CN210444587U - Double-sided etching device - Google Patents
Double-sided etching device Download PDFInfo
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- CN210444587U CN210444587U CN201920664656.1U CN201920664656U CN210444587U CN 210444587 U CN210444587 U CN 210444587U CN 201920664656 U CN201920664656 U CN 201920664656U CN 210444587 U CN210444587 U CN 210444587U
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- 238000005530 etching Methods 0.000 title claims abstract description 97
- 238000001035 drying Methods 0.000 claims abstract description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000005406 washing Methods 0.000 claims abstract description 36
- 239000002351 wastewater Substances 0.000 claims abstract description 29
- 125000006850 spacer group Chemical group 0.000 claims abstract description 11
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 4
- 238000005507 spraying Methods 0.000 claims description 132
- 238000005192 partition Methods 0.000 claims description 20
- 238000004064 recycling Methods 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 abstract description 31
- 230000000694 effects Effects 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 21
- 239000007788 liquid Substances 0.000 description 10
- 238000003825 pressing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000008399 tap water Substances 0.000 description 3
- 235000020679 tap water Nutrition 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 235000012149 noodles Nutrition 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The utility model relates to a high frequency copper-clad plate production field, concretely relates to two-sided etching device, including the spray segment, be equipped with open-close type spray leaf in the spray segment, etching solution flows through first spray leaf and second respectively through pressure conveyor and sprays in the leaf, spray to the circuit board surface through the nozzle, circuit board after the etching is carried to the washing section, places in the spacer groove in the washing section, lets in the quick washing of rivers, carries to the stoving section again, absorbs water by the layer that absorbs water and dries the layer simultaneously of drying, and the waste water that spray segment and washing section produced still can recycle after adsorbing copper ion, the utility model discloses two-sided etching device simple structure, etching effect is good, and etching waste water still can recycle, has advantages such as environmental protection and energy saving.
Description
Technical Field
The utility model relates to a high frequency copper-clad plate production field, concretely relates to two-sided etching device.
Background
Etching is an indispensable processing step before the performance test of the copper-clad plate, a double-sided etching machine is equipment for removing copper foils on two sides of the copper-clad plate by using a chemical etching method in the copper-clad plate industry, and a chemical solution (etching solution) with hydrochloric acid as a main component is used in the chemical etching to achieve the purpose of removing the copper foils on the surface through chemical reaction.
In the etching process of the double-sided etching machine, the main process is as follows: feeding, etching with chemical solution (spraying with the same etching solution on two surfaces), washing with circulating water 1, washing with circulating water 2, washing with commercial water, sucking absorbent cotton, drying by blowing with strong wind, and discharging to complete copper-clad plate etching.
As described above, in the etching process of the conventional double-sided etching machine, 3 washing steps are performed in total, and the purpose of washing is to clean the etching solution on the surface of the copper-clad plate, so that in the washing process, the concentration of the etching solution in the circulating water tank is higher and higher, and the etching solution in the etching solution tank is less and less, so that the circulating water in the circulating water tank needs to be replaced periodically, the waste water is discharged into the waste water tank, and the etching solution tank needs to be added with a certain proportion of chemical solution and tap water periodically. While the double-sided etching machine brings convenience, the following disadvantages exist:
the waste water generated by etching pollutes the environment, which is contrary to the environmental protection policy advocated vigorously at present.
The etching waste water can not be poured at will, and needs qualified recovery mechanisms to recover periodically, thereby increasing the cost consumption.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a spray even, washing effectual, can fast drying, etching waste water can recycle's two-sided etching device.
The utility model discloses a following technical scheme realizes:
a double-sided etching device comprises a spraying section, wherein a first etching support and a second etching support are arranged in the spraying section and used for placing a circuit board;
the etching solution is positioned above the circuit board, the upper spraying device comprises a spraying rod, a first spraying page and a second spraying page, the first spraying page and the second spraying page are rotatably connected with the spraying rod, the first spraying page and the second spraying page rotate independently, the first spraying page and the second spraying page are symmetrically arranged by taking the spraying rod as a symmetry axis, the shape and the structure of the first spraying page are completely consistent with those of the second spraying page, the inner pages of the first spraying page and the second spraying page are both provided with a nozzle and a solution storage space communicated with the nozzle, the inner pages of the first spraying page and the second spraying page are directed to one surface of the circuit board, and the etching solution respectively flows through the solution storage spaces arranged on the first spraying page and the second spraying page through a pressure conveying device and is sprayed to the surface of the circuit board through the nozzle;
the lower spraying device is positioned below the circuit board, the lower spraying device and the upper spraying device are arranged in a vertically symmetrical mode, and the shape and the structure of the upper spraying device are completely consistent with those of the lower spraying device and are completely independent.
