CN210405821U - Photosensitive assembly and camera module - Google Patents

Abstract

The application relates to a photosensitive assembly and a camera module thereof. The photosensitive assembly comprises a photosensitive chip and a circuit board, wherein the circuit board comprises a circuit board main body and an ink layer formed on the circuit board main body. The ink layer comprises a hollow-out area formed in a photosensitive chip mounting area of the circuit board. The hollowed-out area is configured to apply an adhesive thereon so that the photosensitive chip is bent downward by the adhesive in a process of being attached to the circuit board. Thus, the bending state of the photosensitive chip is adjusted to improve the imaging quality thereof.

Description

Photosensitive assembly and camera module

Technical Field

The application relates to the module field of making a video recording, especially relate to photosensitive assembly and the module of making a video recording.

Background

With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied to various fields such as medical treatment, security, industrial production, and the like.

As consumers demand higher and higher imaging quality for mobile electronic devices (e.g., smart phones), the size of the light sensing chip in the camera module is gradually increasing. This causes a series of technical problems such as chip deformation problems, an oversized camera module, and the like. Accordingly, there is a need for improved camera module design.

SUMMERY OF THE UTILITY MODEL

The main aim at of this application provides a photosensitive assembly and module of making a video recording, wherein, the printing ink layer of circuit board has the fretwork region that is formed at photosensitive chip installation area to through applying adhesive in the fretwork region makes at the photosensitive chip subsides adorn in the in-process of the photosensitive chip installation area of circuit board the photosensitive chip downwarping through this kind of specific structure setting, adjustment the bending state of photosensitive chip is in order to improve the imaging quality of module of making a video recording.

Another object of the present application is to provide a photosensitive assembly and a camera module, wherein the photosensitive chip is attached in the photosensitive chip mounting region's in-process, apply in the adhesive in the hollow area can be cured and can be produced the shrink and be located the printing ink layer around the adhesive is compared with the adhesive has the characteristic of difficult deformation, so that the lower surface of photosensitive chip is crooked in order to adjust the curved state of photosensitive chip.

Another aim at of this application provides a sensitization subassembly and module of making a video recording, wherein, fretwork area is located in the sensitization chip installation area just fretwork area with the misalignment region of sensitization chip installation area is located the shorter avris of sensitization chip installation area to make in the assembly process, the minor avris of sensitization chip produces great bending, in order to adapt to optical lens's field curvature.

Another object of the present application is to provide a photosensitive assembly and a camera module, wherein, the hollow area is located in the photosensitive chip mounting area and the hollow area with the non-coincident area of the photosensitive chip mounting area is located the corner area of the photosensitive chip mounting area, so that in the assembling process, the corner area of the photosensitive chip produces a larger curve to adapt to the field curvature of the optical lens.

Another aim at of this application provides a sensitization subassembly and module of making a video recording, wherein, the direct bonding of sensitization chip is in the circuit board main part, in order to improve the sensitization chip with the combination stability of circuit board.

Another object of this application is to provide a photosensitive component and module of making a video recording, wherein, through the fretwork is regional, can further reduce photosensitive component and the whole height dimension of module of making a video recording thereof.

Other advantages and features of the present application will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

To achieve at least one of the above objects or advantages, the present application provides a photosensitive assembly, including:

a photosensitive chip; and

the circuit board comprises a circuit board main body and an ink layer formed on the circuit board main body, wherein the ink layer comprises a hollowed-out area formed in a photosensitive chip mounting area of the circuit board, and the hollowed-out area is configured to apply an adhesive to the hollowed-out area so that the photosensitive chip bends downwards in the process of attaching the photosensitive chip to the circuit board through the adhesive.

In the sensitization subassembly according to this application, the fretwork is regional with sensitization chip installation area partial coincidence, and, the fretwork regional with sensitization chip installation area's misalignment zone is located sensitization chip installation area's shorter avris.

In the photosensitive assembly according to the application, the hollowed-out area is partially overlapped with the photosensitive chip mounting area, and the non-overlapped area of the hollowed-out area and the photosensitive chip mounting area is located in the corner area of the photosensitive chip mounting area.

In the photosensitive assembly according to the application, the non-coincident regions of the hollow region and the photosensitive chip mounting region are symmetrically distributed relative to the photosensitive chip mounting region.

In the sensitization subassembly according to this application, the fretwork is regional corresponding to the width of sensitization chip installation area's shorter avris is greater than the fretwork is regional corresponding to the width of sensitization chip installation area's longer avris.

In the photosensitive assembly according to the present application, a center of the hollowed-out area corresponds to a center of the photosensitive chip mounting area.

In the photosensitive assembly according to the application, the shape of the hollow-out area is a centrosymmetric figure.

In the photosensitive assembly according to the present application, a shape of the hollowed-out area corresponds to a shape of the photosensitive chip mounting area.

In the photosensitive assembly according to the application, the shape of the hollowed-out area is cross-shaped.

In the photosensitive assembly according to the application, the ink layer further comprises at least one air escape through hole, and the at least one air escape through hole extends outwards from the hollow area and protrudes out of the photosensitive chip mounting area.

