CN210351947U - Attached formula mobile terminal heat abstractor - Google Patents
Attached formula mobile terminal heat abstractor Download PDFInfo
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- CN210351947U CN210351947U CN201920262746.8U CN201920262746U CN210351947U CN 210351947 U CN210351947 U CN 210351947U CN 201920262746 U CN201920262746 U CN 201920262746U CN 210351947 U CN210351947 U CN 210351947U
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- mobile terminal
- heat dissipation
- heat
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- refrigeration
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Abstract
The utility model discloses an attached mobile terminal heat dissipation device, which comprises a shell and a heat dissipation assembly, wherein the heat dissipation assembly comprises a refrigeration element and a heat conduction element; the casing with refrigeration component swing joint, the heat conduction component be attached to refrigeration component's surface, the heat conduction component with mobile terminal contacts, through heat conduction component attached on mobile terminal, has saved the hold assembly of traditional radiator to make the radiator more light, simultaneously, cool down mobile terminal through refrigeration component, compare and have better refrigeration effect with traditional forced air cooling, more effectual the mobile terminal of having alleviated because the high condition that leads to the performance reduction of temperature.
Description
Technical Field
The utility model relates to a radiator, more specifically say, it relates to an attached formula mobile terminal heat abstractor.
Background
With the continuous development of the technology level, the mobile terminal has become an indispensable technology product in people's daily life, and the functions of the mobile phone and the tablet computer are more and more common products in the mobile terminal. Under the condition that the mobile terminal is used for a long time, the mobile terminal often generates heat and raises the temperature, and the heat and the temperature can influence the performance and the service life of the mobile terminal, so that a radiator for the mobile terminal is available in the market.
At present, the existing mobile terminal radiator generally adopts air cooling, that is, a fan is fixed on the back of the mobile terminal through a clamping part, and the fan increases the local wind speed circulation on the back of the mobile terminal to take away heat. However, such heat dissipation methods are inefficient, and the clamping members are generally heavy, increasing the overall weight of the mobile device, and are not suitable for long-term use.
Therefore, the prior art still needs to be improved and developed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an attached formula mobile terminal heat abstractor through the attached on mobile terminal of heat-conducting element, has saved the hold assembly of traditional radiator to make the radiator more light.
The above technical purpose of the present invention can be achieved by the following technical solutions:
an attached mobile terminal heat dissipation device comprises a shell and a heat dissipation assembly, wherein the heat dissipation assembly comprises a refrigeration element and a heat conduction element; the shell is movably connected with the refrigeration element, the heat conduction element is attached to the surface of the refrigeration element, and the heat conduction element is in contact with the mobile terminal.
The adsorption mobile terminal heat dissipation device is characterized in that the heat dissipation assembly further comprises a heat dissipation element; the heat dissipation element and the heat conduction element are respectively arranged on two sides of the refrigeration element.
The adsorption type mobile terminal heat dissipation device comprises a shell, a heat dissipation component and a heat dissipation component, wherein the heat dissipation component comprises a fan; the bottom of the shell is provided with a first through hole, the heat conducting element extends to the outside of the shell through the first through hole, and the heat conducting element is in contact with the mobile terminal.
The adsorption type mobile terminal heat dissipation device is characterized in that the projection area of the heat dissipation element is larger than that of the first through hole.
The adsorption type mobile terminal heat dissipation device comprises a shell, a heat dissipation assembly and a heat dissipation assembly, wherein the shell comprises a cover body, a shell body and a base, the shell body is connected with the cover body and the base to form an accommodating cavity inside, and the heat dissipation assembly is installed in the accommodating cavity; the fan, the heat dissipation element, the refrigeration element and the heat conduction element are sequentially connected, and the fan is in contact with the cover body.
The adsorption type mobile terminal heat dissipation device is characterized in that the shell body is detachably connected to the base through a fastener, the cover body is connected to the shell body in a clamping mode, and the first through hole is formed in the lower end of the base.
The absorption type mobile terminal heat dissipation device is characterized in that the shell body is provided with a second through hole, the cover body comprises at least two ribbed plates movably erected on the second through hole, the ribbed plates are clamped with the second through hole, and a gap exists between the ribbed plates.
The adsorption type mobile terminal heat dissipation device further comprises a control switch for controlling the working states of the fan and the refrigeration element; the control switch is arranged on the shell and is respectively electrically connected with the fan and the refrigeration element
The adsorption type mobile terminal heat dissipation device is characterized in that a power line is further installed on the shell and is electrically connected with the fan, the refrigeration element and the control switch respectively.
