CN115958386A - Production method of high-reliability regulator - Google Patents

Abstract

The invention discloses a production method of a high-reliability regulator, which comprises the following steps: clamping and assembling the IC into the bracket through a mechanical arm and a fixing tool; pressing and fixing the IC by using a pressing device, and transferring the assembled product to a welding point by using a disc machine; after the positioning is carried out through the IC positioning columns, the PIN needles of the IC are connected with the support in a spot welding mode through upper and lower electrodes; the PCBA circuit board is a printed board, and substances which have a vulcanization reaction with sulfur do not exist on the surface of the PCBA circuit board, so that the risk of product failure caused by the vulcanization reaction can be avoided, and the PCBA circuit board is high in strength, good in heat resistance and dielectric property, and not easy to damage in the production process; in the design that the IC chip is connected with the bracket insert in a spot welding manner and is matched with the PCBA circuit board assembly for tin soldering, the IC chip can realize the basic functional requirements of products, and the PCBA circuit board can realize the layout design of multilayer boards and can meet the design requirements of complex circuits.

Description

Production method of high-reliability regulator

Technical Field

The invention relates to the technical field of regulator production processes, in particular to a production method of a high-reliability regulator.

Background

The regulator is an indispensable part on the automobile generator. During the running of the automobile, the rotating speed of the engine changes at any time, and the rotating speed of the alternating-current generator also changes, so that the output voltage of the generator inevitably changes along with the change of the rotating speed. The voltage of the AC generator is controlled within a certain specified range, and when the rotating speed of the generator changes, the output voltage of the generator is automatically regulated and kept constant, so that the electric equipment is prevented from being damaged due to overhigh output voltage, and the storage battery is prevented from being overcharged.

With the continuous development of intelligent automobiles, the functional requirements on the regulator are increasing day by day, the internal space of the regulator system is limited, the working environment is severe, and the reliability requirement is high.

However, the prior regulator has the following problems:

1. in the traditional structure, the ceramic substrate is connected with the heat dissipation plate through glue, and the structural design that the pan head lead is connected with the bracket is adopted, so that the structural strength is low, and the connection failure caused by the influence of vibration and internal stress is easy to cause the functional failure of a product;

2. the lead slurry material in the ceramic substrate is easy to generate a vulcanization reaction with sulfur in the air, so that the permanent failure of the product is caused;

3. the ceramic substrate material is fragile, the substrate is easy to damage or crack in the assembly process of the splinter and the ceramic component, and the micro cracks are not easy to check, so that the batch invalidation and compensation of the finished regulator are easy to cause;

4. the ceramic substrate has limited space, a multilayer board cannot be manufactured, and the circuit layout space is limited, so that the product has single function;

5. in the traditional soldering mode, the tin wire is too large in loss caused by high temperature and other reasons in the welding process, the tin amount of a welding spot cannot be accurately controlled, the defects of tin falling, insufficient soldering and the like are caused, the reliability of the welding spot is low, and the risk of tin cracking failure is high;

6. in the traditional soldering mode, tin beads are easily generated due to the influence of soldering flux, improper operation and other external factors in the welding process, so that the product is invalid;

to this end, a method for producing a highly reliable regulator is proposed.

Disclosure of Invention

The present invention is directed to a method for producing a regulator with high reliability, which solves the above-mentioned problems of the related art.

In order to achieve the purpose, the invention provides the following technical scheme: a method of producing a high reliability regulator comprising the steps of:

s1, clamping and assembling an IC into a support through a mechanical arm and a fixing tool;

s2, pressing and fixing the IC by using a pressing device, and transferring the assembled product to a welding point by using a disc machine;

s3, after the positioning is carried out through the IC positioning columns, the PIN needles of the IC are connected with the support in a spot welding mode through upper and lower electrodes in sequence;

s4, after spot welding of the IC and the support is completed, turning over the support, and assembling the PCBA and the support by using a manipulator;

s5, firstly, hot melting connection between the positioning columns at multiple positions in the support and the PCBA is achieved in the clockwise direction in a hot melting mode, and then the PIN needle of the support and the PCBA are connected in a molten drop welding mode in the clockwise direction through the ceramic welding head.

