CN215069919U - Special wafer grabbing device of semiconductor device - Google Patents
Special wafer grabbing device of semiconductor device Download PDFInfo
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- CN215069919U CN215069919U CN202121510372.0U CN202121510372U CN215069919U CN 215069919 U CN215069919 U CN 215069919U CN 202121510372 U CN202121510372 U CN 202121510372U CN 215069919 U CN215069919 U CN 215069919U
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Abstract
The utility model relates to a wafer processing technology field especially relates to a special wafer grabbing device of semiconductor device, including the cross support body, the breach groove has all been seted up all around to the cross support body to the inboard in breach groove is provided with small-size straw, the middle part fixedly connected with connection pterygoid lamina on small-size straw surface. The utility model discloses a breach groove has all been seted up all around of cross support body, the inboard in breach groove is provided with small-size straw, can select the breach inslot on the cross support body to increase or reduce small-size straw quantity according to the practice demand, and adjust the position of small-size straw, make the sucker structure who comprises small-size straw satisfy different use scene demands, compare prior art, improve sucker structure's commonality, avoid the deposit of multiple sucking disc specification, adopt a plurality of small-size straws to form the multiple spot to inhale tightly simultaneously, it can effectively reduce the air supply energy consumption when grabbing the effect to guarantee to adsorb to compare current sucker structure, and the production cost is saved.
Description
Technical Field
The utility model relates to a wafer processing technology field especially relates to a special wafer grabbing device of semiconductor device.
Background
Semiconductor silicon wafers are widely used in the semiconductor manufacturing industry, there are various sizes and specifications of silicon wafers during processing of semiconductor silicon wafers, including 4 inches, 5 inches, 6 inches, 8 inches and 12 inches, and a vacuum chuck is one of vacuum equipment actuators, and generally, a method for grasping a product by using a vacuum chuck is the cheapest method, and a vacuum chuck is a common equipment for grasping a semiconductor silicon wafer.
Among the prior art, vacuum chuck on the market generally is the sucking disc structure of fixed size, and when snatching to the wafer that big small dimension leads to, undersize or too big sucking disc can not be fine satisfy the user demand, need change the sucking disc of different specifications in order to guarantee to the good effect of snatching of material, the commonality is poor, consequently, provides a special wafer grabbing device of semiconductor device to solve the poor problem of grabbing device commonality among the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a special wafer grabbing device of semiconductor device.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a special wafer grabbing device of semiconductor device, includes the cross support body, the breach groove has all been seted up all around to the cross support body to the inboard in breach groove is provided with small-size straw, the surperficial middle part fixedly connected with connection pterygoid lamina of small-size straw, the cross support body all around and be located the both sides in breach groove and all set up the constant head tank with connection pterygoid lamina looks adaptation, the kidney slot has all been seted up to the surface of cross support body and the both sides that are located the breach groove, the inside in kidney slot is provided with fixing bolt to the screw hole with fixing bolt looks adaptation is seted up at the middle part of connecting pterygoid lamina.
Preferably, the top of the cross-shaped frame body is provided with a connecting plate, the middle of the top of the cross-shaped frame body is provided with a connecting sleeve, and the bottom of the connecting plate is provided with a connecting part matched with the connecting sleeve.
Preferably, the top of the connecting plate is fixedly connected with an air path pipe, the surface of the air path pipe is communicated with a branch pipe, and one end, far away from the air path pipe, of the branch pipe is communicated with the top end of the small suction pipe.
Preferably, rib plates are fixedly connected to the cross corners of the cross-shaped frame body, and a rubber ring is arranged on the edge of the bottom end of the small suction pipe.
Preferably, the top of the cross-shaped frame body and the two sides of the notch groove are provided with distance scales.
The utility model discloses possess following beneficial effect at least:
the periphery of the cross-shaped frame body is provided with the notch grooves, the inner sides of the notch grooves are provided with the small straws, the middle parts of the surfaces of the small straws are fixedly connected with the connecting wing plates, the periphery of the cross-shaped frame body and the two sides of the notch grooves are provided with the positioning grooves matched with the connecting wing plates, the surfaces of the cross-shaped frame body and the two sides of the notch grooves are provided with the kidney-shaped grooves, the inside of the kidney-shaped grooves is provided with the fixing bolt, the middle parts of the connecting wing plates are provided with the threaded holes matched with the fixing bolt, the number of the small straws can be increased or reduced in the notch grooves on the cross-shaped frame body according to the practical requirement, the positions of the small straws can be adjusted, so that the sucker structure consisting of the small straws meets the requirements of different use scenes, compared with the prior art, the universality of the sucker structure is improved, the storage of various sucker specifications is avoided, and the small straws are adopted to form multi-point suction tight, compared with the existing sucker structure, the sucker structure can effectively reduce the energy consumption of an air source while ensuring the adsorption and grabbing effects, and saves the production cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.
Fig. 1 is a top view of the structure of the present invention;
FIG. 2 is a top view of the cross frame structure of the present invention;
fig. 3 is a schematic view of the structure of the connection wing plate and the small straw of the present invention.
