KR20100051232A - Method for manufacturing camera module - Google Patents

Abstract

PURPOSE: A manufacturing method of a camera module is provided to prevent exposure of parts to environment of high pressure and high temperature by installing the parts on a ceramic substrate after coupling of a flexible printed circuit board and the ceramic substrate. CONSTITUTION: A ceramic substrate(110) is mounted on a mounted part of an FPCB(Flexible Printed Circuit Board)(100). The ceramic substrate is electrically connected to a bonding pad of the flexible printed circuit board. A coupling technology of the flexible printed circuit board and the ceramic substrate demands environment of high pressure and high temperature. The ceramic substrate can include chip parts(115) like a condenser, a resistance, etc. in a upper part. The condenser and the resistance are arranged around a mounted area of an image sensor.

Description

Method for Manufacturing Camera Module

The present invention relates to a camera module, and more particularly, to a method of manufacturing a camera module for mounting a housing after mounting a ceramic substrate on a flexible printed circuit board.

Nowadays, portable terminals such as mobile phones and PDAs are being used as a multi-convergence with music, movies, TV, and games as well as simple telephone functions with the development of the technology. The camera module is the most representative. The camera module is changing from the existing 300,000 pixels (VGA level) to the high pixel center of 8 million pixels or more, and is being changed to implement various additional functions such as auto focusing (AF) and optical zoom.

In particular, a portable terminal having a camera module to which an auto focusing function is added has been increasing in demand due to the advantage of providing a high quality image in which focusing is implemented regardless of a focal length with respect to a subject.

On the other hand, the camera module is manufactured by a chip on film (COF) method or a chip on board (COB) method. The COB type camera module is more productive than other package methods in a similar process to a conventional semiconductor production line. However, since the image sensor is mounted on the substrate using a wire, the size of the module increases due to the space for installing the wire, and thus requires an additional process.

Therefore, in recent years, a COF-based camera module based on bumps having external projecting joints is frequently used to reduce module size, improve heat dissipation and electrical performance, and improve reliability.

Since the COF type camera module does not need a space for attaching the wire above all, the package area is reduced, and the height of the barrel can be reduced, so that the thin and thin can be obtained. In addition, since a thin film (FPCB) or a flexible printed circuit board (FPCB) is used, a reliable package that can withstand external shocks is possible and the process is relatively simple. In addition, the COF system meets the trend of high-speed processing, high density, and pinning of signals due to miniaturization and reduction of resistance.

The COF type camera module has a problem in that the shape of the device is changed as the devices, such as the image sensor module, the lens barrel and the housing, coupled to each other on the flexible printed circuit board are mounted in a high temperature and high pressure environment.

In particular, when the COF-type camera module includes an actuator for auto focusing, it may cause a defect that the characteristics of the piezo provided in the actuator for moving the lens barrel are changed by the high temperature and high pressure environment.

SUMMARY OF THE INVENTION An object of the present invention relates to a method of manufacturing a camera module that can prevent the deformation and functional characteristics of a device from being degraded by mounting a housing after mounting a ceramic substrate on a flexible printed circuit board.

In order to achieve the above technical problem, an aspect of the present invention provides a camera module. Mounting the image sensor module on a flexible printed circuit board; And installing a housing in which a lens barrel is coupled to the image sensor module.

The mounting of the image sensor module on the flexible printed circuit board may include mounting a ceramic substrate on the flexible printed circuit board; And mounting an image sensor on the ceramic substrate.

In addition, the mounting of the ceramic substrate on the flexible printed circuit board may be performed by any one of a hot bar process, a reflow process, and an ACF process.

The mounting of the image sensor module on the flexible printed circuit board may include providing a ceramic substrate on which an image sensor is mounted; And sealing the image sensor by using a sealing member to form an image sensor module.

In addition, the mounting of the image sensor module on the flexible printed circuit board may be performed by a flip chip bonding method.

In addition, the housing may be bonded onto the image sensor module by using an adhesive resin.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of the camera module. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 to 4 are flowcharts of a camera module manufacturing method according to a first embodiment of the present invention.

Referring to FIG. 1, in order to manufacture a camera module, a flexible printed circuit board 100 is first provided.

The flexible printed circuit board 100 may be made of a flexible resin substrate such as a polyimide resin substrate. The flexible printed circuit board 100 may include a circuit pattern and a bonding pad electrically connected to the circuit pattern. In addition, although not shown, a connector for electrically connecting the camera module to an external device may be installed at one end of the flexible printed circuit board.

Referring to FIG. 2, a ceramic substrate 110 is mounted on a mounting portion of the flexible printed circuit board 100. In this case, the ceramic substrate 110 is electrically connected to the bonding pads of the flexible printed circuit board 100. Here, examples of the process of mounting the ceramic substrate 110 on the flexible printed circuit board 100 may be a hot bar process, a reflow process, an ACF process, and the like. At this time, the coupling technology of the flexible printed circuit board 100 and the ceramic substrate 110 requires an environment of high temperature and high pressure.

The ceramic substrate 110 may include a chip component 115, such as a capacitor and a resistor, disposed around the region where the image sensor 120 to be described later is mounted thereon.

Referring to FIG. 3, the image sensor 120 is mounted on the ceramic substrate 110 to form image sensor modules 110 and 120. In this case, the image sensor 120 may be mounted on the ceramic substrate 110 using a wire bonding 125 method.

The image sensor 120 detects light energy from the outside and converts the light energy into an electrical signal. Examples of the image sensor 120 may be a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).

