CN210607310U

CN210607310U - High-air-tightness LED support with cup-shaped structure

Info

Publication number: CN210607310U
Application number: CN201921232679.1U
Authority: CN
Inventors: 杨风帆; 宁峥; 许长乐; 周世忠; 陈小刚; 时甲甲; 肖自然; 韩志培; 黄书见
Original assignee: ANHUI SHENGYE ELECTRONICS CO LTD
Current assignee: ANHUI SHENGYE ELECTRONICS CO LTD
Priority date: 2019-07-31
Filing date: 2019-07-31
Publication date: 2020-05-22
Anticipated expiration: 2029-07-31

Abstract

The utility model provides a high gas tightness LED support of cup type structure, include: the reflecting cup body, the lower insulating base and the conductive base; the conductive base comprises a first bonding pad, a second bonding pad and a plurality of welding feet which are respectively connected with the two bonding pads; a plurality of through holes are formed at the connection positions of the first bonding pads and the soldering tin pins connected with the first bonding pads; the conductive base is arranged between the reflective cup body and the lower insulating base, the first bonding pad and the second bonding pad are separated by the insulating groove, the reflective cup body and the lower insulating base are connected through the through hole at the position of the solder foot and are integrally formed to form a rivet structure, so that the combination strength among the reflective cup body, the lower insulating base and the conductive base is enhanced, relative displacement is difficult to occur, the stability of the internal structure of the LED lead frame monomer is favorably ensured, and the air tightness of a product is enhanced; the lower insulating base is coated by the plurality of soldering tin pins. The utility model discloses in, insulating seat under the cladding of soldering tin foot has guaranteed that the installation of soldering tin foot is stable.

Description

High-air-tightness LED support with cup-shaped structure

Technical Field

The utility model relates to a LED technical field especially relates to a high gas tightness LED support of cup type structure.

Background

The LED lead frame is used for packaging an LED device and is used as a carrier of an LED wafer, the conduction and heat conduction of positive and negative electric wires are provided for an LED light source, and meanwhile, the light effect required by the light source is achieved through the adjustment of the angle and the light shape of the light-emitting cup; it acts as a bridge to external wires and is an important base material in the LED industry.

Traditional LED lead frame is because of conductive base and insulating anti-light cup integrated into one piece back, and the associativity is relatively poor, and the infiltration route is shorter, and the gas tightness is relatively poor, leads to the great and life of product use time limit short.

SUMMERY OF THE UTILITY MODEL

Based on the technical problem that the background art exists, the utility model provides a high gas tightness LED support of cup type structure.

The utility model provides a high gas tightness LED support of cup type structure, include: the reflecting cup body, the lower insulating seat and the conductor base;

the conductor base comprises a first bonding pad, a second bonding pad and a plurality of soldering tin feet; a plurality of through holes are arranged at the connection part of the first bonding pad and the soldering tin foot connected with the first bonding pad;

the first bonding pad, the second bonding pad and the plurality of soldering tin feet are all clamped between the reflective cup body and the lower insulating base, the first bonding pad and the second bonding pad are isolated by the insulating groove, and the reflective cup body and the lower insulating base are connected with the plurality of through holes at the connecting positions of the soldering tin feet connected with the reflective cup body through the first bonding pad and are integrally formed; the rivet structure is formed, so that the combination strength among the reflective cup body, the lower insulating base and the conductive base is enhanced, relative displacement is difficult to occur, the stability of the internal structure of the LED lead frame monomer is ensured, and the air tightness of a product is enhanced; the lower insulating seat is coated by the plurality of soldering tin pins;

the reflecting cup body is provided with a cup-shaped groove for mounting the LED light-emitting chip, and is also provided with a first through hole and a second through hole which are communicated with the cup-shaped groove, and the first through hole and the second through hole are isolated by an insulating groove; the LED light-emitting chip positioned in the cup-shaped groove is communicated with the first bonding pad and the second bonding pad through metal wires, namely, one electrode is communicated with the other electrode.

