CN210403691U - Wafer conveying arm for gluing and developing equipment - Google Patents
Wafer conveying arm for gluing and developing equipment Download PDFInfo
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- CN210403691U CN210403691U CN201921626002.6U CN201921626002U CN210403691U CN 210403691 U CN210403691 U CN 210403691U CN 201921626002 U CN201921626002 U CN 201921626002U CN 210403691 U CN210403691 U CN 210403691U
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Abstract
The utility model discloses a wafer conveying arm for rubber coating developing device, including the arm body, still include two and arm body sliding connection's regulation seat, be equipped with vacuum channel in the regulation seat, fixedly connected with bulb seat on the regulation seat, fixedly connected with top, bottom are planar bulb on the bulb seat, bulb top fixedly connected with limiting plate, be equipped with the through-hole on the limiting plate, through-hole downwardly extending runs through bulb, bulb seat in proper order and communicates with vacuum channel, the bulb outside has rotationally cup jointed the sucking disc seat, the relative bulb of sucking disc seat is swung in the certain extent, the sucking disc is installed at sucking disc seat top, sucking disc and through-hole intercommunication. The utility model discloses can adapt to not unidimensional wafer and take place warped wafer.
Description
Technical Field
The utility model relates to a conveying arm device field especially relates to a wafer conveying arm for rubber coating development equipment.
Background
At present, a transfer arm installed on a transfer robot of a semiconductor device is of a vacuum adsorption type, but a wafer sometimes warps in a manufacturing process, and an ordinary transfer arm cannot completely suck the wafer due to the warping of the wafer in a transfer process, and even a wafer is dropped, so that unnecessary loss is caused. On the other hand, most of the existing transfer arms are designed for one size of wafer, and the transfer arms with different sizes need to be purchased in order to adapt to wafers with different sizes, thereby greatly increasing the production cost.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem mentioned in the above-mentioned background art, the utility model provides a wafer conveying arm for rubber coating development equipment can adapt to not unidimensional wafer and take place warping wafer.
The utility model provides a wafer conveying arm for rubber coating developing device, includes the arm body, still includes two and arm body sliding connection's regulation seat, be equipped with vacuum channel in the regulation seat, fixedly connected with bulb seat on the regulation seat, fixedly connected with top, bottom are planar bulb on the bulb seat, bulb top fixedly connected with limiting plate, be equipped with the through-hole on the limiting plate, through-hole downwardly extending runs through bulb, bulb seat in proper order and communicates with vacuum channel, the bulb outside has rotationally cup jointed the sucking disc seat, the relative bulb of sucking disc seat swings at the certain limit, the sucking disc is installed at sucking disc seat top, sucking disc and through-hole intercommunication.
Further, arm body one end is equipped with the spout, two the equal fixedly connected with of one end of adjusting the seat establish inside the spout and with spout matched with slider, two all be equipped with the screw hole of at least one vertical distribution on the slider, the spout is equipped with rectangular through-hole with the one end lateral wall that the screw hole is relative, rectangular through-hole runs through have with screw hole threaded connection's bolt assembly.
Furthermore, vacuum air hole joints are arranged on the sides, far away from each other, of the two adjusting seats, first air holes communicated with the through holes are formed in the tops of the adjusting seats, one ends of the vacuum channels extend to the vacuum air hole joints to be communicated with the vacuum air hole joints, and the other ends of the vacuum channels extend to the first air holes to be communicated with the first air holes.
Further, the sucking disc seat is narrow horn-shaped structure and inside cavity down for the upper width, the bottom lateral wall of sucking disc seat rotationally cup joints the bulb outside, the bottom lateral wall of sucking disc seat can swing at certain extent relative bulb, leave the clearance between the top lateral wall of sucking disc seat and limiting plate, the top lateral wall of sucking disc seat is equipped with the second venthole, second venthole and sucking disc intercommunication.
Furthermore, the ball head seat is arranged at one end of the adjusting seat far away from the arm body.
Furthermore, the vacuum air hole joint is arranged at one end of the adjusting seat close to the arm body.
Further, two threaded holes are formed in each sliding block.
Furthermore, the bottom of the sucker is provided with an air exhaust hole corresponding to the second vent hole.
The utility model has the advantages that:
1. the utility model discloses the position of accessible adjusting block in the spout makes the transfer arm be applicable to not unidimensional wafer.