In the photosensitive assembly according to the application, the photosensitive assembly further comprises at least one electronic component arranged on the circuit board and a lead used for electrically connecting the photosensitive chip with the circuit board, wherein at least one air escape channel is formed on the circuit board without the lead and one side of the electronic component.

In the photosensitive assembly according to the application, the area of the hollow area is 30-90% of the area of the photosensitive chip mounting area.

In the photosensitive assembly according to the present application, the thickness of the portion of the ink layer for mounting the photosensitive chip is higher than the thickness of the ink layer of the other portion.

In the photosensitive assembly according to the application, the thickness of the printing ink layer is 30-100 microns.

In the photosensitive assembly according to the application, the thickness of the adhesive is 10-100 micrometers.

In the photosensitive assembly according to the present application, the ink layer is less likely to deform than the adhesive.

In the photosensitive member according to the present application, the adhesive has an insulating property.

According to another aspect of the present application, the present application further provides a camera module, which includes:

the photosensitive member as described above; and

and the optical lens is kept on a photosensitive path of the photosensitive component.

In the module of making a video recording according to this application, the crooked shape adaptation of the lower surface of sensitization chip in the shape of the real focus imaging surface of the module of making a video recording.

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 illustrates a schematic diagram of a pick-up process of a photosensitive chip in a conventional COB assembly process.

Fig. 2 illustrates an imaging optical path schematic diagram of the camera module.

Fig. 3 illustrates a schematic diagram of a camera module according to an embodiment of the present application.

FIG. 4 illustrates a schematic view of a photosensitive assembly according to an embodiment of the present application.

FIG. 5 illustrates a schematic top view of the photosensitive assembly according to an embodiment of the present application.

FIG. 6 is a schematic top view illustrating a modified implementation of the photosensitive assembly according to embodiments of the present application.

FIG. 7 illustrates a schematic top view of another implementation of a variation of the photosensitive assembly according to embodiments of the present application.

FIG. 8 illustrates a schematic top view of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 9 illustrates a schematic top view of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 10 illustrates a schematic top view of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 11 illustrates a schematic top view of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 12 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 13 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 14 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 15 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 16 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 17 illustrates a schematic view of a manufacturing process of the photosensitive member according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, as the imaging quality of the terminal device is higher and higher, the size of the photosensitive chip of the camera module is gradually increased, which causes a series of technical problems, such as chip deformation, and the camera module is oversized. Accordingly, there is a need for improved camera module structural design and fabrication solutions.

Specifically, the conventional camera module is generally assembled by using a cob (chip on board) process: picking up the photosensitive chip → attaching to the circuit board → electrically connecting the photosensitive chip to the circuit board. However, with the increasing size, the photosensitive chip is easily deformed during the pick-up process.

Fig. 1 illustrates a schematic diagram of a pick-up process of a photosensitive chip in a conventional COB assembly process. As shown in fig. 1, in the conventional COB assembly process, the photosensitive chip is picked up by suction, and the suction nozzle of the pickup can only be attached to the non-photosensitive area of the photosensitive chip because the photosensitive area of the photosensitive chip cannot be contacted. During the picking-up process, the photosensitive chip will be sucked and bent toward the photosensitive surface of the photosensitive chip to form an upwardly convex shape (from the effect shown in fig. 1, the curved shape of the photosensitive chip can be defined as "crying face").

Those skilled in the art should know that even if the photo sensor chip does not generate "crying face" shape deformation (i.e., the photo sensor chip is planar), due to the difference between the optical path of the edge portion and the optical path of the central portion of the photo sensor chip relative to the optical lens, there are assembling tolerance and other factors in the optical design of the lens and the assembling process of the lens, which causes the imaging light to easily generate distortion, corner light loss, and poor definition when reaching the edge portion of the photo sensor chip, resulting in poor imaging effect. These artifacts are further exacerbated after the "crying face" shape changes occur, and more severely affect the imaging quality.

Specifically, fig. 2 illustrates an imaging optical path schematic diagram of the camera module. As shown in fig. 2, in the imaging process of the camera module, due to factors such as the optical design of the lens and the assembly tolerance existing in the lens assembly process, the shape of the actual focal point imaging surface is an arc surface protruding toward the image side. Those skilled in the art will appreciate that the best imaging quality is achieved when the plane of the photo-sensing chip coincides with the actual focal imaging plane. However, in practical situations, even if multiple mirrors are used to modulate the optics of the camera module, the actual focal plane still appears as an arc. This is also a cause of the occurrence of defects such as distortion, corner loss, and deterioration in resolution even if the photosensitive chip is not deformed during the pickup process. However, since the photosensitive chip generates the crying-face-shaped deformation during the picking-up process, it can be seen from the comparison of the shape of the actual focal plane in fig. 2 that the crying-face-shaped deformation is just opposite to the deformation of the actual focal plane, which causes the aggravation of the undesirable phenomena such as distortion, corner light loss, and acute angle reduction, and more seriously affects the imaging quality of the camera module.

