CN210365906U - Automatic frequency modulation of wafer pricks material machine - Google Patents
Automatic frequency modulation of wafer pricks material machine Download PDFInfo
- Publication number
- CN210365906U CN210365906U CN201921143424.8U CN201921143424U CN210365906U CN 210365906 U CN210365906 U CN 210365906U CN 201921143424 U CN201921143424 U CN 201921143424U CN 210365906 U CN210365906 U CN 210365906U
- Authority
- CN
- China
- Prior art keywords
- frequency modulation
- guide rail
- pricking
- linear guide
- axis linear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model provides a wafer automatic frequency modulation pricks material machine which characterized in that: the wafer frequency modulation device comprises a wafer carrier plate, a frequency modulation X-axis linear guide rail, a frequency modulation Y-axis linear guide rail, a frequency modulation Z-axis lifting motor, a probe and a laser frequency modulation device; the wafer material-pricking device comprises a material-pricking platform, a material-pricking X-axis linear guide rail, a material-pricking Y-axis linear guide rail, a material-pricking Z-axis motor and a material-pricking needle. The utility model discloses with the frequency modulation with prick the material integration together, can get into at once and prick the material procedure after the frequency modulation procedure is accomplished, link up closely between two processes, can shorten the flow time greatly, improve flow efficiency, do moreover and can also be integrated into an equipment with two equipment, reduce manufacturing cost, improve the market competition of product.
Description
Technical Field
The utility model belongs to wafer production facility field, concretely relates to automatic frequency modulation of wafer pricks material machine.
Background
In the field of micro tuning fork crystal production, frequency adjustment needs to be performed on tuning fork units on wafer wafers after a silver process is completed, and the frequency of tuning forks is increased to an expected value by changing the thickness of an electrode film layer. After the frequency is adjusted, the tuning fork unit needs to be taken down from the wafer to form an independent tuning fork unit product.
Chinese patent is granted No. CN 207021971U, and the utility model discloses a laser tuning fork crystal frequency modulation machine that granted announcement day is 2018, 2 months 16 days, which comprises a frame, be provided with the transmission band in the frame, there are loading attachment and unloader at the transmission band both ends, still be provided with between loading attachment and the unloader and press from both sides tight probe and frequency adjusting device, frequency adjusting device includes frequency analyzer and laser instrument, and the laser instrument is located and presss from both sides tight probe top, and the laser instrument links to each other with altitude controller.
The utility model discloses a simple structure, convenient to use, machining efficiency height. However, the device only focuses on tuning with tuning fork crystals, and the tuning fork crystals after tuning are processed by the next process, so that the efficiency of the whole process is influenced, and moreover, the tuning bundling is completed by using two machines, so that the production cost is increased, and the market competitiveness of the product is reduced.
Disclosure of Invention
The utility model aims at overcoming the problem that exists among the prior art, providing a simple structure, the function is comprehensive, high efficiency low cost's wafer automatic frequency modulation pricks material machine.
In order to achieve the above purpose, the technical solution of the utility model is that: the utility model provides a wafer automatic frequency modulation pricks material machine which characterized in that: the wafer frequency modulation device comprises a wafer carrier plate, a frequency modulation X-axis linear guide rail, a frequency modulation Y-axis linear guide rail, a frequency modulation Z-axis lifting motor, a probe and a laser frequency modulation device, wherein the frequency modulation Y-axis linear guide rail is connected on the frequency modulation X-axis linear guide rail in a sliding manner, the wafer carrier plate is connected on the frequency modulation Y-axis linear guide rail in a sliding manner, the transmission end of the frequency modulation Z-axis lifting motor is fixedly connected with the bottom of the wafer carrier plate, and the probe and the laser frequency modulation device are positioned right above the frequency modulation X-axis linear guide rail; the wafer pricking device comprises a pricking platform, a pricking X-axis linear guide rail, a pricking Y-axis linear guide rail, a pricking Z-axis motor and a pricking needle, wherein the pricking platform is connected to the pricking X-axis linear guide rail in a sliding mode, the pricking Y-axis linear guide rail is installed on a guide rail support, the pricking Z-axis motor is connected to the pricking Y-axis linear guide rail in a sliding mode, the pricking needle is connected with the pricking Z-axis motor together through a pricking needle connecting piece, and the pricking needle is located over the pricking X-axis linear guide rail.