Preferably: in the step S5, the adopted soldering is a molten drop soldering process, the solder wire with a fixed length is placed in the ceramic welding head, the solder wire with a fixed length is heated and rapidly melted by the ceramic welding head, the molten drop process is realized by rapid shaking of the ceramic welding head in the welding process, and the ceramic welding head is used for pressing down the molten drop to realize the soldering.

Preferably: in the step S5, the welding temperature is 500-600 ℃.

Preferably: the length of the welding wire of the molten drop welding process is 1.04mm.

Preferably: the PCBA circuit board is a printed board.

Compared with the prior art, the invention has the beneficial effects that:

1. the PCBA board is a printed board, and substances which have a vulcanization reaction with sulfur do not exist on the surface of the PCBA board, so that the risk of product failure caused by the vulcanization reaction can be avoided.

2. The PCBA board has high strength, good heat resistance and good dielectricity, and is not easy to damage in the production process.

3. In the design that the IC is connected with the bracket insert in a spot welding manner and is matched with the molten drop welding of the PCBA assembly, the IC can realize the basic functional requirements of products, the PCBA can realize the layout design of a multilayer board, and the design requirements of complex circuits and the additional circuit protection function can be met, so that the performance reliability of the products is improved.

4. The spot welding of IC and support inserts is carried out earlier, carries out the droplet welding of PCBA subassembly and support PIN again, need not to have enough to meet the need the product, and simple process reduces because of the product turnover causes the possibility of inefficacy.

5. IC and support inserts spot welding, in the structural design of cooperation PCBA molten drop welding, do not have the risk that IC and PCBA lug connection became invalid.

6. PCBA soldering technology adopts the molten drop welding technology, puts into ceramic bonding tool with the solder wire of fixed length, and through the quick molten fixed length solder wire of ceramic bonding tool heating, the loss of solder wire in the reduction heating process, accurate management and control soldering tin quantity guarantees the uniformity of product.

7. PCBA soldering technology adopts the molten drop welding technology, utilizes the quick shake of ceramic bonding tool in welding process to realize the molten drop process to utilize the ceramic bonding tool to the action of pushing down of molten drop, realize the soldering, reduce the risk of falling tin and rosin joint, eliminate the tin pearl, improve the solder joint reliability, reduce the risk that the tin splits and causes the inefficacy, and guarantee the uniformity of solder joint outward appearance and quality.

Drawings

FIG. 1 is a flow chart of the present invention;

FIG. 2 is a view of a spot welding location of the present invention;

FIG. 3 is a view of a droplet welding position of the present invention;

FIG. 4 is a detailed weld technique comparison table of the present invention:

FIG. 5 is a table comparing the properties of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Examples

Referring to fig. 1-3, the present invention provides a technical solution: a method of producing a high reliability regulator, comprising the steps of:

s1, clamping and assembling an IC1 into a support 2 through a mechanical arm and a fixing tool;

s2, compressing and fixing the IC1 by using a compressing device, and transferring the assembled product to a welding point by using a disc machine;

s3, after the IC positioning columns are used for positioning, the PIN needles of the IC1 are sequentially connected with the support 2 in a spot welding mode through the upper electrode and the lower electrode;

s4, after spot welding of the IC1 and the support 2 is completed, overturning the support 2, and assembling the PCBA3 and the support 2 by using a manipulator;

s5, hot melting connection between a plurality of positioning columns in the support 2 and the PCBA3 is achieved in the clockwise direction by adopting a hot melting mode, and then the PIN needle of the support 2 and the PCBA3 are connected in a molten drop welding mode in the clockwise direction by adopting a ceramic welding head.

As shown in fig. 1: in step S6, the adopted soldering is a molten drop soldering process, in which a solder wire with a fixed length is placed in a ceramic soldering head, the solder wire with a fixed length is heated and rapidly melted by the ceramic soldering head, the molten drop process is realized by rapid shaking of the ceramic soldering head in the welding process, and the ceramic soldering head is used to press down the molten drop, thereby realizing the soldering.

