CN210449971U - Ceramic disc scrubbing structure for wafer scrubbing - Google Patents

Ceramic disc scrubbing structure for wafer scrubbing Download PDF

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Publication number
CN210449971U
CN210449971U CN201921065579.4U CN201921065579U CN210449971U CN 210449971 U CN210449971 U CN 210449971U CN 201921065579 U CN201921065579 U CN 201921065579U CN 210449971 U CN210449971 U CN 210449971U
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CN
China
Prior art keywords
plate
scrubbing
negative pressure
rotary table
fixedly connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201921065579.4U
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Chinese (zh)
Inventor
蒋宇飞
蒋焰云
朱建国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Symantec Technology Co Ltd
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Wuxi Symantec Technology Co Ltd
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Filing date
Publication date
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Priority to CN201921065579.4U priority Critical patent/CN210449971U/en
Application granted granted Critical
Publication of CN210449971U publication Critical patent/CN210449971U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a ceramic dish that is used for wafer to scrub scrubs structure, comprising a base plate, the top of bottom plate is equipped with the revolving stage, the interior roof fixedly connected with closing plate of revolving stage, form sealed negative pressure chamber between closing plate and the revolving stage, the fixed a plurality of air duct of inlaying of interior roof of revolving stage, the bottom and the negative pressure chamber of air duct are linked together, the top of air duct extends to the top of revolving stage and fixed intercommunication has rubber suction cup, the bottom surface fixedly connected with negative pressure pump of closing plate. The utility model relates to a rational in infrastructure, it can take the air of negative pressure intracavity out through the negative pressure pump, makes to produce the adsorption affinity between rubber suction cup and the ceramic dish, makes the ceramic dish fix on rubber suction cup, can avoid the ceramic dish to receive just power to collide with and damage, through pneumatic telescopic rod, can not only highly adjust the brush, can adjust the brush moreover to the dynamics of scrubbing of ceramic dish, reduces the wearing and tearing to ceramic dish at the scrubbing in-process.

