CN210398849U - Phase-change heat-conducting radiator - Google Patents

Phase-change heat-conducting radiator Download PDF

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Publication number
CN210398849U
CN210398849U CN201921852694.6U CN201921852694U CN210398849U CN 210398849 U CN210398849 U CN 210398849U CN 201921852694 U CN201921852694 U CN 201921852694U CN 210398849 U CN210398849 U CN 210398849U
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metal cylinder
heat
hole
metal barrel
radiator
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CN201921852694.6U
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Chinese (zh)
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卿傲
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Individual
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Abstract

The utility model discloses a phase transition heat conduction radiator, including the radiator body, the radiator body includes metal barrel and fin, and the fin setting has a plurality of fin at the metal barrel outer wall on the metal barrel outer wall, and the metal barrel inner chamber is the heat exchange chamber, and the metal barrel inner wall is provided with the heat dissipation muscle and the muscle groove that forms by the heat dissipation muscle, and open metal barrel one end has the through-hole, and through-hole department installation heat conduction subassembly, the metal barrel other end are opened there is the through-hole, and the upper cover is installed to through-hole department, the utility model discloses structural design is novel, can improve the radiating effect of high density heat source, reduces the heat dissipation cost, has improved high density LED integrated light source's radiating efficiency, and then prolongs the life of LED lamp, can also regard as computer.

Description

Phase-change heat-conducting radiator
Technical Field
The utility model relates to a radiator technical field specifically is a phase transition heat conduction radiator.
Background
The existing high-power LED lamp can only be made into small particles to be dispersed on a radiator due to heat dissipation, so that the light management is not easy and the materials are wasted; in addition, as the density of the computer cpu is increased, the heat density is also increased, and the old radiator can not lead heat out of the cpu in time, so that the heat island phenomenon that the temperature of the radiator is low and the temperature of the heat conducting surface and the cpu is high is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a phase transition heat conduction radiator to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a phase-change heat-conducting radiator comprises a radiator body, wherein the radiator body comprises a metal cylinder and radiating fins, the radiating fins are arranged on the outer wall of the metal cylinder, a plurality of radiating fins are distributed on the outer wall of the metal cylinder, the inner cavity of the metal cylinder is a heat exchange cavity, radiating ribs and rib grooves formed by the radiating ribs are arranged on the inner wall of the metal cylinder, a through hole is formed in one end of the metal cylinder, a heat-conducting component is installed at the through hole, a through hole is formed in the other end of the metal cylinder, and an upper cover is installed at the through hole;
the heat conduction assembly comprises a heat conduction plate and a capillary core, the capillary core is arranged on the inner side of the heat conduction plate, the heat conduction plate is tightly connected with the capillary core, liquid is adsorbed in the capillary core, and the capillary core is clamped in the through hole of the metal cylinder; the capillary core is made of copper powder sintering, ceramic sintering or flexible fabric.
Preferably, the metal cylinder and the heat sink are both made of aluminum or copper.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses structural design is novel, can improve the radiating effect of high density heat source, reduces the heat dissipation cost, has improved high density LED integrated optical source's radiating efficiency, and then prolongs the life of LED lamp, perhaps to the heat dissipation that is used for computer CPU.
(2) The utility model discloses in, the radiator body includes metal cylinder and fin, and the fin setting has a plurality of fin at the metal cylinder outer wall on the metal cylinder outer wall, and this radiator heat dissipation area of contact is big, can improve heat exchange efficiency.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a sectional view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a phase-change heat-conducting radiator comprises a radiator body 1, wherein the radiator body 1 comprises a metal cylinder 3 and radiating fins 4, and the metal cylinder 3 and the radiating fins 4 are both made of aluminum or copper; the radiating fins 4 are arranged on the outer wall of the metal cylinder 3, and a plurality of radiating fins are distributed on the outer wall of the metal cylinder 3, so that the radiator is large in radiating contact area and can improve heat exchange efficiency; the inner cavity of the metal cylinder 3 is a heat exchange cavity 5, the inner wall of the metal cylinder is provided with a heat dissipation rib and a rib groove formed by the heat dissipation rib, a proper amount of volatile liquid is required to be filled in the heat exchange cavity as a medium, and the inner wall of the heat exchange cavity is provided with the heat dissipation rib, so that more heat exchange area is ensured; one end of the metal cylinder 3 is provided with a through hole, a heat conduction assembly is arranged at the through hole, the other end of the metal cylinder 3 is provided with a through hole, and an upper cover 6 is arranged at the through hole.
In the utility model, the heat conducting component comprises a heat conducting plate 8 and a capillary core 9, the capillary core 9 is arranged at the inner side of the heat conducting plate 8, the heat conducting plate 8 is tightly connected with the capillary core 9, liquid is adsorbed in the capillary core 9, and the capillary core 9 is clamped into the through hole of the metal cylinder 3; the capillary core is made of copper powder sintering, ceramic sintering or flexible fabric.
The working principle is as follows: when the heat conducting plate is heated, the liquid in the capillary core contacted with the heat conducting plate is quickly vaporized and distributed in the closed heat exchange cavity. At this time, the heat dissipation ribs in the heat exchange cavity exchange heat with the gas and conduct the heat to the radiator, and then the heat is dissipated. The gas heat is converted into liquid after exchanging heat with the heat dissipation ribs, and the liquid is absorbed by the capillary core for cyclic evaporation. This reduces the heat source to heat sink temperature difference.
To sum up, the utility model discloses structural design is novel, can improve the radiating effect of high density heat source, reduces the heat dissipation cost, has improved high density LED integrated optical source's radiating efficiency, and then prolongs the life of LED lamp, can also be used as computer CPU heat dissipation in addition.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (2)