The adsorption type mobile terminal heat dissipation device is characterized in that the refrigeration element is a semiconductor refrigeration sheet, the heat dissipation element is a metal heat dissipation sheet, and the heat conduction element is a heat conduction silica gel sheet.
To sum up, this application is attached on mobile terminal through heat conduction silica gel piece, has saved the hold assembly of traditional radiator to make the radiator more light, simultaneously, cool down mobile terminal through the semiconductor refrigeration piece, compare and have better refrigeration effect with traditional forced air cooling, more effectual the mobile terminal of having alleviated because the high condition that leads to the performance to reduce of temperature.
Drawings
Fig. 1 is a schematic top view of the whole of the present embodiment.
Fig. 2 is a schematic bottom structure of the whole of the present embodiment.
Fig. 3 is an exploded view of the whole of the present embodiment.
In the figure: 1. a housing; 11. a base; 111. a first through hole; 112. a baffle ring; 12. a shell body; 121. a second through hole; 122. a card slot; 13. a cover body; 131. a rib plate; 132. clamping the strip; 14. a control switch; 15. a power line; 2. a heat dissipating component; 21. a refrigeration element; 22. a heat dissipating element; 221. a base plate; 222. a fin; 23. a heat conducting element; 24. a fan.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
The utility model provides an attached formula mobile terminal heat abstractor, as shown in fig. 1 to fig. 3, including casing 1 and set up radiator unit 2 in casing 1, the preferred metal casing or the plastic housing of casing 1. The heat dissipation assembly 2 is disposed in an accommodating cavity formed inside the housing 1, the heat dissipation assembly 2 includes a refrigeration element 21, a heat dissipation element 22 and a heat conduction element 23, the heat conduction element 23 is attached to the surface of the refrigeration element 21, the heat conduction element 23 is in contact with the mobile terminal, and the heat dissipation element 22 and the heat conduction element 23 are respectively disposed at two sides of the refrigeration element 21. Specifically, the heat radiating member 22 is disposed at an upper end of the cooling member 21, and the heat conducting member 23 is disposed at a lower end of the cooling member 21.
In another embodiment of the present invention, the heat sink body includes a housing 1, a cooling element 21 disposed in the housing 1, a heat conducting element 23 attached to the surface of the cooling element 21 and contacting with the mobile terminal, and a power supply module, wherein the power supply module includes a power line 15 electrically connected to the cooling element 21 or a battery internally disposed in the housing 1 and electrically connected to the cooling element 21.
In the embodiment of the present invention, the cooling element 21 is preferably a semiconductor cooling plate, the heat dissipating element 22 is preferably a metal cooling plate, the heat conducting element 23 is preferably a heat conducting silicone sheet, the heat dissipating element 22 includes a bottom plate 221 and fins 222 integrally formed on the bottom plate 221, and the heat dissipating element 22 is provided with a fan 24. The utility model discloses in other embodiments, this refrigeration component still can be for other components and parts that can realize the refrigeration function.
The bottom of the housing 1 is provided with a first through hole 111, the heat conducting element 23 extends to the outside of the housing 1 through the first through hole 111, the heat conducting element 23 contacts with the mobile terminal, the refrigeration element 21 passes through the first through hole 111 or is arranged inside the housing 1, the heat conducting element 23 is tightly attached to the mobile terminal, and the heat dissipation element 22 is fastened and fixed inside the housing 1. The projected area of the heat dissipation member 22 should be larger than the projected area of the first through hole 111, i.e., the cross-sectional size of the first through hole 111 is smaller than the cross-sectional size of the heat dissipation member 22.
The embodiment of the utility model provides an in, the cold junction of semiconductor refrigeration piece is towards mobile terminal, and the hot junction of semiconductor refrigeration piece is towards heat-radiating element 22, heat-radiating element 22's upper end is provided with fan 24, fan 24 is the hot junction heat dissipation for the semiconductor refrigeration piece with heat-radiating element 22's effect, the temperature difference in semiconductor refrigeration piece cold and hot junction can reach 40 degrees to 65 degrees usually, reduce the hot junction temperature through the radiating mode of initiative, so that the cold junction temperature correspondingly descends, reach better radiating effect.
The semiconductor refrigerating sheet has small thermal inertia, fast refrigerating and heating time, maximum temperature difference within one minute after being electrified, no vibration and noise during working, long service life, convenient installation and continuous working.
In this embodiment, the attached lower extreme at the semiconductor refrigeration piece of heat conduction silica gel piece, the heat conduction silica gel piece plays heat conduction, soaking and absorbent effect for heat transfer between semiconductor refrigeration piece and the mobile terminal is more even, because the heat conduction silica gel piece has viscidity, thereby can adsorb on the mobile terminal dorsal scale, and then has saved the hold assembly of traditional radiator, makes the radiator more light, provides convenience for the user.
The heat-conducting silica gel sheet is in a porous form and has an average pore diameter of 2.4 nanometers, so that the heat-conducting silica gel sheet has good viscosity, and meanwhile, the heat-conducting silica gel sheet has the advantages of high temperature resistance, easiness in cleaning and long service life. After the radiator is used, the radiator can be restored to be clean by directly impacting with clean water, and convenience is provided for users.
The casing 1 includes a base 11 for accommodating the heat dissipation assembly 2, a casing 12 disposed on the upper end of the base 11 and used for accommodating the fan 24, and a cover 13 disposed on the casing 12 and covering the outside of the fan 24, the casing 12 is connected with the cover 13 and the base 11 to form an accommodating cavity therein, and the heat dissipation assembly 2 is mounted in the accommodating cavity. The fan 24, the heat dissipating element 22, the cooling element 21, and the heat conducting element 23 are connected in sequence, and the fan 24 is in contact with the cover 13.
Specifically, the housing 12 is detachably connected to the base 11 through a fastener, the cover 13 is fastened to the housing 12, and the first through hole 111 is opened in the middle of the lower end of the base 11.
Specifically, radiating element 22 sets up in base 11, and shell 12 passes through the fix with screw on base 11, and contradict on radiating element 22 after the screw penetrates base 11 to accomplish fixed to radiating element 22, the apex angle department of shell 12 is provided with the assembly groove with the screw adaptation the utility model provides an in, the preferred hexagon socket head cap screw that is interior to the screw that fixed adoption. The edges of the housing 12 are provided with chamfered or radiused edges to provide more comfort for the user when contacting the edges of the heat sink during use.
The refrigeration element 21 is attached to the lower end of the heat dissipation element 22, one surface of the heat conduction element 23 is attached to the lower end of the refrigeration element 21, and the other surface of the heat conduction element 3 is used for being attached to the back shell of the mobile terminal.
In other embodiments, the semiconductor refrigeration piece is fixed at the lower end of the metal cooling fin through a screw, the heat dissipation silicone layer is arranged between the semiconductor refrigeration piece and the metal cooling fin, and the heat conduction silicone piece is fixed at the lower end of the semiconductor refrigeration piece through a screw, so that the semiconductor refrigeration piece and the heat conduction silicone piece have better heat conduction effects while the assembly of the heat dissipation assembly is completed.
At least one ventilation hole is formed in the surface of the cover 13, specifically, a second through hole 121 is formed in the shell 12, the second through hole 121 is used for accommodating the fan 24, the cover 13 includes at least two ribbed plates 131 movably erected on the second through hole 121, the ribbed plates 131 are clamped with the second through hole 121, a gap exists between the ribbed plates 131, specifically, clamping strips 132 are arranged at two ends of the ribbed plates 131, and a clamping groove 122 clamped and connected with the clamping strips 132 is formed in the shell 12.
Closely cooperate between fan 24 and the second through-hole 121, lid 13 lid is established in the upper end of fan 24, and wherein, lid 13 includes a plurality of parallel arrangement's floor 131 to when guaranteeing the ventilation, for fan 24 provides the protection, prevent that the user from causing the injury because mistake touches fan 24 in the use. In the embodiment of the present invention, the cover 13 preferably includes five ribs 131.
The side of base 11 is provided with keeps off ring 112, and the side of base 11 is provided with a plurality of fender rings 112, has increased frictional force and the heat radiating area of base 11 side, and wherein, keeps off ring 112 and keeps off the ring for the metal, when convenience of customers got and puts the radiator for casing 1 has good radiating effect, and the side of base 11 is preferred to be provided with four layers and keeps off ring 112. In other embodiments of the present invention, the retaining ring 112 can also be made of rubber or soft plastic, so as to improve the contact comfort of the user when the heat dissipation performance is sacrificed.
The casing 1 is provided with a control switch 14 for controlling the working state of the heat sink and a power cord 15 connected to a power supply, wherein the control switch 14 is arranged on the casing 12, the power cord 15 is connected to the base 11, and the connector of the power cord 15 is preferably a USB connector.
Specifically, the control switch 14 is used for controlling the operating states of the fan 24 and the refrigeration element 21, the control switch 14 is disposed on the housing 1, and the control switch 14 is electrically connected to the fan 24 and the refrigeration element 21, respectively.