In the figure: 1. a cross-shaped frame body; 2. a notch groove; 3. a small straw; 4. connecting wing plates; 5. positioning a groove; 6. a kidney-shaped groove; 7. fixing the bolt; 8. a threaded hole; 9. a connecting plate; 10. connecting sleeves; 11. an air passage pipe; 12. a connection pipe is connected; 13. a rib plate; 14. distance scales.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-3, a special wafer grabbing device of semiconductor device, including cross support body 1, breach groove 2 has all been seted up around cross support body 1, and the inboard of breach groove 2 is provided with small-size straw 3, the middle part fixedly connected with connection pterygoid lamina 4 on small-size straw 3 surface, cross support body 1 all around and the both sides that are located breach groove 2 all set up with the constant head tank 5 of being connected pterygoid lamina 4 looks adaptation, kidney slot 6 has all been seted up on cross support body 1's surface and the both sides that are located breach groove 2, the inside of kidney slot 6 is provided with fixing bolt 7, and the screw hole 8 with fixing bolt 7 looks adaptation is seted up at the middle part of connecting pterygoid lamina 4.
The scheme has the following working processes:
during the use, drive 1 structure of cross support body through the arm and remove to waiting to snatch the wafer top, make 3 bottom contact wafer top surfaces of small-size straw, realize the vacuum environment to in the small-size straw 3 through gas circuit pipe 11 and takeover 12, reach and adsorb the purpose of snatching the wafer, when snatching the operation to different specification wafers, the accessible is addd or is subtracted to establish small-size straw 3 to 2 inslots on the cross support body, the range that makes small-size straw 3 satisfies the user demand, multipoint type adsorbs snatchs messenger's equipment and can absorb to irregular surface material, reinforcing application scope, compare traditional sucker structure simultaneously and help reducing air supply energy consumption.
Further, the top of cross support body 1 is provided with connecting plate 9 to the middle part at 1 top of cross support body is provided with adapter sleeve 10, and the bottom of connecting plate 9 is provided with the connecting portion with adapter sleeve 10 matched with, and connecting plate 9 is used for the installation to cross support body 1, and connecting plate 9 installs on the arm, snatchs the operation through mechanical arm control sucker structure to the material implementation.
Further, the top of connecting plate 9 is fixedly connected with gas circuit pipe 11 to gas circuit pipe 11's surface intercommunication has takeover 12, and the one end that gas circuit pipe 11 was kept away from to takeover 12 is linked together with the top of small-size straw 3, and gas circuit pipe 11 switch-on vacuum apparatus, and takeover 12 is provided with a plurality ofly, guarantees to satisfy the extension of maximum load, and the 12 ends of takeover that vacate use the end cap to carry out the shutoff.
Further, cross corner fixedly connected with gusset 13 of cross support body 1, the bottom edge of small-size straw 3 is provided with the rubber circle, and gusset 13 reinforcing cross support body 1's structural strength and stability, rubber circle make 3 adsorption ports of small-size straw be soft contact with the material surface, help strengthening the absorption leakproofness simultaneously.
Further, the top of cross support body 1 and the both sides that are located breach groove 2 all are provided with apart from scale 14, apart from the setting of scale 14, are convenient for master small-size straw 3's position control, the regulation positioning operation of small-size straw 3 of being convenient for through apart from scale 14.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a special wafer grabbing device of semiconductor device, includes cross support body (1), its characterized in that, breach groove (2) have all been seted up all around of cross support body (1) to the inboard in breach groove (2) is provided with small-size straw (3), the middle part fixedly connected with on small-size straw (3) surface connects pterygoid lamina (4), just be located the both sides in breach groove (2) all around of cross support body (1) and seted up constant head tank (5) with connection pterygoid lamina (4) looks adaptation, waist-shaped groove (6) have all been seted up on the surface of cross support body (1) and the both sides that are located breach groove (2), the inside in waist-shaped groove (6) is provided with fixing bolt (7) to screw hole (8) with fixing bolt (7) looks adaptation are seted up at the middle part of connecting pterygoid lamina (4).
2. The special wafer grabbing device for the semiconductor device as recited in claim 1, wherein the top of the cross frame body (1) is provided with a connecting plate (9), the middle of the top of the cross frame body (1) is provided with a connecting sleeve (10), and the bottom of the connecting plate (9) is provided with a connecting part matched with the connecting sleeve (10).
3. The wafer grabbing device special for the semiconductor device as claimed in claim 2, wherein an air path pipe (11) is fixedly connected to the top of the connection plate (9), and a connection pipe (12) is connected to the surface of the air path pipe (11), and one end of the connection pipe (12) far away from the air path pipe (11) is connected to the top end of the small suction pipe (3).
4. The special wafer grabbing device for the semiconductor device according to claim 1, wherein a rib plate (13) is fixedly connected to a cross corner of the cross-shaped frame body (1), and a rubber ring is arranged at the bottom end edge of the small suction pipe (3).
5. The special wafer grabbing device for the semiconductor device as claimed in claim 1, wherein the distance scales (14) are arranged on the top of the cross frame body (1) and on both sides of the notch groove (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121510372.0U CN215069919U (en) | 2021-07-05 | 2021-07-05 | Special wafer grabbing device of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121510372.0U CN215069919U (en) | 2021-07-05 | 2021-07-05 | Special wafer grabbing device of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215069919U true CN215069919U (en) | 2021-12-07 |
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ID=79227354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121510372.0U Active CN215069919U (en) | 2021-07-05 | 2021-07-05 | Special wafer grabbing device of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215069919U (en) |
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2021
- 2021-07-05 CN CN202121510372.0U patent/CN215069919U/en active Active
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