Further preferably, the nozzle is a needle nozzle.
Further preferably, first etching support and second etching support bottom and sliding tray sliding connection, first etching support is close to or keeps away from along the sliding tray with the second etching support, and first etching support is injectd the position in the sliding tray by stop device with the second etching support.
Preferably, the first spraying page is driven by a first driving device to rotate, and a partition plate is arranged between the first spraying page and the second spraying page;
the first driving device comprises a limit switch arranged between the first spraying page and the partition plate, the limit switch is electrically connected with the driving motor through a first control circuit, the first control circuit is disconnected when the limit switch is pressed down, the first control circuit is connected when the limit switch is lifted up, and the first limit switch is in a pressed state when the angle between the first spraying page and the partition plate is positioned between the initial included angle angles;
an infrared signal generator is arranged on a row of nozzles closest to the circuit board on the first spraying page;
the infrared sensor corresponding to the infrared signal generator is arranged on the first etching bracket and used for receiving the infrared rays generated by the infrared signal generator;
the infrared signal generator, the infrared sensor, the first etching bracket and the first spraying page are positioned on the same side of the spraying rod;
the infrared sensor collects signals sent by the infrared signal generator and feeds the signals back to the second control circuit, and the second control circuit drives the first driving motor to change the rotation direction according to the feedback signals;
when the limit switch is lifted, the first driving motor is started in the forward direction to drive the first spraying page to open outwards to rotate in a trial mode, when the first spraying page rotates to an angle at which a signal sent by the infrared signal generator can be collected by the infrared sensor, the second control circuit drives the first driving motor to change the rotating direction according to a feedback signal, namely the first spraying page rotates inwards in a closed mode, when the angle between the first spraying page and the partition plate is equal to the initial angle, the limit switch is pressed down, the circuit is cut off, and the first driving motor stops rotating;
the second spraying leaf is driven by a second driving device to rotate, and the structure of the second driving device and the driving mode of the second spraying leaf are completely consistent with those of the first driving device and are independent of each other.
Further preferably, the initial included angle between the first shower blade and the partition plate is set to be 30 to 35 degrees.
Preferably, the double-sided etching device further comprises a washing section, a washing tank is arranged in the washing section, a water inlet and a water outlet are respectively formed in the front direction and the rear direction of the washing tank, a spacing layer is arranged in the washing tank and made of impermeable materials, and water flows from the water inlet to the water outlet through a space layer formed between the spacing layers.
It is further preferred that the distance between the spacer layers is 2-3 times the thickness of the circuit board.
Preferably, the bottom of the rinsing bath is provided with a vibration rod which is driven by a motor.
Preferably, the waste water output by the spraying section and the water washing section flows through a waste water discharge pipe to be recycled to a waste water recycling device, and after copper ions in the waste water are separated by an extraction process, the waste water flows through a waste water recycling pipe and is conveyed to an etching liquid tank for recycling.
Preferably, the double-sided etching device further comprises a drying section, wherein the drying section is internally provided with a drying device, and the drying device comprises a water absorbing layer and a drying layer;
the drying layer is divided into an upper drying surface and a lower drying surface, the bottom of the upper drying surface emits drying heat flow, the top of the lower drying surface emits drying heat flow, and drying air flow is formed between the upper drying surface and the lower drying surface;
the layer that absorbs water sets up at last stoving face under and between the stoving face, and the layer that absorbs water includes netted face and netted face down, and the material that absorbs water is installed to the bottom of netted face, and the material that absorbs water is installed at the top of netted face down, and netted face both sides are equipped with the briquetting on going up, and netted face both sides are equipped with briquetting down, go up through spring coupling between briquetting and the briquetting down, go up the briquetting and compress tightly through closing device between the briquetting down.