As shown in fig. 4: in step S6, the welding temperature is 500-600 ℃.

As shown in fig. 4: the length of the welding wire of the molten drop welding process is 1.04mm.

As shown in fig. 1: the PCBA circuit board is a printed board.

According to the molten drop welding process used in the process, as shown in fig. 4, a ceramic welding head is heated to 500-600 ℃ to rapidly melt a tin wire with the length of 1.04mm, and then the molten drop process is realized by utilizing the rapid vibration of the ceramic welding head in the welding process, so that the soldering work is realized. Compared with the traditional soldering process, the process has the advantages that the use time is shorter, the manual control of the length of the welding wire is avoided, and the accuracy of the integral production is improved.

According to the illustration of fig. 5, the performance of the process product and the product produced by the conventional process were tested:

and (3) temperature detection, namely determining that the detected temperature is-40 ℃ to 150 ℃, the detection time is 30min, and the conversion time is not more than 1min when the temperature is adjusted, wherein through the detection in the mode, the product produced by the traditional process fails due to solder joint tin cracking after 700H, and the product produced by the process still does not fail after 1500H.

And (3) vibration detection, wherein the frequency is 100 HZ-1000 HZ sine 10 HZ-2000HZ, T _min = -40 ℃, T _ max =120 ℃, the product produced by the traditional process fails after lasting for 3 × 16H due to solder joint tin cracking, and the product produced by the process does not fail after lasting for 3 × 24H.

And power cycle detection, namely detecting at the temperature of between 40 ℃ below zero and 145 ℃ through a direct-current power supply and a module load, wherein the low temperature and the high temperature are 20min and 40min respectively, the traditional process fails after 600H of cycle, and the process does not fail after 1500H of cycle.

And (3) storing at high temperature, namely respectively storing the two products in an environment at 155 ℃, wherein the products produced by the traditional process fail after 2000H, and the products produced by the process do not fail after 3000H.

Poor welding tin beads, wherein in the process of randomly sampling and inspecting 100PCS products, the poor tin bead proportion of the products produced by the traditional process is 5-10%, and the poor tin bead proportion of the products produced by the process is less than 0.1%.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A method of producing a highly reliable regulator, comprising the steps of:

s1, clamping and assembling an IC (1) into a support (2) through a mechanical arm and a fixing tool;

s2, pressing and fixing the IC (1) by using a pressing device, and transferring the assembled product to a welding point by using a disc machine;

s3, after the positioning is carried out through the IC positioning columns, the PIN needles of the IC (1) are connected with the support (2) in a spot welding mode through upper and lower electrodes in sequence;

s4, after spot welding of the IC (1) and the support (2) is completed, overturning the support (2), and assembling the PCBA (3) and the support (2) by using a manipulator;

s5, hot melting connection between a plurality of positioning columns in the support (2) and the PCBA (3) is achieved in the clockwise direction by adopting a hot melting mode, and then the PIN needle of the support (2) and the PCBA (3) are connected in a molten drop welding mode in the clockwise direction by adopting a ceramic welding head.

2. A method for producing a regulator with high reliability according to claim 1, wherein: in the step S5, the adopted molten droplet welding process includes placing the solder wire with a fixed length into the ceramic welding head, heating and rapidly melting the solder wire with a fixed length by the ceramic welding head, implementing the molten droplet process by the rapid shaking of the ceramic welding head in the welding process, and implementing the soldering by the pressing action of the ceramic welding head on the molten droplet.

3. A method for producing a high-reliability regulator according to claim 1, wherein: in the step S5, the welding temperature is 500-600 ℃.

4. A method for producing a high-reliability regulator according to claim 2, wherein: the length of the welding wire of the molten drop welding process is 1.04mm.

5. A method for producing a high-reliability regulator according to claim 1, wherein: the PCBA circuit board is a printed board.

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