CN113726985A - Photosensitive chip assembly, camera module and terminal equipment - Google Patents
Photosensitive chip assembly, camera module and terminal equipment Download PDFInfo
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- CN113726985A CN113726985A CN202010434183.3A CN202010434183A CN113726985A CN 113726985 A CN113726985 A CN 113726985A CN 202010434183 A CN202010434183 A CN 202010434183A CN 113726985 A CN113726985 A CN 113726985A
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The application provides a sensitization chip subassembly, module and terminal equipment of making a video recording. Wherein, sensitization chip subassembly includes: the light sensing chip comprises a silicon substrate, a light sensing area and a micro-lens array, wherein the light sensing area is positioned on the silicon substrate, and the micro-lens array is positioned on the light sensing area; the first stress layer is arranged on the back side of the photosensitive chip and generates tensile stress to drive the central area of the photosensitive chip to be bent towards the direction close to the micro-lens array, and the periphery of the photosensitive chip is bent towards the direction far away from the micro-lens array. Set up first stress layer through the dorsal part at sensitization chip, make sensitization chip crooked and with the crooked phase-match of camera lens field to reduce the module field of making a video recording and bent, promote and shoot the quality.
Description
Technical Field
This application belongs to the module field of making a video recording, specifically relates to a sensitization chip subassembly, module and terminal equipment make a video recording.
Background
As shown in fig. 1, the camera module generally includes a lens and a photosensitive element. The lens is arranged on the photosensitive assembly. The photosensitive assembly generally comprises a photosensitive chip, an electronic component and a circuit board. The photosensitive chip is adhered to the circuit board and is electrified with the circuit board through the electrifying lead. During shooting, the scenery is imaged through the lens. And the photosensitive area on the photosensitive chip receives the image of the lens and outputs a picture or a video.
The photosensitive chip is composed of a micro-lens array, a photosensitive area, a non-photosensitive area, a silicon substrate and the like. The production process is the semiconductor process production, so the whole photosensitive chip is similar to a flat plate, and the bending degree of the photosensitive chip is very small. And the lens is different. The image plane of the lens is a curved plane due to the lens refractive index, lens assembly deviation and the like.
The curvature condition of the image surface of the lens is as follows: the central region of the image plane is curved (upward curved) in the direction away from the photosensitive chip, and the periphery of the image plane is curved (downward curved) in the direction close to the photosensitive chip. This phenomenon is also called lens curvature of field. The distance between the center of the image plane and the center of the photosensitive area of the photosensitive chip is different from the distance between the periphery of the image plane and the periphery of the photosensitive area, so that when the camera module is used for shooting, the central area can image clearly and the periphery can not image clearly, or the central area can image not clearly and the periphery can image clearly. The imaging quality of the camera module can be reduced due to the large field curvature of the camera module.
Disclosure of Invention
This application aims at providing a sensitization chip subassembly, makes the sensitization chip crooked and with the crooked phase-match of camera lens field to reduce the module field of making a video recording song, promote and shoot the quality.
According to a first aspect of the present application, there is provided a photosensitive chip assembly comprising.
The light sensing chip comprises a silicon substrate, a light sensing area and a micro-lens array, wherein the light sensing area is positioned on the silicon substrate, and the micro-lens array is positioned on the light sensing area;
the first stress layer is arranged on the back side of the photosensitive chip and generates tensile stress to drive the central area of the photosensitive chip to be bent towards the direction close to the micro-lens array, and the periphery of the photosensitive chip is bent towards the direction far away from the micro-lens array.
According to some embodiments, the material of the first stress layer comprises: a metallic material.
According to further embodiments, the material pulling the first force layer further comprises:
a metal alloy material or a non-metallic material capable of generating tensile stress.
According to some embodiments, the first stress layer has a thickness of: 0.1um to 10 um.
According to some embodiments, the first stress layer comprises a vacuum evaporation coated layer and/or a vacuum sputter coated layer.