The beneficial effects of the utility model reside in that, the utility model discloses the setting of the open-close type leaf that sprays of spray section can improve the etching homogeneity, make solution spray every position of board comprehensively, and make face solution accelerate to flow, the waste water of spray section and washing section recycles once more after the separation is retrieved, when adding chemical solution and the running water of a proportion in the etching cistern, replace the running water with waste water and add etching cistern recycle, the method has significantly reduced the discharge of waste water, the pollution to the environment has been reduced, chemical solution's use amount has still been reduced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the spraying device of the present invention;
FIG. 3 is a schematic view of the inner side surface of the spraying device of the present invention;
FIG. 4 is a schematic structural view of a preferred embodiment of the spray section of the present invention;
description of reference numerals: 1: spraying section, 2: spray rod, 3: first spraying page, 4: a second spraying page, 5: first bearing, 6: second bearing, 7: nozzle, 9: first etching holder, 11: water washing section, 12: rinsing bath, 13: spacer layer, 14: drying section, 15: upper dried noodles, 16: lower oven dried noodles, 17: upper mesh surface, 18: lower mesh, 19: pressing blocks, 20: briquetting, 21: spring, 22: slot, 23: u-shaped bolt.
Detailed Description
For the understanding of the present invention, the following detailed description is given with reference to the accompanying drawings and the embodiments.
As shown in fig. 1 and 2, a double-sided etching apparatus includes a shower section 1, specifically,
an etching support, an upper spraying device and a lower spraying device are arranged in the spraying section, the upper spraying device and the lower spraying device are arranged in a vertically symmetrical mode, and the shape and the structure of the upper spraying device are completely consistent with and completely independent of those of the lower spraying device;
go up spray set and include spray bar 2, first spray page or leaf 3, the second sprays page or leaf 4, first spray page or leaf 3 and install on spray bar 2 through first bearing 5, the second sprays page or leaf 4 and installs on spray bar 2 through second bearing 6, first spray page or leaf 3 and second spray 4 symmetry settings, first spray page or leaf 3 shape and structure and second spray page or leaf 4 completely unanimous, first spray page or leaf 3 and second spray the interior page or leaf of page or leaf 4 and all be equipped with nozzle 7, etching solution flows through pressure conveyor respectively first spray page or leaf 3 and second spray the inside stock solution space of page or leaf 4, stock solution space and nozzle intercommunication, spray to the circuit board surface through nozzle 7.
More preferably, as shown in fig. 3, the nozzle 7 is a needle nozzle.
Preferably, the first spraying blade 3 is driven by a first driving motor to rotate, a partition plate is arranged between the first spraying blade 3 and the second spraying blade 4, and an initial included angle between the first spraying blade 3 and the partition plate is set to be 30-35 degrees;
a first limit switch is arranged between the first spraying leaf 3 and the partition plate, the first limit switch is electrically connected with the first driving motor through a first control circuit, the first control circuit is disconnected when the first limit switch is pressed down, the first control circuit is connected when the first limit switch is lifted up, the first limit switch is arranged between the first spraying leaf 3 and the partition plate, and the first limit switch is in a pressed state when the angle between the first spraying leaf 3 and the partition plate is between the initial included angle angles;
a first infrared signal generator is arranged on the first spraying page 3 and is closest to the row of nozzles of the circuit board;
a first infrared sensor corresponding to the first infrared signal generator is installed on the first etching support 9 and is used for receiving the infrared rays generated by the first infrared signal generator;
the first infrared signal generator, the first infrared sensor, the first etching bracket 9 and the first spraying page 3 are positioned at the same side of the spraying rod 2;
the first infrared sensor collects signals sent by the first infrared signal generator and feeds the signals back to the second control circuit, and the second control circuit drives the first driving motor to change the rotation direction according to the feedback signals;
when the first limit switch is lifted, the first driving motor is started in the forward direction to drive the first spraying page 3 to open outwards to rotate in a trial mode, when the first spraying page is rotated to an angle at which a signal sent by the first infrared signal generator can be collected by the first infrared sensor, the second control circuit drives the first driving motor to change the rotating direction according to a feedback signal, namely the first spraying page 3 rotates inwards in a closed mode, when the angle between the first spraying page 3 and the partition plate is equal to an initial angle, the first limit switch is pressed down, the circuit is cut off, and the first driving motor stops rotating;
