconductor laser chip welding jig, the on-line screen storage device comprises a base 1, support 2, mount 3, middle briquetting 4, avris briquetting 5, casing 6, ladder is heat sink 7, laser chip 8, recess 9, shaft hole 10, connecting axle 11, through-hole 12, screw 13 and spring 14, the bilateral symmetry fixed mounting of base 1 up end has two supports 2, support 2 is "T" shape structure down, be provided with mount 3 between two supports 2, the centre of mount 3 bottom is provided with middle briquetting 4, one side of mount 3 bottom is provided with avris briquetting 5, base 1's up end is provided with casing 6, 6 inside ladder heat sinks (7) that are provided with of casing, be provided with laser chip (8) on ladder heat sink (7).
Further, base 1 up end is seted up flutedly 9, and casing 6 is located inside flutedly 9, and recess 9 and casing 6 looks adaptation carry out the block through flutedly 9 to casing 6 and fix.
Further, the shaft hole 10 has been seted up to the avris of support 2, and the both ends fixed mounting of mount 3 has connecting axle 11, and mount 3 passes shaft hole 10 and support 2 fixed connection through connecting axle 11, carries out unsettled installation to mount 3 through support 2 and the connecting axle 11 that sets up.
Further, through-hole 12 has been seted up to the up end equidistant of mount 3, the inside of through-hole 12 is provided with screw 13, equal fixed mounting has spring 14 between mount 3 and middle briquetting 4 and the avris briquetting 5, screw 13 is located spring 14's inboard, threaded connection between screw 13 and middle briquetting 4 and the avris briquetting 5, spring 14 has certain tension, it adjusts control to spring 14's compression length through twisting screw 13, briquetting 4 and the power of avris briquetting 5 effect on laser chip 8 in the middle of the final control, simultaneously, the power of briquetting 4 is used in two laser chip 8 in the middle of the power of one, guarantee the inside laser chip 8 atress homogeneity of whole laser instrument, effectively promote the 8 welded planarization of laser chip, effectively promote the maneuverability of laser facula compression plastic.
Further, the bottom of middle briquetting 4 is the step form, the up end of ladder heat sink 7 also is the step form of ladder form, the step of middle briquetting 4 bottom and the step looks adaptation of the up end of ladder heat sink 7, the up end and the lower terminal surface of mount 3 are the step form, the step of mount 3 bottom and the up end looks adaptation of middle briquetting 4 and avris briquetting 5, it is fixed to carry out effective block through the middle briquetting 4 of the ladder form that sets up and laser chip 8 when avris briquetting 5 is to semiconductor laser welding, wherein two adjacent middle briquetting 4 can be fixed same laser chip 8.
The working principle is as follows: firstly, place casing 6 inside recess 9 of base 1 up end, it is fixed to carry out the block through recess 9 to casing 6, then put laser chip 8 neatly on the inside step of casing 6 again, pass through-hole 12 fixed mounting on support 2 through connecting axle 11 with mount 3 again, then twist screw 13, adjust control to the compression length of spring 14, briquetting 4 and avris briquetting 5 effect are on the power of laser chip 8 in the middle of the final control, wherein, the power of a middle briquetting 4 is used in on two laser chip 8, guarantee the inside laser chip 8 atress homogeneity of whole laser instrument, effectively promote the smoothness of laser chip 8 welding, effectively promote the maneuverability of laser facula compression plastic.
It should be finally noted that the above only serves to illustrate the technical solution of the present invention, and not to limit the scope of the present invention, and that simple modifications or equivalent replacements performed by those skilled in the art to the technical solution of the present invention do not depart from the spirit and scope of the technical solution of the present invention.
Claims (5)
1. The utility model provides a semiconductor laser chip welding jig, includes base (1), its characterized in that: the utility model discloses a laser chip mounting structure, including base (1), support (2), mount (3), briquetting (4) in the middle of mount (3) bottom, the one side of mount (3) bottom is provided with avris briquetting (5), the up end of base (1) is provided with casing (6), be provided with ladder heat sink (7) in casing (6), be provided with laser chip (8) on ladder heat sink (7), the bilateral symmetry fixed mounting of base (1) up end has two supports (2), support (2) are for falling "T" shape structure, two be provided with mount (3) between support (2), the centre of mount (3) bottom is provided with middle briquetting (4.
2. A semiconductor laser chip bonding jig according to claim 1, characterized in that: the upper end face of the base (1) is provided with a groove (9), the shell (6) is located inside the groove (9), and the groove (9) is matched with the shell (6).
3. A semiconductor laser chip bonding jig according to claim 1, characterized in that: shaft hole (10) have been seted up to the avris of support (2), the both ends fixed mounting of mount (3) has connecting axle (11), mount (3) pass shaft hole (10) and support (2) fixed connection through connecting axle (11).
4. A semiconductor laser chip bonding jig according to claim 1, characterized in that: through-hole (12) have been seted up to the up end equidistant of mount (3), the inside of through-hole (12) is provided with screw (13), equal fixed mounting has spring (14) between mount (3) and middle briquetting (4) and avris briquetting (5), screw (13) are located the inboard of spring (14), threaded connection between screw (13) and middle briquetting (4) and avris briquetting (5).
5. A semiconductor laser chip bonding jig according to claim 1, characterized in that: the bottom of middle briquetting (4) is the step form, the up end of the heat sink of ladder (7) also is the step form, the step of middle briquetting (4) bottom and the step looks adaptation of the heat sink of ladder (7) up end, the up end and the lower terminal surface of mount (3) are the step form, the step of mount (3) bottom and the up end looks adaptation of middle briquetting (4) and avris briquetting (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921697339.6U CN210468376U (en) | 2019-10-11 | 2019-10-11 | Semiconductor laser chip welding jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921697339.6U CN210468376U (en) | 2019-10-11 | 2019-10-11 | Semiconductor laser chip welding jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210468376U true CN210468376U (en) | 2020-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921697339.6U Active CN210468376U (en) | 2019-10-11 | 2019-10-11 | Semiconductor laser chip welding jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210468376U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690643A (en) * | 2019-10-11 | 2020-01-14 | 江苏天元激光科技有限公司 | Semiconductor laser chip welding jig |
-
2019
- 2019-10-11 CN CN201921697339.6U patent/CN210468376U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690643A (en) * | 2019-10-11 | 2020-01-14 | 江苏天元激光科技有限公司 | Semiconductor laser chip welding jig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Entrepreneurship Service Center, High-tech Zone, No. 99, Zhulin Road, Danyang City, Zhenjiang City, Jiangsu Province 212300 Patentee after: Jiangsu Skyera Laser Technology Co.,Ltd. Address before: 212300 No.8, high tech industrial concentration zone, Danyang City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU SKYERALASER TECHNOLOGY CO.,LTD. |
|
| CP03 | Change of name, title or address |