According to some embodiments, the height difference between the central region of the photosensitive chip and the periphery of the photosensitive chip is between 0 and 15 um.
According to some embodiments, the photosensitive chip assembly further comprises:
and the second stress layer is arranged on the side, opposite to the photosensitive chip, of the second stress layer.
According to some embodiments, the surface roughness of the second stress layer is less than or equal to 200 nm.
According to some embodiments, a thickness of the second stress layer is greater than or equal to a thickness of the first stress layer.
According to some embodiments, the second stress layer comprises: a film coating layer or an adhesive layer.
According to some embodiments, the coating layer comprises: and (5) a compressive stress film.
According to some embodiments, the material of the coating layer comprises: a compound material.
Further, the compound material includes: one or more of silicon dioxide, magnesium fluoride, aluminum oxide and titanium oxide.
According to some embodiments, the thickness of the coating layer is: 0.1um to 10 um.
According to some embodiments, the coating comprises a vacuum evaporation coating and/or a vacuum sputter coating.
According to some embodiments, the material of the glue layer comprises: one or more of thermosetting adhesive, UV thermosetting adhesive and moisture curing adhesive.
Further, the thickness of the glue layer is as follows: 0.1um to 30 um.
According to some embodiments, the glue layer comprises a spray coating and/or a spin-on coating.
According to a second aspect of the present application, there is provided a camera module, comprising:
the photosensitive chip component packaging body comprises the photosensitive chip component;
a lens assembly, comprising: a lens; the lens carrier or the motor is connected with the photosensitive chip assembly and the packaging body.
According to some embodiments, the curvature of field of the camera module is within-10 um to 10 um.
According to some embodiments, the curvature of field of the photosensitive chip assembly is in the same direction as the curvature of field of the lens and the difference is within-10 um to 10 um.
According to a third aspect of the present application, there is provided a terminal device including the above camera module.
The utility model provides a sensitization chip subassembly makes the crooked and the curved phase-match of camera lens field of sensitization chip through setting up first stress layer to the crooked degree of sensitization chip is controlled to the selection of accessible material and thickness, thereby reduces the module field of making a video recording curved, promotes and shoots the quality. In addition, in order to protect the first stress layer from cracking, the second stress layer is arranged on the back side of the first stress layer, and the photosensitive chip is further protected from cracking by forming a compressive stress film, improving the phenomenon of surface tension concentration of the first stress layer or limiting the surface bending degree of the first stress layer.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application.
Fig. 1 shows a schematic diagram of a conventional camera module assembly.
Fig. 2 shows a schematic diagram of a conventional photosensitive chip structure.
Fig. 3 shows a schematic structural diagram of a photosensitive chip assembly according to a first exemplary embodiment of the present application.
Fig. 4 is a schematic view illustrating a degree of curvature of a photosensitive chip assembly according to a first exemplary embodiment of the present application.
Fig. 5 is a schematic view illustrating a bending effect of a photosensitive chip assembly according to a first exemplary embodiment of the present application.
Fig. 6 shows a schematic view of a fragmentation of a photosensitive chip assembly according to a first exemplary embodiment of the present application.
FIG. 7 shows a schematic view of a photosensitive chip assembly according to a second exemplary embodiment of the present application.
FIG. 8 shows a schematic view of a flexure of a photosensitive chip assembly according to a second exemplary embodiment of the present application.
FIG. 9 shows a schematic crack filling diagram of a photosensitive chip assembly according to a second example embodiment of the present application.
Fig. 10 shows a second stress layer thickness diagram according to a second exemplary embodiment of the present application.
Fig. 11 is a schematic structural diagram of a camera module photosensitive chip assembly package according to a first exemplary embodiment of the present application.
Fig. 12 is a schematic structural diagram of a camera module photosensitive chip assembly package according to a second exemplary embodiment of the present application.
Fig. 13 is a schematic structural diagram of a camera module photosensitive chip assembly package according to a third exemplary embodiment of the present application.