the second spraying page 4 is driven by a second driving motor to rotate, a second limit switch is arranged between the second spraying page 4 and the partition plate, the second limit switch is electrically connected with the second driving motor through a third control circuit, the third control circuit is disconnected when the second limit switch is pressed down, the third control circuit is connected when the second limit switch is lifted up, the second limit switch is installed between the second spraying page 4 and the partition plate, and when the angle between the second spraying page 4 and the partition plate is positioned between the initial included angle angles, the second limit switch is in a pressed-down state;
a second infrared signal generator is arranged on the second spraying page 4 and is closest to the row of nozzles of the circuit board;
a second infrared sensor corresponding to the second infrared signal generator is arranged on the second etching bracket and used for receiving the infrared rays generated by the second infrared signal generator;
the second infrared signal generator, the second infrared sensor, the second etching bracket and the second spraying page 4 are positioned at the same side of the spraying rod 2;
the second infrared sensor collects signals sent by the second infrared signal generator and feeds the signals back to the fourth control circuit, and the fourth control circuit drives the second driving motor to change the rotating direction according to the feedback signals;
when the second limit switch is lifted up, the second driving motor is started in the forward direction to drive the second spraying page 4 to open outwards to rotate in a trial mode, when the second spraying page is rotated to an angle which can be acquired by the second infrared sensor through a signal sent by the second infrared signal generator, the fourth control circuit drives the second driving motor to change the rotating direction according to a feedback signal, namely, the second spraying page 4 rotates in an inward closed mode, when the angle between the second spraying page 4 and the partition plate is equal to the initial angle, the second limit switch is pressed down, the circuit is cut off, and the second driving motor stops rotating.
The double-sided etching device has the advantages that the automatic etching can be realized, the design structure of the open-close type spraying blade is simple, the open-close limit of the spraying blade is controlled by combining the needle type nozzle, the etching liquid can be utilized to the maximum extent while the etching liquid is comprehensively sprayed to each part of the board, the waste of the etching liquid is avoided, a certain pressure is formed on the surface of the circuit board after the etching liquid is sprayed out through the nozzle, and the surface action effect of the etching liquid and the circuit board is improved.
Further preferably, the bottoms of the first etching support 9 and the second etching support are slidably connected with the sliding groove, the first etching support 9 and the second etching support are close to or far away from the sliding groove, and the positions of the first etching support 9 and the second etching support are limited in the sliding groove by a limiting device.
Preferably, as shown in fig. 1, the double-sided etching apparatus further includes a washing section 11, a washing tank 12 is disposed in the washing section 11, a water inlet and a water outlet are disposed in the washing tank 12 in the front-back direction, a spacer layer 13 is disposed in the washing tank 12, the spacer layer 13 is made of a water-impermeable material, water flows from the water inlet through a space layer formed between the spacer layers 13 and flows to the water outlet, the distance between the spacer layers 13 is 2-3 times of the thickness of the circuit board, a vibration rod is disposed at the bottom of the washing tank 12, and the vibration rod is driven by a motor.
Above wash bowl's setting, during washing, insert the circuit board and put between the wall, the wall can wash each layer inner circuit board separation, and the separation is washed and is guaranteed the washing independence, avoids the circuit board by secondary pollution or wash unclean, and the wall distance is established to 2-3 times of circuit board thickness, can guarantee to wash the stability of comprehensive and washing in-process circuit board, and this wash bowl's setting not only washes effectually, still has the water conservation effect.
Further preferably, as shown in fig. 1, the double-sided etching device further includes a drying section 14, a drying device is arranged in the drying section 14, the drying device includes a water absorbing layer, the drying layer is divided into an upper drying surface 15 and a lower drying surface 16, the bottom of the upper drying surface 15 emits drying heat flow, the top of the lower drying surface 16 emits drying heat flow, the water absorbing layer is arranged between the upper drying surface 15 and the lower drying surface 16, the water absorbing layer includes an upper mesh surface 17 and a lower mesh surface 18, a water absorbing material is arranged at the bottom of the upper mesh surface 17, the top of the lower mesh surface 18 is provided with the water absorbing material, two sides of the upper mesh surface 17 are provided with upper pressing blocks 19, two sides of the lower mesh surface 18 are provided with lower pressing blocks 20, the upper pressing blocks are connected with the lower pressing blocks through springs 21, the upper pressing blocks 19 and the lower pressing blocks 20 are provided with slots 22 on the same side, and the upper pressing blocks and the lower pressing blocks are inserted into the slots.
