CN210401583U - Power-on aging test device for integrated circuit board - Google Patents
Power-on aging test device for integrated circuit board Download PDFInfo
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- CN210401583U CN210401583U CN201921025825.3U CN201921025825U CN210401583U CN 210401583 U CN210401583 U CN 210401583U CN 201921025825 U CN201921025825 U CN 201921025825U CN 210401583 U CN210401583 U CN 210401583U
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Abstract
The utility model discloses a power-on aging test device for an integrated circuit board, which relates to the field of aging test devices and solves the problems of low efficiency and inconvenient use and matching of the current aging test; the side plates are respectively fixedly arranged at two sides of the bottom plate, and a plurality of grooves perpendicular to the bottom plate are formed in the side edges of the side plates away from the bottom plate at intervals; the partition boards are embedded in the slots in a clamping manner, and a test station for testing is formed between every two adjacent partition boards; power link plate demountable installation is in one side of its side plate back to the bottom plate, is provided with the power supply interface of multichannel one-to-one in order to supply power of test station on the power link plate, the utility model discloses an integrated circuit board that is used for integrated circuit board's circular telegram aging testing device can supply multiple product carries out aging testing, and the adjustment is simple and convenient, and test station is sufficient, and efficiency of software testing is higher.
Description
Technical Field
The utility model relates to an aging testing device, in particular to circular telegram aging testing device for integrated circuit board.
Background
Through the rapid development of science and technology, most of civil and industrial instruments on the market are developed towards intellectualization. In order to realize various detection and communication functions, the use of large-scale integrated circuits is inevitable, and the reliability test of the integrated circuit board becomes an indispensable task. The power-on aging test of the integrated circuit board can determine or evaluate the functions and the performances of the integrated circuit components, and is an important means for verifying whether the design is reasonable, monitoring whether the production process is normal and detecting whether the product quality is qualified.
The integrated circuit boards of each batch need to be subjected to power-on aging test in a certain proportion, the efficiency of the current power-on aging test on the integrated circuit boards of the same batch is low, and for the integrated circuit boards of different products, a testing device needs to be correspondingly arranged according to the specification design of the integrated circuit boards so as to adjust a testing station to be proper, the overall efficiency is low, the use is inconvenient, and a space for improvement is reserved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a circular telegram aging testing device for integrated circuit board can supply the integrated circuit board of multiple product to carry out aging testing, and the adjustment is simple and convenient, and tests the station sufficient, and efficiency of software testing is higher.
The above technical purpose of the present invention can be achieved by the following technical solutions:
a power-on aging test device for an integrated circuit board comprises a bottom plate, side plates, partition plates and a power supply hanging plate;
the bottom plate is horizontally arranged for placing an integrated circuit board; the side plates are respectively fixedly arranged on two sides of the bottom plate along the length direction of the bottom plate, the side plates are perpendicular to the bottom plate, and a plurality of grooves perpendicular to the bottom plate are formed in the side edges, far away from the bottom plate, of the side plates at intervals along the length direction; the partition plates are arranged in the open grooves in a clamping and embedding manner, and a test station for testing a single integrated circuit board is formed between every two adjacent partition plates; the power supply hanging plate is detachably mounted on one side, back to the bottom plate, of the side plate, and is provided with multiple power supply interfaces for supplying power to the integrated circuit board needing power-on aging test, and the multiple power supply interfaces correspond to the test stations one by one.
By adopting the scheme, the supply of multiple test stations is realized by the matching of the slots arranged on the side plates and the partition plates, the aging tests of more integrated circuit boards can be simultaneously carried out, and the test efficiency is higher; the specification adjustment of the test station can be realized by adjusting the number of the mounting partition plates, and the test device can be suitable for integrated circuit boards of different products and different specifications and can realize various test requirements; due to the arrangement of the detachably mounted power hanging plate, the testing device can conveniently realize the switching selection of the aging tests under the power-on and power-off conditions, and is more convenient and fast to use.