Fig. 14 shows a schematic structural diagram of a camera module according to an exemplary embodiment of the present application.
FIG. 15 is a flow chart of a method for fabricating a photosensitive chip assembly according to an exemplary embodiment of the present application.
FIG. 16 shows a flow chart of a method of fabricating a photosensitive chip assembly according to another example embodiment of the present application.
Detailed Description
Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar parts in the drawings, and thus, a repetitive description thereof will be omitted.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the subject matter of the present application can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and so forth. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the application.
It will be understood that, although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first component discussed below may be termed a second component without departing from the teachings of the present concepts. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Those skilled in the art will appreciate that the drawings are merely schematic representations of exemplary embodiments, which may not be to scale. The blocks or flows in the drawings are not necessarily required to practice the present application and therefore should not be used to limit the scope of the present application.
The inventor proposes that the bending direction of the photosensitive chip is matched with the bending direction of the imaging surface of the lens by changing the structure of the photosensitive chip. Therefore, the field curvature of the camera module is reduced, and the shooting quality is improved.
The technical solution of the present application will be described in detail below with reference to the accompanying drawings.
Fig. 2 shows a schematic diagram of a conventional photosensitive chip structure.
As shown in fig. 2, the structure of the photo-sensing chip 110 is, from top to bottom, a microlens array 111, a photo-sensing region 112, and a silicon substrate 115. The lens array 111 is generally made of an organic film, for example, an acrylic thermosetting resin, an acrylic thermoplastic resin, or other inorganic compound material such as silica. The materials of the photosensitive region 112 and the silicon substrate 115 are mainly inorganic materials, mainly silicon, other semiconductor materials, and metal materials.
Fig. 3 shows a schematic structural diagram of a photosensitive chip assembly according to a first exemplary embodiment of the present application.
In order to make the crooked direction of sensitization chip and the crooked direction phase-match of camera lens imaging surface, this application provides a sensitization chip subassembly. As shown in FIG. 3, the photo chip assembly 1100 includes a photo chip 110 and a first stress layer 120. The first stress layer 120 is disposed on the backside of the photo sensor chip 110. The first stress layer 120 generates a tensile stress to drive the central region of the photosensitive chip 110 to bend towards the direction close to the microlens array 111, and the periphery of the photosensitive chip 110 to bend towards the direction far away from the microlens array 111.
The first stress layer 120 may be at least one tensile stress coating disposed on the backside of the photo sensor chip 110, i.e., under the silicon substrate 115. The first stress layer 120 is a less dense film layer, i.e. the distance between the molecules or atoms of the film material is larger. The molecules or atoms of the membrane material generate mutual attraction, so that the membrane layer has the tendency of shrinking. Thereby generating a tensile stress on the contact surface of the first stress layer 120 and the silicon substrate 115, driving the central region of the photosensitive chip 110 to bend towards the direction close to the microlens array 111, and driving the periphery of the photosensitive chip 110 to bend towards the direction far away from the microlens array 111.
The material of the first stress layer 120 may be a metal material, such as chromium, cobalt, nickel, copper, etc. According to other embodiments of the present application, the material of the first stress layer 120 may also be a metal alloy material, and may also be other non-metal materials that can generate a tensile stress, which is not limited to this application. The first stress layer 120 may be a vacuum evaporation coating layer or a vacuum sputtering coating layer, and the coating manner may be vacuum evaporation coating, vacuum sputtering coating, vapor deposition, and the like, which is not limited in this application.
Fig. 4 is a schematic view illustrating a degree of curvature of a photosensitive chip assembly according to a first exemplary embodiment of the present application.