Above drying device's setting, through set up the layer that absorbs water between the stoving layer, can effectively save the stoving time, pass on for the circuit board again through absorbing water the layer heat, can improve the stoving homogeneity.
Preferably, the waste water output by the spraying section 1 and the water washing section 11 flows through a waste water discharge pipe to be recycled to a waste water recycling device, and after copper ions in the waste liquid are separated by an extraction process, the waste water flows through a waste water recycling pipe and is conveyed to an etching liquid tank for recycling.
The waste water of the spraying section and the water washing section is recycled after being separated and recycled, and when chemical solution and tap water in a certain proportion are added into the etching liquid tank, the waste water is added into the etching liquid tank instead of the tap water for recycling.
The above embodiments are only preferred embodiments of the present invention, and the present invention is not limited in any way, and all technical solutions obtained by means of equivalent replacement or equivalent transformation should fall within the protection scope of the present invention for those skilled in the art.
Claims (10)
1. A double-sided etching device comprises a spraying section (1), a first etching bracket (9) and a second etching bracket (10) are arranged in the spraying section (1) and used for placing a circuit board, and is characterized in that,
the etching solution spraying device is also arranged above the circuit board and comprises a spraying rod (2), a first spraying page (3) and a second spraying page (4), the first spraying page (3) and the second spraying page (4) are rotatably connected with the spraying rod (2), the first spraying page (3) and the second spraying page (4) rotate independently, the first spraying page (3) and the second spraying page (4) are symmetrically arranged by taking the spraying rod (2) as a symmetry axis, the shape and the structure of the first spraying page (3) are completely consistent with those of the second spraying page (4), the inner pages of the first spraying page (3) and the second spraying page (4) are both provided with a nozzle (7) and a solution storage space communicated with the nozzle (7), the inner pages of the first spraying page (3) and the second spraying page (4) refer to face towards the circuit board, the etching solution respectively flows through the solution storage spaces arranged on the first spraying page (3) and the second spraying page (4) through a pressure conveying device, and sprayed to the surface of the circuit board by a nozzle (7);
the lower spraying device is positioned below the circuit board, the lower spraying device and the upper spraying device are arranged in a vertically symmetrical mode, and the shape and the structure of the upper spraying device are completely consistent with those of the lower spraying device and are completely independent.
2. A double-sided etching apparatus according to claim 1, wherein the nozzle (7) is a needle nozzle.
3. A double-sided etching apparatus according to claim 1, wherein the bottoms of the first etching holder (9) and the second etching holder (10) are slidably connected to the sliding groove, the first etching holder (9) and the second etching holder (10) are close to or away from each other along the sliding groove, and the first etching holder (9) and the second etching holder (10) are limited in position in the sliding groove by a limiting means.
4. A double-sided etching apparatus according to claim 1,
the first spraying page or leaf (3) and the second spraying page or leaf (4) are arranged, the first spraying page or leaf (3) is arranged on the spraying rod (2) through a first bearing (5), the second spraying page or leaf (4) is arranged on the spraying rod (2) through a second bearing (6), and the first bearing (5) and the second bearing (6) are mutually independent;
the first spraying leaf (3) is driven by a first driving device to rotate, and a partition plate (8) is arranged between the first spraying leaf (3) and the second spraying leaf (4);
the first driving device comprises a limit switch arranged between the first spraying leaf (3) and the partition plate (8), the limit switch is electrically connected with the driving motor through a first control circuit, the first control circuit is disconnected when the limit switch is pressed down, the first control circuit is connected when the limit switch is lifted up, and the first limit switch is in a pressed state when the angle between the first spraying leaf (3) and the partition plate (8) is positioned between the initial included angle angles;
an infrared signal generator is arranged on a row of nozzles closest to the circuit board on the first spraying page (3);
an infrared sensor corresponding to the infrared signal generator is arranged on the first etching bracket (9) and is used for receiving the infrared rays generated by the infrared signal generator;
the infrared signal generator, the infrared sensor, the first etching bracket (9) and the first spraying page (3) are positioned at the same side of the spraying rod (2);
the infrared sensor collects signals sent by the infrared signal generator and feeds the signals back to the second control circuit, and the second control circuit drives the first driving motor to change the rotation direction according to the feedback signals;
when the limit switch is lifted, the first driving motor is started in the forward direction to drive the first spraying page (3) to open outwards to rotate in a trial mode, when the first spraying page rotates to an angle at which a signal sent by the infrared signal generator can be collected by the infrared sensor, the second control circuit drives the first driving motor to change the rotating direction according to a feedback signal, namely the first spraying page (3) rotates inwards in a closed mode, when the angle between the first spraying page (3) and the partition plate (8) is equal to an initial angle, the limit switch is pressed down, the circuit is cut off, and the first driving motor stops rotating;
the second spraying page (4) is driven by a second driving device to rotate, and the structure of the second driving device and the mode for driving the second spraying page (4) are completely consistent with those of the first driving device and are mutually independent.
