CN210426284U - Detonator bridge wire structure suitable for automatic production - Google Patents
Detonator bridge wire structure suitable for automatic production Download PDFInfo
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- CN210426284U CN210426284U CN201921426303.4U CN201921426303U CN210426284U CN 210426284 U CN210426284 U CN 210426284U CN 201921426303 U CN201921426303 U CN 201921426303U CN 210426284 U CN210426284 U CN 210426284U
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Abstract
The detonator bridging wire structure suitable for automatic production comprises a module substrate; two ends of the module substrate are respectively provided with a leg wire bonding pad and a bridge wire assembly; the module substrate is provided with a detonator IC; the bridge wire assembly comprises a connecting block, two bridge wire columns which are arranged in parallel are mounted on the connecting block, and the top ends of the two bridge wire columns are connected through a heating bridge wire. The bridge wire column made of the conductor is connected with the connecting block and is exposed out of the back of the connecting block; the width of the bridge wire column at the part of the back of the connecting block is increased and is provided with positioning points. And a substrate positioning point is arranged on the bridge wire bonding pad of the module substrate, and the shape and position of the substrate positioning point correspond to the positioning point. Compared with the prior art, the production efficiency can be increased, so that the bridge wire component can be absorbed by a chip mounter, pasted on a PCB coated with solder paste and directly fed into a reflow soldering furnace for soldering; further improving the production quality and the yield of products.
Description
The technical field is as follows:
the application belongs to the field of production tools of civil explosive/initiating explosive device equipment, and particularly relates to a detonator module and a bridge wire structure suitable for automatic production.
Background art:
the core component of the digital detonator is an electronic system therein, also called as a module, and generally, elements such as a chip capacitor, a resistor and the like are arranged on a PCB, and an IC chip, a bridge wire column and a bridge wire are added. The bridgewire is a heating element, is dipped with ignition powder and is used for igniting the explosive in the detonator under the control of the IC.
The detonator module is characterized in that the detonator module is an electronic device of a 'fast-consumable product', namely, the detonator module can be exploded and consumed quickly after being produced, and the characteristics of explosives of the detonator module are added, so that the product precision must be strictly controlled during production, the cost is also reduced as much as possible, the production efficiency is improved, and large-scale automation of a production link must be realized.
At present, a chip mounter-reflow soldering furnace is adopted for assembly line type processing, but the installation of a bridge wire part still needs manual intervention, so that the improvement of the production efficiency is greatly restricted. The bridgewire is connected between two bridge silk posts, breaks because of vibrations very easily and makes useless, and the bridgewire structure can't place with the chip mounter, must be through manual welding, and is the short slab of whole module production at the bottom of the inefficiency, the yields.
The invention content is as follows:
the purpose of the invention is as follows: an object of this application is to provide a detonator bridging filament structure, is that the bridging filament subassembly can compatible automation line, improves production efficiency and product precision.
The technical scheme is as follows:
be suitable for automated production's detonator bridging filament structure, its characterized in that:
comprises a module substrate;
two ends of the module substrate are respectively provided with a leg wire bonding pad and a bridge wire assembly;
the module substrate is provided with a detonator IC;
the bridge wire assembly comprises a connecting block, two bridge wire columns which are arranged in parallel are mounted on the connecting block, and the top ends of the two bridge wire columns are connected through a heating bridge wire.
The bridge wire column made of the conductor is connected with the connecting block and is exposed out of the back of the connecting block; the width of the bridge wire column at the part of the back of the connecting block is increased and is provided with positioning points.
And a substrate positioning point is arranged on the bridge wire bonding pad of the module substrate, and the shape and position of the substrate positioning point correspond to the positioning point.
And the module substrate is also provided with a chip capacitor and a chip resistor component.
The positioning points and the substrate positioning points are a group of corresponding convex-concave circular points.
The connecting block is square, and the non-bridge screw post fixing surface is a smooth plane; the connecting block is made of heat-resistant material.
The beneficial effects of the above technical scheme are:
the method aims to increase the production efficiency, so that the bridge wire assembly can be absorbed by a chip mounter and pasted on a PCB coated with solder paste, and can directly enter a reflow furnace for welding; further improving the production quality and the yield of products.
Description of the drawings:
FIG. 1 is a schematic diagram of the overall structure of the present application;
FIG. 2 is a schematic structural view of the present application with the bridgewire assembly removed;
FIG. 3 is a schematic structural view of a bridgewire assembly according to the present application;
the figure is marked with:
1, connecting a block; 2, bridging a silk column; 3, bridging filaments; 4, a detonator IC; 5 a module substrate; 6-pin wire bonding pads;
21, positioning points; 51 module location points.