The photosensitive chip assembly 1100 provided by the present application can control the curvature of the photosensitive chip 110 by changing the thickness and material of the first stress layer 120, so as to match different lens field curvatures. The thickness of the first stress layer 120 may be between 0.1um and 10 um. As shown in FIG. 4, the difference a (height decreasing position) between the height of the central region of the photosensitive region 112 and the height of the periphery of the photosensitive region can be controlled to be between 0 to 15um, even between 0 to 10um by selecting different coating materials and coating thicknesses. In addition, because the surface of the first stress film is provided with a certain micro gap, the bonding force between the photosensitive chip and the bonding glue can be enhanced, and the risk that the photosensitive chip falls off from the circuit board is reduced.
Fig. 5 is a schematic view illustrating a bending effect of a photosensitive chip assembly according to a first exemplary embodiment of the present application.
The first stress layer 120 disposed on the backside of the silicon substrate 115 drives the central region of the photo sensor chip 110 to bend towards the direction close to the microlens array 111 and drives the periphery of the photo sensor chip 110 to bend towards the direction away from the microlens array 111 by the tensile stress generated by the plating. The bent photosensitive chip is connected with the circuit board and assembled with the lens to obtain the camera module. As shown in fig. 5, the above structure makes the curvature direction of the photosensitive area consistent with the curvature direction of the image plane 100 of the lens, so as to reduce the difference between the distance from the center of the image plane to the center of the photosensitive area of the photosensitive chip and the distance from the periphery of the image plane to the periphery of the photosensitive area, and control the curvature of field of the camera module to be between-10 um and 10um, even between-5 um and 5um, thereby improving the imaging quality of the camera module. The field curvature value of the camera module can be measured by shooting, an SFR algorithm, an MTF algorithm and other methods.
For example, for the same batch of shots, the batch of shots may be divided into multiple batches according to each detected shot curvature value. And the shots with the curvature of field in the first interval are in a batch, the shots with the curvature of field in the second interval are in a batch, the shots with the curvature of field in the third interval are in a batch, and the like. Aiming at the lenses with different field curvature ranges, different coating thicknesses and coating materials can be selected to obtain photosensitive chips with different bending degrees to be respectively matched with a plurality of batches of lenses, so that the field curvature value of each batch of assembled camera modules is controlled to be-10 um.
Furthermore, for different batches of shots, because the field curvature difference of the shots of different batches is larger, the field curvature difference of the camera modules of different batches can be reduced by using the method. The standard value of the field curvature value of the camera module can be set to be-10 um, and all batches of lenses are divided into a plurality of batches according to the detected field curvature value of each lens. For example, shots with curvature of field in the first interval are grouped, shots with curvature of field in the second interval are grouped, shots with curvature of field in the third interval are grouped, and so on. Aiming at the lenses with different field curvature ranges, different coating thicknesses and coating materials can be selected to obtain photosensitive chips with different bending degrees to be respectively matched with a plurality of batches of lenses, so that the field curvature value of each batch of assembled camera modules is controlled to be-10 um. Therefore, the field curvature consistency of the camera modules in different batches can be improved.
Fig. 6 shows a schematic view of a fragmentation of a photosensitive chip assembly according to a first exemplary embodiment of the present application.
In the processes of camera module assembly, camera module mechanical reliability test, temperature reliability test and the like, deformation quantities and deformation directions of various components such as a circuit board, a photosensitive chip, a lens base, glue and the like are possibly different, and the photosensitive chip is stressed to further bend. For example, when the curvature shown in fig. 6 occurs, the central region of the photosensitive chip 110 is curved in a direction away from the microlens array, and the periphery of the photosensitive chip 110 is curved in a direction close to the microlens array. The bending of the photo sensor chip 110 drives the bending of the first stress layer 120, and the surface of the first stress layer 120 is more bent, and a tensile force is generated on the surface of the first stress layer 120. Due to the low compactness of the first stress layer 120, a large number of micro-cracks 121 are formed on the surface of the first stress layer 120. The micro-gap belongs to a surface shape mutation part, and stress is easily concentrated at the shape mutation part. Therefore, the tensile force is concentrated on the micro-gaps 121, so that the breaking strain of the first stress layer 120 is reduced, i.e., the first stress layer can be broken with a smaller deformation amount/force. In this case, the first stress layer 120 is easily chipped, and further the photo chip is chipped.