5. A double-sided etching apparatus according to claim 4, wherein an initial angle between the first shower blade (3) and the partition plate (8) is set at 30 to 35 degrees.
6. A double-sided etching apparatus as claimed in claim 1, further comprising a washing section (11), wherein a washing tank (12) is provided in the washing section (11), a water inlet and a water outlet are provided in the washing tank (12) in the front-rear direction, respectively, a spacer layer (13) is provided in the washing tank (12), the spacer layer (13) is made of a water-impermeable material, and water flows from the water inlet through a space layer formed between the spacer layers (13) to the water outlet.
7. A double-sided etching device as claimed in claim 6, characterized in that the distance between the spacer layers (13) is 2-3 times the thickness of the circuit board.
8. A double-sided etching apparatus as defined in claim 6 wherein the bottom of the rinsing bath (12) is provided with a vibration rod driven by a motor.
9. A double-sided etching device as claimed in claim 6, characterized in that the waste water from the spraying section (1) and the water washing section (11) is recycled to the waste water recycling device through a waste water discharge pipe, and after copper ions in the waste water are separated by the extraction process, the waste water passes through a waste water recycling pipe and is conveyed to the etching solution tank for recycling.
10. A double-sided etching apparatus according to claim 6, further comprising a drying section (14), wherein the drying section (14) is provided with a drying device, the drying device comprises a water-absorbing layer, a drying layer;
the drying layer is divided into an upper drying surface (15) and a lower drying surface (16), the bottom of the upper drying surface (15) emits drying heat flow, the top of the lower drying surface (16) emits drying heat flow, and drying airflow is formed between the upper drying surface (15) and the lower drying surface (16);
the layer that absorbs water sets up at last drying surface (15) and between drying surface (16) down, the layer that absorbs water includes netted face (17) and netted face (18) down, go up the bottom of netted face (17) and install the material that absorbs water, the material that absorbs water is installed at the top of netted face (18) down, it is equipped with briquetting (19) to go up netted face (17) both sides, netted face (18) both sides are equipped with down briquetting (20) down, go up the briquetting and connect through spring (21) between the briquetting down, go up briquetting (19) and compress tightly through closing device between briquetting (20) down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920664656.1U CN210444587U (en) | 2019-05-10 | 2019-05-10 | Double-sided etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920664656.1U CN210444587U (en) | 2019-05-10 | 2019-05-10 | Double-sided etching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210444587U true CN210444587U (en) | 2020-05-01 |
Family
ID=70394245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920664656.1U Withdrawn - After Issue CN210444587U (en) | 2019-05-10 | 2019-05-10 | Double-sided etching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210444587U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110113883A (en) * | 2019-05-10 | 2019-08-09 | 无锡睿龙新材料科技有限公司 | A kind of two-sided Etaching device |
-
2019
- 2019-05-10 CN CN201920664656.1U patent/CN210444587U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110113883A (en) * | 2019-05-10 | 2019-08-09 | 无锡睿龙新材料科技有限公司 | A kind of two-sided Etaching device |
| CN110113883B (en) * | 2019-05-10 | 2024-04-02 | 无锡睿龙新材料科技有限公司 | Double-sided etching device |
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