Preferably, the power hanging plate comprises a power plate provided with a power supply interface, and further comprises a side top plate and a side bottom plate which are respectively and vertically installed on the upper side and the lower side of the power plate so as to form a containing cavity for placing a wiring on one side of the power plate close to the side plate, and fixing blocks fixedly installed at the two ends of the power plate and clamped between the side top plate and the side bottom plate for fixedly connecting.
By adopting the scheme, the power supply interface is arranged on the power panel of the power hanging panel to carry out power supply access, the side top plate and the side bottom plate are matched with the power panel, a cavity with a certain space is formed on one side of the side plate to protect an internal circuit, and the fixed block realizes the fixed installation of the side top plate, the side bottom plate and the power panel.
Preferably, one end of the fixing block, which is far away from the power supply board, protrudes out of the edges of the side top plate and the side bottom plate; the power link plate is still including the cardboard with power link plate fixed mounting to curb plate, the cardboard set up and fixed mounting in corresponding to the fixed block one end surface of power link plate is kept away from to the fixed block, both sides the cardboard is close to the edge extension protrusion in that holds chamber one side the edge of fixed block, be formed with the space that the curb plate was located to the cover between cardboard and the side roof and the side bottom plate, just the space is greater than the thickness of side plate.
Adopt above-mentioned scheme, the fixed block protrusion is in the one end that the power strip was kept away from to side bottom plate and side roof, and then form the step difference at both ends, cardboard fixed mounting is on the convex terminal surface of fixed block and the edge extends to being close to appearance chamber one side, with the side roof, form the space that is greater than curb plate thickness between the side bottom plate, and then make the power link plate when installing, establish at the both ends of curb plate through the clearance cover of cardboard department, convenient realization does not have the fixed mounting of accessory, it is simple convenient to install and dismantle.
Preferably, the power panel is provided with two power input holes on one side of the power supply interface.
Preferably, the surfaces of the bottom plate and the partition plate are uniformly communicated with a plurality of open holes for free circulation of air.
By adopting the scheme, the plurality of the openings are uniformly communicated on the surfaces of the bottom plate and the partition plate, so that air at the testing station can circulate freely, and the arrangement of the openings is favorable for reducing the whole weight, so that the carrying is easier; when the placed integrated circuit board is used for testing various items, the opening on the bottom plate ensures free circulation of air in the high-low temperature box body, and short circuit of electronic components caused by accumulated water above the bottom plate in a high-humidity environment is avoided.
Preferably, the portable electronic device further comprises a handle which is arranged on the bottom plate and is used for carrying the device, and a fixing hole which is fixedly connected with the handle through a screw is formed in the side surface of the bottom plate.
By adopting the scheme, the arrangement of the handle is convenient for a tester to hold and is convenient and stable in carrying; the fixed orifices that the both ends of bottom plate were seted up realize the fixed mounting to the handle for the handle installation is stable.
Preferably, the two ends of the partition board are provided with step surfaces which are clamped and embedded in the grooves, and chamfers which guide the partition board during installation are arranged on the bottom edges of the partition board and the step surfaces.
By adopting the scheme, the step surface designed on the side surface of the partition board is used for being matched with the open slot of the side board, and the partition board can be kept at a vertical position after being assembled in place, so that the partition board is stably placed in the open slot; the chamfer of the design of step face bottom of baffle, the baffle of being convenient for is led occasionally inserting for the installation of baffle is convenient.
Preferably, the surface of the side plate is provided with a plurality of screw holes which are fixedly connected with the bottom plate through screws at intervals along the length direction at one side close to the bottom plate.
By adopting the scheme, the side plate is convenient to be connected with the bottom plate by the screw holes formed on one side close to the bottom plate, and the screw holes are formed at intervals to be more stable after connection.
Preferably, the bottom plate, the side plates, the partition plate and the power hanging plate are all made of bakelite plates.
Adopt above-mentioned scheme, bakelite board has advantages such as insulating nature height, high temperature resistant, intensity height, uses the more durable of testing arrangement that bottom plate, curb plate, baffle and the power link plate installation of bakelite board preparation constitute, and is durable, uses more safety simultaneously.