FIG. 7 shows a schematic view of a photosensitive chip assembly according to a second exemplary embodiment of the present application.
FIG. 8 shows a schematic view of a flexure of a photosensitive chip assembly according to a second exemplary embodiment of the present application.
To solve the above-mentioned fragmentation problem, the present application provides another kind of photosensitive chip assembly. As shown in fig. 7 and 8, the photosensitive chip assembly 1100 includes a photosensitive chip 110, a first stress layer 120, and a second stress layer 130. The first stress layer 120 is disposed on the backside of the photo sensor chip 110, and the second stress layer 130 is disposed on the opposite side of the second stress layer from the photo sensor chip 110, i.e., the backside of the first stress layer 120. The second stress layer has smaller surface roughness, for example, less than or equal to 200nm, and can improve fracture strain and reduce surface stress concentration. In addition, the thickness of the second stress layer is larger than or equal to that of the first stress layer, so that the strength and compactness of the second stress layer are improved, and the fracture risk can be reduced.
According to some embodiments of the present disclosure, the second stress layer 130 may be a coating layer, and the material thereof may be a compound material, such as one or more of silicon dioxide, magnesium fluoride, aluminum oxide, and titanium oxide, and may also be other compound materials capable of generating a compressive stress, which is not limited in the present disclosure. The coating layer has better compactness, and the surface micro-crack/micro-gap of the coating layer is smaller, so that a compressive stress film can be formed. Because the distance between the material molecules/atoms of the coating layer is small, mutual repulsion force is generated between the material molecules/atoms of the coating layer, and the contact surface between the coating layer and the first stress layer 120 generates compressive stress. The second stress layer 130 has a good surface compactness, and the microcracks on the surface are smaller and shallower. The coating layer comprises a vacuum evaporation coating layer, a vacuum sputtering coating layer or a vapor deposition layer.
FIG. 9 shows a schematic crack filling diagram of a photosensitive chip assembly according to a second example embodiment of the present application.
As shown in fig. 9, the second stress layer 130 is disposed below the first stress layer 120, and since the coating layer of the second stress layer 130 has a relatively high compactness, material molecules of the second stress layer can fill the micro-gaps 121 on the surface of the first stress layer 120, so as to improve the shape of the micro-gaps 121 on the surface of the first stress layer 120. The shape of the first stress layer 120 is suddenly changed to be smaller, and the breaking strain is correspondingly increased, so that the surface tension concentration of the first stress layer 120 generated by the bending of the photosensitive chip 110 is reduced.
Fig. 10 shows a second stress layer thickness diagram according to a second exemplary embodiment of the present application.
As shown in fig. 10, the coating layer 130 has a certain thickness, for example, 0.1 to 10um, so that the backside of the photo sensor chip 110 has a better compactness and a smaller roughness, and further reduces the concentration of the surface tension of the first stress layer 120 generated by the bending of the photo sensor chip 110, thereby protecting the photo sensor chip from cracking.
The second stress layer 130 shown in fig. 8 may also be a glue layer, according to some embodiments of the present application. In the processes of module assembly, camera module mechanical reliability test, temperature reliability test and the like, the photosensitive chip can be stressed to bend, the central area of the photosensitive chip bends towards the direction far away from the micro-lens array, and the periphery of the photosensitive chip bends towards the direction close to the micro-lens array. After the second stress layer of the adhesive layer is arranged, in the assembling process, the adhesive layer is heated and shrunk, so that the bending degree is reduced, the surface of the first stress layer is bent and does not reach the fracture strain, the first stress layer is protected from being cracked, and the photosensitive chip is protected from being cracked.