1. The utility model provides a phase transition heat conduction radiator, includes radiator body (1), its characterized in that: the radiator body (1) comprises a metal cylinder body (3) and radiating fins (4), wherein the radiating fins (4) are arranged on the outer wall of the metal cylinder body (3), a plurality of radiating fins are distributed on the outer wall of the metal cylinder body (3), the inner cavity of the metal cylinder body (3) is a heat exchange cavity (5), radiating ribs and rib grooves formed by the radiating ribs are arranged on the inner wall of the metal cylinder body, one end of the metal cylinder body (3) is provided with a through hole, a heat conduction assembly is installed at the through hole, the other end of the metal cylinder body (3) is provided with a through hole, and an upper cover (6) is installed at the through hole;
the heat conduction assembly comprises a heat conduction plate (8) and a capillary core (9), the capillary core (9) is arranged on the inner side of the heat conduction plate (8), the heat conduction plate (8) is tightly connected with the capillary core (9), liquid is adsorbed in the capillary core (9), the capillary core (9) is clamped into a through hole of the metal cylinder body (3), and the capillary core (9) is sintered by copper powder, sintered by ceramic or is made of flexible fabric.
2. A phase change thermally conductive heat sink as claimed in claim 1, wherein: the metal cylinder (3) and the radiating fins (4) are both made of aluminum or copper.
CN201921852694.6U 2019-10-31 2019-10-31 Phase-change heat-conducting radiator Active CN210398849U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921852694.6U CN210398849U (en) 2019-10-31 2019-10-31 Phase-change heat-conducting radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921852694.6U CN210398849U (en) 2019-10-31 2019-10-31 Phase-change heat-conducting radiator

Publications (1)

Publication Number Publication Date
CN210398849U true CN210398849U (en) 2020-04-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921852694.6U Active CN210398849U (en) 2019-10-31 2019-10-31 Phase-change heat-conducting radiator

Country Status (1)

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CN (1) CN210398849U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115023126A (en) * 2022-07-13 2022-09-06 Oppo广东移动通信有限公司 Electronic equipment and heat conduction system thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115023126A (en) * 2022-07-13 2022-09-06 Oppo广东移动通信有限公司 Electronic equipment and heat conduction system thereof

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