To sum up, the utility model discloses following beneficial effect has:
the grooving arranged on the side plate is matched with the partition plate, so that the supply of more test stations is realized, the aging test of more integrated circuit boards can be simultaneously carried out, the internal space of the equipment is effectively utilized, and the test efficiency is higher; the specification adjustment of the test station can be realized by adjusting the number of the mounting partition plates, the test device can be suitable for integrated circuit boards with various specifications, and the test flexibility is greatly improved; due to the arrangement of the detachably mounted power hanging plate, the testing device can conveniently realize the switching selection of the aging tests under the power-on and power-off conditions, and is more convenient and fast to use.
Drawings
FIG. 1 is a schematic structural diagram of a power-on burn-in test apparatus;
FIG. 2 is an exploded view of the structure of the power strip;
FIG. 3 is a partial block diagram of the base plate;
FIG. 4 is a partial block diagram of a side view;
fig. 5 is a schematic structural view of the separator.
In the figure: 1. a base plate; 101. a fixing hole; 2. a partition plate; 201. a step surface; 12. opening a hole; 3. a side plate; 301. grooving; 302. a screw hole; 4. a power supply hanging plate; 401. a power panel; 4011. a power supply interface; 4012. a power input aperture; 402. a side roof panel; 403. a side floor; 404. a fixed block; 405. clamping a plate; 5. a handle.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment discloses a power-on aging test device for an integrated circuit board, as shown in fig. 1, which includes a bottom plate 1, a partition plate 2, a side plate 3, a power hanging plate 4 and a handle 5. For clarity, the side plates 3 are fixedly installed on both sides of the bottom plate 1 along the length direction of the bottom plate 1 perpendicular to the plane of the surface of the bottom plate 1, and a space for performing the burn-in test is formed on the upper surface of the bottom plate 1, based on the placement shown in fig. 1. The upper edge of the side plate 3 is provided with a plurality of grooves 301 perpendicular to the surface of the bottom plate 1, the partition plate 2 is embedded in the grooves 301, the space between the bottom plate 1 and the side plates 3 on the two sides is divided, and a testing station for testing the integrated circuit board is formed. Power peg board 4 fixed mounting is provided with a plurality of mains operated interface 4011 in one side curb plate 3 on power peg board 4 in one side curb plate to carry out the circular telegram of the integrated circuit board of circular telegram aging test to the test station.
As shown in fig. 1 and 2, power strap 4 comprises a plurality of parts, be power strip 401 respectively, side roof 402, side bottom plate 403, fixed block 404, cardboard 405 constitutes, power strap 4 passes through fixed block 404 fixed connection power strip 401, side roof 402, side bottom plate 403 and cardboard 405, the function is that two routes power of input divide into a plurality of groups of equivalent power, the work load of wiring has been reduced by a wide margin to this kind of design layout, effectively reduce the probability of wiring mistake, test occasion is neater and more orderly simultaneously.
The two fixing blocks 404 are arranged on one side, close to the bottom plate 1, of the power panel 401, the two fixing blocks 404 are respectively arranged at two ends of the power panel 401, through the surface of each fixing block, a through hole communicated with the power panel 401 is formed, the fixing connection of the power panel 401 and the fixing blocks 404 is achieved after screws are installed, 6 through holes are preferably formed, and the hole portion of each through hole is provided with a chamfer.
The cardboard 405 is provided with two corresponding to the fixed block 404, and equal fixed mounting is in the fixed block 404 a side surface of keeping away from power strip 401, and the correspondence is seted up the screw hole and is carried out fixed mounting on the surface of cardboard 405 and fixed block 404, and the screw hole of cardboard 405 installation is preferred to be seted up threely, has still seted up two cotter holes simultaneously, cooperates and is used for fixing once more at the lower surface of side bottom plate 403 in the pin. Both sides of the two-side clamping plate 405 extend towards the containing cavity and protrude out of the edge of the fixing plate, a gap is formed between the two-side clamping plate and the side top plate 402 and the side bottom plate 403, and the gap is larger than the thickness of the side plate 3, so that the side plate 3 can be sleeved with the gap to realize suspension installation.
As shown in figures 1 and 3, the bottom plate 1 is preferably made of 10 mm-thick bakelite plates, and has the advantages of high insulativity, high temperature resistance and high strength, the overall dimension is designed according to the internal space dimension of the high-low temperature test box, and the structural characteristics of a human body are considered simultaneously, so that a tester can carry the bakelite plates easily. A plurality of trompils 12 have been seted up at even interval on the surface to bottom plate 1 to high low temperature box inside air freely circulates when guaranteeing the test, and avoids high humid environment under 1 top ponding of bottom plate, causes electronic components short circuit, because of the bakelite plate density is big than ordinary plastics, trompil 12 still is favorable to alleviateing whole weight, makes the transport more light. The base plate 1 is provided at both ends thereof with a pair of fixing holes 101, the handles 5 are fixed through the fixing holes 101, and each handle 5 is fixed from the other side of the base plate 1 by a screw. The handle 5 is preferably made of stainless steel material, the diameter is preferably 10mm, the height of the center from the bottom plate 1 is 30mm, and the handle is convenient for a tester to hold.
As shown in fig. 1 and 4, the side plate 3 is preferably a 5 mm-thick bakelite plate, the slots 301 are uniformly distributed and preferably 20mm deep for mounting the partition 2, each slot width is increased by 0.5mm according to the thickness of the partition 2, and the slot width can be subdivided into 20 test stations according to the height dimension of the existing integrated circuit board, so that 21 slots 301 are designed. 11 screw holes 302 are uniformly distributed at the bottom end of the side plate 3, one side of each screw hole 302 close to the bottom plate 1 is arranged at intervals along the length direction, and a 2mm chamfer angle is designed at the hole part and is fixed on the bottom plate 1 through the screw holes 302 by using countersunk head screws.
As shown in fig. 1 and 5, the partition board 2 preferably adopts a 5 mm-thick bakelite board for isolating the tested integrated circuit boards, preventing mutual collision between the circuit boards, causing short circuit or device damage, and the partition board 2 also has uniformly distributed open holes 12 on the surface, preferably uniformly arranged 48, so as to ensure free circulation of air inside the high-low temperature box body during testing, and simultaneously, the partition board is favorable for reducing the whole weight, and the transportation is easier. The side face of the partition board 2 is provided with a step face 201 which is used for being matched with the open slot 301 of the side board 3, the partition board 2 can be kept at a vertical position after being assembled in place, and the bottom edge of the step face 201 of the partition board 2 is provided with a chamfer, so that the partition board 2 can be guided when being inserted. The number of the partition boards 2 is flexibly adjusted according to the height and the size of different integrated circuit boards, 21 partition boards 2 are used at most, 20 integrated circuit boards are tested at the same time, and if a higher integrated circuit board is tested, part of the partition boards 2 can be taken out, so that a larger test space is reserved.
The operation condition is as follows:
the bottom plate 1, the side plate 3 and the handle 5 are fixedly installed, and the power hanging plate 4 is sleeved between the clamping plate 405 and the side plate 3, so that the power hanging plate 4 is flexibly and stably installed on the device;
according to the specification of the integrated circuit board to be subjected to the aging test, a partition plate 2 is installed in a clamping manner in a groove 301 of a side plate 3, a testing device is placed in a high-low temperature testing box through a handle 5, and the power supply board 401 of the power supply hanging board 4 is electrified corresponding to a power supply interface 4011 so as to perform the electrified aging test on the integrated circuit board to be tested;
when the power-on aging test is not needed, the power hanging plate 4 can be detached from the side plate 3 to perform other aging tests.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Claims (9)
1. A power-on aging test device for an integrated circuit board is characterized in that: comprises a bottom plate (1), a side plate (3), a clapboard (2) and a power hanging plate (4);
the bottom plate (1) is horizontally arranged for placing an integrated circuit board; the side plates (3) are respectively fixedly arranged on two sides of the bottom plate (1) along the length direction of the bottom plate (1), the side plates (3) are perpendicular to the bottom plate (1), and a plurality of slots (301) perpendicular to the bottom plate (1) are formed in the side edges, far away from the bottom plate (1), of the side plates (3) at intervals along the length direction; the partition plates (2) are installed in the open grooves (301) in a clamping and embedding mode, and a test station for testing a single integrated circuit board is formed between every two adjacent partition plates (2); power link plate (4) demountable installation in one of them curb plate (3) back to one side of bottom plate (1), be provided with power supply interface (4011) that the multichannel carries out the power supply to the integrated circuit board that needs circular telegram aging testing on power link plate (4), the multichannel power supply interface (4011) one-to-one is in test station.