According to some embodiments of the present application, the glue layer may be a spray coating or a spin coating, and the glue layer may be a spray coating, a spin coating, or the like. The material of the glue layer can be one or more of thermosetting glue, UV thermosetting glue and moisture curing glue. The thickness of the glue layer can be between 0.1um and 30 um.
In other embodiments, the second stress layer 130 may also be formed on the backside of the first stress layer 120 by ink printing, paint spraying, or the like.
Fig. 11 is a schematic structural diagram of a camera module photosensitive chip assembly package according to a first exemplary embodiment of the present application.
As shown in fig. 11, the camera module photosensitive assembly package 1000 includes a photosensitive chip assembly 1100, a circuit board 1200, an electronic element 1300, a package member 1400, and a filter element 1500.
The photo chip assembly 1100 includes a photo chip 110, a first stress layer 120, and a second stress layer 130. According to other embodiments of the present application, the photosensitive chip assembly 1100 may also include only the photosensitive chip 110 and the first stress layer 120.
The photosensitive chip assembly 1100 is adhered to the wiring board 1200 by an adhesive 900. The circuit board 1200 is electrically connected to the photo sensor chip assembly 1100, and transmits digital signals. The electronic component 1300 is disposed on the circuit board 1200, and is electrically connected to the circuit board 1200 to provide an auxiliary circuit for transmitting and processing digital signals.
The package member 1400 may be a mirror base, and is bonded to the circuit board 1200 by an adhesive, so as to package the electronic component 1300, such as a capacitor or a resistor, and the photo sensor chip package 1100 on the circuit board 1200. The package member 1400 and the circuit board 1200 enclose a cavity 1441 for accommodating the die assembly 1100 and the electronic component 1300, and the package member 1400 has a window 1442 through which light rays passing through the lens are incident to the photosensitive area of the die assembly. The filter element 1500 is disposed on the package member 1400 and covers the window 1442 for filtering out infrared rays to improve the image capturing effect.
The packaging body structure provided by the embodiment can prevent the photosensitive chip, the electronic element, the circuit board and the like from being polluted.
Fig. 12 is a schematic diagram illustrating a structure of a package of a photosensitive element of a camera module according to a second exemplary embodiment of the present application.
The package body can also be integrally formed on the circuit board by transfer molding, injection molding, die pressing and the like. As shown in fig. 12, the package member 1400 may be further formed integrally on the circuit board 1200 by transfer molding, injection molding, or die pressing. The package member 1400 encapsulates the photosensitive chip assembly 1100 and the electronic component 1300, and encapsulates the chip non-photosensitive region and the electronic component power-on leads therein. And the package member 1400 has a light-transmissive window 1442 exposing the light-sensing region 112 of the die assembly 1100.
The package structure is reduced in size in all directions of length, width and height, so that the adhesive is prevented from being separated out, and the electronic element and the connecting wire are further protected by the package part 1400.
Fig. 13 is a schematic diagram illustrating a structure of a package of a photosensitive assembly of a camera module according to a third exemplary embodiment of the present application.
Optionally, the package component 1400 includes a mold 1443, a bezel 1444. The molding 1443 is integrally formed on the circuit board 1200 by transfer molding, injection molding, press molding, or the like, and covers the electronic component 1300. The lens holder 1444 is disposed on the molding portion 1443, and the filter element 1500 is disposed on the lens holder 1444.
The packaging body structure has simple packaging process, small warpage and less dirt generated in the packaging process, and the sizes in the length direction and the width direction are reduced.
In addition, this application still provides a module of making a video recording, includes above-mentioned sensitization chip subassembly packaging body.
Fig. 14 shows a schematic structural diagram of a camera module according to an exemplary embodiment of the present application.
As shown in fig. 14, the camera module 2000 further includes a lens assembly 1600 configured to be mounted on the package member 1400 for capturing and focusing a subject to be photographed for transfer to the photo chip assembly 1100. Lens assembly 1600 includes a lens 1610, a lens carrier or motor 1620. .