2. The utility model discloses a sucking disc seat and bulb rotatable coupling to make the sucking disc seat bulb relatively swing in the certain limit, when adsorbing the warped wafer, the sucking disc seat angle of adjusting of swinging of bulb seat relatively makes the sucking disc and the laminating of the warped wafer of living, avoids taking place the piece in the data send process.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a front view of the present invention.
Fig. 3 is an enlarged view of fig. 2 at a.
Fig. 4 is a schematic diagram of the internal structure of the present invention.
Fig. 5 is an enlarged view of fig. 4 at B.
Fig. 6 is a schematic structural view of the wafer with warped wafer adsorbed by the present invention.
Wherein, 1 is the arm body, 2 is adjusting the seat, 3 is the vacuum channel, 4 is the bulb seat, 5 is the bulb, 6 is the limiting plate, 7 is the through-hole, 8 is the sucking disc seat, 9 is the sucking disc, 10 is the spout, 11 is the slider, 12 is the screw hole, 13 is rectangular through-hole, 14 is bolt assembly, 15 is the vacuum gas pocket joint, 16 is first air vent, 17 is the second air vent, 18 is the wafer, 19 is the cavity, 20 is the aspirating hole.
Detailed Description
The present invention will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.
As shown in the figure, a wafer conveying arm for rubber coating developing equipment, including arm body 1, still include two and 1 sliding connection's of arm body regulation seat 2, be equipped with vacuum channel 3 in the regulation seat 2, fixedly connected with bulb seat 4 on the regulation seat 2, fixedly connected with top, bottom are planar bulb 5 on the bulb seat 4, 5 top fixedly connected with limiting plates of bulb 6, be equipped with through-hole 7 on the limiting plate 6, through-hole 7 downwardly extending runs through bulb 5, bulb seat 4 in proper order and communicates with vacuum channel 3, 5 outsides of bulb have rotationally cup jointed sucking disc seat 8, sucking disc seat 8 bulb 5 can swing in the certain extent relatively, sucking disc 9 is installed at 8 tops of sucking disc seat, sucking disc 9 and through-hole 7 intercommunication.
Wherein, 1 one end of arm body is equipped with spout 10, two the equal fixedly connected with of one end of adjusting seat 2 establish inside 10 spouts and with spout 10 matched with slider 11, two all be equipped with at least one vertical distribution's screw hole 12 on the slider 11, the spout 10 is equipped with rectangular through-hole 13 with the one end lateral wall that screw hole 12 is relative, rectangular through-hole 13 runs through have with screw hole 12 threaded connection's bolt assembly 14, bolt assembly 14 is bolt, nut. Wherein, the length of the sliding chute 10 can be 30cm, and the length of the strip through hole 13 can be 26 cm.
The two adjusting bases 2 are provided with vacuum air hole joints 15 at the sides far away from each other, the top of each adjusting base 2 is provided with a first air hole 16 communicated with the through hole 7, one end of each vacuum channel 3 extends to the vacuum air hole joint 15 to be communicated with the vacuum air hole joint 15, and the other end of each vacuum channel 3 extends to the first air hole 16 to be communicated with the first air hole 16.
Wherein, sucking disc seat 8 has cavity 19 for narrow horn-shaped structure and inside under the wide, sucking disc seat 8's bottom lateral wall rotationally cup joints 5 outsides of bulb, sucking disc seat 8's bottom lateral wall can swing at certain extent relatively bulb 5, leave the clearance between sucking disc seat 8's top lateral wall and limiting plate 6, sucking disc seat 8's top lateral wall is equipped with second ventilation hole 17, second ventilation hole 17 and sucking disc 9 intercommunication.
Wherein, the ball head seat 4 is arranged at one end of the adjusting seat 2 far away from the arm body 1.
Wherein, the vacuum air hole joint 15 is arranged at one end of the adjusting seat 2 close to the arm body 1.
Two threaded holes 12 are formed in each sliding block 11.
Wherein, the bottom of the sucking disc 9 is provided with an air suction hole 20 corresponding to the position of the second vent hole 17.