2. The power-on burn-in apparatus for an integrated circuit board of claim 1, wherein: power link plate (4) are including power strip (401) of seting up mains operated interface (4011), still including respectively install perpendicularly in the side roof (402) and the side bottom plate (403) that the chamber was placed in order to form the confession wiring in one side that power strip (401) are close to curb plate (3) in the upper and lower both sides limit of power strip (401), the both ends fixed mounting of power strip (401) have the card inlay in carry out fixed connection's fixed block (404) between side roof (402) and side bottom plate (403).
3. The power-on burn-in apparatus for an integrated circuit board of claim 2, wherein: one end, far away from the power supply board (401), of the fixing block (404) protrudes out of the edges of the side top plate (402) and the side bottom plate (403); power link plate (4) are still including cardboard (405) with power link plate (4) fixed mounting to curb plate (3), cardboard (405) set up and fixed mounting in corresponding to fixed block (404) one end surface of power link plate (401) is kept away from in fixed block (404), both sides cardboard (405) are close to the edge that holds chamber one side and extend protrusion in the edge of fixed block (404), be formed with the space that the cover located curb plate (3) between cardboard (405) and side roof (402) and side bottom plate (403), just the space is greater than the thickness of curb plate (3).
4. The power-on burn-in apparatus for an integrated circuit board of claim 2, wherein: and two paths of power supply input holes (4012) are formed in one side of the power supply board (401) on the power supply interface (4011).
5. The power-on burn-in apparatus for an integrated circuit board of claim 1, wherein: the bottom plate (1) and the partition plate (2) are evenly communicated with a plurality of open holes (12) for free circulation of air.
6. The power-on burn-in apparatus for an integrated circuit board of claim 1, wherein: the device is characterized by further comprising a handle (5) which is arranged on the bottom plate (1) and used for lifting the device, and fixing holes (101) which are fixedly connected with the handle (5) through screws are formed in two ends of the bottom plate (1).
7. The power-on burn-in apparatus for an integrated circuit board of claim 1, wherein: the side face of the partition plate (2) is provided with a step face (201) clamped in the groove (301), and the bottom edges of the partition plate (2) and the step face (201) are provided with chamfers for guiding when the partition plate (2) is installed.
8. The power-on burn-in apparatus for an integrated circuit board of claim 1, wherein: and a plurality of screw holes (302) fixedly connected with the bottom plate (1) through screws are formed in the surface of the side plate (3) at intervals along the length direction at one side close to the bottom plate (1).
9. The power-on burn-in apparatus for an integrated circuit board of claim 1, wherein: the bottom plate (1), the side plates (3), the partition plate (2) and the power hanging plate (4) are all made of bakelite plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921025825.3U CN210401583U (en) | 2019-07-03 | 2019-07-03 | Power-on aging test device for integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921025825.3U CN210401583U (en) | 2019-07-03 | 2019-07-03 | Power-on aging test device for integrated circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN210401583U true CN210401583U (en) | 2020-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921025825.3U Active CN210401583U (en) | 2019-07-03 | 2019-07-03 | Power-on aging test device for integrated circuit board |
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| CN (1) | CN210401583U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113466580A (en) * | 2021-06-02 | 2021-10-01 | 无锡市航鹄科技有限公司 | Test method and integrated test equipment of aviation simulation test system |
-
2019
- 2019-07-03 CN CN201921025825.3U patent/CN210401583U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113466580A (en) * | 2021-06-02 | 2021-10-01 | 无锡市航鹄科技有限公司 | Test method and integrated test equipment of aviation simulation test system |
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