The motor 1620 drives the lens 1610 to move or tilt, thereby implementing functions such as auto-focusing and optical anti-shake. The lens carrier or motor 1620 may be selectively mounted on the circuit board 1200 or the package 1400. In fig. 14, a lens carrier or motor 1620 is mounted on a package 1400. By arranging the first stress layer 120, the bending direction of the photosensitive chip 110 is matched with the bending direction of the lens imaging surface. The curvature of field of the photo-sensing chip assembly 1100 is in the same direction as the curvature of field of the lens 1610 and the difference is controlled within ± 10 um. Therefore, the field curvature of the camera module is reduced, and the shooting quality is improved.
In addition, this application still provides a terminal equipment, includes above-mentioned module of making a video recording.
FIG. 15 is a flow chart of a method for fabricating a photosensitive chip assembly according to an exemplary embodiment of the present application.
As shown in fig. 15, in step S10, a first stress layer is provided on the back surface of the photosensitive chip. The material of the first stress layer can be a metal material, such as chromium, cobalt, nickel, copper, etc., and can also be a metal alloy material or a non-metal material generating tensile stress. Specific methods for arranging the first stress layer comprise vacuum evaporation coating, vacuum sputtering coating and the like. The thickness of the formed first stress layer is 0.1-10 um.
In step S11, a plating layer is disposed on the back surface of the first stress layer. The material of the coating layer can be a compound material, such as one or more of silicon dioxide, magnesium fluoride, aluminum oxide and titanium oxide. The coating layer has better compactness, and the surface micro-crack/micro-gap of the coating layer is smaller, so that a compressive stress film can be formed, the phenomenon of tension concentration on the surface of the first stress layer is improved, and the photosensitive chip is protected from cracking. The thickness of the coating layer can be 0.1-10 um.
FIG. 16 shows a flow chart of a method of fabricating a photosensitive chip assembly according to another example embodiment of the present application.
As shown in fig. 16, in step S20, a first stress layer is provided on the back surface of the photosensitive chip. The specific method for disposing the first stress layer is the same as S10, and is not described herein again.
In step S21, a glue layer is disposed on the back side of the first stress layer. The glue layer can be a spray coating layer or a spin coating layer, and the glue coating mode can be a spray coating mode, a spin coating mode and the like. The material of the glue layer can be one or more of thermosetting glue, UV thermosetting glue and moisture curing glue. The thickness of the glue layer can be between 0.1um and 30 um. In the assembling process, the adhesive layer is heated and shrunk, so that the bending degree is reduced, the surface of the first stress layer is bent and does not reach the fracture strain of the first stress layer, the first stress layer is protected from being cracked, and the photosensitive chip is protected from being cracked.
The first stress layer is arranged on the back of the photosensitive chip, so that the bending direction of the photosensitive chip is matched with the bending direction of the imaging surface of the lens. Therefore, the field curvature of the camera module is reduced, and the shooting quality is improved. The second stress layer is arranged on the back side of the first stress layer, so that the tension concentration phenomenon on the surface of the first stress layer is improved or the surface of the first stress layer is bent and does not reach the fracture strain of the first stress layer, the first stress layer is protected from being cracked, and the photosensitive chip is protected from being cracked.
It should be understood that the above examples are only for clearly illustrating the present application and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of this invention may be made without departing from the spirit or scope of the invention.
Claims (22)
1. A photosensitive chip assembly, comprising:
the light sensing chip comprises a silicon substrate, a light sensing area and a micro-lens array, wherein the light sensing area is positioned on the silicon substrate, and the micro-lens array is positioned on the light sensing area;
the first stress layer is arranged on the back side of the photosensitive chip and generates tensile stress to drive the central area of the photosensitive chip to be bent towards the direction close to the micro-lens array, and the periphery of the photosensitive chip is bent towards the direction far away from the micro-lens array.
2. The photosensitive chip assembly of claim 1, wherein the material of the first stress layer comprises: a metallic material.