Further, a power cord 15 is mounted on the housing 1, and the power cord 15 is electrically connected to the fan 24, the refrigeration unit 21 and the control switch 14.
The fan 24 and the refrigeration element 21 are both electrically connected to the control switch 14, and when the heat sink is externally connected to the power supply, the fan 24 and the refrigeration element 21 start to operate, and the fan 24 releases the heat in the housing 1 to the outside of the housing through the ventilation channel formed by the second through hole 121 and the cover 13.
The utility model discloses in other embodiments, still be provided with the built-in battery who provides the power for fan and refrigeration component in the casing to save external power supply's power cord, use for user's removal and provide convenience.
To sum up, the radiator of this application is through heat conduction silica gel piece attached on mobile terminal, has saved the hold assembly of traditional radiator to make the radiator more light, simultaneously, cool down mobile terminal through the semiconductor refrigeration piece, compare and have better refrigeration effect with traditional forced air cooling, more effectually alleviated mobile terminal because the high condition that leads to the performance to reduce of temperature.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. The attached mobile terminal heat dissipation device is characterized by comprising a shell and a heat dissipation assembly, wherein the heat dissipation assembly comprises a refrigeration element and a heat conduction element; the shell is movably connected with the refrigeration element, the heat conduction element is attached to the surface of the refrigeration element, and the heat conduction element is in contact with the mobile terminal.
2. The attached mobile terminal heat sink according to claim 1, wherein: the heat dissipation assembly further comprises a heat dissipation element; the heat dissipation element and the heat conduction element are respectively arranged on two sides of the refrigeration element.
3. The attached mobile terminal heat sink according to claim 2, wherein: the heat dissipation assembly further comprises a fan, the fan is arranged inside the shell and is movably connected with the heat dissipation element; the bottom of the shell is provided with a first through hole, the heat conducting element extends to the outside of the shell through the first through hole, and the heat conducting element is in contact with the mobile terminal.
4. The attached mobile terminal heat sink according to claim 3, wherein: the projection area of the heat dissipation element is larger than that of the first through hole.
5. The attached mobile terminal heat sink according to claim 3, wherein: the shell comprises a cover body, a shell body and a base, the shell body is connected with the cover body and the base to form an accommodating cavity inside, and the heat dissipation assembly is installed in the accommodating cavity; the fan, the heat dissipation element, the refrigeration element and the heat conduction element are sequentially connected, and the fan is in contact with the cover body.
6. The attached mobile terminal heat sink according to claim 5, wherein: the shell body passes through the fastener can dismantle connect in the base, the lid block connect in the shell body, first through-hole sets up the lower extreme of base.
7. The attached mobile terminal heat sink according to claim 6, wherein: the shell body is provided with a second through hole, the cover body comprises at least two ribbed plates movably erected on the second through hole, the ribbed plates are clamped with the second through hole, and a gap exists between the ribbed plates.
8. The attached mobile terminal heat sink according to any one of claims 3-7, wherein: the control switch is used for controlling the working states of the fan and the refrigeration element; the control switch is arranged on the shell and is respectively and electrically connected with the fan and the refrigerating element.
9. The attached mobile terminal heat sink according to claim 8, wherein: the shell is further provided with a power line, and the power line is electrically connected with the fan, the refrigeration element and the control switch respectively.
10. The attached mobile terminal heat sink according to any one of claims 2-7, wherein: the refrigeration element is a semiconductor refrigeration sheet, the heat dissipation element is a metal heat dissipation sheet, and the heat conduction element is a heat conduction silica gel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920262746.8U CN210351947U (en) | 2019-03-01 | 2019-03-01 | Attached formula mobile terminal heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920262746.8U CN210351947U (en) | 2019-03-01 | 2019-03-01 | Attached formula mobile terminal heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210351947U true CN210351947U (en) | 2020-04-17 |
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ID=70172193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920262746.8U Active CN210351947U (en) | 2019-03-01 | 2019-03-01 | Attached formula mobile terminal heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210351947U (en) |
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2019
- 2019-03-01 CN CN201920262746.8U patent/CN210351947U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 408, floor 4, No. 1, Longquan science and Technology Industrial Park, Henglang community, Dalang street, Longhua District, Shenzhen, Guangdong Patentee after: Shenzhen lisen Technology Co.,Ltd. Address before: 518109 Room 101, 1st floor, dormitory building 4, Huachang Industrial Zone, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN DIYIWEI ELECTRONICS Co.,Ltd. |
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| CP03 | Change of name, title or address |