CN210401620U

CN210401620U - Double-station thick film hybrid integrated circuit module metallized hole conduction tester

Info

Publication number: CN210401620U
Application number: CN201920759461.5U
Authority: CN
Inventors: 刘国庆
Original assignee: Weike Electronic Modules Shenzhen Co ltd
Current assignee: Weike Electronic Modules Shenzhen Co ltd
Priority date: 2019-05-24
Filing date: 2019-05-24
Publication date: 2020-04-24
Anticipated expiration: 2029-05-24

Abstract

The utility model discloses a double-station thick film hybrid integrated circuit module metalized hole conduction tester, which comprises a base, a first test board, a second test board, a power supply module and a driving component, wherein two first test boards are arranged on the base and are arranged in parallel along the front and back directions, a rear wall is vertically extended upwards from the rear edge of the upper end surface of the base, the driving component is fixed on the front end surface of the rear wall and is connected with the second test board, wherein the first test board and the second test board are both connected with the power supply module, the second test board is driven to move left and right and up and down by the driving component, so as to control the first test probes to abut against the two first test boards respectively, so that the plurality of first test probes abut against the plurality of second test probes correspondingly to form an independent power-on loop, the other thick film hybrid integrated circuit module is synchronously replaced when being tested, and the testing efficiency is greatly improved.

Description

Double-station thick film hybrid integrated circuit module metallized hole conduction tester

Technical Field

The utility model relates to the technical field of circuits, concretely relates to duplex position thick film hybrid integrated circuit module metallized hole conduction tester.

Background

The thick film hybrid integrated circuit features more flexible design, simple technology and low cost, and is especially suitable for small-batch production of multiple varieties. In terms of electrical properties, it can withstand higher voltages, higher powers and higher currents.

However, in the process of metallization of the thick film hybrid integrated circuit, some through holes are not completely metallized and cannot be conducted, so that in the subsequent process after the metallization hole process is completed, the metallization holes need to be tested, whether each pin jack can be conducted or not is detected, the existing detection mode is complex in operation, and when batch detection is carried out, the efficiency is too low, and the thick film hybrid integrated circuit module cannot be synchronously replaced for testing.

SUMMERY OF THE UTILITY MODEL

The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, an object of the utility model is to provide a duplex position thick film hybrid integrated circuit module metallized hole conduction tester, include:

the rear edge of the upper end surface of the base is provided with a rear wall in an upward vertical extending manner;

the two first test boards are arranged on the base in parallel along the front-back direction, bearing areas for bearing the thick film hybrid integrated circuit module are formed on the two first test boards respectively, and a plurality of first test probes are arranged in the two bearing areas respectively;

the second test board is positioned above the two first test boards, and a plurality of second test probes are arranged on the lower surface of the second test board;

the first test probe and the second test probe are connected to the power supply module;

and the driving component is fixed on the front end surface of the rear wall, is connected to the second test board and is used for driving the second test board to move left and right and move up and down so as to control the second test board to abut against the two first test boards respectively, so that the plurality of first test probes abut against the plurality of second test probes correspondingly to form an independent power-on loop.

Preferably, according to an embodiment of the present invention, the driving assembly includes:

the vertical driving mechanism is provided with a sliding seat and two sliding rails, the two sliding rails are vertically fixed on two sides of the front end surface of the rear wall, the left end and the right end of the sliding seat are correspondingly fixed on the two sliding rails in a vertically sliding manner, a lifting cylinder is fixedly arranged on the rear wall, and the lifting cylinder is positioned in the vertical direction of the sliding seat and is fixedly connected with the sliding seat and used for driving the sliding seat to move up and down on the two sliding rails;

the horizontal driving mechanism is a screw rod transmission linear module arranged along the left-right direction, the screw rod transmission linear module is provided with a front sliding plate and a connecting rod vertically connected with the front sliding plate forwards, and the second test plate is horizontally and fixedly arranged at the front end of the lower bottom surface of the connecting rod.

Preferably, according to the utility model discloses an embodiment, two the bearing area is the sunken recess, transversely offers respectively on sunken recess both sides wall and is formed with the spacing groove, so that thick film hybrid integrated circuit module clamp is located in the spacing groove, and with the laminating of first test probe.

Preferably, according to the utility model discloses an embodiment, two be formed with a plurality of connecting holes in the bearing area, the connecting hole is connected in power module, first test probe can dismantle by extend to in the connecting hole outside the connecting hole, so that first test probe connect in power module.

Preferably, according to an embodiment of the present invention, the first test probe and the second test probe each have a tapered tip portion insertable into a metalized hole such that the tip portion is connected to the metalized hole.

Preferably, according to the utility model discloses an embodiment, all be equipped with elastic mechanism in first test probe with the second test probe for it is right to buffer first test probe with the test of second test probe.