Description

Ceramic disc scrubbing structure for wafer scrubbing
Technical Field
The utility model relates to a technical field is scrubbed to technical semiconductor equipment, specifically is a ceramic dish scrubbing structure for wafer is scrubbed.
Background
The ceramic disc is a circular ceramic consumable material for polishing and brushing semiconductor wafers, and a coating formed by piling up wafer dust is accumulated on the surface of the ceramic disc after the ceramic disc is used, and the ceramic disc can be repeatedly used after being cleaned.
The ceramic disc needs to be fixed in the brushing process and then is brushed, and the ceramic disc is easy to be damaged by being collided by a rigid force in the brushing or fixing process due to the fact that the ceramic disc is fragile and hard in texture. To this end, we provide a ceramic disk scrubbing structure for wafer scrubbing that solves the above problems.
SUMMERY OF THE UTILITY MODEL
One) technical problem to be solved
The utility model aims at making up the deficiency of the prior art and providing a ceramic plate brushing structure for wafer brushing.
II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a ceramic disc brushing structure for wafer brushing comprises a bottom plate, wherein a rotary table is arranged above the bottom plate, a sealing plate is fixedly connected to the inner top wall of the rotary table, a sealed negative pressure cavity is formed between the sealing plate and the rotary table, a plurality of air guide tubes are fixedly embedded in the inner top wall of the rotary table, the bottom ends of the air guide tubes are communicated with the negative pressure cavity, the top ends of the air guide tubes extend to the upper side of the rotary table and are fixedly communicated with a rubber sucker, a negative pressure pump is fixedly connected to the bottom surface of the sealing plate, an air inlet of the negative pressure pump is communicated with the negative pressure cavity, a supporting plate is fixedly mounted in the rotary table, a motor is fixedly connected to the upper surface of the bottom plate, and an;
the upper surface of the bottom plate is fixedly provided with two supporting plates which are parallel, the top ends of the supporting plates are provided with top plates, the top ends of the two supporting plates are fixedly connected with the bottom surface of the top plate, one side surface of the two supporting plates, which is close to each other, is provided with a sliding groove, the two sliding grooves are symmetrical, a brush seat is arranged between the two supporting plates, the bottom surface of the brush seat is provided with a brush, the left end and the right end of the brush seat respectively extend to the inside of the sliding groove and are in sliding contact with the sliding groove, and the upper surface of the brush seat is arranged on the bottom surface of the top plate through two;
the brush is characterized in that a spray head is arranged above the brush seat, the top end of the spray head is fixedly communicated with a water guide pipe, and the top end of the water guide pipe penetrates through the top plate and extends to the upper portion of the top plate.
Furthermore, a plurality of drain holes are formed in the outer wall of the rotary table and are located above the supporting plate.
Furthermore, the bottom end of the rotary table is fixedly connected with a water retaining cylinder, and the water retaining cylinder is of a circular truncated cone shape.
Furthermore, the supporting plate is disc-shaped, and the edge of the supporting plate is connected with the inner wall of the rotary table in a sealing mode.
Furthermore, the motor is a stepping motor with the brand model of Mitsubishi HG-KR053, the stepping motor further comprises a starter, and the brand model of a driver of the stepping motor is Mitsubishi MR-J4-10A.
Furthermore, four mounting grooves are formed in the left side and the right side of the upper surface of the bottom plate, and the four mounting grooves are close to four corners of the bottom plate respectively.
III) beneficial effects
Compared with the prior art, the ceramic disc brushing structure for wafer brushing has the following beneficial effects:
firstly, the method comprises the following steps: the utility model discloses an air of negative pressure intracavity is taken out to the negative pressure pump, makes to produce the adsorption affinity between rubber suction cup and the ceramic dish, makes the ceramic dish fix on rubber suction cup, can avoid the ceramic dish to receive just power to collide with and damage, through pneumatic telescopic handle, can not only highly adjust the brush, can adjust the brush moreover to the dynamics of scrubbing of ceramic dish, reduces the wearing and tearing to the ceramic dish at the scrubbing in-process, improves the scrubbing effect.
Secondly, the method comprises the following steps: the utility model discloses a manger plate section of thick bamboo of round platform type of revolving stage bottom design can effectively avoid splashing the motor under the round platform at the sewage of scrubbing the in-process to keep the dry operational environment of motor, can prolong the life of motor, improve this work stability who scrubs the structure.
