CN117393482B - Full-automatic wafer tuning fork laser frequency modulation equipment - Google Patents
Full-automatic wafer tuning fork laser frequency modulation equipment Download PDFInfo
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- CN117393482B CN117393482B CN202311665849.6A CN202311665849A CN117393482B CN 117393482 B CN117393482 B CN 117393482B CN 202311665849 A CN202311665849 A CN 202311665849A CN 117393482 B CN117393482 B CN 117393482B
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- 230000007246 mechanism Effects 0.000 claims abstract description 240
- 238000012360 testing method Methods 0.000 claims abstract description 68
- 239000000463 material Substances 0.000 claims abstract description 40
- 238000010329 laser etching Methods 0.000 claims abstract description 33
- 230000002950 deficient Effects 0.000 claims abstract description 24
- 235000012431 wafers Nutrition 0.000 claims description 73
- 239000000428 dust Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 6
- 238000012546 transfer Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides full-automatic wafer tuning fork laser frequency modulation equipment, which relates to the technical field of semiconductor industry and comprises an equipment body and the following mechanisms arranged on the equipment body: the wafer transfer device comprises a feeding basket mechanism, a coarse positioning mechanism, a positioning test mechanism, a laser etching mechanism, a material transferring platform, a defective product removing mechanism, a storage basket mechanism and a material transferring mechanism, wherein the material transferring mechanism is used for completing wafer transfer operation among the feeding basket mechanism, the coarse positioning platform mechanism, the positioning test platform mechanism, the material transferring platform and the storage basket mechanism; through this full-automatic wafer tuning fork laser frequency modulation equipment, alleviate the enterprise that exists among the prior art and adopted artifical unloading, perhaps adopt semi-automatization mode, the lower technical problem of efficiency and reliability of the whole production flow of product has reached the production flow and has realized automaticly, and production efficiency and the higher technical effect of reliability.
Description
Technical Field
The invention relates to the technical field of semiconductor industry, in particular to full-automatic wafer tuning fork laser frequency modulation equipment.
Background
The full-automatic wafer tuning fork laser frequency modulation device is applied to the fields of advanced semiconductor manufacturing, mobile electronic equipment and the like, and has rapid development in recent years. Some enterprises adopt manual feeding and discharging, or some enterprises adopt a semi-automatic mode, and the efficiency and reliability of the whole production process of the product are low.
Disclosure of Invention
The invention aims to provide full-automatic wafer tuning fork laser frequency modulation equipment so as to solve the problem that enterprises in the prior art adopt manual feeding and discharging or adopt a semi-automatic mode, and the efficiency and reliability of the whole production process of products are low.
The invention provides full-automatic wafer tuning fork laser frequency modulation equipment, which comprises an equipment body and the following mechanisms arranged on the equipment body:
the feeding basket mechanism is used for Cheng Fangjing circles;
the coarse positioning mechanism comprises a coarse positioning platform mechanism and a first camera module arranged above the coarse positioning platform mechanism, and the coarse positioning mechanism and the first camera module are matched to perform coarse positioning on the position of a wafer transferred to the coarse positioning platform mechanism by the feeding basket mechanism;
the positioning test mechanism comprises a positioning test platform mechanism, a second camera module and a test mechanism, wherein the positioning test platform mechanism is used for accommodating the coarsely positioned wafer, and the positioning test platform mechanism is matched with the second camera module to test the accurately positioned wafer when the positioning test platform mechanism moves to the lower part of the positioning test platform mechanism;
the laser etching mechanism is used for carrying out laser etching on the wafer subjected to the test and at least sending defective product data;
the material transferring platform is used for accommodating the wafer subjected to laser etching;
the defective product removing mechanism is used for receiving the defective product data and removing defective products from the material transferring platform according to the defective product data;
the accommodating basket mechanism is used for accommodating good wafers;
and the material transferring mechanism is used for completing the wafer transferring operation of the wafer between the material feeding basket mechanism, the coarse positioning platform mechanism, the positioning test platform mechanism, the material transferring platform and the storage basket mechanism.