The utility model discloses when concrete implementation: the bolt assembly 14 is firstly screwed off, the distance between the two adjusting seats 2 is adjusted according to the size of the wafer 18, then the wafer 18 is fixed through the bolt assembly 14, and when the wafer 18 is in contact with the sucking disc 9, the vacuum channels 3 in the two adjusting seats 2 are vacuumized through a vacuum pump (not shown), so that the sucking disc 9 adsorbs the wafer 18. As shown in fig. 6, when the wafer 18 is a warped wafer, the chuck base 8 can swing relative to the ball head 5 to adjust the angle of the chuck 9, so that the chuck 9 contacts the warped wafer 18, and the wafer 18 is sucked.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a wafer conveying arm for rubber coating developing device, includes the arm body, its characterized in that still includes two and arm body sliding connection's regulation seat, be equipped with vacuum channel in the regulation seat, fixedly connected with bulb seat on the regulation seat, fixedly connected with top, bottom are planar bulb on the bulb seat, bulb top fixedly connected with limiting plate, be equipped with the through-hole on the limiting plate, through-hole downwardly extending runs through bulb, bulb seat in proper order and communicates with vacuum channel, the sucking disc seat has rotationally been cup jointed to the bulb outside, the bulb can swing at the certain extent relatively of sucking disc seat, the sucking disc is installed at sucking disc seat top, sucking disc and through-hole intercommunication.
2. The wafer conveying arm for the gluing and developing device according to claim 1, wherein a sliding groove is formed in one end of the arm body, a sliding block which is arranged inside the sliding groove and matched with the sliding groove is fixedly connected to one end of each of the two adjusting seats, at least one vertically distributed threaded hole is formed in each of the two sliding blocks, a long through hole is formed in one side wall of the sliding groove, which is opposite to the threaded hole, and a bolt assembly in threaded connection with the threaded hole penetrates through the long through hole.
3. The wafer conveying arm for the gumming developing device as claimed in claim 2, wherein a vacuum air hole joint is arranged on one side of each of the two adjusting bases, which is far away from each other, a first vent hole communicated with the through hole is arranged on the top of each of the two adjusting bases, one end of each vacuum channel extends to the vacuum air hole joint to be communicated with the vacuum air hole joint, and the other end of each vacuum channel extends to the first vent hole to be communicated with the first vent hole.
4. The wafer conveying arm for the gluing and developing device according to claim 1, wherein the suction cup seat is of a horn-shaped structure with a wide top and a narrow bottom, a cavity is formed in the suction cup seat, the bottom side wall of the suction cup seat is rotatably sleeved outside the ball head, the bottom side wall of the suction cup seat can swing within a certain range relative to the ball head, a gap is reserved between the top side wall of the suction cup seat and the limiting plate, a second vent hole is formed in the top side wall of the suction cup seat, and the second vent hole is communicated with the suction cup.
5. The wafer conveying arm for the gluing and developing device according to claim 3, wherein the ball seat is arranged at one end of the adjusting seat far away from the arm body.
6. The wafer transfer arm for the gumming development device as in claim 5, wherein the vacuum air hole joint is arranged at one end of the adjusting seat close to the arm body.
7. The wafer transfer arm for the gumming developing device as in claim 2, wherein there are two threaded holes on each slide block.
8. The wafer conveying arm for the gluing and developing device as claimed in claim 4, wherein a suction hole is formed in the bottom of the suction cup corresponding to the second vent hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921626002.6U CN210403691U (en) | 2019-09-27 | 2019-09-27 | Wafer conveying arm for gluing and developing equipment |
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Application Number | Priority Date | Filing Date | Title |
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CN201921626002.6U CN210403691U (en) | 2019-09-27 | 2019-09-27 | Wafer conveying arm for gluing and developing equipment |
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CN210403691U true CN210403691U (en) | 2020-04-24 |
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CN201921626002.6U Active CN210403691U (en) | 2019-09-27 | 2019-09-27 | Wafer conveying arm for gluing and developing equipment |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110718499A (en) * | 2019-09-27 | 2020-01-21 | 上海图双精密装备有限公司 | Wafer conveying arm for gluing and developing equipment |
WO2022209888A1 (en) * | 2021-03-30 | 2022-10-06 | 東京エレクトロン株式会社 | Processing device and substrate transport method |
-
2019
- 2019-09-27 CN CN201921626002.6U patent/CN210403691U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110718499A (en) * | 2019-09-27 | 2020-01-21 | 上海图双精密装备有限公司 | Wafer conveying arm for gluing and developing equipment |
CN110718499B (en) * | 2019-09-27 | 2024-06-14 | 上海图双精密装备有限公司 | Wafer conveying arm for glue spreading and developing equipment |
WO2022209888A1 (en) * | 2021-03-30 | 2022-10-06 | 東京エレクトロン株式会社 | Processing device and substrate transport method |
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