Drawings
Fig. 1 is a cross-sectional view of a front view of the ceramic disc brushing structure of the present invention;
fig. 2 is a front view of the ceramic plate brushing structure of the present invention;
fig. 3 is a top view of the rotary table and the brush holder of the present invention.
In the figure: 1. a base plate; 2. a support plate; 3. mounting grooves; 4. a motor; 5. a support plate; 6. a turntable; 7. a sealing plate; 8. a negative pressure chamber; 9. an air duct; 10. a rubber suction cup; 11. a chute; 12. a top plate; 13. a pneumatic telescopic rod; 14. a brush holder; 15. a brush; 16. a water conduit; 17. a spray head; 18. a negative pressure pump; 19. a water retaining cylinder; 20. and (4) draining the water.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-3, the utility model provides a technical solution: a ceramic plate brushing structure for wafer brushing comprises a bottom plate 1, wherein a rotary table 6 is arranged above the bottom plate 1, a sealing plate 7 is fixedly connected to the inner top wall of the rotary table 6, a sealed negative pressure cavity 8 is formed between the sealing plate 7 and the rotary table 6, a plurality of air guide tubes 9 are fixedly embedded in the inner top wall of the rotary table 6, the bottom ends of the air guide tubes 9 are communicated with the negative pressure cavity 8, the top ends of the air guide tubes 9 extend to the upper side of the rotary table 6 and are fixedly communicated with a rubber sucker 10, a negative pressure pump 18 is fixedly connected to the bottom surface of the sealing plate 7, the air inlet of the negative pressure pump 18 is communicated with the negative pressure cavity 8, a supporting plate 5 is fixedly installed in the rotary table 6, a motor 4 is fixedly connected to the upper;
the upper surface of the bottom plate 1 is fixedly provided with two supporting plates 2, the two supporting plates 2 are parallel, the top ends of the supporting plates 2 are provided with a top plate 12, the top ends of the two supporting plates 2 are fixedly connected with the bottom surface of the top plate 12, one side surface of the two supporting plates 2 close to each other is provided with a sliding groove 11, the two sliding grooves 11 are symmetrical, a brush seat 14 is arranged between the two supporting plates 2, the bottom surface of the brush seat 14 is provided with a brush 15, the left end and the right end of the brush seat 14 respectively extend into the sliding groove 11 and are in sliding contact with the sliding groove 11, and the upper surface of the brush seat 14 is arranged on the bottom surface of the top;
a spray head 17 is arranged above the brush seat 14, a water guide pipe 16 is fixedly communicated with the top end of the spray head 17, and the top end of the water guide pipe 16 penetrates through the top plate 12 and extends to the upper part of the top plate 12.
Further, the outer wall of the turntable 6 is provided with a plurality of water drainage holes 20, and the water drainage holes 20 are located above the supporting plate 5. During the operation of the device, part of water discharged by the negative pressure pump 18 is accumulated above the supporting plate 5, accumulated water on the supporting plate 5 can be discharged under the action of centrifugal force through the water discharge holes 20, and the interior of the rotary table 6 is kept dry.
Further, the bottom end of the rotary table 6 is fixedly connected with a water blocking cylinder 19, and the water blocking cylinder 19 is of a circular truncated cone shape. The water blocking cylinder 19 can effectively prevent sewage in the brushing process from splashing to the motor 4 under the circular truncated cone, so that the dry working environment of the motor 4 is kept, and the service life of the motor 4 can be prolonged.
Further, the supporting plate 5 is disc-shaped, and the edge thereof is hermetically connected with the inner wall of the turntable 6. This scheme can avoid ponding on the layer board 5 to spill 4 motors on, further keeps 4 dry operational environment of motor, can prolong the life of motor.
Further, the motor 4 is a servo motor with the brand model of Mitsubishi HG-KR053, the servo motor further comprises a starter, and the brand model of a driver of the servo motor is Mitsubishi MR-J4-10A. The servo motor can control the rotation speed more accurately, and the use performance of the device is optimized.
Further, four mounting grooves 3 are formed in the left side and the right side of the upper surface of the bottom plate 1, and the four mounting grooves 3 are close to four corners of the bottom plate 1 respectively. Through four mounting grooves 3, the installation of this device of can being convenient for is fixed.
The working principle is as follows: put the ceramic dish on rubber suction cup 10, the air in the negative pressure chamber 8 is taken out through negative pressure pump 18, make and produce the adsorption affinity between rubber suction cup 10 and the ceramic dish, make the ceramic dish fix on rubber suction cup 10, then it is rotatory with the pottery to drive revolving stage 6 through motor 4, rethread brush 15 is scrubbed the ceramic dish, aqueduct 16 and shower nozzle 17 are used for providing the washing water, do concertina movement through pneumatic telescopic rod 13, can not only adjust the height of brush 15, and can adjust the scrubbing dynamics of brush 15 to the ceramic dish.