And a dust suction device is arranged above the probe and is in sliding connection with a dust suction U-axis linear guide rail through a connecting plate, and the dust suction U-axis linear guide rail is arranged on the guide rail support.
The probes are fixed on the probe connecting blocks, and two ends of the probe connecting blocks are fixedly connected with the probe supports on two sides of the split frequency modulation X-axis linear guide rail respectively.
Compared with the prior art, the utility model, following advantage has:
1. the utility model discloses with the frequency modulation with prick the material integration together, can get into at once and prick the material procedure after the frequency modulation procedure is accomplished, link up closely between two processes, can shorten the flow time greatly, improve flow efficiency, do moreover and can also be integrated into an equipment with two equipment, reduce manufacturing cost, improve the market competition of product.
2. The utility model discloses set up dust extraction above the probe, can inhale away the debris that the frequency modulation in-process produced, guarantee the quality of wafer.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: the device comprises a wafer frequency modulation device 1, a wafer pricking device 2, a wafer support plate 3, a frequency modulation X-axis linear guide rail 4, a frequency modulation Y-axis linear guide rail 5, a frequency modulation Z-axis lifting motor 6, a probe 7, a laser frequency modulation device 8, a pricking platform 9, a pricking X-axis linear guide rail 10, a pricking Y-axis linear guide rail 11, a pricking Z-axis motor 12, a pricking needle 13, a guide rail support 14, a pricking needle connecting piece 15, a dust collection device 16, a dust collection U-axis linear guide rail 17, a probe connecting block 18 and a probe support 19.
Detailed Description
The invention will be described in further detail with reference to the following description and embodiments, with reference to the accompanying drawings, in which:
referring to fig. 1, the automatic wafer frequency modulation material bundling machine comprises a wafer frequency modulation device 1 and a wafer material bundling device 2, wherein the wafer frequency modulation device 1 comprises a wafer carrier plate 3, a frequency modulation X-axis linear guide rail 4, a frequency modulation Y-axis linear guide rail 5, a frequency modulation Z-axis lifting motor 6, a probe 7 and a laser frequency modulation device 8, the frequency modulation Y-axis linear guide rail 5 is slidably connected to the frequency modulation X-axis linear guide rail 4, the wafer carrier plate 3 is slidably connected to the frequency modulation Y-axis linear guide rail 5, a transmission end of the frequency modulation Z-axis lifting motor 6 is fixedly connected with the bottom of the wafer carrier plate 3, the probe 7 is fixed on a probe connection block 18, two ends of the probe connection block 18 are respectively fixedly connected with probe supports 19 on two sides of the row frequency modulation X-axis linear guide rails 4, and the probe 7 and the laser frequency modulation device 8 are positioned right above the frequency modulation X-axis linear guide rail 4; wafer pricks material device 2 is including pricking material platform 9, pricking material X axle linear guide 10, pricking material Y axle linear guide 11, pricking material Z axle motor 12 and pricking material needle 13, prick material platform 9 sliding connection on pricking material X axle linear guide 10, prick material Y axle linear guide 11 and install on guide rail support 14, prick material Z axle motor 12 sliding connection on pricking material Y axle linear guide 11, prick material needle 13 and prick material Z axle motor 12 and link together through pricking material needle connecting piece 15, prick material needle 13 and be located and prick directly over material X axle linear guide 10.
In order to avoid that sundries generated during frequency modulation fall on the wafer to influence the quality of the wafer, a dust suction device 16 is arranged above the probe 7, the dust suction device 16 is connected with a dust suction U-axis linear guide rail 17 in a sliding mode through a connecting plate, and the dust suction U-axis linear guide rail 17 is installed on the guide rail support 14.