In addition, in the process that the photosensitive chip is attached to the corresponding area of the circuit board through a DA (Die Attach) process, because the thermal expansion coefficients of the circuit board and the photosensitive chip are not consistent, the expansion amount generated by the circuit board is greater than that of the photosensitive chip in the baking and curing process of the adhesive, and when the temperature is reduced to room temperature again, the contraction amount generated by the circuit board is greater than that of the photosensitive chip, so that the photosensitive chip is bent to be convex towards the image side. That is, when the photosensitive chip is mounted on the circuit board by the DA process, the deformation of the crying face is intensified, which causes the occurrence of the bad phenomena such as distortion, corner light loss, and acute angle decrease, so that the imaging effect is further deteriorated.

Particularly, for a high-pixel and large-chip-size image pickup module, since the size of the photosensitive chip is rapidly increased and the thickness of the photosensitive chip is thinner than that of other common chips, the large-size photosensitive chip is more prone to generate a bending problem, and the influence on the imaging quality of the image pickup module is increased.

In order to solve the technical problems, the basic idea of the application is to arrange a hollow structure in a part, corresponding to a photosensitive chip mounting area, of an ink layer of a circuit board, so that the photosensitive chip is bent downwards in the process of being attached to the photosensitive chip mounting area of the circuit board through an adhesive applied in the hollow structure, and through the structural arrangement, the bending state of the photosensitive chip is adjusted to improve the imaging quality of the photosensitive chip.

Based on this, this application has proposed a photosensitive assembly, and it includes: the photosensitive chip comprises a circuit board main body and an ink layer formed on the circuit board main body, wherein the ink layer comprises a hollow-out area formed in a photosensitive chip mounting area of the circuit board, and the hollow-out area is configured to apply an adhesive to the hollow-out area so that the photosensitive chip bends downwards in the process of mounting the photosensitive chip on the circuit board through the adhesive.

In this way, through the specific structure of the ink layer provided with the hollowed-out area, the photosensitive chip can have a bending space formed by the ink layer with the hollowed-out area when being mounted on the circuit board, so that the photosensitive chip can be bent downwards in the mounting process. Furthermore, the photosensitive chip bends downwards in the hollow area in the installation process, so that the bending state of the photosensitive chip after installation can be adjusted, and the imaging quality is improved.

Having described the general principles of the present application, various non-limiting embodiments of the present application will now be described with reference to the accompanying drawings.

Exemplary camera module and photosensitive assembly thereof

As shown in fig. 3 and 4, a camera module according to an embodiment of the present application is illustrated, wherein the camera module includes an optical lens 10 and a photosensitive element 20, the optical lens 10 is maintained in a photosensitive path of the photosensitive element 20, so that light collected by the optical lens 10 can be imaged in the photosensitive element 20 along the photosensitive path.

As shown in fig. 4, the photosensitive assembly 20 according to the embodiment of the present application includes: the optical lens assembly comprises a circuit board 21, a photosensitive chip 22, at least one electronic component 23 and a package 24, wherein the photosensitive chip 22 is electrically connected to the circuit board 21, the at least one electronic component 23 is arranged around the photosensitive chip 22 and electrically connected to the circuit board 21, and the package 24 is arranged on the circuit board 21 and configured to mount the optical lens 10 thereon.

Specifically, in the present embodiment, the package body 24 is implemented as a conventional plastic bracket, which is prefabricated and attached to a predetermined position of the circuit board 21 by a COB process. Of course, those skilled in the art will appreciate that the package 24 may be implemented as other types of packages 24 in other examples of the present application. For example, the package body 24 may be implemented as a mold frame formed on the circuit board 21 by a mob (molding on board) process and integrally covering at least a portion of the circuit board 21 and at least a portion of the electronic component 23, as shown in fig. 15. For another example, the package 24 may also be implemented as a mold frame formed on the circuit board 21 by an moc (molding on chip) process and integrally covering at least a portion of the circuit board 21, at least a portion of the non-photosensitive region of the photosensitive chip 22 and at least a portion of the electronic component 23, as shown in fig. 16. And is not intended to limit the scope of the present application.

In the embodiment of the present application, the at least one electronic component 23 may be mounted on the upper surface of the circuit board 21 by a surface mounting Technology (surface mounting Technology). Generally, the at least one electronic component 23 is mounted on the peripheral region of the photosensitive chip 22. Alternatively, the at least one electronic component 23 may be embedded in the circuit board 21, so as to reduce the height of the at least one electronic component 23 protruding from the circuit board 21. It should be understood that the mounting process for the at least one electronic component 23 is not limited by the present application. Meanwhile, in the embodiment of the present application, the type of the at least one electronic component 23 is not limited in the present application, and includes but is not limited to a capacitor, an inductor, a triode, a thyristor, a resistor, and the like.

In the embodiment of the present application, the electrical connection between the photosensitive chip 22 and the circuit board 21 is realized by a lead 25. Specifically, in the embodiment of the present application, each of the leads 25 extends between the light sensing chip 22 and the circuit board 21 in a bending manner, so that the light sensing chip 22 is electrically connected to the circuit board 21 through the lead 25, the circuit board 21 can supply power to the light sensing chip 22 based on the lead 25, and the light sensing chip 22 can transmit the collected signals based on the lead 25. It is noted that the type of the lead 25 is not limited in the present application, and for example, the lead 25 may be a gold wire, a silver wire, or a copper wire. The lead 25 can be mounted between the circuit board 21 and the light sensing chip 22 by a "gold wire bonding" process for electrical connection therebetween.

