CN210443582U - LED support for firmly installing LED chip - Google Patents
LED support for firmly installing LED chip Download PDFInfo
- Publication number
- CN210443582U CN210443582U CN201921561492.6U CN201921561492U CN210443582U CN 210443582 U CN210443582 U CN 210443582U CN 201921561492 U CN201921561492 U CN 201921561492U CN 210443582 U CN210443582 U CN 210443582U
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- CN
- China
- Prior art keywords
- led
- led chip
- lamp cup
- support
- electrode foot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a make LED support of firm installation of LED chip, include the LED support that is formed by the punching press is taken to the metal material, the LED support includes: first electrode foot and second electrode foot, second electrode foot upper end integrated into one piece has sunken lamp cup, and the lamp cup is used for placing the LED chip, the inside pad net that is provided with metal material of lamp cup supports the LED chip, when the LED chip passes through the viscose and pastes on the lamp cup, fills up the area of contact who increases LED chip and lamp cup, strengthens the adsorption affinity, strengthens heat-sinking capability simultaneously, has increased the area of contact between LED chip and the LED support, improves adhesive force, simultaneously because area of contact's increase, has also strengthened the heat conduction speed of LED chip, has accelerated the heat dissipation.
Description
Technical Field
The utility model belongs to the technical field of the LED support and specifically relates to a LED support that makes firm installation of LED chip is related to.
Background
An LED bracket is arranged on the base plate,LED lamp beadFixing the chip on the bottom base before packaging on the basis of the LED support, welding positive and negative electrodes, and then usingPackaging adhesiveAnd (5) packaging and forming once. led stents are typically made of copper (also iron, aluminum, ceramic, etc.) because of the fact thatThe copper has good conductivity and leads inside for connectionLED lamp bead chipAnd after the LED lamp bead chip is packaged and formed, the lamp bead can be taken down from the support, and copper pins at two ends of the lamp bead become the positive electrode and the negative electrode of the lamp bead and are used for being welded to an LED lamp or other LED finished products.
At present, the LED chip is fixed in the LED bracket through glue, but because the volume of the LED chip is small, and the lamp cup on the LED bracket is generally bowl-shaped, when the LED chip is installed on the LED bracket, the contact area between the LED chip and the LED bracket is small, so that the LED chip is easy to fall off.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an it is not enough to overcome above-mentioned condition, aims at providing the technical scheme that can solve above-mentioned problem.
The utility model provides a make LED support of firm installation of LED chip, includes the LED support that is formed by the punching press of metal material area, and the LED support includes: first electrode foot and second electrode foot, second electrode foot upper end integrated into one piece has sunken lamp cup, and the lamp cup is used for placing the LED chip, the inside pad net that is provided with metal material of lamp cup supports the LED chip, when the LED chip passes through the viscose and pastes the lamp cup on, fills up the area of contact who increases LED chip and lamp cup, strengthens the adsorption affinity, strengthens the heat-sinking capability simultaneously.
As a further aspect of the present invention: the pad net is made of alloy material with good heat dissipation performance.
As a further aspect of the present invention: the LED support is made of copper, and the surface of the LED support is plated with silver.
Compared with the prior art, the beneficial effects of the utility model are that: the contact area between the LED chip and the LED support is increased, the adhesive force is improved, meanwhile, the heat conduction speed of the LED chip is also increased due to the increase of the contact area, and the heat dissipation is accelerated.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic view of a LED support according to the present invention.
Fig. 2 is a schematic structural diagram of the first electrode pin and the second electrode pin of the present invention.
Fig. 3 is a schematic structural diagram of the middle light cup of the present invention.
In the figure: 1. LED support, 2, first electrode foot, 3, second electrode foot, 4, lamp cup, 5, pad net.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be understood that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, in an embodiment of the present invention, an LED bracket for firmly mounting an LED chip includes an LED bracket 1 formed by stamping a metal strip, where the LED bracket 1 includes: first electrode foot 2 and second electrode foot 3, 3 upper end integrated into one piece of second electrode foot have sunken lamp cup 4, and lamp cup 4 is used for placing the LED chip, the inside pad net 5 that is provided with metal material of lamp cup 4 is supporting the LED chip, and when the LED chip passes through the viscose and pastes lamp cup 4, the pad plays the area of contact who increases LED chip and lamp cup 4, strengthens the adsorption affinity, strengthens heat-sinking capability simultaneously.
The pad net 5 is made of alloy material with good heat dissipation performance.
The LED support 1 is made of copper, and the surface of the LED support is plated with silver.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (3)
1. The utility model provides a make LED support of firm installation of LED chip, includes the LED support that is formed by the punching press of metal material area, and the LED support includes: first electrode foot and second electrode foot, its characterized in that, second electrode foot upper end integrated into one piece has sunken lamp cup, and the lamp cup is used for placing the LED chip, the inside pad net that is provided with metal material of lamp cup supports the LED chip, when the LED chip passes through the viscose and pastes the lamp cup on, pads up the area of contact who increases LED chip and lamp cup, strengthens the adsorption affinity, strengthens heat-sinking capability simultaneously.
2. The LED bracket for firmly mounting the LED chip as claimed in claim 1, wherein the mat is made of an alloy material with good heat dissipation performance.
3. The LED holder for firmly mounting the LED chip according to claim 1, wherein the LED holder is made of copper, and the surface of the LED holder is plated with silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921561492.6U CN210443582U (en) | 2019-09-19 | 2019-09-19 | LED support for firmly installing LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921561492.6U CN210443582U (en) | 2019-09-19 | 2019-09-19 | LED support for firmly installing LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210443582U true CN210443582U (en) | 2020-05-01 |
Family
ID=70411074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921561492.6U Expired - Fee Related CN210443582U (en) | 2019-09-19 | 2019-09-19 | LED support for firmly installing LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210443582U (en) |
-
2019
- 2019-09-19 CN CN201921561492.6U patent/CN210443582U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200501 Termination date: 20200919 |