Preferably, according to the utility model discloses an embodiment, be equipped with on the base and be used for controlling drive assembly and the touch-control screen that shows the test result, and be equipped with power button and be used for adjusting current's adjust knob.

Preferably, according to the utility model discloses an embodiment, still include main control unit, main control unit respectively control connect in drive assembly, power module, touch screen, power button and adjust knob.

The utility model provides a duplex position thick film hybrid integrated circuit module metallization hole conduction tester, through setting up two first survey test panel on the base, and parallel to each other along the fore-and-aft direction, be equipped with a back wall along the perpendicular extension that makes progress behind the base up end, be fixed in the front end face of back wall with drive assembly, and connect in the second and survey the test panel, wherein first survey test panel and second survey test panel and all connect in power module, survey the control panel through drive assembly drive second and remove and reciprocate, so that it supports respectively to lean on two first test panels, make a plurality of first test probe correspond and form independent circular telegram circuit with a plurality of second test probe counterbalance, make and change another in step when testing one of them thick film hybrid integrated circuit module, the efficiency of its test promotes greatly.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural view of a double-station thick film hybrid integrated circuit module metalized hole conduction tester provided in an embodiment of the present invention;

fig. 2 is a schematic diagram of a circuit structure provided in an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of the first test board shown in FIG. 1;

fig. 4 is a state structure diagram of a test process provided in an embodiment of the present invention.

The reference numbers illustrate:

10. a base; 101. a rear wall; 102. a touch screen; 103. a power button; 104. adjusting a knob; 20. a first test board; 201. a first test probe; 2011. an elastic mechanism; 202. a load-bearing zone; 203. a limiting groove; 30. a second test board; 301. a second test probe; 40. a drive assembly; 401. a sliding seat; 402. a horizontal driving mechanism; 403. a slide rail; 404. a front slide plate; 50. a lifting cylinder; 60. a connecting rod; 70. a thick film hybrid integrated circuit module; 701. metallizing the hole; 80. a main controller; 90. and a power supply module.

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention, and all other embodiments obtained by those skilled in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", and the like, indicate the orientation or positional relationship indicated based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The utility model discloses duplex position thick film hybrid integrated circuit module metallization hole conduction tester of embodiment is described in detail with reference to the attached drawing in the following.

Referring to fig. 1, fig. 2 and fig. 4, according to the embodiment of the present invention, a double-station thick film hybrid integrated circuit module metalized hole conduction tester comprises a base 10, a first test board 20, a second test board 30, a power supply module 90 and a driving assembly 40, wherein a rear wall 101 is vertically extended upward from a rear edge of an upper end surface of the base 10; two first test boards 20 are arranged on the base 10 in parallel along the front-back direction, a bearing area 202 for bearing the thick film hybrid integrated circuit module 70 is formed on each of the two first test boards 20, and a plurality of first test probes 201 are arranged in each of the two bearing areas 202; the second test board 30 is located above the two first test boards 20, and a plurality of second test probes 301 are arranged on the lower surface of the second test board; the first test probe 201 and the second test probe 301 are connected to the power supply module 90; the driving component 40 is fixed on the front end surface of the rear wall 101, connected to the second testing board 30, and used for driving the second testing board 30 to move left and right and up and down, so as to control the second testing board 30 to abut against the two first testing boards 20, respectively, so that the plurality of first testing probes 201 abut against the plurality of second testing probes 301 correspondingly to form an independent power-on loop.

The utility model provides a duplex position thick film hybrid integrated circuit module metallization hole conduction tester, through set up two first survey test panel 20 on base 10, and parallel mutually along the fore-and-aft direction, it is equipped with a back wall 101 to follow upwards vertical extension behind its base 10 up end, be fixed in the front end face of back wall 101 with drive assembly 40, and connect in the second and survey test panel 30, wherein first survey test panel 20 and second survey test panel 30 and all connect in power module 90, survey test panel 30 through drive assembly 40 drive second and remove and reciprocate about, so that it supports respectively to lean on two first test panel 20, make a plurality of first test probe 201 correspond and offset and form independent circular telegram with a plurality of second test probe 301, make and change another in step when testing one of them thick film hybrid integrated circuit module 70, the efficiency of its test promotes greatly.

Referring to fig. 1, the driving assembly 40 includes: the vertical driving mechanism is provided with a sliding seat 401 and two sliding rails 403, the two sliding rails 403 are vertically fixed on two sides of the front end surface of the rear wall 101, the left end and the right end of the sliding seat 401 are correspondingly fixed on the two sliding rails 403 in a vertically sliding manner, a lifting cylinder 50 is fixedly arranged on the rear wall 101, and the lifting cylinder 50 is positioned in the vertical direction of the sliding seat 401 and is fixedly connected with the sliding seat 401 and used for driving the sliding seat 401 to move up and down on the two sliding rails 403; the horizontal driving mechanism 402, the horizontal driving mechanism 402 is a screw rod transmission linear module set along the left-right direction, the screw rod transmission linear module has a front slide plate 404 and a connecting rod 60 vertically connected to the front slide plate 404 forward, the second testing plate 30 is horizontally fixed at the front end of the bottom surface of the connecting rod 60. Wherein, control sliding seat 401 up-and-down motion and remove about through the preceding slide 404 of the drive of the straight line module of screw rod transmission through lift cylinder 50 for it can drive second test board 30 and remove about and from about, can change thick film hybrid integrated circuit module 70 in step in the testing process, makes efficiency promote greatly.

Referring to fig. 3, the two carrying regions 202 are recessed grooves, and two side walls of the recessed grooves are respectively and transversely provided with a limiting groove 203, so that the thick film hybrid integrated circuit module 70 is clamped in the limiting groove 203 and attached to the first test probe 201. The limit groove 203 clamps the thick film hybrid integrated circuit module 70 to prevent the thick film hybrid integrated circuit module from being unstable in the test process, and the first test probe 201 and the second test probe 301 can clamp the metalized hole 701 of the first test probe 201 and the second test probe 301 to test, so that the safety and stability of the test are ensured.

Furthermore, a plurality of connection holes are formed in the two bearing areas 202, the connection holes are connected to the power supply module 90, and the first test probe 201 can be detached and extended from the connection holes to the outside of the connection holes, so that the first test probe 201 is connected to the power supply module 90. The first test probe 201 can be adjusted at any position of the connection hole by setting the connection hole to adapt to different metallized holes 701 for testing, and optionally, the second test board 30 can also be provided with the connection hole to adjust the position of the second test probe 301.

Referring to fig. 4, the first and second test probes 201 and 301 each have a tapered tip portion insertable into the metallization hole 701 such that the tip portion is connected to the metallization hole 701. Wherein the tapered tip portion can be adapted to fit the metalized hole 701, so that both the first test probe 201 and the second test probe 301 can contact the metalized hole 701 and perform a test during the testing process.

Further, the first test probe 201 and the second test probe 301 are both provided with an elastic mechanism 2011 therein for buffering the test of the first test probe 201 and the second test probe 301.

Referring to fig. 1 again, the base 10 is provided with a touch screen 102 for operating the driving component 40 and displaying the test result, and is provided with a power button 103 and an adjusting knob 104 for adjusting the current. The driving device 40 can be controlled to move up and down and left and right through the touch screen 102, and the test result can be displayed through the touch screen 102 to determine whether the metalized hole 701 is connected.

The touch screen control device further comprises a main controller 80, wherein the main controller 80 is respectively connected to the driving assembly 40, the power supply module 90, the touch screen 102, the power button 103 and the adjusting knob 104 in a controlling manner, and a person skilled in the art can understand that the main controller 80 can be a controller respectively used for controlling the driving assembly 40, the power supply module 90, the touch screen 102, the power button 103 and the adjusting knob 104 to operate.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. The utility model provides a duplex position thick film hybrid integrated circuit module metallized hole conduction tester which characterized in that includes:

2. The dual station thick film hybrid integrated circuit module metalized via continuity tester of claim 1, wherein said drive assembly comprises:

3. The double-station thick film hybrid integrated circuit module metalized hole conduction tester as claimed in claim 1, wherein the two bearing areas are recessed grooves, and limiting grooves are respectively and transversely formed on two side walls of the recessed grooves, so that the thick film hybrid integrated circuit module is clamped in the limiting grooves and attached to the first test probe.

4. The double-station thick film hybrid integrated circuit module metalized hole conduction tester as claimed in claim 1, wherein a plurality of connection holes are formed in the two bearing areas, the connection holes are connected to a power supply module, and the first test probe detachably extends from the inside of the connection hole to the outside of the connection hole so as to connect the first test probe to the power supply module.

5. The dual station thick film hybrid integrated circuit module metalized hole conduction tester of claim 1, wherein the first test probe and the second test probe each have a tapered tip portion insertable into a metalized hole such that the tip portion connects to the metalized hole.

6. The double-station thick film hybrid integrated circuit module metalized hole conduction tester as claimed in claim 5, wherein an elastic mechanism is provided in each of the first test probe and the second test probe for buffering the test of the first test probe and the second test probe.

7. The double-station thick film hybrid integrated circuit module metalized hole conduction tester as claimed in claim 1, wherein a touch screen for operating the driving assembly and displaying the test result, a power button and an adjusting knob for adjusting the current are provided on the base.

8. The double-station thick film hybrid integrated circuit module metalized hole conduction tester as claimed in any one of claims 1 to 7, further comprising a main controller, wherein the main controller is respectively in control connection with the driving assembly, the power supply module, the touch screen, the power button and the adjusting knob.