Preferably, the conductor base comprises a plurality of soldering tin pins connected with the first bonding pad, a soldering tin pin connected with the second bonding pad and an overhanging soldering tin pin, and the overhanging soldering tin pin is isolated from the first bonding pad and the second bonding pad through the insulating groove; a plurality of soldering tin feet that link to each other with first pad symmetric distribution is in the both sides that first pad is relative, and a soldering tin foot that links to each other with the second pad and unsettled soldering tin foot are located the both sides that first pad is relative respectively, and a soldering tin foot that links to each other with the second pad and unsettled soldering tin foot are located respectively between a plurality of soldering tin feet that link to each other with first pad.

Preferably, the joints of the first bonding pad and the plurality of solder pins connected with the first bonding pad are respectively provided with a through hole and are distributed in a rectangular shape.

Preferably, at least two anti-seepage grooves are arranged on two opposite sides of each through hole, so that the permeation path of harmful substances is enhanced, and the air tightness of the product is enhanced.

Preferably, each soldering tin foot connected with the first bonding pad is integrally formed with the first bonding pad, and a pre-folding line is arranged at the connecting position of each soldering tin foot and the first bonding pad; the second pad links to each other and welds tin foot and second pad integrated into one piece, and is "T" style of calligraphy with the tin foot that links to each other, and the design of "T style of calligraphy can make it when receiving the exogenic action, can withhold insulating reflection of light cup, restricts it and takes place the displacement to strengthen the gas tightness of product. And the connecting position of each soldering tin foot and each pad all is equipped with broken line in advance, can make product soldering tin foot when buckling, reduces the production of stress, prevents to force the electrically conductive base to take place the displacement because of the stress is too big to strengthen the gas tightness of product.

Preferably, the first through hole is arranged in the middle of the bottom of the cup-shaped groove, and the second through hole is arranged on one side of the bottom of the cup-shaped groove.

Preferably, the first through hole is shaped in a special shape, a protruding pad area is arranged at the upper and lower opposite corners of the first through hole, and the protruding pad area can be used as a bonding wire area. And a positioning mark is arranged on the first bonding pad area corresponding to the first through hole, and the positioning mark is close to the bonding pad area protruding downwards, so that each welding leg can be identified through the positioning marks 3-8, and the LED light-emitting chip is convenient to assemble.

Preferably, a strip-shaped boss is arranged at the middle position of the bottom of the lower insulating base, and the lower insulating base is coated by a plurality of soldering tin feet from two opposite sides of the boss; in order to ensure better tin-absorbing performance of the single tin soldering feet of the LED lead frame, the height of the lug boss is lower than the thickness of each soldering foot.

The utility model provides a high gas tightness LED support of cup type structure pours behind the electrically conductive base of accessible mould centre gripping, obtains integrated into one piece's reflection of light cup and lower insulator seat. In the utility model, the arrangement of the through hole at the connecting part of the soldering tin foot connected with the first bonding pad strengthens the combination force among the reflecting cup body, the lower insulating seat and the conductive base, is difficult to generate relative displacement, and is beneficial to ensuring the stability of the internal structure of the LED lead frame monomer; meanwhile, the possibility of relative displacement between the conductive base and the upper insulation cover reflecting cup body and between the conductive base and the lower insulation cover reflecting cup body is reduced, and the air tightness of the product is enhanced. The pre-folding lines at the soldering tin pins are arranged, so that stress is reduced when the soldering tin pins of the product are bent, and the conductive base is prevented from being forcibly displaced due to overlarge stress, so that the air tightness of the product is further enhanced; the arrangement of the penetrating line at the through hole at the joint of the first bonding pad and the soldering tin pin strengthens the penetrating path of harmful substances, and further strengthens the air tightness of the product; the second bonding pad and the soldering tin foot connected with the second bonding pad are in a T shape, so that the second bonding pad can buckle the insulating reflective cup body to limit the displacement of the insulating reflective cup body when being acted by external force, and the air tightness of the product is thoroughly enhanced.

The utility model discloses in, insulating seat under the cladding of soldering tin foot has guaranteed promptly that the installation of soldering tin foot is stable, makes the soldering tin foot expose at reflection of light cup and insulating seat outside down again, makes things convenient for the metal terminal heat dissipation to be favorable to improving the heat dispersion of product, and avoided the thickness of reflection of light cup and insulating seat down to the adverse effect of thermal diffusivity.