Further, the feeding basket mechanism comprises a basket bottom bracket and a basket assembly arranged on the basket bottom bracket;
the basket assembly comprises a plurality of layers of clamping grooves which are arranged from top to bottom at intervals and used for horizontally placing wafers.
Further, a proximity sensor is arranged on the basket base, and the proximity sensor detects whether the basket assembly is horizontally placed.
Further, the coarse positioning platform mechanism comprises a coarse positioning platform, an X-direction driving mechanism, a Y-direction driving mechanism and a rotating mechanism, wherein the X-direction driving mechanism, the Y-direction driving mechanism and the rotating mechanism are used for driving the coarse positioning platform to act;
the X-direction driving mechanism and the Y-direction driving mechanism are used for driving the coarse positioning platform to move along the X direction or the Y direction respectively, and the rotating mechanism is used for driving the coarse positioning platform to rotate in an XY plane.
Further, the positioning test platform mechanism comprises a positioning test platform, an X-direction driving mechanism and a Y-direction driving mechanism;
the Y-direction driving mechanism is arranged on the X-direction driving mechanism, and the positioning test platform is arranged on the Y-direction driving mechanism;
the second camera module is positioned above the Y-direction driving mechanism;
the test mechanism comprises a test assembly and a Z-direction driving mechanism, and the test assembly is arranged on the Z-direction driving mechanism;
the test assembly is arranged above a moving track line of the Y-direction driving mechanism.
Further, the laser etching mechanism comprises a laser etching platform, a laser generator and an electron microscope assembly;
the laser generator is arranged on the laser etching platform;
the electron microscope component is arranged below the laser etching platform;
the second camera module is arranged above the front of the laser etching platform.
Further, a dust collection assembly is further arranged below the laser etching platform and used for sucking away dust under etching.
Further, the defective product removing mechanism comprises an X-direction driving mechanism, a Y-direction driving mechanism and a Z-direction driving mechanism;
the material transferring platform is arranged on the Y-direction driving mechanism;
the Z-direction driving mechanism is arranged on the X-direction driving mechanism.
Further, the storage basket mechanism is arranged at one side of the material transferring platform;
the storage basket mechanism comprises a basket bottom bracket and a storage basket assembly arranged on the basket bottom bracket;
the accommodating basket component comprises a plurality of layers of clamping grooves which are arranged from top to bottom at intervals and used for horizontally placing good wafers.
Further, the material moving mechanism comprises an X-direction driving mechanism, a Y-direction driving mechanism, a Z-direction driving mechanism and a ceramic arm;
the Z-direction driver of the Z-direction driving mechanism is arranged above the X-direction driving mechanism;
the Y-direction driving mechanisms are arranged in two groups and are arranged on the Z-direction driving mechanisms side by side;
the ceramic arm is arranged on the Y-direction driving mechanism.
The full-automatic wafer tuning fork laser frequency modulation device provided by the invention has at least the following beneficial effects:
the precise matching among the mechanisms can smoothly realize the functions of basket feeding, automatic material taking, coarse positioning, precise positioning, testing, laser etching, defective product rejection, good product storage and the like, the degree of automation is high, the product feeding and good product storage efficiency is high, the performance of the product is stable due to the coarse positioning and the precise positioning, the yield is high, and therefore the production efficiency and the reliability of the whole equipment are higher.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a full-automatic wafer tuning fork laser frequency modulation device according to an embodiment of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic view of the feed basket mechanism;
FIG. 4 is a schematic diagram of a coarse positioning mechanism;
FIG. 5 is a schematic diagram of a positioning test platform mechanism and a second camera module;
FIG. 6 is a schematic structural diagram of a test mechanism;
FIG. 7 is a schematic diagram of a laser etching mechanism;
FIG. 8 is a schematic diagram of a defective product removing mechanism and a material transferring platform;
fig. 9 is a schematic structural view of the material transferring mechanism.
Icon:
100-an equipment body;
200-feeding basket mechanism; 210-basket underwire; 220-basket assembly; 230-a proximity sensor;
300-a coarse positioning mechanism; 310-coarse positioning stage mechanism; 320-a first camera module;
400-positioning a test mechanism; 410-positioning a test platform mechanism; 420-a second camera module; 430-a testing mechanism; 431-testing the component;
500-a laser etching mechanism; 510-a laser etching platform; 520-a laser generator; 530-an electron microscope assembly; 540-a dust collection assembly;
600-material transferring platform;
700-removing defective products;
800-accommodating basket mechanism;
900-a material moving mechanism; 910-ceramic arm.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The devices of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhanging, but may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1 and 2, the embodiment provides a full-automatic tuning fork laser tuning device, which comprises a device body 100 and the following mechanisms arranged on the device body 100: the feeding basket mechanism 200, the coarse positioning mechanism 300, the positioning testing mechanism 400, the laser etching mechanism 500, the material transferring platform 600, the defective product removing mechanism 700, the storage basket mechanism 800 and the material transferring mechanism 900 are arranged at reasonable positions according to the cooperation of the mechanisms, and the specific structure of each mechanism will be described in detail below.
Referring to fig. 3, a feed basket mechanism 200 includes a basket mount 210 and a basket assembly 220 disposed to the basket mount 210; the basket assembly 220 includes a plurality of clamping grooves arranged at intervals from top to bottom for horizontally placing wafers; wherein, can place multilayer wafer on the material basket subassembly.
Wherein, through the cooperation of jackscrew and screw, can adjust the levelness of basket subassembly 220, every layer still can position the wafer about the position, makes equipment stability strengthen greatly.
With continued reference to fig. 3, a proximity sensor 230 is provided on the basket mount, and the proximity sensor 230 is configured to detect whether the basket assembly 220 is horizontally placed, and if the basket assembly 220 is not horizontally placed, an alarm is sent. Referring to fig. 4, the coarse positioning mechanism 300 includes a coarse positioning stage mechanism 310 and a first camera module 320 positioned above the coarse positioning stage mechanism 310, which cooperate to coarse position the wafer position transferred from the feed basket mechanism 200 to the coarse positioning stage mechanism 310.
Wherein the purpose of coarse positioning is to achieve accurate positioning, to accurately position a 0.2mm anchor point on a wafer (wafer), within the field of view of an accurate positioning camera.
Further, the coarse positioning platform mechanism 310 includes a coarse positioning platform, and an X-direction driving mechanism, a Y-direction driving mechanism and a rotating mechanism for driving the coarse positioning platform to act; the X-direction driving mechanism and the Y-direction driving mechanism are used for driving the coarse positioning platform to move along the X direction or the Y direction respectively, and the rotating mechanism is used for driving the coarse positioning platform to rotate in the XY plane.
Referring to fig. 5 and 6, the positioning test mechanism 400 includes a positioning test platform mechanism 410, a second camera module 420 and a test mechanism 430, wherein the positioning test platform mechanism 410 is used for accommodating a wafer after coarse positioning, and the positioning test platform mechanism 410 is matched with the second camera module 420 to test the wafer after accurate positioning when the positioning test platform mechanism 410 moves below the wafer.
The wafer positioning is accurate, the adsorption holes are added, the stability of the wafer (wafer) on each platform is guaranteed, the accuracy of accurate positioning is within 5 mu m, and the position of the test point is calculated through wafer photoetching positioning.
Further, the positioning test platform mechanism 410 includes a positioning test platform, an X-direction driving mechanism, and a Y-direction driving mechanism; the Y-direction driving mechanism is arranged on the X-direction driving mechanism, and the positioning test platform is arranged on the Y-direction driving mechanism; the second camera module 420 is located above the Y-direction driving mechanism; the test mechanism 430 comprises a test assembly 431 and a Z-direction driving mechanism, and the test assembly 431 is arranged on the Z-direction driving mechanism; the test assembly 431 is disposed above the path of movement of the Y-direction drive mechanism.
Referring to fig. 7, a laser etching mechanism 500 is used to perform laser etching on a wafer that has been tested and at least send out defective data.
Specifically, laser etching mechanism 500 includes a laser etching platform 510, a laser generator 520, and an electron microscope assembly 530; the laser generator 520 is disposed on the laser etching platform 510; the electron microscope assembly 530 is disposed below the laser etching platform 510; the second camera module 420 is mounted in front of and above the laser etching platform 510.
With continued reference to fig. 7, a dust collection assembly 540 is further disposed below the laser etching platform 510, and the dust collection assembly 540 is used for sucking away the etched dust.
Specifically, the product of etching gold plating and silver plating can be compatible, the etching appearance is free of burrs and dust, a dust collection function is added at the platform, and the influence of dust after etching is reduced.
Referring to fig. 8, a transfer stage 600 for receiving a laser etched wafer; the defective product removing mechanism 700 is configured to receive defective product data, and remove defective products from the material transferring platform 600 according to the defective product data.
Specifically, please continue to refer to fig. 8, the defective product removing mechanism 700 includes an X-direction driving mechanism, a Y-direction driving mechanism, and a Z-direction driving mechanism; the material transferring platform 600 is arranged on the Y-direction driving mechanism; the Z-direction driving mechanism is arranged above the X-direction driving mechanism.
Referring to fig. 1, a receiving basket mechanism 800 is provided at one side of a material transferring platform 600; the structure of the receiving basket mechanism 800 is set to be identical to the structure of the feeding basket mechanism 200.
Referring to fig. 1 and 9, a transfer mechanism 900 is provided for performing wafer transfer operations between the feed basket mechanism 200, the coarse positioning stage mechanism 310, the positioning test stage mechanism 410, the transfer stage 600, and the receiving basket mechanism 800.
Specifically, the material moving mechanism 900 includes an X-direction driving mechanism, a Y-direction driving mechanism, a Z-direction driving mechanism, and a ceramic arm 910; the Z-direction driver of the Z-direction driving mechanism is arranged above the X-direction driving mechanism; the Y-direction driving mechanisms are arranged in two groups and are arranged on the Z-direction driving mechanisms side by side; the ceramic arm 910 is mounted on the Y-drive mechanism.
The ceramic arm 910 is selected so as not to damage the surface coating of the wafer. Simultaneously, the double mechanical arms transport can promote transport efficiency.
It should be noted that the aforementioned X-direction driving mechanism, Y-direction driving mechanism, Z-direction driving mechanism and rotating mechanism are all well known in the art, and the present embodiment does not improve the foregoing, and related structures in the prior art may be adopted, which are not described herein.
In conclusion, the full-automatic wafer tuning fork laser frequency modulation equipment overcomes the defects of the prior art, is reasonable in structural arrangement, flexible and simple in operation, fully-automatic in feeding and taking, reduces damage to products caused by personnel errors, improves yield, improves operation efficiency of the equipment by adopting a double-mechanical-arm structure, and is simple in operation, and personnel only need to place basket assemblies.
The working process of the full-automatic wafer tuning fork laser frequency modulation device of the embodiment is as follows:
placing a wafer (full) on the basket assembly;
taking out material from within the basket assembly 220 of the feed basket mechanism by the material transfer mechanism 900;
feeding the material to the coarse positioning platform mechanism 310 through the ceramic arm 910 on the left side of the material moving mechanism 900, and performing coarse positioning photographing on a wafer (wafer) through the first camera module 320 above;
the wafer (wafer) is taken out and moved to the positioning test platform mechanism 410 through the material moving mechanism 900, and coarse adjustment is performed according to coarse positioning data to accurately place the wafer (wafer);
the second camera module 420 above then precisely positions the wafer;
the wafer positioning test platform mechanism 410 then moves under the test mechanism 430 and the test assembly 431 begins testing the wafer;
then the laser etching mechanism 500 modulates the frequency of the wafer (wafer), and the dust collection component 540 sucks away the etched dust;
after etching is completed, positioning test platform mechanism 410 moves back to the initial position;
the ceramic arm 910 on the right side of the material moving mechanism 900 takes down the frequency-modulated wafer (wafer), moves the wafer to the material transferring platform 600, eliminates defective products through the defective product eliminating mechanism 700 according to the test data of the test component 431, and returns the material transferring platform 600 to the initial position after the elimination is completed;
the transfer mechanism 900 removes good wafers (wafer) and places them into the receiving basket mechanism 800.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (10)
1. The full-automatic wafer tuning fork laser frequency modulation device is characterized by comprising a device body (100) and the following mechanisms arranged on the device body (100):
a feed basket mechanism (200) for a Cheng Fangjing circle;
a coarse positioning mechanism (300) comprising a coarse positioning platform mechanism (310) and a first camera module (320) positioned above the coarse positioning platform mechanism (310), wherein the coarse positioning mechanism and the first camera module are matched with each other to perform coarse positioning on the position of a wafer transferred to the coarse positioning platform mechanism (310) by the feeding basket mechanism (200);
the positioning test mechanism (400) comprises a positioning test platform mechanism (410), a second camera module (420) and a test mechanism (430), wherein the positioning test platform mechanism (410) is used for containing a roughly positioned wafer, and the positioning test platform mechanism (410) is matched with the second camera module (420) to test the precisely positioned wafer when the positioning test platform mechanism (410) moves below the positioning test platform mechanism;
the laser etching mechanism (500) is used for carrying out laser etching on the wafer subjected to the test and at least sending defective product data;
a material transferring platform (600) for receiving the wafer after laser etching;
the defective product removing mechanism (700) is used for receiving the defective product data and removing the defective product out of the material transferring platform (600) according to the defective product data;
a storage basket mechanism (800) for storing good wafers;
and the material transferring mechanism (900) is used for completing the wafer transferring operation of the wafer between the material feeding basket mechanism (200), the coarse positioning platform mechanism (310), the positioning test platform mechanism (410), the material transferring platform (600) and the storage basket mechanism (800).
2. The full-automatic wafer tuning fork laser tuning apparatus of claim 1, wherein the feed basket mechanism (200) comprises a basket mount (210) and a basket assembly (220) disposed to the basket mount (210);
the basket assembly (220) includes a plurality of layers of clamping grooves arranged at intervals from top to bottom for horizontally placing wafers.
3. The full-automatic wafer tuning fork laser frequency modulation device according to claim 2, wherein a proximity sensor (230) is provided on the basket mount (210), and the proximity sensor (230) is configured to detect whether the basket assembly (220) is horizontally placed.
4. The full-automatic wafer tuning fork laser frequency modulation device of claim 1, wherein the coarse positioning stage mechanism (310) comprises a coarse positioning stage and an X-direction driving mechanism, a Y-direction driving mechanism and a rotating mechanism for driving the coarse positioning stage to act;
the X-direction driving mechanism and the Y-direction driving mechanism are used for driving the coarse positioning platform to move along the X direction or the Y direction respectively, and the rotating mechanism is used for driving the coarse positioning platform to rotate in an XY plane.
5. The full-automatic wafer tuning fork laser frequency modulation device of claim 1, wherein the positioning test platform mechanism (410) comprises a positioning test platform, an X-direction drive mechanism, a Y-direction drive mechanism;
the Y-direction driving mechanism is arranged on the X-direction driving mechanism, and the positioning test platform is arranged on the Y-direction driving mechanism;
the second camera module (420) is positioned above the Y-direction driving mechanism;
the test mechanism (430) comprises a test component (431) and a Z-direction driving mechanism, and the test component (431) is arranged on the Z-direction driving mechanism;
the test assembly (431) is disposed above a movement trajectory of the Y-direction drive mechanism.
6. The full-automatic wafer tuning fork laser tuning apparatus of claim 1, wherein the laser etching mechanism (500) comprises a laser etching platform (510), a laser generator (520), and an electron microscope assembly (530);
the laser generator (520) is arranged on the laser etching platform (510);
the electron microscope assembly (530) is arranged below the laser etching platform (510);
the second camera module (420) is installed above and in front of the laser etching platform (510).
7. The full-automatic wafer tuning fork laser frequency modulation device according to claim 6, wherein a dust collection assembly (540) is further arranged below the laser etching platform (510) and is used for sucking away dust under etching by the dust collection assembly (540).
8. The full-automatic wafer tuning fork laser frequency modulation device according to claim 1, wherein the reject mechanism (700) comprises an X-direction drive mechanism, a Y-direction drive mechanism, and a Z-direction drive mechanism;
the material transferring platform (600) is arranged on the Y-direction driving mechanism;
the Z-direction driving mechanism is arranged on the X-direction driving mechanism.
9. The full-automatic wafer tuning fork laser frequency modulation device according to claim 1, wherein the receiving basket mechanism (800) is disposed at one side of the material transferring platform (600);
the storage basket mechanism (800) comprises a basket bottom bracket and a storage basket assembly arranged on the basket bottom bracket;
the accommodating basket component comprises a plurality of layers of clamping grooves which are arranged from top to bottom at intervals and used for horizontally placing good wafers.
10. The full-automatic wafer tuning fork laser frequency modulation apparatus of claim 1, wherein the material moving mechanism (900) comprises an X-direction drive mechanism, a Y-direction drive mechanism, a Z-direction drive mechanism, and a ceramic arm (910);
the Z-direction driver of the Z-direction driving mechanism is arranged above the X-direction driving mechanism;
the Y-direction driving mechanisms are arranged in two groups and are arranged on the Z-direction driving mechanisms side by side;
the ceramic arm (910) is mounted over the Y-drive mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311665849.6A CN117393482B (en) | 2023-12-07 | 2023-12-07 | Full-automatic wafer tuning fork laser frequency modulation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN101345514A (en) * | 2007-07-09 | 2009-01-14 | 喻信东 | Tuning fork crystal automatic frequency modulation equipment and its production technique |
| CN104378078A (en) * | 2014-09-19 | 2015-02-25 | 随州润晶电子科技有限公司 | Quartz crystal laser frequency modulation machine |
| CN210365906U (en) * | 2019-07-20 | 2020-04-21 | 湖北泰晶电子科技股份有限公司 | Automatic frequency modulation of wafer pricks material machine |
| CN112420580A (en) * | 2021-01-22 | 2021-02-26 | 山东元旭光电股份有限公司 | Automatic wafer discharging and detecting production line |
| CN113725131A (en) * | 2021-11-02 | 2021-11-30 | 西安奕斯伟材料科技有限公司 | Wafer pretreatment device and wafer defect detection method |
| CN115458431A (en) * | 2022-10-18 | 2022-12-09 | 深圳市中图仪器股份有限公司 | Wafer measuring system |
| CN115863226A (en) * | 2023-02-28 | 2023-03-28 | 天津伍嘉联创科技发展股份有限公司 | Folding machine capable of automatically breaking wafer for inspection and transferring |
| CN117038512A (en) * | 2023-08-10 | 2023-11-10 | 通威太阳能(眉山)有限公司 | Production line tracing method and laser dark mark |
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| CN101345514A (en) * | 2007-07-09 | 2009-01-14 | 喻信东 | Tuning fork crystal automatic frequency modulation equipment and its production technique |
| CN104378078A (en) * | 2014-09-19 | 2015-02-25 | 随州润晶电子科技有限公司 | Quartz crystal laser frequency modulation machine |
| CN210365906U (en) * | 2019-07-20 | 2020-04-21 | 湖北泰晶电子科技股份有限公司 | Automatic frequency modulation of wafer pricks material machine |
| CN112420580A (en) * | 2021-01-22 | 2021-02-26 | 山东元旭光电股份有限公司 | Automatic wafer discharging and detecting production line |
| CN113725131A (en) * | 2021-11-02 | 2021-11-30 | 西安奕斯伟材料科技有限公司 | Wafer pretreatment device and wafer defect detection method |
| CN115458431A (en) * | 2022-10-18 | 2022-12-09 | 深圳市中图仪器股份有限公司 | Wafer measuring system |
| CN115863226A (en) * | 2023-02-28 | 2023-03-28 | 天津伍嘉联创科技发展股份有限公司 | Folding machine capable of automatically breaking wafer for inspection and transferring |
| CN117038512A (en) * | 2023-08-10 | 2023-11-10 | 通威太阳能(眉山)有限公司 | Production line tracing method and laser dark mark |
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| CN117393482A (en) | 2024-01-12 |
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