3. The photosensitive chip assembly of claim 1, wherein the material pulling the first force layer further comprises:
a metal alloy material or a non-metallic material capable of generating tensile stress.
4. The photosensitive chip assembly of claim 1, wherein the first stress layer has a thickness of: 0.1um to 10 um.
5. The photosensitive chip assembly of claim 1, wherein said first stress layer comprises a vacuum evaporation coating and/or a vacuum sputter coating.
6. The photosensitive chip assembly of claim 1, wherein the height difference between the central region of the photosensitive chip and the periphery of the photosensitive chip is between 0-15 um.
7. The photosensitive chip assembly of claim 1, further comprising:
and the second stress layer is arranged on one side of the first stress layer opposite to the photosensitive chip.
8. The photosensitive chip assembly of claim 7, wherein the surface roughness of the second stress layer is less than or equal to 200 nm.
9. The photosensitive chip assembly of claim 7, wherein a thickness of the second stress layer is greater than or equal to a thickness of the first stress layer.
10. The photosensitive chip assembly of claim 7, wherein the second stress layer comprises: a film coating layer or an adhesive layer.
11. The photosensitive chip assembly of claim 10, wherein said coating layer comprises: and (5) a compressive stress film.
12. The photosensitive chip assembly of claim 10, wherein the coating material comprises: a compound material.
13. The photosensitive chip assembly of claim 12, wherein the compound material comprises:
one or more of silicon dioxide, magnesium fluoride, aluminum oxide and titanium oxide.
14. The photosensitive chip assembly of claim 10, wherein the coating layer has a thickness of: 0.1um to 10 um.
15. The photosensitive chip assembly of claim 10, wherein said coating comprises vacuum evaporation coating and/or vacuum sputter coating.
16. The photosensitive chip assembly of claim 10, wherein the material of the glue layer comprises:
one or more of thermosetting adhesive, UV thermosetting adhesive and moisture curing adhesive.
17. The photosensitive chip assembly of claim 16, wherein the thickness of the glue layer is: 0.1um to 30 um.
18. The photosensitive chip assembly of claim 10, wherein said glue layer comprises: spray coating and/or spin coating.
19. The utility model provides a module of making a video recording which characterized in that includes:
a photosensitive chip assembly package comprising the photosensitive chip assembly of any one of claims 1-18;
a lens assembly, comprising: a lens; and the lens carrier or the motor is connected with the photosensitive chip component packaging body.
20. The camera module of claim 19, wherein the field curvature value of the camera module is within the range of-10 um to 10 um.
21. The camera module of claim 19, wherein the curvature of field of the photosensitive chip assembly is in the same direction as the curvature of field of the lens and has a difference value within-10 um to 10 um.
22. A terminal device, characterized in that it comprises a camera module according to any one of claims 19-21.
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| CN202010434183.3A CN113726985B (en) | 2020-05-21 | 2020-05-21 | Photosensitive chip assembly, camera module and terminal equipment |
| PCT/CN2021/091241 WO2021233114A1 (en) | 2020-05-21 | 2021-04-30 | Photosensitive chip assembly, camera module, and terminal device |
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| CN202010434183.3A CN113726985B (en) | 2020-05-21 | 2020-05-21 | Photosensitive chip assembly, camera module and terminal equipment |
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| CN117544844A (en) * | 2024-01-09 | 2024-02-09 | 荣耀终端有限公司 | Photosensitive assembly, mounting method of photosensitive chip, camera module and electronic equipment |
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| CN114500801A (en) * | 2022-01-19 | 2022-05-13 | 横店集团东磁有限公司 | Camera module and packaging method thereof |
| CN115274721B (en) * | 2022-06-30 | 2024-09-10 | 重庆长安汽车股份有限公司 | Field curvature correction method and device of camera module, electronic equipment and storage medium |
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| WO2021233114A1 (en) | 2021-11-25 |
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