Referring to FIG. 4, a housing 130 having a lens barrel 140 coupled thereto is installed on the image sensor modules 110 and 120.

 In the lens barrel 140, a plurality of lenses are stacked and coupled in multiple stages. The lens barrel 140 is inserted and mounted through the upper opening of the housing 130. Here, light is incident through the opening of the housing 130, and the light passes through the lenses of the lens barrel 140 and then flows into the image sensor 120. In this case, the image sensor 120 converts the incoming light into an electrical signal.

Although not shown in the drawing, between the lens mounted on the lens barrel 140 and the image sensor modules 110 and 120 mounted on the flexible printed circuit board 100, the excessive long wavelength flowing into the image sensor 120 may occur. An infrared cut filter may be further disposed to block infrared rays.

An inside of the housing 130 may further include an actuator electrically connected to the lens barrel. The actuator serves as a driving unit for moving the lens barrel 140 up and down for auto focusing in the image sensor modules 110 and 120.

In the exemplary embodiment of the present invention, the lens barrel 140 is assembled to the housing 130 and then installed on the image sensor modules 110 and 120, but the present invention is not limited thereto. That is, the lens barrel 140 may be assembled after the housing 130 is installed on the image sensor modules 110 and 120.

Installation of the housing 130 may be performed using an adhesive resin. That is, adhesive resin is coated on the image sensor modules 110 and 120. Here, the adhesive resin may be a thermosetting resin or UV curable resin. Thereafter, after aligning the housing 130 on the image sensor modules 110 and 120, a curing process is performed to attach the housing 130 to the image sensor modules 110 and 120.

Therefore, after the flexible printed circuit board and the ceramic substrate, which are required to be processed at a high temperature and a high pressure, are bonded to each other in an embodiment of the present invention, an apparatus, that is, an image sensor, a lens barrel, and a housing is installed on the ceramic substrate. Since the exposure to the environment of high temperature and high pressure can be prevented, the apparatus can be prevented from being deformed or deteriorated in functionality.

In addition, after mounting the ceramic substrate on the flexible circuit board, it is possible to produce a product in a basic COB process as subsequent processes are performed, it is possible to improve product productivity.

5 to 7 are process charts illustrating a camera module manufacturing method according to a second embodiment of the present invention.

Since the second embodiment of the present invention uses the same process as the above-described first embodiment except for the manufacturing method of the image sensor module, repeated descriptions thereof will be omitted.

Referring to FIG. 5, in order to manufacture a camera module, an image sensor module 210 is first provided.

In order to manufacture the image sensor module 210, first, a ceramic substrate 110 having an image sensor 212 mounted thereon is provided. Thereafter, the image sensor module 210 may be manufactured by sealing the image sensor using the sealing member 213. That is, the image sensor may be sealed by bonding the ceramic substrate 110 and the sealing member 213 through the sealing resin 214 between the ceramic substrate 110 and the sealing member 213. Can be. In this case, the image sensor 212 and the sealing member 213 are spaced apart at a predetermined interval. Here, the sealing member 213 may be a transparent substrate, for example, a glass substrate.

An electrical connection means 215 electrically connected to the image sensor 212 is disposed on the bottom surface of the ceramic substrate 110. Here, examples of the electrical connection means 215 may be solder balls and bumps.

As a result, the image sensor module 210 may be mounted on the flexible printed circuit board without a separate connecting means.

Referring to FIG. 6, the image sensor module 210 is mounted on the flexible printed circuit board 100. The image sensor module 210 may be mounted on the flexible printed circuit board 100 by a flip chip bonding method. That is, the bonding pads of the flexible printed circuit board 100 and the electrical connection means 215 of the image sensor module 210 are in close contact with each other, and then the reflow process or the hot bar process is performed to perform the image sensor module. The 210 may be mounted on the flexible printed circuit board 100.

Referring to FIG. 7, a camera module may be manufactured by installing a housing 130 in which a lens barrel 140 is coupled to the image sensor module 210.

Therefore, in the exemplary embodiment of the present invention, as the apparatus, that is, the lens barrel and the housing, is bonded after the process of mounting the image sensor module on the flexible printed circuit board requiring a high temperature environment, the apparatus is deformed or its functionality is deteriorated. You can prevent it.

1 to 4 are flowcharts of a camera module manufacturing method according to a first embodiment of the present invention.

5 to 7 are process charts illustrating a camera module manufacturing method according to a second embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: flexible circuit board 110, 211: ceramic substrate

120: image sensor 130: housing

140: lens barrel 210: image sensor module

Claims (6)

Mounting the image sensor module on the flexible printed circuit board; And Installing a housing having a lens barrel coupled to the image sensor module; Method of manufacturing a camera module comprising a. The method of claim 1, Mounting the image sensor module on the flexible printed circuit board, Mounting a ceramic substrate on the flexible printed circuit board; And And mounting an image sensor on the ceramic substrate. The method of claim 2, The mounting of the ceramic substrate on the flexible printed circuit board may be performed by any one of a hot bar process, a reflow process, and an ACF process. The method of claim 1, Mounting the image sensor module on the flexible printed circuit board, Providing a ceramic substrate on which an image sensor is mounted; And Sealing the image sensor using a sealing member to form an image sensor module. The method of claim 4, wherein  And mounting the image sensor module on the flexible printed circuit board by flip chip bonding. The method of claim 1, And the housing is bonded onto the image sensor module using adhesive resin.

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