The utility model discloses a working process does: firstly, correctly placing a Wafer on a Wafer carrier plate 3, driving the Wafer carrier plate 3 to move to the position below a probe 7 along a guide track through a frequency modulation X-axis linear guide rail 4 and a frequency modulation Y-axis linear guide rail 5, fixing the probe by a probe support 19 and a probe connecting block 18, enabling a first row of tuning forks on the Wafer to be opposite to the probe, lifting the Wafer carrier plate 3 through a frequency modulation Z-axis lifting motor 6 to enable the tuning forks to be in contact with the probe, measuring the frequencies of the tuning forks, after the frequency test of the row of tuning forks is completed, transmitting the frequencies of the tuning forks to a computer (not shown in figure 1) through a test circuit (not shown in figure 1) for data processing, emitting laser through a laser frequency modulation device 8 to perform frequency modulation on the row of tuning forks, and simultaneously moving a dust collection device 16 through a dust collection U-axis linear guide rail 17 to collect sundries generated by frequency modulation. After adjustment is completed, controlling a frequency modulation Z-axis lifting motor 6 to reduce the height of a wafer carrier plate 3, controlling a carrier plate platform to move along the X-axis direction by a frequency modulation X-axis linear guide rail 4, enabling a second row of tuning forks to be opposite to probes, lifting the carrier plate to test the frequency modulation work of the second row of tuning forks, sequentially adjusting the frequency of each row of tuning fork units according to the operation step, controlling the wafer carrier plate 3 to return to an original point position after the frequency modulation is completed, taking out the wafer to be placed on a material binding platform 9, moving the wafer material binding platform 9 to the lower side of a material binding needle 13 through a material binding X-axis linear guide rail 10, enabling a first row of the wafer to correspond to the material binding needle 13, moving the material binding needle 13 to the rightmost right side of the row through a material binding Y-axis linear guide rail 11, driving the material binding needle connector 15 to drive the material binding needle 13 to move up and down through a material binding needle connector 15 under the drive of the material binding needle, and sequentially moving the material binding needle 13 to the left side of the row of the material binding needle 13 through a material binding Y-axis linear guide rail 11 after the material And (3) at each tuning fork, moving the binding platform through the binding X-axis linear guide rail 10 after each tuning fork is bound in sequence to carry out binding work of each rear tuning fork row.
Claims (3)
1. The utility model provides a wafer automatic frequency modulation pricks material machine which characterized in that: the wafer frequency modulation device comprises a wafer frequency modulation device (1) and a wafer material bundling device (2), wherein the wafer frequency modulation device (1) comprises a wafer carrier plate (3), a frequency modulation X-axis linear guide rail (4), a frequency modulation Y-axis linear guide rail (5), a frequency modulation Z-axis lifting motor (6), a probe (7) and a laser frequency modulation device (8), the frequency modulation Y-axis linear guide rail (5) is connected onto the frequency modulation X-axis linear guide rail (4) in a sliding mode, the wafer carrier plate (3) is connected onto the frequency modulation Y-axis linear guide rail (5) in a sliding mode, a transmission end of the frequency modulation Z-axis lifting motor (6) is fixedly connected with the bottom of the wafer carrier plate (3), and the probe (7) and the laser frequency modulation device (8) are located right above the frequency modulation X-axis linear guide rail (4); the wafer pricking device (2) comprises a pricking platform (9), a pricking X-axis linear guide rail (10), a pricking Y-axis linear guide rail (11), a pricking Z-axis motor (12) and a pricking needle (13), wherein the pricking platform (9) is connected to the pricking X-axis linear guide rail (10) in a sliding mode, the pricking Y-axis linear guide rail (11) is installed on a guide rail support (14), the pricking Z-axis motor (12) is connected to the pricking Y-axis linear guide rail (11) in a sliding mode, the pricking needle (13) is connected with the pricking Z-axis motor (12) through a pricking needle connecting piece (15), and the pricking needle (13) is located over the pricking X-axis linear guide rail (10).