Specifically, "gold wire bonding" processes generally fall into two types: the 'forward bonding of gold thread' process and the 'reverse bonding of gold thread' process. The "direct bonding gold wire" process means that in the process of laying the lead wires 25, one end of the lead wires 25 is first formed on the conductive end of the wiring board 21, the lead wires 25 are further extended in a bent manner, and finally the other end of the lead wires 25 is formed on the conductive end of the photosensitive chip 22, in such a manner that the lead wires 25 are formed between the photosensitive chip 22 and the wiring board 21. The "reverse gold wire bonding" process means that in the process of laying the lead 25, one end of the lead 25 is first formed on the conductive end of the photosensitive chip 22, the lead 25 is then extended curvedly, and finally the other end of the lead 25 is formed on the conductive end of the wiring board 21, in such a manner that the lead 25 is formed between the photosensitive chip 22 and the wiring board 21. It is worth mentioning that the height of the upward protrusion of the lead 25 formed by the "reverse bonding wire" process is higher than the height of the upward protrusion of the lead 25 formed by the "forward bonding wire" process, and therefore, preferably, in this embodiment, the lead 25 is formed by the "reverse bonding wire" process.

Of course, those skilled in the art should understand that in other examples of the present application, the photosensitive chip 22 and the circuit board 21 can be conducted in other manners, such as a backside conduction manner. And is not intended to limit the scope of the present application.

In the embodiment of the present application, the photosensitive chip 22 is attached to the circuit board 21, that is, the circuit board 21 has a photosensitive chip mounting region 210 for mounting the photosensitive chip 22 thereon. As mentioned above, as the imaging quality of the terminal device is higher and higher, the size of the photosensitive chip 22 in the camera module is gradually increased, so that the problem of chip deformation is more likely to occur and more severe in the process of mounting the photosensitive chip 22 on the circuit board 21. In view of the technical problem, in the embodiment of the present application, the structure of the circuit board 21 is modified and matched with the improved mounting process of the photosensitive chip 22.

Specifically, as shown in fig. 4, in the embodiment of the present application, the circuit board 21 includes a circuit board main body 211 and an ink layer 212 formed on the circuit board main body 211, so that the exposed conductive wire path on the circuit board main body 211 is protected by the ink layer 212, so as to protect the circuit board main body 211. The ink layer 212 also prevents moisture and various dielectrics from invading and oxidizing the wiring to damage the electrical performance, and prevents foreign mechanical damage. Meanwhile, the ink layer 212 can also prevent welding and insulation, prevent short circuit caused by welding of the electronic component 23, save the amount of soldering tin and avoid conduction between circuits. It should be noted that the conductive terminals on the circuit board main body 211 are exposed to the ink layer 212.

Specifically, as shown in fig. 4, in the embodiment of the present application, the ink layer 212 includes a hollow area 213 formed in the photo chip mounting area 210, wherein the hollow area 213 is configured to apply an adhesive 26 thereon, so that the photo chip 22 is bent downward by the adhesive 26 during the process of attaching the photo chip 22 to the circuit board 21. That is, in the embodiment of the present application, the region of the ink layer 212 corresponding to the photosensitive chip 22 is hollowed out, so as to form the hollowed-out region 213 on the photosensitive chip mounting region 210. Accordingly, when the photosensitive chip 22 is attached to the photosensitive chip mounting region 210 of the circuit board 21, the adhesive 26 applied in the hollow region 213 shrinks during the curing process, and the ink layer 212 around the adhesive 26 has a property of being less prone to deformation than the adhesive 26, so that the lower surface of the photosensitive chip 22 is bent downward.

Specifically, fig. 5 illustrates a schematic top view of the photosensitive assembly 20 according to an embodiment of the present application. As shown in fig. 5, in the embodiment of the present application, the hollow area 213 is located in the photosensitive chip mounting area 210. That is, in the embodiment of the present application, the hollow area 213 is accommodated in the photo sensor chip mounting area 210. In particular, in the photosensitive assembly 20 as illustrated in fig. 5, the boundary of the hollow-out region 213 is located completely within the photosensitive chip mounting region 210, that is, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, the projection of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 has only one closed overlapping region.

Accordingly, in the process of attaching the photosensitive chip 22 to the photosensitive chip mounting region 210, the adhesive 26 is first applied to the hollow region 213 (it should be understood that, in the embodiment of the present application, the application position of the adhesive 26 includes not only the hollow region 213 but also a portion of the ink layer 212 for supporting the photosensitive chip 22); further, the photosensitive chip 22 is placed on the photosensitive mounting region (it should be understood that, at this time, the edge of the photosensitive chip 22 is supported on the ink layer 212); then, the adhesive 26 is cured to bond the photosensitive chip 22 to the circuit board main body 211. It should be understood that during the curing process of the adhesive 26, the adhesive 26 will shrink to some extent, so that after the adhesive 26 corresponding to the middle region of the lower surface of the photosensitive chip 22 shrinks, the lower surface of the photosensitive chip 22 will be pulled to bend downwards, thereby adjusting the bending state of the photosensitive chip 22. Specifically, in the embodiment of the present application, the lower surface of the photosensitive chip 22 is bent downward by the adhesive 26, so that the degree of bending of the photosensitive chip 22 toward the object side during the picking process is reduced, and the photosensitive chip 22 tends to be flat, and even, the photosensitive chip 22 is convexly bent toward the image side by the adhesive 26. That is, in the embodiment of the present application, the adhesive 26 can compensate the bending of the circuit board 21 caused by baking and cooling, which is convex toward the object side of the photosensitive chip 22.