It should be noted that, in this document, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A ceramic disc scrubbing structure for wafer scrubbing, comprising a base plate (1), characterized in that: a rotary table (6) is arranged above the bottom plate (1), a sealing plate (7) is fixedly connected with the inner top wall of the rotary table (6), a sealed negative pressure cavity (8) is formed between the sealing plate (7) and the turntable (6), a plurality of air ducts (9) are fixedly embedded in the inner top wall of the rotary table (6), the bottom ends of the air ducts (9) are communicated with the negative pressure cavity (8), the top end of the air duct (9) extends to the upper part of the rotary table (6) and is fixedly communicated with a rubber sucker (10), the bottom surface of the sealing plate (7) is fixedly connected with a negative pressure pump (18), the air inlet of the negative pressure pump (18) is communicated with the negative pressure cavity (8), a supporting plate (5) is fixedly arranged in the rotary table (6), the upper surface of the bottom plate (1) is fixedly connected with a motor (4), an output shaft of the motor (4) is fixedly connected with the bottom surface of the supporting plate (5);
the upper surface of the bottom plate (1) is fixedly provided with two supporting plates (2), the two supporting plates (2) are parallel, the top ends of the supporting plates (2) are provided with a top plate (12), the top ends of the two supporting plates (2) are fixedly connected with the bottom surface of the top plate (12), one side surface, close to each other, of the two supporting plates (2) is provided with a sliding groove (11), the two sliding grooves (11) are symmetrical, a brush seat (14) is arranged between the two supporting plates (2), the bottom surface of the brush seat (14) is provided with a brush (15), the left end and the right end of the brush seat (14) respectively extend into the sliding groove (11) and are in sliding contact with the sliding groove (11), and the upper surface of the brush seat (14) is installed on the bottom surface of the top plate (12) through two pneumatic telescopic rods (13);
a spray head (17) is arranged above the brush seat (14), a water guide pipe (16) is fixedly communicated with the top end of the spray head (17), and the top end of the water guide pipe (16) penetrates through the top plate (12) and extends to the upper side of the top plate (12).
2. A ceramic disk scrubbing structure for wafer scrubbing as defined in claim 1, wherein: the outer wall of the rotary table (6) is provided with a plurality of drain holes (20), and the drain holes (20) are positioned above the supporting plate (5).
3. A ceramic disk scrubbing structure for wafer scrubbing as defined in claim 1, wherein: the bottom end of the rotary table (6) is fixedly connected with a water blocking cylinder (19), and the water blocking cylinder (19) is of a circular table shape.
4. A ceramic disk scrubbing structure for wafer scrubbing as defined in claim 1, wherein: the supporting plate (5) is disc-shaped, and the edge of the supporting plate is connected with the inner wall of the rotary table (6) in a sealing mode.
5. A ceramic disk scrubbing structure for wafer scrubbing as defined in claim 1, wherein: the motor (4) is a stepping motor with the brand model of Mitsubishi HG-KR053, the stepping motor further comprises a starter, and the brand model of a driver of the stepping motor is Mitsubishi MR-J4-10A.
6. A ceramic disk scrubbing structure for wafer scrubbing as defined in claim 1, wherein: four mounting grooves (3) are formed in the left side and the right side of the upper surface of the bottom plate (1), and the four mounting grooves (3) are close to four corners of the bottom plate (1) respectively.
CN201921065579.4U 2019-07-09 2019-07-09 Ceramic disc scrubbing structure for wafer scrubbing Expired - Fee Related CN210449971U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921065579.4U CN210449971U (en) 2019-07-09 2019-07-09 Ceramic disc scrubbing structure for wafer scrubbing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921065579.4U CN210449971U (en) 2019-07-09 2019-07-09 Ceramic disc scrubbing structure for wafer scrubbing

Publications (1)

Publication Number Publication Date
CN210449971U true CN210449971U (en) 2020-05-05

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ID=70444699

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921065579.4U Expired - Fee Related CN210449971U (en) 2019-07-09 2019-07-09 Ceramic disc scrubbing structure for wafer scrubbing

Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112474462A (en) * 2020-12-02 2021-03-12 世科工业设计沧州有限公司 Semiconductor wafer surface cleaning device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112474462A (en) * 2020-12-02 2021-03-12 世科工业设计沧州有限公司 Semiconductor wafer surface cleaning device
CN112474462B (en) * 2020-12-02 2022-06-24 浙江汇隆晶片技术有限公司 Semiconductor wafer surface cleaning device

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20200505

Termination date: 20210709