The specific implementation mode is as follows:
the technical idea of the application is that two independent bridge wire columns are combined into a whole through a square connecting piece, and the bridge wire is prevented from being broken by vibration. Meanwhile, the connecting piece is suitable for being adsorbed by a chip mounter and can enter a reflow oven due to high temperature resistance, so that the installation of the bridge wire assembly is integrated into the automatic production flow of the chip mounter and the reflow oven. During installation, after the chip mounter coats the solder paste on the substrate, the bridge wire assembly is sucked up and pasted on the substrate, is positioned through the positioning point, and then is subjected to reflow soldering.
The technical scheme of the application is explained by taking the structure shown in the attached drawings as an example:
be suitable for automated production's detonator bridging filament structure, its characterized in that:
comprises a module substrate 5; is a standard PCB board;
two ends of the module substrate 5 are respectively provided with a leg wire bonding pad 6 and a bridge wire component;
the module substrate 5 is provided with a detonator IC 4; the detonator IC is a main control chip of the whole detonator and has the functions of delaying, verifying the initiation password and the like.
The bridge wire assembly comprises a connecting block 1, two bridge wire columns 2 which are arranged in parallel are mounted on the connecting block 1, and the top ends of the two bridge wire columns 2 are connected through a heating bridge wire 3. Two original mutually independent bridge wire columns are combined into a part through a connecting block, the bridge wires are prevented from being broken, and the whole bridge wire column can be sucked up by a chip mounter.
The further improvement is that a bridgewire column 2 made of a conductor is connected with the connecting block 1 and is exposed out of the back of the connecting block; the width of the bridge wire column 2 at the back of the connecting block is increased and is provided with positioning points 21. The bridge wire bonding pad of the module substrate 5 is provided with a substrate positioning point 51, and the shape and position of the substrate positioning point correspond to the positioning point 21. The anchor points are a set of complementary convex-concave circular points used for precise location at the time of patch application. Other forms of locating structures are also possible.
And the module substrate 5 is also provided with a chip capacitor and a chip resistor component. The structures such as the capacitor and the resistor all accord with the design of the existing digital electronic detonator, belong to the prior art and are not described again.
The connecting block 1 is square, and the non-bridge screw column fixing surface is a smooth plane; the connecting block 1 is made of heat-resistant material. The heat-resistant material can enter a reflow oven, and the surface of the material is suitable for being sucked by a chip mounter.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (6)
1. Be suitable for automated production's detonator bridging filament structure, its characterized in that:
comprises a module substrate (5);
two ends of the module substrate (5) are respectively provided with a leg wire bonding pad (6) and a bridge wire component;
the module substrate (5) is provided with a detonator IC (4);
the bridge wire assembly comprises a connecting block (1), two bridge wire columns (2) which are arranged in parallel are mounted on the connecting block (1), and the top ends of the two bridge wire columns (2) are connected through a heating bridge wire (3).
2. The detonator bridge wire structure of claim 1 adapted for automated production, wherein: the bridge wire column (2) made of a conductor is connected with the connecting block (1) and is exposed out of the back of the connecting block; the width of the bridge wire column (2) on the back of the connecting block is increased and is provided with positioning points (21).
3. The detonator bridge wire structure of claim 2 adapted for automated production, wherein: and a substrate positioning point (51) is arranged on the bridge wire bonding pad of the module substrate (5), and the shape and position of the substrate positioning point correspond to the positioning point (21).
4. The detonator bridge wire structure of claim 1 adapted for automated production, wherein: and the module substrate (5) is also provided with a chip capacitor and a chip resistor component.
5. A detonator bridge wire structure suitable for automated production according to claim 3, wherein: the positioning points (21) and the substrate positioning points (51) are a group of corresponding convex-concave circular points.
6. The detonator bridge wire structure of claim 1 adapted for automated production, wherein: the connecting block (1) is square, and the non-bridge screw post fixing surface is a smooth plane; the connecting block (1) is made of heat-resistant materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921426303.4U CN210426284U (en) | 2019-08-29 | 2019-08-29 | Detonator bridge wire structure suitable for automatic production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921426303.4U CN210426284U (en) | 2019-08-29 | 2019-08-29 | Detonator bridge wire structure suitable for automatic production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210426284U true CN210426284U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921426303.4U Active CN210426284U (en) | 2019-08-29 | 2019-08-29 | Detonator bridge wire structure suitable for automatic production |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112013730A (en) * | 2020-08-16 | 2020-12-01 | 东莞市弘腾自动化智能科技有限公司 | Manufacturing method of patch bridge wire and patch bridge wire |
-
2019
- 2019-08-29 CN CN201921426303.4U patent/CN210426284U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112013730A (en) * | 2020-08-16 | 2020-12-01 | 东莞市弘腾自动化智能科技有限公司 | Manufacturing method of patch bridge wire and patch bridge wire |
| CN112013730B (en) * | 2020-08-16 | 2022-04-19 | 东莞市弘腾自动化智能科技有限公司 | Manufacturing method of patch bridge wire and patch bridge wire |
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