Preferably, in the embodiment of the present application, the center of the hollow area 213 corresponds to the center of the photosensitive chip mounting area 210. That is, it is preferable that the center of the hollow area 213 coincides with the center of the mounting area of the photosensitive chip 22, or the hollow area 213 is coaxially disposed with the photosensitive chip mounting area 210.

Preferably, in the embodiment of the present application, when the photosensitive chip 22 is attached to the photosensitive chip mounting area 210, the center of the hollow area 213 corresponds to the center of the photosensitive surface of the photosensitive chip 22, wherein the photosensitive surface of the photosensitive chip 22 represents an area set by the photosensitive area of the photosensitive chip 22. It should be noted that in the conventional photo chip, the photosensitive surface of the photo chip 22 is not necessarily located in the central region of the photo chip 22.

Preferably, in the embodiment of the present invention, the shape of the hollow area 213 is a central symmetrical figure, for example, a cross shape (as shown in fig. 6), so that the photosensitive chip 22 can be uniformly bent. It should be noted that the pattern of the hollow area 213 may also be implemented as other patterns, such as a circle, an ellipse, a regular deformation, etc., and this is not a limitation of the present application. Meanwhile, it should be understood that when the shape of the hollow-out region 213 is a central symmetrical pattern, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, the overlapped region of the projection of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 is symmetrically distributed with respect to the photosensitive chip 22.

Preferably, in the embodiment of the present application, the shape of the hollow area 213 corresponds to the shape of the photosensitive chip mounting area 210. As will be appreciated by those of ordinary skill in the art, conventional photo-sensing chips 22 typically have a rectangular configuration. Accordingly, it is preferable that, in the embodiment of the present application, the photosensitive chip mounting region 210 is implemented as a rectangle corresponding to the size of the photosensitive chip 22, and the shape of the hollow region 213 is a rectangle scaled by a certain scale. Of course, as the technology develops, the shape design of the photo sensor chip 22 changes in different scenes, and when the shape of the photo sensor chip 22 changes, the shapes of the photo sensor chip mounting area 210 and the hollow area 213 need to be changed synchronously.

Preferably, in the embodiment of the present application, the width of the hollowed-out region 213 corresponding to the shorter side of the photosensitive chip mounting region 210 is greater than the width of the hollowed-out region 213 corresponding to the longer side of the photosensitive chip mounting region 210, so that the shorter side of the photosensitive chip 22 can relatively generate a larger bending. It will be understood by those skilled in the art that, in general, the bending degree of the focal plane of the lens is higher as the focal plane is farther from the central field of view, and the bending of the photo chip 22 under the influence of the expansion and contraction of the circuit board 21 is also larger at the short side. Therefore, will the width configuration of fretwork area 213 corresponding to the shorter avris of photosensitive chip installation area 210 is greater than the width of fretwork area 213 corresponding to the longer avris of photosensitive chip installation area 210 is favorable to improving photosensitive assembly 20 with the imaging quality of the module of making a video recording.

Fig. 7 illustrates a schematic top view of another variant implementation of the photosensitive assembly 20 according to an embodiment of the present application. As shown in fig. 7, in this modified embodiment, the boundary portion of the hollow area 213 coincides with two boundaries of the photosensitive chip mounting area 210. As shown in fig. 7, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, the projection of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 includes two overlapping regions.

Preferably, as shown in fig. 7, in this modified embodiment, the non-overlapping region between the hollowed-out region 213 and the photosensitive chip mounting region 210 is located at the shorter side of the photosensitive chip mounting region 210, so that the shorter side of the photosensitive chip 22 is relatively bent. More preferably, as shown in fig. 7, the non-overlapping areas of the hollow area 213 and the photosensitive chip mounting area 210 are distributed symmetrically with respect to the center of the photosensitive chip mounting area 210, so that the curvature of the photosensitive chip 22 can be more uniform.

Fig. 8 illustrates a schematic top view of yet another variant implementation of the photosensitive assembly 20 according to an embodiment of the present application. As shown in fig. 8, in this modified embodiment, the boundary portions of the hollow area 213 coincide with four boundaries of the photosensitive chip mounting area 210. As shown in fig. 8, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, the projection of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 includes four overlapping regions.

Preferably, as shown in fig. 8, in this modified embodiment, the non-overlapping area of the hollow area 213 and the photosensitive chip mounting area 210 is located at the corner area of the photosensitive chip mounting area 210. It should be understood that, since the curvature of the focal plane of the lens is higher as the focal plane is farther from the central field of view, the corner regions of the photo sensor chip 22 can be made to have larger curvature to match the curvature of field of the lens for imaging. More preferably, as shown in fig. 8, the non-overlapping areas of the hollow area 213 and the photosensitive chip mounting area 210 are located at 4 corner areas of the photosensitive chip mounting area 210. Of course, it should be understood by those skilled in the art that in other examples of this variant implementation, the non-overlapping area of the hollow area 213 and the photosensitive chip mounting area 210 may be disposed in 2 corner areas of the photosensitive chip 22 area, and this is not a limitation of the present application.

Fig. 9 illustrates a schematic top view of a further variant implementation of the photosensitive assembly 20 according to an embodiment of the present application, wherein the photosensitive assembly 20 illustrated in fig. 9 is the variant implementation of the photosensitive assembly 20 illustrated in fig. 5. Fig. 10 illustrates a schematic top view of a further variant implementation of the photosensitive assembly 20 according to an embodiment of the present application, wherein the photosensitive assembly 20 illustrated in fig. 10 is the variant implementation of the photosensitive assembly 20 illustrated in fig. 7. Fig. 11 illustrates a schematic top view of a further variant implementation of the photosensitive assembly 20 according to an embodiment of the present application, wherein the photosensitive assembly 20 illustrated in fig. 11 is the variant implementation of the photosensitive assembly 20 illustrated in fig. 8. As shown in fig. 9-11, in this modified embodiment, the ink layer 212 further includes at least one air escape channel 214, and the at least one air escape channel 214 extends from the hollow area 213 and protrudes out of the photo chip mounting area 210.

In particular, in the present embodiment, the at least one air escape channel 214 is configured to prevent the light sensing chip 22 from being unexpectedly tilted and/or bent due to the expansion of the air in the enclosed space. Here, the closed space refers to a closed space surrounded by the photosensitive member 20 and the hollow area 213. Specifically, the curing of the adhesive 26 is performed by baking and cooling the enclosed space. If the at least one air escape channel 214 is not provided, the air in the enclosed space cannot be exchanged with the outside, and when the air pressure in the enclosed space exceeds a predetermined threshold, the light sensing chip 22 may be unexpectedly tilted and/or bent.

Preferably, as shown in fig. 9 and 11, the at least one air escape channel 214 is formed on the circuit board 21 on the side where the leads 25 are not located. Of course, it will be understood by those skilled in the art that the at least one air escape channel 214 may also be formed in the circuit board 21 on the side where the leads 25 are present, as shown in fig. 10. In particular, as will be appreciated by those skilled in the art, the distance between the conductive terminals and the photosensitive chip mounting region 210 is about 100 μm, so if at least one air escape channel 214 is disposed on the side of the circuit board 21 where the leads 25 are present, the length of the at least one air escape channel 214 protruding from the photosensitive chip mounting region 210 needs to be taken into account. Preferably, the length is less than 100 micrometers to avoid ink removal around the conductive ends. As will be appreciated by those skilled in the art, the ink has a solder-resistant insulating effect, and when the ink on the periphery of the conductive terminals is removed, short circuits may occur between adjacent conductive terminals.

It should be noted that the at least one air escape channel 214 may also reduce interference of the portion of the ink layer 212 corresponding to the at least one air escape channel 214 on the bending of the photosensitive chip 22 in the bending process of the photosensitive chip 22.

It should be understood that, in the embodiment of the present application, after the ink layer 212 is hollowed out to form the hollowed-out region 213 in the middle region of the ink layer 212, the conductive vias on the circuit board main body 211 may be exposed (not shown). Therefore, in the process of designing the wiring of the circuit board 21, the number of the conductive wire paths arranged at the positions of the hollow-out regions 213 can be reduced. Alternatively, the adhesive 26 may be configured to have an insulating property to prevent short circuits between the wire paths.

When the adhesive 26 is applied to the hollow area 213, preferably, the adhesive 26 is disposed in the hollow area 213 at a middle position corresponding to the photosensitive surface of the photosensitive chip 22, so that the middle area of the photosensitive surface of the photosensitive chip 22 can be uniformly bent downward by the curing and shrinking force of the adhesive 26, so that the image forming surface of the photosensitive chip 22 can be relatively uniformly adjusted. In one embodiment, the adhesive 26 may be arranged in a matrix pattern.

Preferably, in the embodiment of the present application, the area of the hollow area 213 is 30 to 90% of the area of the photosensitive chip mounting area 210. It should be understood that, when the area of the hollow-out region 213 is small, the central region of the photosensitive chip 22 can be accurately curved convexly toward the object side; when the area of the hollow area 213 is larger, more adhesive 26 can be applied to provide stronger adhesion force, so that the photosensitive chip 22 is firmly and stably adhered to the circuit board 21.

It is worth mentioning that in the implementation, the adhesive 26 can also be disposed on the portion of the ink layer 212 in the photosensitive chip mounting region 210. Also, preferably, the thickness of the adhesive 26 applied in the hollow area 213 is higher than the thickness of the surrounding adhesive 26. In this way, during the curing process of the adhesive 26, the adhesive 26 applied in the hollow area 213 has a larger shrinkage, and the surrounding adhesive 26 has a relatively smaller shrinkage and the surrounding ink layer 212 is not easily deformed, so that the bending state of the photosensitive chip 22 can be further adjusted.

It should be noted that, in the embodiment of the present application, the thickness of the ink layer 212 may be set to be 30 to 100 micrometers. Preferably, in the embodiment of the present application, the thickness of the portion of the ink layer 212 for mounting the photosensitive chip 22 is higher than the thickness of the other portions of the ink layer 212, as shown in fig. 12 to 14, where the other portions of the ink layer represent the portions of the ink layer 212 not for mounting the photosensitive chip 22. Specifically, as shown in fig. 12, the thickness of the wiring path in the wiring board 21 is increased, that is, the heights of the wiring and the conductive terminal are increased. As shown in fig. 13, the thickness of the conductive paths in the wiring board 21 is not changed, and only the height of the ink layer 212 is increased. As shown in fig. 14, the thickness of the conductor path in the wiring board 21 is constant, and only the portion of the ink layer 212 for supporting the photosensitive chip 22 is increased in thickness. It should be noted that, when the thickness of the ink layer 212 is too large, the solvent is difficult to volatilize when the ink is cured, increasing the manufacturing difficulty of the ink layer 212, and only increasing the portion of the ink layer 212 supporting the photosensitive chip 22 can reduce the manufacturing difficulty of the ink layer 212 without increasing additional process problems due to changing the thickness of the conductive wire path. In a specific implementation, the thicker portion of the ink layer 212 may be formed by one-time molding or multiple processes, which is not limited in this application.

It should be noted that in the conventional camera module, the thickness of the adhesive 26 used for bonding the photosensitive chip 22 and the circuit board 21 is about 10 to 50 micrometers, and the thickness of the ink layer 212 on the surface of the circuit board 21 is about 20 to 30 micrometers. The thicker adhesive 26 can generate a larger shrinkage amount in the curing process, so that a better chip bending adjustment effect is achieved, and the distance between the photosensitive surface of the photosensitive chip 22 and the circuit board 21 is increased by using the glue with thick glue, so that the thickness of the camera module is increased. Considering the above factors comprehensively, preferably, the thickness of the ink layer 212 is set between 30 to 100 micrometers, and the thickness of the adhesive 26 is set between 10 to 100 micrometers, so that the camera module is guaranteed to be slightly influenced in height, and a certain adhesive force and a chip bending adjustment effect are provided.

In summary, the image pickup module and the photosensitive assembly thereof according to the embodiment of the present application are clarified, and the portion of the ink layer of the circuit board corresponding to the photosensitive chip mounting region is hollowed out, so that the photosensitive chip is bent downward in the process of attaching the photosensitive chip to the photosensitive chip mounting region 210 of the circuit board by the adhesive applied in the hollowed out region, and in this way, the bending state of the photosensitive chip 22 is adjusted, so as to improve the imaging quality.

Although the camera module is implemented as a fixed focus camera module as illustrated in fig. 3-11, it should be understood by those skilled in the art that the camera module related to the present application can also be implemented as a moving focus camera module, that is, the camera module further includes a driving element disposed between the optical lens 10 and the photosensitive component 20, so that the optical lens 10 is carried by the driving element to move along the photosensitive path, so as to change the distance between the optical lens 10 and the photosensitive component 20. Alternatively, the camera module may also be implemented as an optical anti-shake camera module, that is, the camera module further includes an optical anti-shake motor disposed between the optical lens 10 and the photosensitive assembly 20, so as to prevent the imaging quality from being affected by shake during shooting through the optical anti-shake motor. And is not intended to limit the scope of the present application.

Preparation method of schematic photosensitive assembly

According to another aspect of the present application, a method for manufacturing the photosensitive assembly 20 is also provided. Fig. 17 illustrates a schematic view of a manufacturing process of the photosensitive member 20 according to an embodiment of the present application. As shown in fig. 17, the process of manufacturing the photosensitive assembly 20 according to the embodiment of the present application first includes: forming a hollow-out area 213 on the photosensitive chip mounting area 210 of the circuit board 21, wherein the hollow-out area 213 is located in the photosensitive chip mounting area 210; then, an adhesive 26 is applied on the hollowed-out area 213 and the photosensitive chip mounting area 210; and finally attaching the photosensitive chip 22 to the photosensitive chip mounting region 210 to bend the photosensitive chip 22 downward by the adhesive 26.

In the embodiment of the present application, the process of forming the hollow region 213 on the photosensitive chip mounting region 210 of the circuit board 21 includes: first, a circuit board main body 211 is provided; then, an ink layer 212 is formed on the wiring board main body 211; and etching the ink layer 212 by an etching process to form the hollow area 213 on the photo chip mounting area 210 of the circuit board 21.

Specifically, the ink layer 212 may be formed on the wiring board main body 211 by any one of printing, curtain coating, spraying, roll coating, and the like. Further, an etching pattern is disposed on the ink layer 212, wherein the etching pattern is made of a material that is opaque to ultraviolet rays and corresponds to a pattern of the electronic component 23 pad such as a conductive terminal, a resistor, a capacitor, and the like that need to be exposed and the hollowed-out region 213 (for example, a photosensitive reaction of a photoresist may be used to transfer a conductive pattern on a film onto the ink layer 212 of the circuit board 21); irradiating ultraviolet rays, wherein the ultraviolet rays are not transmitted outside the etched pattern, and the rest of ink irradiated by the ultraviolet rays is subjected to a photopolymerization reaction to form a polymer from a monomer; finally, the ink not subjected to photopolymerization is removed from the surface of the wiring board 21 by a weak alkali solution, so that the pads and the hollow-out regions 213 are exposed.

It should be understood by those skilled in the art that in other examples of the present application, the hollowed-out area 213 may be formed on the ink layer 212 by other methods.

For example, in other examples of the present application, the process of forming the hollow region 213 on the photosensitive chip mounting region 210 of the wiring board 21 includes: providing a circuit board main body 211; however, a shielding object is disposed at the position where the hollow region 213 is to be formed; then, an ink layer 212 is formed around the mask, and at the same time, the mask is removed, so as to form the hollow area 213 at a position corresponding to the mask.

As another example, in other examples of the present application, the process of forming the hollow region 213 on the photosensitive chip mounting region 210 of the wiring board 21 includes: providing a circuit board main body 211; and forming an ink layer 212 with the hollow area 213 on the circuit board main body 211 by means of ink jet printing.

In summary, the photosensitive device manufacturing method based on the embodiments of the present application is illustrated, which can manufacture the photosensitive device and the modified embodiments thereof as described above.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims (20)

1. A photosensitive assembly, comprising:

a photosensitive chip; and

the circuit board comprises a circuit board main body and an ink layer formed on the circuit board main body, wherein the ink layer comprises a hollowed-out area formed in a photosensitive chip mounting area of the circuit board, and the hollowed-out area is configured to apply an adhesive to the hollowed-out area so that the photosensitive chip bends downwards in the process of attaching the photosensitive chip to the circuit board through the adhesive.

2. The photosensitive assembly of claim 1, wherein the hollowed-out area is located within the photosensitive chip mounting area.

3. The photosensitive assembly of claim 2, wherein the hollowed-out area partially coincides with the photosensitive chip mounting area, and a non-coinciding area of the hollowed-out area and the photosensitive chip mounting area is located at a shorter side of the photosensitive chip mounting area.

4. The photosensitive assembly of claim 2, wherein the hollowed-out area partially coincides with the photosensitive chip mounting area, and the non-coinciding area of the hollowed-out area and the photosensitive chip mounting area is located at a corner area of the photosensitive chip mounting area.

5. The photosensitive assembly according to claim 3 or 4, wherein the non-overlapping areas of the hollowed-out area and the photosensitive chip mounting area are symmetrically distributed with respect to the photosensitive chip mounting area.

6. The photosensitive assembly of claim 2, wherein the width of the hollowed-out area corresponding to the shorter side of the photosensitive chip mounting area is greater than the width of the hollowed-out area corresponding to the longer side of the photosensitive chip mounting area.

7. The photosensitive assembly of claim 2, wherein a center of the hollowed-out area corresponds to a center of the photosensitive chip mounting area.

8. The photosensitive assembly of claim 7, wherein the shape of the hollowed-out area is a centrosymmetric pattern.

9. The photosensitive assembly of claim 8, wherein the shape of the hollowed-out area corresponds to the shape of the photosensitive chip mounting area.

10. The photosensitive assembly of claim 8, wherein the shape of the hollowed-out area is cross-shaped.

11. The photosensitive assembly according to claim 1 or 2, wherein the ink layer further comprises at least one air escape hole extending outward from the hollow area and protruding out of the photosensitive chip mounting area.

12. The photosensitive assembly of claim 11, further comprising at least one electronic component disposed on the circuit board and a lead for electrically connecting the photosensitive chip and the circuit board, wherein the at least one air escape channel is formed on a side of the circuit board where the lead is not disposed.

13. The photosensitive assembly according to claim 2, wherein the area of the hollowed-out region is 30-90% of the area of the photosensitive chip mounting region.

14. The photosensitive assembly according to claim 1 or 2, wherein the thickness of the portion of the ink layer for mounting the photosensitive chip is higher than the thickness of the ink layer of the other portion.

15. The photosensitive assembly according to claim 14, wherein the thickness of the ink layer is 30 to 100 micrometers.

16. The photosensitive assembly of claim 15, wherein the adhesive has a thickness of 10 to 100 microns.

17. The photosensitive assembly of claim 1, wherein the ink layer is less deformable than the adhesive.

18. The photosensitive assembly of claim 1, wherein the adhesive is insulative.

19. The utility model provides a module of making a video recording which characterized in that includes:

a photosensitive assembly as claimed in any one of claims 1 to 18; and

and the optical lens is kept on a photosensitive path of the photosensitive component.

20. The camera module according to claim 19, wherein the curved shape of the lower surface of the photo-sensing chip is adapted to the shape of an actual focus imaging plane of the camera module.

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