Drawings

Fig. 1 is a front view of a high air tightness LED support with a cup-shaped structure provided by the present invention;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a perspective view of FIG. 2;

FIG. 4 is a diagram of the conductive base of FIG. 1;

fig. 5 is a schematic view of bending the solder legs.

The figure is as follows: the anti-seepage light cup comprises a light reflecting cup body 1, a cup-shaped groove 1-1, a first through hole 1-2, a second through hole 1-3, a special-shaped groove 1-4, a lower insulating base 2, a boss 2-1, a conductive base 3, a first welding disc 3-1, a second welding disc 3-2, a through hole 3-3, a soldering tin pin 3-4 connected with the first welding disc, a soldering tin pin 3-5 connected with the second welding disc, a suspended soldering tin pin 3-6, an anti-seepage groove 3-7, a positioning mark 3-8 and a pre-broken line 3-9.

Detailed Description

Referring to fig. 1, fig. 2, fig. 3, fig. 4, the utility model provides a high gas tightness LED support of cup type structure, include: a reflecting cup body 1, a lower insulating base 2 and a conductive base 3.

The conductive mount 3 includes a first pad 3-1, a second pad 3-2, and a plurality of solder fillets. A plurality of through holes 3-3 are arranged at the connection part of the first bonding pad 3-1 and the soldering tin foot connected with the first bonding pad.

The first bonding pad 3-1, the second bonding pad 3-2 and the plurality of soldering tin feet are all clamped between the reflective cup body 1 and the lower insulating base 2, the first bonding pad 3-1 and the second bonding pad 3-2 are isolated through the insulating groove, and the reflective cup body 1 and the lower insulating base 2 are connected through the through hole 3-3 and are integrally formed. Specifically, the conductive base 3 can be clamped by a mold and then poured to obtain the integrally formed reflective cup body 1 and the lower insulating base 2. In the embodiment, the arrangement of the through holes 3-3 on the first bonding pad 3-1 ensures that the combination strength among the reflective cup body 1, the lower insulating base 2 and the conductive base 3 is strong, relative displacement is difficult to occur, and the stability of the internal structure of the bracket is favorably ensured; meanwhile, the possibility of relative displacement between the metal base 3 and the reflecting cup body 1 and between the metal base and the lower insulating base 2 is reduced, and the air tightness of the product is enhanced.

The lower insulating base 2 is coated by the plurality of soldering tin pins, and the plurality of soldering tin pins comprise 3-4 soldering tin pins, 3-5 soldering tin pins and 3-6 soldering tin pins; the soldering tin pins 3-4 are all connected with the first bonding pad 3-1, and the soldering tin pins 3-5 are all connected with the second bonding pad 3-2; the solder fillets 3-6 are suspended solder fillets.

The reflecting cup body 1 is provided with a cup-shaped groove 1-1 for mounting an LED light-emitting chip, the upper insulating light-emitting cup body 1 is also provided with a first through hole 1-2 and a second through hole 1-3 which are communicated with the cup-shaped groove 1-1, and the first through hole 1-2 and the second through hole 1-3 are isolated by an insulating groove. The first through hole 1-2 in the cup-shaped groove 1-1 is connected with the first bonding pad 3-1 and used as one electrode, and the second through hole 1-3 in the cup-shaped groove 1-1 is connected with the second bonding pad and used as the other electrode.

In this embodiment, insulating seat 2 under the cladding of soldering tin foot, the installation of having guaranteed the leg is stable promptly, makes the soldering tin foot expose in reflection of light cup 1 and insulating seat 2 outsidely down again, makes things convenient for conductive base 3 heat dissipation to be favorable to improving the heat dispersion of product, and avoided reflection of light cup 1 and insulating seat 2's thickness to the adverse effect of heat dispersion down.

In the embodiment, the conductive base 3 comprises solder pins 3-4, solder pins 3-5 and an overhead solder pin 3-6, and the overhead solder pin 3-6 is separated from the first pad 3-1 and the second pad 3-2 by an insulating groove. The soldering tin feet 3-4 are symmetrically distributed on two opposite sides of the first bonding pad 3-1, the soldering tin feet 3-5 and the suspended soldering tin feet 3-6 are respectively positioned on two opposite sides of the first bonding pad 3-1, and the soldering tin feet 3-5 and the suspended soldering tin feet 3-6 are respectively positioned between the soldering tin feet 3-4. The arrangement of the suspended solder pins 3-6 can prevent adverse effects such as reverse connection and the like, and ensure that the LED light-emitting chip in the cup-shaped groove 1-1 can be electrified and lightened only under the condition of correct installation. The symmetrical arrangement of the plurality of welding feet is beneficial to improving the aesthetic property of the LED lead frame monomer; meanwhile, the reasonable distribution of the soldering tin pins on the LED lead frame monomer is improved through the rectangular distribution of the soldering tin pins 3-4, so that the conductive connection requirement of the LED light-emitting chip after the LED lead frame monomer is installed is met.

In the embodiment, through holes 3-3 are formed in the connecting parts of the first bonding pad 3-1 and the soldering tin feet connected with the first bonding pad, the through holes 3-3 are distributed in a rectangular shape, and the through holes 3-3 improve that the reflecting cup body 1, the lower insulating base 2 and the conductive base 3 form a rivet structure, so that the combination strength among the reflecting cup body, the lower insulating base and the conductive base is enhanced, relative displacement is difficult to occur, the stability of the internal structure of the LED lead frame monomer is favorably ensured, and the air tightness of the product is enhanced; specifically, each through hole 3-3 corresponds to each solder foot 3-4.

In the embodiment, the first through hole 1-2 is arranged at the middle position of the bottom of the cup-shaped groove 1-1. The second through hole 1-3 is arranged on one side of the cup-shaped groove 1-1, so that the LED light-emitting chip can be conveniently welded and installed.

In the embodiment, a positioning mark (3-8) is arranged on a first bonding pad (3-1), the shape of a first through hole (1-2) is abnormal, a convex bonding pad area is arranged at the diagonal angle of the upper part and the lower part of the first through hole, and the positioning mark (3-8) is close to the convex bonding pad area (1-4); so that each welding leg can be identified through the positioning marks 3-8, and the LED light-emitting chip is convenient to assemble.

In the embodiment, the middle position of the bottom of the lower insulating base 2 is provided with a strip-shaped boss 2-1, and a plurality of soldering tin pins coat the lower insulating base 2 from two opposite sides of the boss 2-1; the height of the lug boss is lower than the thickness of each welding pin, so that the better tin absorption performance of the single soldering pin of the LED lead frame can be ensured.

In the embodiment, through holes 3-3 are formed at the joints of the first bonding pad 3-1 and the soldering tin feet connected with the first bonding pad, and at least two anti-seepage grooves 3-7 are formed on two opposite sides of each through hole 3-3, so that when the reflective cup body 1 and the lower insulating base 2 are cast, a seepage path is increased, and the air tightness of a product is further improved.

In the embodiment, the solder legs 3-4 and the first bonding pad 3-1 are integrally formed, and the connection position of each solder leg 3-4 and the first bonding pad 3-1 is provided with a pre-folding line. The soldering tin feet 3-5 and the second bonding pad 3-2 are integrally formed, and the connecting positions of the soldering tin feet 3-5 and the second bonding pad 3-2 are all provided with pre-folding lines. Therefore, when the soldering tin pins 3-4 and the soldering tin pins 3-5 are bent, the stress of the metal during bending can be greatly reduced, and the phenomenon that the air tightness of a product is influenced by the pulling of the conductive base 3 is avoided.

In the embodiment, the second bonding pad and the soldering tin foot connected with the second bonding pad are in a T shape, so that the second bonding pad can buckle the insulating reflective cup body to limit the displacement of the insulating reflective cup body when being subjected to the action of external force, and the air tightness of the product is thoroughly enhanced.

The above description is only the specific implementation of the preferred embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can be in the technical scope of the present invention, and according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be covered within the protection scope of the present invention.

Claims

1. A high gas tightness LED support of cup type structure which characterized in that includes: a reflective cup body (1), a lower insulating base (2) and a conductive base (3);

the conductive base (3) is provided with a first bonding pad (3-1), a second bonding pad (3-2) and a plurality of soldering tin pins; a plurality of through holes (3-3) are arranged at the connection part of the first bonding pad (3-1) and the soldering tin foot connected with the first bonding pad;

the first bonding pad (3-1), the second bonding pad (3-2) and the joint of the bonding pad and a soldering tin foot are all clamped between the reflective cup body (1) and the lower insulating base (2), the first bonding pad (3-1) and the second bonding pad (3-2) are isolated through an insulating groove, and the reflective cup body (1) and the lower insulating base (2) are connected through the through hole (3-3) and are integrally formed; the lower insulating base (2) is coated by the plurality of soldering tin feet, and the plurality of soldering tin feet comprise a plurality of soldering tin feet (3-4) connected with the first bonding pad, soldering tin feet (3-5) connected with the second bonding pad and suspended soldering tin feet (3-6);

a cup-shaped groove (1-1) for mounting an LED light-emitting chip is arranged on the light-reflecting cup body (1), a first through hole (1-2) and a second through hole (1-3) are arranged in the cup-shaped groove (1-1), and the first through hole (1-2) and the second through hole (1-3) are isolated by an insulating groove; the first through hole (1-2) is matched with the conductive base to form a first bonding pad (3-1) which can be used for placing a light-emitting chip, and the second through hole (1-3) is matched with the conductive base to form a second bonding pad (3-2); can be used to place a zener; the chip and the Zener are placed on the bonding pads, and then the metal wires are used for respectively connecting the two bonding pads.

2. The highly hermetic LED support of cup type structure according to claim 1, wherein the conductive base (3) comprises a plurality of solder fillets (3-4) connected to the first pads, one solder fillet (3-5) connected to the second pads, and one hanging solder fillet (3-6), the hanging solder fillet (3-6) being isolated from the first pads (3-1) and the second pads (3-2) by an insulating groove; the plurality of soldering tin feet (3-4) connected with the first bonding pad are symmetrically distributed on two opposite sides of the first bonding pad (3-1), the soldering tin feet (3-5) and the suspended soldering tin feet (3-6) connected with the second bonding pad are respectively positioned on two opposite sides of the first bonding pad (3-1), and the soldering tin feet (3-5) and the suspended soldering tin feet (3-6) connected with the second bonding pad are respectively positioned between the soldering tin feet (3-4) connected with the first bonding pad.

3. The high-airtightness LED support with the cup-shaped structure according to claim 2, wherein through holes (3-3) are respectively formed at the connection positions of the first bonding pads (3-1) and the solder pins (3-4) connected thereto, and the through holes (3-3) are distributed in a rectangular shape.

4. A highly air-tight LED support in cup-shaped configuration according to claim 3, characterized in that the through-holes (3-3) correspond in position to the respective solder feet (3-4) associated with the first pads.

5. A highly air-tight LED support of cup-shaped construction according to claim 3, characterized in that at least two impermeable grooves (3-7) are provided on opposite sides of each through hole (3-3) at the connection of the first pad (3-1) with the solder foot (3-4) connected thereto.

6. The high-airtightness LED support with the cup-shaped structure according to claim 2, wherein a plurality of solder fillets (3-4) are integrally formed with the first bonding pad (3-1), and each solder fillet (3-4) is provided with a pre-folding line at a position located at the periphery of the lower insulating base; the solder pins (3-5) and the second bonding pads (3-2) are integrally formed and are T-shaped, and the solder pins (3-5) are provided with pre-folding lines at the periphery of the lower insulating base.

7. The high-airtightness LED support having a cup-shaped structure according to claim 1, wherein the first through hole (1-2) is provided in the middle of the cup-shaped groove (1-1), and the second through hole (1-3) is provided on one side of the cup-shaped groove (1-1).

8. The highly airtight LED support of cup type structure as claimed in claim 7, wherein the first pad (3-1) is provided with a positioning mark (3-8), the first through hole (1-2) is shaped as a profile, a convex pad area is provided at the upper and lower diagonal corners, and the positioning mark (3-8) is close to the convex pad area (1-4).

9. The high-airtightness LED support with the cup-shaped structure according to claim 1, wherein a strip-shaped boss (2-1) is provided at the middle position of the bottom of the lower insulating base (2), and a plurality of solder legs cover the lower insulating base (2) from the two opposite sides of the boss (2-1); the height of the boss (2-1) is lower than the thickness of the solder feet after being coated.