2. The wafer automatic frequency modulation material binding machine of claim 1, wherein: a dust suction device (16) is arranged above the probe (7), the dust suction device (16) is connected with a dust suction U-axis linear guide rail (17) in a sliding mode through a connecting plate, and the dust suction U-axis linear guide rail (17) is installed on a guide rail support (14).
3. The wafer automatic frequency modulation material binding machine of claim 1, wherein: the probe (7) is fixed on a probe connecting block (18), and two ends of the probe connecting block (18) are respectively and fixedly connected with probe supports (19) on two sides of the split-row frequency-modulation X-axis linear guide rail (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921143424.8U CN210365906U (en) | 2019-07-20 | 2019-07-20 | Automatic frequency modulation of wafer pricks material machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921143424.8U CN210365906U (en) | 2019-07-20 | 2019-07-20 | Automatic frequency modulation of wafer pricks material machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210365906U true CN210365906U (en) | 2020-04-21 |
Family
ID=70272791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921143424.8U Active CN210365906U (en) | 2019-07-20 | 2019-07-20 | Automatic frequency modulation of wafer pricks material machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210365906U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117393482A (en) * | 2023-12-07 | 2024-01-12 | 天津伍嘉联创科技发展股份有限公司 | Full-automatic wafer tuning fork laser frequency modulation equipment |
-
2019
- 2019-07-20 CN CN201921143424.8U patent/CN210365906U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117393482A (en) * | 2023-12-07 | 2024-01-12 | 天津伍嘉联创科技发展股份有限公司 | Full-automatic wafer tuning fork laser frequency modulation equipment |
| CN117393482B (en) * | 2023-12-07 | 2024-02-09 | 天津伍嘉联创科技发展股份有限公司 | Full-automatic wafer tuning fork laser frequency modulation equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100632378B1 (en) | In-line auto fog bonding m/c | |
| CN108355989A (en) | A kind of tab cutting for electronic product battery detects mechanism for sorting | |
| CN107186103B (en) | Planing tool blade automatic machining device and its processing technology | |
| CN210365906U (en) | Automatic frequency modulation of wafer pricks material machine | |
| CN209956356U (en) | Shielding case packaging machine with flatness detection mechanism | |
| CN109262278A (en) | A kind of mobile phone elastic slice process equipment | |
| CN106623001B (en) | A kind of automation preliminary filling and test equipment | |
| CN116008715A (en) | Parallel testing and packaging integrated machine for ceramic dielectric filter | |
| CN202616212U (en) | Full-automatic feeding and discharging device for laser processing semiconductor chip | |
| CN209699185U (en) | A kind of mobile-phone lens cutting apparatus | |
| CN218841960U (en) | Double-platform glass cutting machine | |
| CN216706620U (en) | Automatic assembly device for detection card | |
| CN115319356A (en) | Bus bar welding equipment and welding method | |
| CN209418960U (en) | A kind of TYPE-C interface automatic buckling machine | |
| CN108161472A (en) | A kind of filter screen automatic assembling | |
| CN219881582U (en) | Full-automatic cutting equipment for luggage fabric | |
| CN113828545A (en) | Full-automatic acupuncture grain sorting equipment | |
| CN214428600U (en) | Solar cell IV testing arrangement | |
| CN221151644U (en) | Automatic equipment for sticking PCB to horn bracket | |
| CN217156569U (en) | Triaxial fast conversion device for semiconductor chip frequency sweep vibration test | |
| CN217889791U (en) | Panel welding unit | |
| CN216730375U (en) | Automatic mechanism of NTC chip dress welding carrier | |
| CN212733632U (en) | Automatic correction cutting machine | |
| CN216539622U (en) | Automatic audio test equipment | |
| CN210132761U (en) | Reverse pasting and pressure detecting integrated machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 441300 Zengdou Economic Development Zone, Hubei, Suizhou Patentee after: Taijing Technology Co., Ltd Address before: 441300 Zengdou Economic Development Zone, Hubei, Suizhou Patentee before: HUBEI TKD ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |